# Power MOSFET, N Channel, 100 V, 10 A, 0.185 ohm, TO-252AA, Surface Mount

![Product image](https://novapart.co/image/farnell:2781153/)

**URL**: https://novapart.co/products/IRLR120NTRLPBF/power-mosfet-n-channel-100-v-10-a-0185-ohm-to
**SKU**: IRLR120NTRLPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8320
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:10A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.185ohm; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 48W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252AA |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 10A |
| Drain Source On State Resistance | 0.185ohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2781153/)

Surface Mount (IRLR120N) Straight Lead (IRLU120N) Advanced Process Technology 

Fast Switching 

Fully Avalanche Rated Lead-Free 

## **Description** 

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**----- Start of picture text -----**<br>
HEXFET [®]  Power MOSFET<br>D<br>VDSS = 100V<br>R  = 0.185 Ω<br>DS(on)<br>G<br>ID = 10A<br>S<br>**----- End of picture text -----**<br>


|version(IRFUseries) isforthrough-holemountingapplications.<br>Powerdissipation levels upto 1.5watts are possible intypical<br>surfacemountapplications.|version(IRFUseries) isforthrough-holemountingapplications.<br>Powerdissipation levels upto 1.5watts are possible intypical<br>surfacemountapplications.|||D-Pak<br>IRLR120NPbF|D-Pak<br>IRLR120NPbF|I-Pak<br>G<br>IRLU120NPbF|I-Pak<br>G<br>IRLU120NPbF|I-Pak<br>G<br>IRLU120NPbF|I-Pak<br>G<br>IRLU120NPbF|||
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||
|**Form**<br>**Quantity**<br>**Package Type**<br>**Standard Pack**<br>**Base Part  Number**|||||**Orderable Part Number**|||**Note**||||
||Tube||75||IRLR120NPbF|||||||
||Tape and Reel||2000||IRLR120NTRPbF|||||||
|Tape and Reel Left<br>IRLR120NPbF<br>D-Pak|||3000||IRLR120NTRLPbF|||||||
||~~Tape and Reel Right~~||~~3000~~||~~IRLR120NTRRPbF~~|||EOL notice # 289||EOL notice # 289||
|IRLU120NPbF<br>IPak<br>Tube|||75||IRLU120NPbF|||||||
|**Absolute Maximum Ratings**||||||||||||
||**Parameter**||||**Max.**||||**Units**|||
|ID@ TC= 25°C<br>Continuous Drain Current,VGS@ 10V<br>ID@ TC= 100°C<br>Continuous Drain Current, VGS@ 10V<br>IDM<br>Pulsed Drain Current<br>PD@TC= 25°C<br>Power Dissipation<br>~~————————~~|||||10<br>7.0<br>A<br>35<br>48<br>W<br>~~ne~~|||||||
||Linear DeratingFactor||||0.32||||W/°C|||
|VGS|Gate-to-Source Voltage||||± 16|||||V||
|EAS<br>~~i~~|Single Pulse Avalanche Energy||||85|||||mJ||
|IAR<br>~~a~~|Avalanche Current||||6.0|||||A||
|EAR<br>Repetitive Avalanche Energy<br>dv/dt<br>Peak Diode Recoverydv/dt<br>TJ<br>Operating Junction and<br>~~a~~<br>~~aa~~<br>~~O~~||~~O~~|~~O~~|~~O~~|4.8<br>5.0<br>-55  to + 175<br>~~O~~||||mJ<br>V/ns|||
|TSTG|Storage Temperature Range|||||||||°C||
||SolderingTemperature, for 10 seconds||||300(1.6mm from case)|||||||
|**Thermal Resistance**||||||||||||
||**Parameter**||||**Typ.**|**Max.**|||**Units**|||
|RθJC|Junction-to-Case||||–––|3.1||||||
|RθJA|Junction-to-Ambient(PCB mount)**||||–––|50|||°C/W|||
|RθJA|Junction-to-Ambient||||–––|110||||||



## **Absolute Maximum Ratings** 

## **Thermal Resistance** 

## ������������� 

## **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ. **|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage|100|–––|–––|V|VGS= 0V, ID= 250μA|
|ΔV(BR)DSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|0.12|–––|V/°C|Reference to 25°C, ID= 1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|–––|0.185|Ω|VGS= 10V, ID= 6.0A�|
|||–––|–––|0.225||VGS= 5.0V, ID= 6.0A�|
|||–––|–––|0.265||VGS= 4.0V, ID= 5.0A�|
|VGS(th)|Gate Threshold Voltage|1.0|–––|2.0|V|VDS= VGS, ID= 250μA|
|gfs|Forward Transconductance|3.1|–––|–––|S|VDS= 25V, ID= 6.0A�|
|IDSS|Drain-to-Source Leakage Current|–––|–––|25|μA|VDS= 100V, VGS= 0V|
|||–––|–––|250||VDS= 80V, VGS= 0V, TJ= 150°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 16V|
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -16V|
|Qg|Total Gate Charge|–––|–––|20|nC|ID= 6.0A<br>VDS= 80V<br>VGS= 5.0V, See Fig. 6 and 13��|
|Qgs|Gate-to-Source Charge|–––|–––|4.6|||
|Qgd|Gate-to-Drain("Miller")Charge|–––|–––|10|||
|td(on)|Turn-On DelayTime|–––|4.0|–––|ns|VDD= 50V<br>ID= 6.0A<br>RG= 11Ω,VGS= 5.0V<br>RD= 8.2Ω,See Fig. 10��|
|tr|Rise Time|–––|35|–––|||
|td(off)|Turn-Off DelayTime|–––|23|–––|||
|tf|Fall Time|–––|22|–––|||
|LD|Internal Drain Inductance|���|4.5|���|nH|Between lead,<br>6mm (0.25in.)<br>from package<br>and center of die contact�<br>S<br>D<br>G|
||||||||
|LS|Internal Source Inductance|–––|7.5|–––|||
|Ciss|Input Capacitance|–––|440|–––|pF|VGS= 0V<br>VDS= 25V<br>ƒ = 1.0MHz, See Fig. 5�|
|Coss|Output Capacitance|–––|97|–––|||
|Crss|Reverse Transfer Capacitance|–––|50|–––|||



## **Source-Drain Ratings and Characteristics** 

|IS|**Parameter**|**Min. **|**Typ. **|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
||Continuous Source Current<br>(BodyDiode)|–––|–––|10|A|S<br>D<br>G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunction diode.|
|ISM<br>VSD<br>trr|Pulsed Source Current<br>(BodyDiode) ��|–––|–––|35|||
||Diode Forward Voltage|–––|–––|1.3|V|TJ= 25°C, IS= 6.0A, VGS= 0V�|
||Reverse RecoveryTime|–––|110|160|ns|TJ= 25°C, IF=6.0A<br>di/dt = 100A/μs ��|
|Qrr<br>ton|Reverse RecoveryCharge|–––|410|620|nC||
||Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)|||||



## **Notes:** 

- Repetitive rating;  pulse width limited by 

- Pulse width ≤ 300μs; duty cycle ≤ 2%. 

- max. junction temperature. ( See fig. 11 ) � VDD = 25V, starting TJ = 25°C, L = 4.7mH � This is applied for I-PAK, LS of D-PAK is measured between lead and RG = 25 Ω , IAS = 6.0A. (See Figure 12) center of  die contact � ISD ≤ 6.0A, di/dt ≤ 340A/μs, VDD ≤ V(BR)DSS, � Uses IRL520N data and test conditions. TJ ≤ 175°C 

- **   When mounted on 1" square PCB (FR-4 or G-10 Material ) . 

For recommended footprint and soldering techniques refer to application note #AN-994 

� ����������� ��������������������������������� ������������������������� ��������������������������������� 

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100 100<br> TOP           15V  TOP           15V<br>                   12V                    12V<br>                   10V                    10V<br>                   8.0V                    8.0V<br>                   6.0V SE                    6.0V 0 a<br>                   4.0V                    4.0V<br>                   3.0V                    3.0V<br> BOTTOM   2.5V ual  BOTTOM   2.5V 1el<br>10 ll Al 10 ee ema<br>ey 74) ee | ER Le eee<br>a” 2 ae rT<br>2.5V<br>1 All4 | ea eeee 1 | ——"y fie.WMA Un Ty |<br>2.5V<br>Yt iA yp V 7/AM GEE eeell<br> 20μs PULSE WIDTH  20μs PULSE WIDTH<br>0.1 SatiWA  T   = 25°CJ A 0.1 AGmail  T   = 175°CJ<br>0.1 1 10 100 0.1 1 10 100<br>V     , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br>100 Se 3.0 i ee<br>re es 2.5 PEELE<br>a————— T  = 25°CJ EE EEL EE EEL EE EE ’<br>eee PEE<br>T  = 175°CJ<br>10 eae 2.0 PP ae<br>SS eS PA<br>a> a ee ee 1.5 PE EEE EEA yy<br>1 0 / e e eee eeee ee 1.0 EPP L Eeeee<br>(= ee ee eet<br>_——— a 0.50.0 ae tL<br> V     = 50V DS<br>0.1 LFHt |} sorecous PULSEse WIDTHmeal A 0.0 P EEEE E EE EELLLLLL v= = tow<br>2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>V     , Gate-to-Source Voltage (V)GS T   , Junction Temperature (°C)JJ<br>I   , Drain-to-Source Current (A)D I   , Drain-to-Source Current (A)D<br>(Normalized)<br>D<br>I   , Drain-to-Source Current (A)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
3.0<br>i ee<br>2.5 PEELE EE EEL EE EEL EE EE ’<br>PEE<br>2.0 PP ae<br>PA<br>1.5 PE EEE EEA yy<br>1.0 EPP L Eeeee<br>eet<br>0.50.0 ae P EEEE tL E EE EELLLLLL v= = tow<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T   , Junction Temperature (°C)JJ<br>(Normalized)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance Vs. Temperature 

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800 15<br>V      = 0V,         f = 1MHzGS I    = 6.0AD<br>C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds Poty cov,<br>C      = C rss         gd<br>C      = C     + Coss        ds         gd 12  V      = 20VDS<br>600 Cc s rr S| el eS<br>9<br>| L ra vf<br>400<br>ss 6 NVA<br>200<br>PE) ss ae<br>3<br>Tt | [TTT ——<br>0 reTTES> A 0 [btsYe}     SEE FIGURE 13 enrestencum<br>1 10 100 0 5 10 15 20 25<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>100 100<br> OPERATION IN THIS AREA LIMITED<br>                       BY R DS(on)<br>10μs<br>10 es T  = 175°CJ a 10 Pa a Ps<br>ae 47 4nne ea |<br>100μs<br>T  = 25°C J<br>1ms<br>1 fh 1 peep NON ce<br>fff | | I|<br>10ms<br>0.1 Tp FA Le | | eww A 0.1 BeBe  Single Pulse et | TTT TT<br>0.4 0.6 0.8 1.0 1.2 1.4 1 10 100 1000<br>V     , Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A)D<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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**----- Start of picture text -----**<br>
10 PN~. Et Vos Rp :<br>8 PoPPP | NETNENN Re Ves D.U.T.<br>-<br>6 PENA \ SI | vee<br>SERN }} Sov ≤ 1<br>≤ 0.1 %<br>4 Pot PE EN PB u lsey Fa Wid t h ys<br>Fig 10a.   Switching Time Test Circuit<br>2<br>VDS<br>90%<br>0 A |<br>25 50 75 100 125 150 175<br>|<br>T  , Case Temperature (°C)C |<br>10%<br>VGS | |<br>Fig 9.   Ft Maximum Drain Current Vs. tL tT AY. t \¢ d(on) < < tr > | t o d(off) e tf<br>Case Temperature<br>Fig 10b.   Switching Time Waveforms<br> 10 ===a ==...- +. ane<br>PCT a ee ee ee eee eee<br>a<br>J D = 0.50 ————<br>SH<br> 1 |<br>0.20<br>SS eee ee eeeeee<br>ee ee ee ee ee ee<br>geerr 0.10 0.050.02 La = SINGLE PULSE | | rr eeeee PDM<br>0.1 a 0.01 (THERMAL RESPONSE) ee<br>t1<br>PCTCT t2<br>OO<br>Notes:<br>1. Duty factor D = t   / t 1 2<br>2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1<br>t  , Rectangular Pulse Duration (sec)1<br>I  , Drain Current (Amps)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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**----- Start of picture text -----**<br>
15V<br>L DRIVER<br>VDS<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>10V<br>> tt tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

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**----- Start of picture text -----**<br>
V(BR)DSS<br><~<— tp —><br>/ ‘|\<br>/ \<br>IAS<br>**----- End of picture text -----**<br>


**Fig 12b.** Unclamped Inductive Waveforms 

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**----- Start of picture text -----**<br>
QG<br>soy -- Te<br>QGS QGD<br>VG<br>=<br>Charge<br>**----- End of picture text -----**<br>


**Fig 13a.** Basic Gate Charge Waveform 

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**----- Start of picture text -----**<br>
200<br>                    ID<br>PTT Ty TOP            2.4A<br>160 Gane NEET                    4.2ABOTTOM    6.0A<br>PNP EE<br>120 WENGE<br>80 PNENU<br>PNAN<br>40 PASSA<br>PSS<br>Pet ESS<br>0<br>25 50 75 100 125 150 175<br>Starting T  , Junction Temperature (°C)J<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy Vs. Drain Current 

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**----- Start of picture text -----**<br>
Current Regulator<br>Same Type as D.U.T.<br>50K Ω<br>12V .2 μ F<br>.3 μ F<br>LE jt +<br>D.U.T. -VDS<br>VGS<br>3mA<br>a |<br>C al<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13b.** Gate Charge Test Circuit 

## **Peak Diode Recovery dv/dt Test Circuit** 

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**----- Start of picture text -----**<br>
+ Circuit Layout Considerations<br>D.U.T<br>   •  Low Stray Inductance<br> •   Ground Plane<br> •   Low Leakage Inductance<br>( rp       Current Transformer<br>-<br>|<br>+<br>ee<br>- - +<br>7<br>(0<br>RG •   dv/dt controlled by RG +<br>1a •   Driver same type as D.U.T. - VDD<br>•   ISD controlled by Duty Factor "D"<br>•   D.U.T. - Device Under Test<br>**----- End of picture text -----**<br>


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® Driver Gate Drive<br>P.W.<br>Period D =<br>ee P.W. | Period _ !<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current "| Current di/dt fs<br>@ D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>iv<br>Re-Applied \a k<br>Voltage Body Diode  Forward Drop<br>@ Inductor Curent<br>a<br>Ripple  ≤ 5% ISD<br>* VGS = 5V for Logic Level Devices<br>**----- End of picture text -----**<br>


**Fig 14.** For N-Channel HEXFETS 

**==> picture [317 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
EXAMPLE: THIS IS AN IRFR120<br>PART NUMBER<br>WITH ASSEMBLY INTERNATIONAL —— s<br>LOT CODE 1234 RECTIFIER IRFR120 DATE CODE<br>ASSEMBLED ON WW 16, 2001 LOGO 116A YEAR 1 =  2001<br>IN THE ASSEMBLY LINE "A" 12 34 WEEK 16<br>LINE A<br>Note: "P" in assembly line position ASSEMBLY<br>indicates "Lead-Free" LOT CODE<br>"P" in assembly line position indicates<br>"Lead-Free" qualification to the consumer-level<br>PART NUMBER<br>INTERNATIONAL co<br>OR DATE CODE<br>: RECTIFIER IRFR120 P =  DESIGNATES LEAD-FREE<br>LOGO PRODUCT (OPTIONAL)<br>12 34<br>P =  DESIGNATES LEAD-FREE<br>ASSEMBLY PRODUCT QUALIFIED TO THE<br>LOT CODE at CONSUMER LEVEL (OPTIONAL)<br>YEAR 1 =  2001<br>WEEK 16<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


**Note: For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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**----- Start of picture text -----**<br>
E XAMPLE : T HIS  IS  AN IRF U120 PART  NU MBE R<br>INT E RNAT IONAL<br>WIT H AS S E MB LYLOT  CODE  5678AS S E MBLE D ON WW 19, 2001 RE CT IF IE RLOGO 56IRFU120119A78 DAT E  CODEYE AR 1 =WE E K  19  2001<br>IN T H E  AS S E MB LY LINE  "A"<br>LINE  A<br>AS S E MB LY<br>LOT  CODE<br>Note: "P" in as s embly line pos ition<br>indicates  Lead-F ree"<br>OR aif<br>PART  NUMB E R<br>INT E RNAT IONAL c S<br>RE CT IF IE R IRF U120 DAT E  CODE<br>LOGO P =  DE S IGNAT E S  LE AD-F RE E<br>56 78 PRODUCT  (OPT IONAL)<br>AS S E MB LY YE AR 1 =  2001<br>LOT  CODE WE E K  19<br>A =  AS S E MB LY S IT E  CODE<br>**----- End of picture text -----**<br>


**Note: For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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**----- Start of picture text -----**<br>
TR TRR TRL<br>eoeodooe sol) | ee¢oo/|<br>16.3 ( .641 ) 16.3 ( .641 )<br>15.7 ( .619 ) 15.7 ( .619 )<br>12.1 ( .476 ) FEED DIRECTION 8.1 ( .318 ) FEED DIRECTION<br>11.9 ( .469 ) 7.9 ( .312 )<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
NOTES :<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
1.  CONTROLLING DIMENSION : MILLIMETER.<br>**----- End of picture text -----**<br>


2.  ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 

3.  OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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**----- Start of picture text -----**<br>
  13 INCH<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
16 mm<br>**----- End of picture text -----**<br>


NOTES : 1. OUTLINE CONFORMS TO EIA-481. 

**Note: For the most current drawing please refer to IR website at http://www.irf.com/package/** 

|**Qualification information**<br>†|||
|---|---|---|
|Qualification level|Industrial<br>(per JEDEC JESD47F<br>††guidelines)||
|Moisture Sensitivity Level|D-Pak|MS L1|
||I-Pak||
|RoHS compliant|Yes||



- Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability ††   Applicable version of JEDEC standard at the time of product release 

|**Date**|**Comment**|
|---|---|
|7/9/2014|•Updated Electrical parameter table typo on Rdson units from "W" to "Ω" on page2.<br>•Updated Package outline on page 8 & page 9.<br>•Added Orderable table on page1.<br>•Updated datasheet with IR corporate template.<br>•Updated ordering information to reflect the End-Of-life  (EOL notice #289)<br>•AddedQualification table onpage10.|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 



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