# Power MOSFET, N Channel, 30 V, 78 A, 3500 µohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:2726003/)

**URL**: https://novapart.co/products/IRLB4132PBF/power-mosfet-n-channel-30-v-78-a-3500-ohm-to-220ab
**SKU**: IRLB4132PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3490
**Stock**: 1000+
**Lead Time**: 85 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:78A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.0025ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.8V; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 140W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 78A |
| Drain Source On State Resistance | 3500µohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2726003/)

IRLB4132PbF 

|**Application**<br>Optimized for UPS/Inverter Applications<br>Low Voltage Power Tools<br>**Benefits**<br>Best in Class Performance for UPS/Inverter Applications<br>Very Low RDS(on) at 4.5V VGS|G||HEXFET®Power MOSFET<br>D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**3.5**<br>**m**<br>(@VGS= 4.5V)<br>**4.5**<br>**Qg (typical)**<br>**36**<br>**nC**<br>**ID (Silicon Limited)**<br>**150**<br>**ID (Package Limited)**<br>**78A**<br>**A**<br>~~7~~|HEXFET®Power MOSFET<br>D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**3.5**<br>**m**<br>(@VGS= 4.5V)<br>**4.5**<br>**Qg (typical)**<br>**36**<br>**nC**<br>**ID (Silicon Limited)**<br>**150**<br>**ID (Package Limited)**<br>**78A**<br>**A**<br>~~7~~|
|---|---|---|---|---|
|Ultra-Low Gate Impedance|||||
|Fully Characterized Avalanche Voltage and Current|||||
|Lead-Free, RoHS Compliant|TO-220AB<br>**G**<br>**D**<br>**S**<br>Gate<br>Drain<br>Source<br>S<br>D<br>G<br>~~-+~~||||
|**Base part number**<br>**Package Type**<br>**Standard Pack**<br>**Form**<br>**Quantity**<br>IRLB4132PbF<br>TO-220AB<br>Tube<br>50<br>IRLB4132PbF<br>**Orderable Part Number**<br>~~—————————~~|||||
|**Absolute Maximum Rating**|||||
|**Symbol**<br>**Parameter**|||**Max.**<br>**Units**||
|VDS<br>Drain-to-Source Voltage|||30<br>V||
|VGS<br>Gate-to-Source Voltage|||± 20<br>V||
|ID @TC= 25°C<br>Continuous Drain Current,VGS @10V(Silicon Limited)|||150||
|ID @TC= 100°C<br>Continuous Drain Current,VGS @10V(Silicon Limited)|||100<br>A||
|ID @TC= 25°C<br>Continuous Drain Current,VGS @10V(Package Limited)|||78||
|IDM<br>Pulsed Drain Current<br>PD @TC= 25°C<br>Maximum Power Dissipation<br>~~——~~|||620<br>140<br>W||
|PD @TC= 100°C<br>Maximum Power Dissipation|||68<br>W||
|Linear DeratingFactor|||0.90<br>W/°C||
|TJ<br>TSTG<br>Operating Junction and<br>Storage Temperature Range<br>SolderingTemperature,for 10 seconds (1.6mm fromcase)<br>MountingTorque, 6-32 or M3 Screw<br>~~pf~~<br>~~a~~|||-55  to + 175<br>°C<br>300<br>10 lbf·in(1.1 N·m)||



## **Thermal Resistance** 

|**Symbol**|**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RJC|Junction-to-Case|–––|1.11|°C/W|
|RCS|Case-to-Sink,Flat Greased Surface|0.50|–––||
|RJA|Junction-to-Ambient|–––|62||



Notes through are on page 8 

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**Static @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min.**|**Typ. Max. Units**|**Typ. Max. Units**|**Typ. Max. Units**|**Conditions**|
|---|---|---|---|---|---|---|
|BVDSS<br>~~ee~~|Drain-to-Source Breakdown Voltage<br>~~nD~~|30<br>~~I~~|–––<br>~~Is~~|–––<br>~~I~~|V<br>~~I~~|VGS= 0V,ID= 250µA|
|BVDSS/TJ<br>~~ee~~|Breakdown Voltage Temp. Coefficient<br>~~nD~~|–––<br>~~I~~<br>~~EEE~~|17<br>~~Is~~<br>~~EEE~~|––– mV/°C Reference to 25°C<br>~~I~~<br>~~EEE~~|––– mV/°C Reference to 25°C<br>~~I~~<br>~~EEE~~|––– mV/°C Reference to 25°C,ID= 1mA|
|RDS(on)<br>~~ee~~<br>~~Cf~~|Static Drain-to-Source On-Resistance<br>~~nD ~~<br>~~Cf~~|–––<br> ~~I ~~<br>~~Cf~~<br>~~EEE~~<br>~~a~~|2.5<br> ~~Is ~~<br>~~Cf~~<br>~~EEE~~<br>~~ee~~|3.5<br> ~~I ~~<br>~~Cf~~<br>~~EEE~~<br>~~ee~~|m<br> ~~I~~<br>~~Cf~~<br>~~EEE~~<br>~~ee~~|VGS= 10V,ID= 40A<br>~~Cf~~|
|||–––<br>~~Cf~~<br>~~EEE~~<br>~~a~~|3.5<br>~~Cf~~<br>~~EEE~~<br>~~ee~~|4.5<br>~~Cf~~<br>~~EEE~~<br>~~ee~~||VGS= 4.5V,ID= 32A<br>~~Cf~~|
|VGS(th)<br>~~Cf~~<br>~~ee~~|GateThresholdVoltage<br>~~Cf~~<br>~~ee~~|1.35<br>~~Cf~~<br>~~EEE~~<br>~~ee~~<br>~~a~~|1.8<br>~~Cf~~<br>~~EEE~~<br>~~ee~~<br>~~ee~~|2.35<br>~~Cf~~<br>~~EEE~~<br>~~ee~~<br>~~ee~~|V<br>~~Cf~~<br>~~EEE~~<br>~~ee~~<br>~~ee~~|VDS= VGS, ID= 100µA<br>––– mV/°C<br>~~Cf~~<br>~~ee~~|
|GS(th)<br>VGS(th)/TJ<br>~~ee~~|Gate Threshold Voltage Coefficient<br>~~ee~~|–––<br>~~ee~~<br>~~a~~|-7.7<br>~~ee~~<br>~~ee~~|––– mV/°C<br>~~ee~~<br>~~ee~~|––– mV/°C<br>~~ee~~<br>~~ee~~||
|GS(th)<br>IDSS<br>~~a~~|Drain-to-Source Leakage Current<br>~~a~~|–––<br>~~a ~~<br>~~a~~|–––<br> ~~ee~~<br>~~a~~|1.0<br>~~ee~~<br>~~a~~|µA<br>~~ee~~<br>~~a~~|VDS=24 V,VGS=0V<br>~~a~~|
|||–––<br>~~a~~|–––<br>~~a~~|100<br>~~a~~||VDS=24V,VGS=0V,TJ=125°C<br>~~a~~|
|IGSS<br>~~a~~|Gate-to-Source Forward Leakage<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~|100<br>~~a~~|nA<br>~~a~~|VGS= 20V<br>~~a~~|
||Gate-to-SourceReverseLeakage<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~|-100<br>~~a~~||VGS= -20V<br>~~a~~|
|gfs<br>~~eee~~|Forward Transconductance<br>~~eee~~|190<br>~~eee~~|–––<br>~~eee~~|–––<br>~~eee~~|S|VDS= 15V,ID=32A<br>~~eee~~|
|Qg<br>~~eee~~|Total Gate Charge<br>~~eee~~|–––<br>~~eee~~|36<br>~~eee~~|54<br>~~eee~~|<br>nC<br>~~——————~~|VDS= 15V<br>VGS= 4.5V<br>ID= 32A<br>~~eee~~<br>~~——————~~|
|Qgs1<br>~~eee~~|Pre-Vth Gate-to-Source Charge<br>~~eee~~|–––<br>~~eee~~|9.1<br>~~eee~~|–––<br>~~eee~~|||
|Qgs2<br>~~eee~~|Post-Vth Gate-to-Source Charge<br>~~eee~~|–––<br>~~eee~~|4.2<br>~~eee~~|–––<br>~~eee~~|||
|Qgd<br>~~eee~~<br>~~—~~|Gate-to-Drain Charge<br>~~eee~~<br>|–––<br>~~eee~~<br>|13<br>~~eee~~<br>|–––<br>~~eee~~<br>|||
|Qgodr<br>~~eee~~<br>~~—~~|Gate Charge Overdrive<br>~~eee~~<br>|–––<br>~~eee~~<br>|13<br>~~eee~~<br>|–––<br>~~eee~~<br>|||
|Qsw<br>~~eee~~<br>~~——————~~|Switch Charge(Qgs2 +Qgd)<br>~~eee~~<br>~~——————~~|–––<br>~~eee~~<br>~~——————~~|17.2<br>~~eee~~<br>~~——————~~|–––<br>~~eee~~<br>~~——————~~|||
|Qoss<br>~~eee~~<br>~~——————~~|Output Charge<br>~~eee~~<br>~~——————~~|–––<br>~~eee~~<br>~~——————~~|21<br>~~eee~~<br>~~——————~~|–––<br>~~eee~~<br>~~——————~~|nC<br>~~——————~~|VDS= 16V,VGS= 0V<br>~~eee~~<br>~~——————~~|
|RG<br>~~——————~~|Gate Resistance<br>~~——————~~|–––<br>~~——————~~|0.85<br>~~——————~~|1.5<br>~~——————~~|<br>~~——————~~|~~——————~~|
|td(on)<br>~~=~~|Turn-On DelayTime<br>~~=~~|–––<br>~~=~~|23<br>~~=~~|–––<br>~~=~~|ns<br>~~=~~<br>~~el~~|VDD= 15V<br>ID= 32A<br>RG= 1.8<br>VGS= 4.5V<br>~~=~~|
|tr<br>~~=~~|Rise Time<br>~~=~~|–––<br>~~=~~|92<br>~~=~~|–––<br>~~=~~|||
|td(off)<br>~~=~~|Turn-Off DelayTime<br>~~=~~|–––<br>~~=~~|25<br>~~=~~|–––<br>~~=~~|||
|tf<br>~~=~~|Fall Time<br>~~=~~|–––<br>~~=~~|36<br>~~=~~<br>~~e~~|–––<br>~~=~~<br>~~e~~|||
|Ciss<br>~~=~~<br>~~e~~|Input Capacitance<br>~~=~~<br>~~e~~|–––<br>~~=~~<br>~~e~~~~**e**~~|5110<br>~~=~~<br>~~**e**~~<br>~~e~~|–––<br>~~=~~<br>~~**e**~~<br>~~e~~|<br>pF<br> <br>~~=~~<br>~~**e**~~<br>~~el~~|VGS= 0V<br>VDS= 15V<br>ƒ= 1.0MHz<br>~~=~~<br>~~**e**~~|
|Coss<br>~~e~~|Output Capacitance<br>~~e~~|–––<br>~~e~~~~**e**~~|960<br>~~**e**~~<br>~~e~~|–––<br>~~**e**~~<br>~~e~~|||
|Crss<br>~~e~~|Reverse Transfer Capacitance<br>~~e~~|–––<br>~~e~~~~**e**~~|440<br>~~**e**~~<br>~~e~~|–––<br>~~**e**~~<br>~~e~~|||



**Diode Characteristics** 

|**Diode Characteristics**|**Diode Characteristics**|**Diode Characteristics**|**Diode Characteristics**|**Diode Characteristics**|**Diode Characteristics**|**Diode Characteristics**|
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter **|**Min.**|**Typ. M**|**. Max.**|**Units**|**Conditions**|
|IS|Continuous Source Current<br>(BodyDiode)|–––|––– 150|––– 150|A|MOSFET symbol<br>showing  the<br>integral reverse<br>p-n junction diode.|
|ISM|Pulsed Source Current<br>(Body Diode)|–––|–––|620|||
|VSD|Diode Forward Voltage|–––|–––|1.0|V|TJ= 25°C,IS= 32A,VGS= 0V|
|trr|Reverse RecoveryTime|–––|29|44|ns|TJ= 25°C IF= 32A ,VDD=15V<br>nC   di/dt = 200A/µs|
|Qrr|Reverse RecoveryCharge|–––|49|74|nC   di/dt = 200A/||



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**Fig 1.** Typical Output Characteristics 

**Fig 3.** Typical Transfer Characteristics 

**Fig 5.** Typical Capacitance vs. Drain-to-Source Voltage 

**Fig 2.** Typical Output Characteristics 

**Fig 4.** Normalized On-Resistance vs. Temperature 

**Fig 6.** Typical Gate Charge vs. Gate-to-Source Voltage 

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## IRLB4132PbF ~~OT~~ 

**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

**Fig 9.** Maximum Drain Current vs. Case Temperature 

**Fig 10.** Threshold Voltage vs. Temperature 

**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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**Fig 12.** Typical On-Resistance vs. Gate Voltage 

**Fig 13.** Maximum Avalanche Energy vs. Drain Current 

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**Fig 14.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET[® ] Power MOSFETs 

**Fig 15a.** Unclamped Inductive Test Circuit 

**Fig 15b.** Unclamped Inductive Waveforms 

**Fig 16a.** Switching Time Test Circuit 

**Fig 16b.** Switching Time Waveforms 

**Fig 17a.** Gate Charge Test Circuit 

**Fig 17b.** Gate Charge Waveform 

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## **TO-220AB Package Outline** (Dimensions are shown in millimeters (inches)) 

## **TO-220AB Part Marking Information** 

E X A M P L E : T H IS IS A N IR F 1 0 1 0 L O T  C O D E 1 7 8 9 A S S E M B L E D O N W W 1 9 , 2 0 0 0 IN T H E A S S E M B L Y  L IN E "C " 

N o t e :  "P " in a s s e m b ly  lin e p o s it io n in d ic a t e s  "L e a d -  F r e e " 

**==> picture [251 x 83] intentionally omitted <==**

**----- Start of picture text -----**<br>
P A R T  N U M B E R<br>IN T E R N A T IO N A L<br>R E C T IF IE R<br>L O G O<br>D A T E  C O D E<br>Y E A R  0  =  2 0 0 0<br>A S S E M B L Y<br>W E E K  1 9<br>L O T  C O D E<br>L IN E  C<br>**----- End of picture text -----**<br>


TO-220AB packages are not recommended for Surface Mount Application. 

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|infineon|infineon|infineon|infineon|infineon|
|---|---|---|---|---|
|<br>IRLB4132PbF<br>**Qualification Information**<br>infineon<br>~~Grenee~~|||||
||**Qualification Level**||Industrial<br>(per JEDEC JESD47F)†||
||**Moisture Sensitivity Level**|TO-220AB|N/A||
||**RoHS Compliant**||Yes||



- Applicable version of JEDEC standard at the time of product release. 

## **Notes:** 

- Repetitive rating; pulse width limited by max. junction temperature. 

-  Limited by TJmax, starting TJ = 25°C, L = 0.61mH, RG = 25, IAS = 32A. 

- Pulse width  400µs; duty cycle  2%. 

- Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 78A. 

- When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques Refer to application note #AN-994. 

- R is measured at TJ approximately 90°C. 

-  Starting TJ =25°C, L=0.50mH, RG = 25, IAS =60A, VDD =25V. (Statistical Limit) 

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## **Trademarks of Infineon Technologies AG** 

µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™ 

Trademarks updated November 2015 

## **Other Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

## **IMPORTANT NOTICE** 

**Edition 2016-04-19** The information given in this document shall in no **Published by** event be regarded as a guarantee of conditions or **Infineon Technologies AG characteristics  (“Beschaffenheitsgarantie”) . 81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information **© 2016 Infineon Technologies AG.** regarding the application of the product, Infineon **All Rights Reserved.** Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement **Do you have a question about this** of intellectual property rights of any third party. **document? Email:** erratum@infineon.com 

**Email:** erratum@infineon.com In addition, any information given in this document **is subject to customer’s compliance with its** obligations stated in this document and any applicable legal requirements, norms and **Document reference** standards concerning customer’s products and **ifx1** any use of the product of Infineon Technologies in **customer’s applications.** 

The data contained in this document is exclusively intended for technically trained staff. It is the **responsibility of customer’s technical departments** to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). 

Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, **Infineon Technologies’ products may** not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 

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## Links

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- [Supplier page](https://es.farnell.com/infineon/irlb4132pbf/mosfet-n-ch-30v-78a-to-220ab/dp/2726003)
---

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