# Power MOSFET, N Channel, 20 V, 80 A, 3000 µohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:2114661/)

**URL**: https://novapart.co/products/IRLH6224TR2PBF/power-mosfet-n-channel-20-v-80-a-3000-ohm-pqfn
**SKU**: IRLH6224TR2PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6670
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:80A; Drain Source Voltage Vds:20V; On Resistance Rds(on):0.0023ohm; Rds(on) Test Voltage Vgs:4.5V; Threshold Voltage Vgs:800mV; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 52W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 80A |
| Drain Source On State Resistance | 3000µohm |
| Gate Source Threshold Voltage Max | 800mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2114661/)

## HEXFET ® Power MOSFET 

|**VDS**|**20**|**V**|
|---|---|---|
|**Vgs  max**|**± 12**|**V**|
|**RDS(on) max**<br>(@VGS= 4.5V)|**3.0**|**m**Ω|
|(@VGS= 2.5V)|**4.0**||
|**Qg typ**|**44**|**nC**|
|**ID **<br>(@Tc(Bottom)= 25°C)<br>~~po]~~|**80**<br>~~po]~~|**A**<br>~~po]~~|



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PQFN 5X6 mm<br>**----- End of picture text -----**<br>


## **Applications** 

- Battery Protection Switch 

## **Features and Benefits** 

|**Features and Benefits**|||
|---|---|---|
|**Features**||**Benefits**|
|Low Thermal Resistance to PCB (< 2.4°C/W)||Enable better thermal dissipation|
|100% Rg tested||Increased Reliability|
|Low Profile (<1.2mm)|results in|Increased Power Density|
|Industry-Standard Pinout|⇒|Multi-Vendor Compatibility|
|Compatible with Existing Surface Mount Techniques|Compatible with Existing Surface Mount Techniques|Easier Manufacturing|
|RoHS Compliant Containing no Lead, no Bromide and no Halogen|RoHS Compliant Containing no Lead, no Bromide and no Halogen|Environmentally Friendlier|
|MSL1, Industrial Qualification||Increased Reliability|



||**Parameter**|**Max.**<br>~~cc~~|**Units**|
|---|---|---|---|
|VDS|Drain-to-Source Voltage<br>~~a~~|20<br>~~a~~<br>~~cc~~|V|
|VGS|Gate-to-Source Voltage<br>~~a~~|± 12<br>~~a~~<br>~~cc~~||
|ID@ TA= 25°C|Continuous Drain Current,VGS@ 10V<br>~~a~~|28<br>~~cc~~<br>~~a~~|A<br>~~=~~|
|ID@ TA= 70°C|Continuous Drain Current,VGS@ 10V<br>~~a~~|22<br>~~a~~||
|ID@ TC(Bottom)= 25°C|Continuous Drain Current,VGS@ 10V<br>~~a~~|105<br>~~a~~||
|ID@ TC(Bottom)= 100°C|Continuous Drain Current,VGS@ 10V<br>~~a~~|67<br>~~a~~||
|ID@ TC= 25°C|Continuous Drain Current,VGS@ 10V(Package Limited)|80<br>~~=~~||
|IDM|Pulsed Drain Current<br>~~a~~|400<br>~~a~~||
|PD@TA= 25°C|Power Dissipation<br>~~a~~<br>~~Re~~|3.6<br>~~a~~<br>~~Re~~|W<br>~~Re~~|
|PD@TC(Bottom)= 25°C|Power Dissipation<br>~~Re~~|52<br>~~Re~~||
||Linear Derating Factor<br>~~a~~|0.029<br>~~a~~|W/°C<br>~~a~~|
|TJ<br>TSTG|Operating Junction and<br>Storage Temperature Range<br>~~a~~|-55  to + 150<br>~~a~~|°C<br>~~a~~|



> Notes ® through © are on page 9 

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**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|20|–––|–––|V|VGS =0V, ID =250μA||
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|5.0|–––|mV/°C|Reference to 25°C,ID= 1.0mA||
|RDS(on)|Static Drain-to-Source On-Resistance|–––|2.3|3.0|mΩ|VGS= 4.5V,ID= 20A�||
|||–––|3.2|4.0||VGS= 2.5V,ID= 16A�||
|VGS(th)|Gate Threshold Voltage|0.5|0.8|1.1|V|VDS= VGS, ID= 50μA||
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-4.2|–––|mV/°C|||
|IDSS|Drain-to-Source Leakage Current|–––|–––|1|μA|VDS= 16V,VGS= 0V||
|||–––|–––|150||VDS= 16V,VGS= 0V,TJ= 125°C||
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 12V||
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -12V||
|gfs|Forward Transconductance|150|–––|–––|S|VDS= 10V,ID= 20A||
|Qg|Total Gate Charge|–––|86|–––|nC|VGS= 10V,VDS= 15V,ID= 20A||
|Qg|Total Gate Charge|–––|44|–––|nC|VGS= 4.5V<br>ID= 20A<br>VDS= 10V||
|Qgs1|Pre-Vth Gate-to-Source Charge|–––|3.8|–––||||
|Qgs2|Post-Vth Gate-to-Source Charge|–––|4.7|–––||||
|Qgd|Gate-to-Drain Charge|–––|8.5|–––||||
|Qgodr|Gate Charge Overdrive|–––|27|–––||||
|Qsw|Switch Charge(Qgs2+ Qgd)|–––|13|–––||||
|Qoss|Output Charge|–––|30|–––|nC|VDS= 16V,VGS= 0V||
|RG|Gate Resistance|–––|2.0|–––|Ω|||
|td(on)|Turn-On DelayTime|–––|9.4|–––|ns|RG=1.8Ω<br>ID= 20A<br>VDD= 15V, VGS= 4.5V||
|tr|Rise Time|–––|23|–––||||
|td(off)|Turn-Off DelayTime|–––|67|–––||||
|tf|Fall Time|–––|36|–––||||
|Ciss|Input Capacitance|–––|3710|–––|pF|VGS= 0V<br>VDS= 10V<br>ƒ= 1.0MHz||
|Coss|Output Capacitance|–––|1050|–––||||
|Crss|Reverse Transfer Capacitance|–––|770|–––||||
|**Avalanche Characteristics**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|EAS|Single Pulse Avalanche Energy�||–––|||125|mJ|
|IAR|Avalanche Current�||–––|||20|A|
|**Diode Characteristics**||||||||
||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**||
|IS|Continuous Source Current<br>(Body Diode)|–––|–––|67|A|D<br>S<br>G<br>showing  the<br>integral reverse<br>p-n junction diode.<br>MOSFET symbol||
|ISM|<br>Pulsed Source Current<br>(Body Diode)��|–––|–––|400||||
|VSD|<br>Diode Forward Voltage|–––|–––|1.2|V|TJ= 25°C,IS= 20A,VGS= 0V�<br>||
|trr|Reverse RecoveryTime|–––|38|57|ns|TJ= 25°C, IF= 20A, VDD= 15V<br>di/dt = 300A/μs��||
|Qrr|Reverse RecoveryCharge|–––|82|125|nC|||
|ton|Forward Turn-On Time|Time is dominated by parasitic Inductance||||||



## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJC (Bottom)|Junction-to-Case�|–––|2.4|°C/W|
|RθJC (Top)|Junction-to-Case�|–––|34||
|RθJA|Junction-to-Ambient�|–––|35||
|RθJA (<10s)|Junction-to-Ambient�|–––|22||



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1000<br>VGS<br>TOP           10V<br>7.00V<br>ae 4.50V<br>2.50V<br>100 2.30V<br>2.00V<br>1.75V<br>BOTTOM 1.50V<br>ooo THI<br>10<br>eTpyee<br>——<br>1.50V<br>1 com ee |<br>≤ 60μs PULSE WIDTH<br>Tj = 25°C<br>0.1 eeSw ati e ttdl<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>1000 se es ol<br>100<br>T = 150°C<br>J<br>Po ffA i<br>10<br>Se eS<br>ee ee A ee ee ee<br>T J  = 25°C<br>1<br>pf |<br>VDS = 10V<br>a ≤ 60μs PULSE WIDTH<br>0.1 ee<br>0 1 2 3 4<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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100000<br>VGS   = 0V,       f = 1 MHZ<br>Ciss   = Cgs + Cgd,  Cds SHORTED<br>- C rss    = C gd<br>10000 rr- Coss  = Cds + Cgd<br>ee<br>ee<br>Ciss<br>HtPN eee<br>C<br>1000 C HE rss oss TH<br>tS<br>Ee ee ee ee eeeee<br>a a ee ee ee<br>PEE CET<br>100<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

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1000<br>VGS<br>TOP           10V<br>7.00V<br>4.50V<br>amenity zeal 2.50V<br>2.30V<br>2.00V<br>100 1.75V<br>BOTTOM 1.50V<br>ZO ArO a<br>7/Zcqutiil So<br>Oa |<br>1.50V<br>10<br>as aeeateais<br>≤ 60μs PULSE WIDTH<br>al Tj = 150°C<br>1 Blin |<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.6<br>ID = 20A<br>VGS = 10V p<br>1.4<br>1.2<br>Wa y,<br>1.0 WA<br>YY<br>0.8<br>0.6<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>Fig 4.   Normalized On-Resistance vs. Temperature<br>14<br>ID= 20A VDS= 16V<br>12 V DS = 10V<br>VDS= 4.0V<br>A<br>10 | WY _|<br>8 TT o T f] /<br>V<br>6<br>| | |) | |<br>4 | A Fy<br>Vy<br>2 NA/<br>0<br>an<br>0 20 40 60 80 100 120<br> QG  Total Gate Charge (nC)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

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1000<br>Es es ee es es ee<br>TJ = 150°C<br>100<br>SY<br>| si re ee ee eee<br>T = 25°C<br>J<br>10 SAF<br>Se pp<br>} J<br>V GS  = 0V<br>1.0 |PPPTT} Pp| ot<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8<br>VSD, Source-to-Drain Voltage (V)<br>ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


## **Fig 7.** Typical Source-Drain Diode Forward Voltage 

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10000<br>OPERATION IN THIS AREA<br>Ea LIMITED BY RDS(on) T |Thy<br>1000<br>100 30 10msec |<br>100μsec<br>ee ee ees eee<br>ee<br>10<br>Limited by Package<br>ee ee<br>1msec<br>8<br>1 HR Tc = 25°C  oSA|<br>Tj = 150°C DC<br>Single Pulse<br>0.1 AHHCorrswits tteCUT<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 8.** Maximum Safe Operating Area 

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120<br>Limited By Packag<br>100 Lv |<br>ia<br>80<br>NN<br>a<br>60 ae<br>40 ‘<br>AN<br>20<br>0<br>25 50 75 100 125 150<br> TC,  Case Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


## **Fig 9.** Maximum Drain Current vs. Case (Bottom) Temperature 

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1.6<br>1.4<br>FURR EEae<br>1.2 PPPS<br>RW Ss ><br>1.0<br>EL PRK<br>SSS LES<br>0.8 I D  = 50μA<br>ID = 250μA <x)<br>SS<br>0.6 I D  = 1.0mA<br>ID = 1.0A Aa q<br>RSS<br>0.4<br>0.2<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 10.** Threshold Voltage vs. Temperature 

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10<br>pt<br>D = 0.50<br>1 eee ae a<br>Po 0.20 et ert ra<br>_—— 0.10 FE SF<br>0.05<br>0.1 eee errr |<br>ee 0.02<br>0.01<br>ee On Ds cam 0 0<br>| ee EA A<br>0.01 pe<br>SINGLE PULSE Notes:<br>rT ( THERMAL RESPONSE ) ee 1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthjc + Tc<br>0.001 PT EE SE EE ee ee<br>1E-006 1E-005 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJC )<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case (Bottom) 

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8 500<br>ID = 20A ID<br>TOP          5.7A<br>400<br>                 9.3A<br>6<br>BOTTOM   20A<br>300<br>4 CLT Ty] BNE<br>T = 125°C<br>J<br>200<br>7 \ S oem NARCNOth<br>2<br>NEFA CNN<br>100<br>TJ = 25°C ASC ASNS<br>PSS i.<br>0 0<br>0 2 4 6 8 10 12 25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>VGS, Gate -to -Source Voltage  (V)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>Ω )<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance vs. Gate Voltage 

**Fig 13.** Maximum Avalanche Energy vs. Drain Current 

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15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>y 20V db<br>tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig 14a.** Unclamped Inductive Test Circuit 

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-<br>≤ 1  us<br>≤ 0.1<br>**----- End of picture text -----**<br>


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V(BR)DSS<br><< tp —><br>/<br>/ |i<br>aan<br>IAS —<br>Fig 14b.<br>V<br>DS<br>[NN<br>90% \/<br>10%<br>/\<br>V<br>GS<br>it | tt<br>o>! 44!<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 14b.** Unclamped Inductive Waveforms 

**Fig 15a.** Switching Time Test Circuit 

**Fig 15b.** Switching Time Waveforms 

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Driver Gate Drive<br>P.W.<br>D.U.T + { P.W. + Period ——— + D = —— Period<br>) [©)]    •  Circuit Layout Considerations ) V | t GS=10<br>| — -  •   GroundLow StrayPlane Inductance<br> •   CurrentLow LeakageTransformerInductance 2) D.U.T. ISD Waveform<br>+<br>Reverse<br>@ - a | S - ® + RecoveryCurrent r Body Diode ForwardCurrent di/dt /\ ——_<br>©) D.U.T. VDS Waveform Diode Recoverydv/dt ‘ '<br>00 we VDD<br>iv<br>•   Re-Applied<br>•   Driver same type as D.U.T. + Voltage Body Diode  Forward Drop<br>Ro (4 •   dv/dt controlledIsp controlled by byDuty Rg Factor "D" Vp p - @) Inductor Curent<br>•<br>D.U.T. - Device Under Test Ripple  ≤ 5% e s ISD ee<br>**----- End of picture text -----**<br>


## **Fig 16.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET ® Power MOSFETs 

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L<br>VCC<br>DUT<br>0 oe eos oe<br>1K S<br>**----- End of picture text -----**<br>


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Id<br>Vds i<br>Vgs<br>I<br>1<br>i)<br>1<br>1<br>1<br>'<br>Vgs(th)<br>—_<br>' 1<br>' 1<br>H \<br>\ \<br>J |\ \\i)<br><> __<> _ 4A>>4—_\!_____"<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 17.** Gate Charge Test Circuit 

**Fig 18.** Gate Charge Waveform 

International TOR Rectitier 

AN INFINEON TECHNOLOGIES COMPANY 

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IRLH6224PbF<br>**----- End of picture text -----**<br>


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Note: For the most current drawing please refer to IR website at: http:/Awww ~~.~~ irf.com/ ~~p~~ ackage/ 

~~[27 www.irf.com~~ © 2015 International Rectifier 

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July 7, 2015 

## INTERNATIONAL RECTIFIER LOGO 

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DATE CODE<br>XXXX P ART NUMBER<br>ASSEMBLY (“4 or 5 digits”)<br>SITE CODE XYWWX M ARKING CODE<br>(Per SCOP 200-002) (Per Marking Spec)<br>XXXXX<br>PIN 1<br>IDENTIFIER<br>le | LOT CODE<br>(Eng Mode - Min last 4 digits of EATI#)<br>(Prod Mode - 4 digits of SPN code)<br>**----- End of picture text -----**<br>


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REEL DIMENSIONS<br>**----- End of picture text -----**<br>


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TAPE DIMENSIONS<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
CODE DESCRIPTION<br>Ao Dimension design to accommodate the component width<br>Bo Dimension design to accommodate the component lenght<br>Ko Dimension design to accommodate the component thickness<br>W Overall width of the carrier tape<br>= P1 Pitch between successive cavity centers<br>**----- End of picture text -----**<br>


||||**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~H~~oles|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||SO||OOO|||OA||||||||||||
|||||~~Jer[oe{~~<br>Jos ~~[os |~~|||~~Jo [oo~~<br>Jos ~~[0+ |~~|||||User||~~=>~~<br> Direction of Feed|||||||
||||||Pocke~~t ~~Vecron~~ts~~||||||||||||||||
|Note:  All dimension are nominal|||||||||||||||||||||
||Package|Reel|QTY|Reel||Ao||Bo||||Ko|||||P1||W|Pin 1|
||Type|Diameter||Width||(mm)||(mm)||||(mm)|||||(mm)||(mm)|Quadrant|
|||(Inch)||W1|||||||||||||||||
|||||(mm)|||||||||||||||||
||5 X 6 PQFN|13|4000|12.4||6.300||5.300||||1.20|||||8.00||12|Q1|



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**==> picture [60 x 31] intentionally omitted <==**

## **Qualification information**[†] 

|**Qualification information**†|||
|---|---|---|
|Qualification level|Indus trial††<br>(per JEDEC JE S D47F †††guidelines )||
|Moisture Sensitivity Level|PQFN 5mm x 6mm|MS L1<br>(per JEDEC J-S TD-020D†††)|
|RoHS compliant|Yes||



- Qualification standards can be found at International Rectifier’s web site 

- http://www.irf.com/product-info/reliability 

- �� Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ 

- ��� Applicable version of JEDEC standard at the time of product release. 

## **������** 

- Repetitive rating;  pulse width limited by max. junction temperature. 

- Starting TJ = 25°C, L = 0.63mH, RG = 50 Ω , IAS = 20A. 

- Pulse width ≤ 400μs; duty cycle ≤ 2%. 

- R θ is measured at TJ of approximately 90°C. 

- When mounted on 1 inch square  2 oz copper pad on 1.5x1.5 in. board of FR-4 material. 

- Calculated continuous current based on maximum allowable junction temperature. 

- Package is limited to 80A by die-source to lead-frame bonding technology 

|**Revision History**||
|---|---|
|**Date**|**Comment**|
|5/12/2014|•Updated ordering information to reflect the End-Of-life (EOL) of the mini-reel option  (EOL notice #259)|
||•Updated Tape and Reel on page 8.|
||•Updated data sheet based on corporate template.|
|6/2/2015|•Updated package outline for “option E” and  added package outline for “option G” on page 7.|
||<br>•Updated "IFX" logo on page 1 & 9.|
||• Updated tape and reel on page 8.|
|7/7/2015|<br>• Corrected package outline for“option E”on page 7.|



**==> picture [107 x 56] intentionally omitted <==**

**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 

� ����������� ��������������������������������� ������������������������� �������������������������������������������� 



## Links

- [View this product on Novapart](https://novapart.co/products/IRLH6224TR2PBF/power-mosfet-n-channel-20-v-80-a-3000-ohm-pqfn)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irlh6224tr2pbf/mosfet-n-ch-20v-80a-8pqfn/dp/2114661)
---

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