# Power MOSFET, N Channel, 20 V, 3.2 A, 0.1 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:3155159/)

**URL**: https://novapart.co/products/IRLMS1902TRPBF/power-mosfet-n-channel-20-v-32-a-01-ohm-sot-23
**SKU**: IRLMS1902TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0870
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:3.2A; Drain Source Voltage Vds:20V; On Resistance Rds(on):0.1ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:700mV; Power

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 6Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 1.7W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 3.2A |
| Drain Source On State Resistance | 0.1ohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3155159/)

## PD - 95359 IRLMS1902PbF 

HEXFET[®] Power MOSFET 

Fifth Generation HEXFET[®] power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.  This benefit, combined with the fast switching speed and ruggedized device design that HEXFET[®] power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

The  Micro6™ package with its customized leadframe produces a HEXFET[®] power MOSFET with RDS(on) 60% less than a similar size SOT-23.  This package is ideal for applications where printed circuit board space is at a premium.   It's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23. 

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> ISD ≤ 2.2A, di/dt ≤ 110A/us,Vpp ≤ Verypss; ® Surface mounted on FR-4 board, t ≤ ≤ 

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 100  100<br>VGS VGS<br>TOP 7.50V TOP 7.50V<br>5.00V 5.00V<br>4.00V 4.00V<br>3.50V 3.50V<br>3.00V ee ee ee 3.00V PT [tity]<br>2.50V 2.50V<br>2.00V 2.00V<br>BOTTOM 1.75V Tobe BOTTOM 1.75V TTT<br> 10 ee ) ZeeEE  10 | attimanagee<br>| AT erty TTT re 2<br> 1  1<br>ZZ || CAE =a<br>aEa ee ee eeee aeTe Re tiv SA<br>eP ve 20µs PULSE WIDTHT  = 25J e °C ail 20µs PULSE WIDTHT  = 150J ee °C<br>0.1 0.1<br>0.1  1  10 0.1  1  10<br>V     , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br> 100 2.0<br>ID = 2.2A<br>SS =Saaaa Sea ue ETE<br>Pp | [| [| | [| f [| TT fT tT ft 7 7<br>Sooeeeeeeeeeee T  = 25  CJ ° 1.5 PL E E<br> 10 eee === T  = 150  CJ ° TTTpal<br>aSane cenenneea CLarBa<br>1.0<br>ne LT<br> 1 EP  /AGeeeeeeeee CTLTT<br>0.5<br>|S27fff)fi yy SaaSftSERREfttftT deb V      = 10V aa DS aaaEEEEe CELCTa T<br>20µs PULSE WIDTH VGS = 4.5V<br>0.1 0.0<br>1.5 A 2.0 2.5 3.0 3.5 ee 4.0 4.5 5.0 e e -60 ATAU -40 -20 0 20 40 TOA 60 80 100 120 140 160<br>V     , Gate-to-Source Voltage (V)GS T  , Junction TemperatureJ (  C)°<br>D D<br>I   ,  Drain-to-Source Current (A) I   ,  Drain-to-Source Current (A)<br>(Normalized)<br>D<br>I   ,  Drain-to-Source Current (A)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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600 10<br>VGS = 0V, f = 1MHz ID = 2.2A<br>500 —- CCCissrssoss === CCCgsgdds + C+ Cgd ,gd C      SHORTEDds 8 ee VDS = 16V<br>400<br>PNC PTE LL 6 pi} ft LA<br>Ciss<br>P E HH<br>300<br>S S tt EEA<br>4<br>200 PP Zo<br> SNOT Coss rT | TA” Td<br>KE I ><br>2<br>100 | SWAT TTT ——4 a<br>Crss<br>FOR TEST CIRCUIT<br>0 Pie e TT 0 yifffi | SEE FIGURE        oc 9<br> 1  10  100 0 2 4 6 8<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100  100<br>OPERATION IN THIS AREA LIMITED<br>BY RDS(on)<br>ee = a tt<br>| | | | [| [| [ [| [ | | Pe | TTTTT<br> 10 SERED? Wo  10 eS<br>|} T  = 150  C —} J —} ° —+ Fr pt +L 100us UTTTII==S=e5<br>| | [| [AT Yt [fT f[ a aS a<br>1ms<br>T  = 25  CJ °<br> 1 | | | Y{TA_ {| | { | |  1 Ca st<br>10ms<br>ee Aree e e SO<br> T TCJ = 25  C= 150  C° °<br>0.1 i)Pete on) oTT e V      = 0 V GS 0.1 p  Single Pulse e elble<br>0.4 0.6 0.8 1.0 1.2 1.4  1  10  100<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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D.U.T + Circuit Layout Considerations<br>—_    • Low Stray Inductance<br>® •  Ground Plane<br>•  ow Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>Fee :<br>ty<br>Re •  v/dt controlled by Rg +<br>•  Driver same type as D.U.T. -<br>•<br>•  D.U.T. - Device Under Test<br>**----- End of picture text -----**<br>


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Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period<br>t<br>VGS=10V<br>‘<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current "\ Current di/dt fs<br>® D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>y<br>Re-Applied<br>Voltage Body Diode  Th Forward Drop<br>® Inductor Curent ee<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


**Fig 12.** For N-channel HEXFET[®] power MOSFETs 

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Micro6 (SOT23 6L) Package Outline 

Dimensions are shown in milimeters (inches) 

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||||||||
|---|---|---|---|---|---|---|
|_|3.00 (.118 )2.80 (.111 )|Ce|-B-|LEAD ASSIGNMENTS|OO|RECOMMENDED FOOTPRINT|
|D|D|S|2X  0.95 (.0375 )|
|1.75 (.068 )|6         5         4|6X  (1.06 (.042 )|
|1.50 (.060 )|3.00 (.118 )|6         5         4|
|-A-|1         2         3|2.60 (.103 )|1         2         3|2.20 (.087 )|
|D|D|G|
|0.95 ( .0375 )|
|2X|6X|0.50 (.019 )0.35 (.014 )|6X  0.65 (.025 )|
|4]|0.15   (.006 ) M  C A S  B S|CLL|O_O)|
|1.30 (.051 )|1.45 (.057 )|0  -10O           O|6X|0.20 (.007 )0.09 (.004 )|
|0.90 (.036 )|0.90 (.036 )|
|-C-|0.10 (.004 )|
|0.15 (.006 )|6   SURFACES|0.60 (.023 )|
|MAX.|0.10 (.004 )|
|NOTES :|
|1.  DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1982.|
|2.  CONTROLLING DIMENSION : MILLIMETER.|
|3.  DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES).|
|Micro6 (SOT23 6L) Part Marking Information|
|W =  (1-26) IF PRECEDED BY LAST DIGIT OF CALENDAR YEAR|
|WORK|
|YEAR|Y|WEEK|W|
|Y =  YEAR|2001|1|01|A|
|PART NUMBER|W =  WEEK|2002|2|02|B|
|2003|3|03|C|
|2004|4|04|D|
|2005|5|
|LOT|2006|6|
|CODE|2007|7|
|TOP|
|2008|8|
|2009|9||||
|2010|0|24|X|
|PART NUMBER CODE REFERENCE:|25|Y|
|26|Z|
|A =  IRLMS1902|
|B =  IRLMS1503|W =  (27-52) IF PRECEDED BY A LETTER|
|C =  IRLMS6702|WORK|
|D =  IRLMS5703|YEAR|Y|WEEK|W|
|E =  IRLMS6802|2001|A|27|A|
|F =  IRLMS4502|2002|B|28|B|
|G =  IRLMS2002|2003|C|29|C|
|H =  IRLMS6803|2004|D|30|D|
|2005|E|
|2006|F|
|2007|G|
|Note: A line above the work week|2008|H|
|(as shown here) indicates Lead-Free.|2009|J||||
|2010|K|50|X|
|51|Y|
|52|Z|

**----- End of picture text -----**<br>


## Micro6 (SOT23 6L) Part Marking Information 

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## Micro6 Tape & Reel Information 

Dimensions are shown in milimeters (inches) 

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8mm<br>4mm FEED DIRECTION<br>NOTES :<br>1.  OUTLINE CONFORMS TO EIA-481 & EIA-541.<br>| [a] oC \<br>  178.00<br>( 7.008 )<br>    MAX.<br>IN NZ XY LZ<br>9.90 ( .390 )<br>8.40 ( .331 )<br>NOTES:<br>1.  CONTROLLING DIMENSION : MILLIMETER.<br>**----- End of picture text -----**<br>


2.  OUTLINE CONFORMS TO EIA-481 & EIA-541. 

This product has been designed and qualified for the consumer market. Qualification Standards can be found on IR’s Web site. 

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- [Supplier page](https://es.farnell.com/infineon/irlms1902trpbf/mosfet-n-ch-20v-sot-23-6/dp/3155159)
---

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