# Power MOSFET, N Channel, 30 V, 200 A, 0.0026 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1298508/)

**URL**: https://novapart.co/products/IRL3713STRLPBF/power-mosfet-n-channel-30-v-200-a-00026-ohm-to-263
**SKU**: IRL3713STRLPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3200
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 330W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 330W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0026ohm |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 200A |
| Drain Source On State Resistance | 0.0026ohm |
| Gate Source Threshold Voltage Max | 2.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1298508/)

## **SMPS MOSFET** 

## . **Applications** 

High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use High Frequency Buck  Converters for Computer Processor Power 100% RG Tested 

## **Benefits** 

Ultra-Low Gate Impedance 

Very Low RDS(on) at 4.5V VGS Fully Characterized Avalanche Voltage and Current Lead-Free 

HEXFET ® Power MOSFET **VDSS RDS(on) max (m ID** ~~a en?)~~ **30V** 3.0@VGS = 10V 260A ~~ee ee~~ TO-220AB D[2] Pak TO-262 IRL3713PbF IRL3713SPbF IRL3713LPbF 

|and Current<br>Lead-Free|||||
|---|---|---|---|---|
|**Base Part  Number**|**Package Type**|**Standard Pack**||**Orderable Part Number**|
|||**Form**|**Quantity**||
|IRL3713PbF|TO-220|Tube|50|IRL3713PbF|
|IRL3713SLPbF|TO-262|Tube|50|IRL3713SLPbF|
|IRL3713SPbF|D<br>2Pak|Tube|50|IRL3713SPbF|
|||Tape and Reel Left|800|IRL3713STRLPbF|
|||Tape and Reel Right|800|IRL3713STRRPbF|



## **Absolute Maximum Ratings** 

|**Symbol**|**Parameter**|**Max**|**Units**|
|---|---|---|---|
|VDS|Drain-Source Voltage|30|V|
|VGS<br>~~a~~|Gate-to-Source Voltage<br>~~or~~<br>~~a~~|± 20<br>~~or~~|V<br>~~or~~|
|ID@ TC= 25°C<br>~~a~~|Continuous Drain Current, VGS@ 10V<br>~~or~~<br>~~a~~|260<br>~~or~~|A<br>~~or~~|
|ID @ TC = 100°C<br>~~a~~<br>~~a~~|Continuous Drain Current, VGS@ 10V<br>~~a~~<br>~~a~~|180||
|IDM<br>~~a~~|Pulsed Drain Current<br>~~a~~|1040||
|PD @TC = 25°C<br>~~a~~|Maximum Power Dissipation<br>~~a~~<br>~~LO~~<br>~~i~~|330<br>~~LO~~<br>~~i~~|W<br>~~i~~|
|PD@Tc = 100°C|Maximum Power Dissipation<br>~~i~~|170<br>~~i~~||
||Linear Derating Factor<br>~~i~~<br>~~Le~~|2.2<br>~~i~~<br>~~Le~~|W/°C<br>~~i~~<br>~~Le~~|
|TJ, TSTG|Linear Derating Factor<br>Junction and Storage Temperature Range<br>~~Le~~<br>~~a~~|-55 to +175<br>~~Le~~<br>~~a~~|°C<br>~~Le~~<br>~~a~~|



## **Thermal Resistance** 

|**Symbol**<br>~~a~~|**Parameter**<br>~~a~~|**Typ**<br>~~a~~|**Max**<br>~~a~~|**Units**<br>~~a~~|
|---|---|---|---|---|
|RθJC<br>~~a~~|Junction-to-Case<br>~~a~~<br>~~2~~|–––<br>~~a~~<br>~~2~~|0.45*<br>~~a~~<br>~~2~~|°C/W<br>~~a~~<br>~~2~~<br>~~TOELELEET~~|
|RqCS<br>~~a~~|Case-to-Sink, Flat, Greased Surface<br>~~a~~|0.50<br>~~a~~|–––<br>~~a~~||
|RθJA<br>~~TTT~~|Junction-to-Ambient<br>~~2~~<br>~~TTT~~<br>~~TOELELEET~~|–––<br>~~2~~<br>~~TOELELEET~~|62<br>~~2~~<br>~~TOELELEET~~||
|RθJA<br>~~TTT~~|Junction-to-Ambient (PCB Mount)<br>~~TTT~~<br>~~TOELELEET~~|–––<br>~~TOELELEET~~|40<br>~~TOELELEET~~||



* R θ JC (end of life) for D[2] Pak and TO-262  = 0.50°C/W. This is the maximum measured value after 1000 temperature cycles from -55 to 150°C and is accounted for by the physical wearout of the die attach medium. 

Notes 0) through 0) are on page 11 

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## **Static @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min**|**Typ**|**Max **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage|30|–––|–––|V|VGS= 0V, ID= 250μA|
|ΔV(BR)DSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|0.027|–––|V/°C|Reference to 25°C, ID= 1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|2.6|3.0|mΩ|VGS= 10V, ID= 38A�|
|||–––|3.3|4.0||VGS= 4.5V, ID= 30A�|
|VGS(th)|Gate Threshold Voltage|1.0|–––|2.5|V|VDS= VGS, ID= 250μA|
|IDSS|Drain-to-Source Leakage Current|–––|–––|50|μA|VDS= 30V, VGS= 0V|
|||–––|–––|20||VDS= 24V, VGS= 0V|
|||–––|–––|100||VDS= 24V, VGS= 0V, TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|200|nA|VGS= 20V|
||Gate-to-Source Reverse Leakage|–––|–––|-200||VGS= -20V|



## **Dynamic @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min**|**Typ**|**Max **|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|gfs|Forward Transconductance|76|–––|–––|S|VDS= 15V, ID= 30A||
|Qg|Total Gate Charge|–––|75|110|nC|ID= 30A<br>VDS= 15V<br>VGS= 4.5V�||
|Qgs|Gate-to-Source Charge|–––|24|–––||||
|Qgd|Gate-to-Drain ("Miller") Charge|–––|37|–––||||
|QOSS|Output Gate Charge||61|92||VGS= 0V, VDS= 15V||
|RG|Gate Resistance|0.5|–––|3.4|Ω|||
|td(on)|Turn-On Delay Time|–––|16|–––|ns|VGS= 4.5V�<br>VDD= 15V<br>ID= 30A<br>RG= 1.8Ω||
|tr|Rise Time|–––|160|–––||||
|td(off)|Turn-Off DelayTime|–––|40|–––||||
|tf|Fall Time|–––|57|–––||||
|Ciss|Input Capacitance|–––|5890|–––|pF|VGS= 0V<br>VDS= 15V<br>ƒ= 1.0MHz||
|Coss|Output Capacitance|–––|3130|–––||||
|Crss|Reverse Transfer Capacitance|–––|630|–––||||
|**Avalanche Characteristics**||||||||
|**Symbol**|**Parameter**||**Typ**|||**Max**|**Units**|
|EAS|Single Pulse Avalanche Energy�||–––|||1530|mJ|
|IAR|Avalanche Current��||–––|||46|A|



## **Diode Characteristics** 

|**Symbol**|**Parameter**|**Min**|**Typ**|**Max **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|IS|Continuous Source Current<br>(Body Diode)|–––|–––|260�|A|integral reverse<br>p-n junction diode.<br>MOSFET symbol<br>showing  the|
|ISM|<br>Pulsed Source Current<br>(Body Diode)���|–––|–––|1040�|||
|VSD|<br>Diode Forward Voltage|–––|0.80|1.3|V|TJ= 25°C, IS= 30A, VGS= 0V�|
|||–––|0.68|–––||TJ= 125°C, IS= 30A, VGS= 0V�|
|trr|Reverse RecoveryTime|–––|75|110|ns|TJ= 25°C, IF= 30A, VR= 0V<br>di/dt = 100A/μs�|
|Qrr|Reverse RecoveryCharge|–––|140|210|nC||
|trr|Reverse Recovery Time|–––|78|120|ns|TJ= 125°C, IF= 30A, VR= 20V<br>di/dt = 100A/μs�|
|Qrr|Reverse RecoveryCharge|–––|160|240|nC||



� ������������������������������������������������������������������������������������������������� 

**==> picture [203 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
 1000<br>VGS<br>TOP 10V<br>8.0V<br>6.0V<br>4.5V<br>4.0V 2) a<br>3.3V<br> 100 2.8V Pe TT |<br>BOTTOM 2.5V SS ——— === —— eet<br>ern<br> 10 2 |<br>Se caiill emae i eel<br> 1 AE ll<br>EE 2.5V Sd<br>} re<br>a<br>20μs PULSE WIDTH<br>PI T  = 25J °C<br>0.1<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

**==> picture [199 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
 1000 —————<br>a ee ee ee ee<br>T  = 175  CJ °<br> 100<br>er |<br>—nae ee ee eee eee<br> 10<br>== T  = 25  CJ °<br>Ey 2 ee<br>V      = 15V DS<br>PTI 20μs PULSE WIDTH<br> 1<br>2.5 3.0 3.5 4.0 4.5<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**==> picture [213 x 472] intentionally omitted <==**

**----- Start of picture text -----**<br>
 1000<br>VGS<br>TOP 10V<br>8.0V<br>6.0V<br>4.5V<br>4.0V HH<br>3.3V<br>2.8V Ye<br>BOTTOM 2.5V é<br> 100<br>—<br>for |<br> 10 2.5V<br>Coeel<br>SS<br>2<br>ee eel<br>ie<br>20μs PULSE WIDTH<br> 1 TTT LL T  = 175J °C<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>Fig 2.   Typical Output Characteristics<br>2.0<br>ID = 260A<br>Pr LLL<br>1.5 PELL Lear<br>1.0 PETE LT“|<br>0.5<br>TELE VGS = 10V<br>0.0<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T  , Junction TemperatureJ (  C)°<br>D<br>I   ,  Drain-to-Source Current (A)<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

**==> picture [432 x 483] intentionally omitted <==**

**----- Start of picture text -----**<br>
14<br>100000 ——== VCGS  iss    = C = 0V,       f = 1 MHZgs + Cgd,   Cds    SHORTED 12 esTf ID = 30A VV VDS DSDS == =  24V 15V  6V TT=a<br>Crss    = Cgd<br>C  = C + C<br>10000 Po| oo oss   ds  gd 10 aa A<br>Ciss<br>8<br>Coss<br>6<br>SSIS REA<br>1000 Crss<br>a | 4 7,<br>2<br>ae ee a el —<br>100 PCE ETT 0 ot HEE<br>1 10 100 0 40 80 120 160<br>VDS, Drain-to-Source Voltage (V) Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 1000 10000<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br> 100 aan T   J = 175  C° > cane 1000 jae AdTT 100μsec<br>——————————— pf tt a SL PT a<br>100 1msec<br>10msec<br> 10<br>10<br>DC<br>T  = 25  CJ °<br> 1<br>1 Tc = 25°C<br>Tj = 175°C<br>Single Pulse<br>0.1 ==PTT===AEE=== == == V      = 0 V GS — 0.1 eeHEL=:etl<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1 10 100<br>V     ,Source-to-Drain Voltage (V)SD VDS, Drain-to-Source Voltage (V)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I     , Reverse Drain Current (A)SD<br>C, Capacitance(pF)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

**==> picture [431 x 480] intentionally omitted <==**

**----- Start of picture text -----**<br>
300<br>LIMITED BY PACKAGE<br>250<br>=an Te Ves (Tour<br>-<br>200 kT | EET] Re | _<br>SEER SERRE : Voo<br>150 Sy RRS t ov ≤ 1<br>≤ 0.1 %<br>PT | tT AT an Pulse Wieth ys<br>Pt; TT yy Ty RS Duty Factor :<br>100 Pt tT ER TT PN<br>PET Fig 10a.   Switching Time Test Circuit<br>VDS<br>50 Pitt AT EN<br>90%<br>Pi ttt TETyt tT TTey tyTAGry /<br>0 Pie Te eT TT tt |<br>25 50 75 100 125 150 175 |<br>T   , Case TemperatureC (  C)° |<br>10%<br>VGS | |<br>\¢ > < > ! < p ><br>Fig 9.   Maximum Drain Current Vs. td(on) tr td(off) tf<br>Case Temperature<br>Fig 10b.   Switching Time Waveforms<br> 1<br>PEErr ee eee ee Eoeee eeeaeee<br>D = 0.50<br>a I ee<br>0.1 er 0.20<br>0.10<br>es ese ES enne<br>ee 0.05<br>el el eee<br>0.02 SINGLE PULSE<br>0.01 (THERMAL RESPONSE) PDM<br>0.01 antleT ty<br>t1<br>t2<br>a ee ee ee eee eee eee Notes:<br>1. Duty factor D = t   / t 1 2<br>Er ie 2. Peak T J = P DM x  Z thJC + TC<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

**==> picture [150 x 100] intentionally omitted <==**

**----- Start of picture text -----**<br>
15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>i<br>2V0VGS<br>n ba tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

**==> picture [121 x 92] intentionally omitted <==**

**----- Start of picture text -----**<br>
V(BR)DSS<br>> tp<br>al<br>a<br>IAS<br>**----- End of picture text -----**<br>


**==> picture [213 x 204] intentionally omitted <==**

**----- Start of picture text -----**<br>
3000<br>ID<br>PET<br>2500 hE TOP 30A 38A<br>BOTTOM 46A<br>2000 VfP\ ET|ETett<br>NNER<br>1500 KENNNN<br>1000 PEPTNANIAL<br>500 Pit Sa<br>PotSS<br>0 Pe tit | Tre Oe<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJ (  C)°<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy Vs. Drain Current 

**Fig 12b.** Unclamped Inductive Waveforms 

**==> picture [104 x 115] intentionally omitted <==**

**----- Start of picture text -----**<br>
QG<br>ov —— —<br>QGS QGD<br>VG<br>Charge<br>**----- End of picture text -----**<br>


**Fig 13a.** Basic Gate Charge Waveform 

**==> picture [130 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
Current Regulator<br>Same Type as D.U.T.<br>50K Ω<br>12V .2 μ F<br>| lst .3 μ F<br>+<br>D.U.T. -VDS<br>VGS<br>3mA<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13b.** Gate Charge Test Circuit 

**==> picture [276 x 431] intentionally omitted <==**

**----- Start of picture text -----**<br>
D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Re •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>(1) Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _ t<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current "| Current di/dt a<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  __ Forward Drop e _<br>® Inductor Curent e s ee<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


**Fig 14.** For N-Channel HEXFET ® Power MOSFETs 

**==> picture [426 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
E XAMPLE : T HIS  IS  AN IRF1010<br>LOT  CODE  1789<br>AS S E MBLED ON WW 19, 1997 INT E RNAT IONAL PART  NUMBER<br>IN T HE  AS S E MBLY LINE "C" RECT IFIE R<br>I RF 1010<br>LOGO<br>Note:   "P" in assembly line IeaR 719C<br>position indicates "Lead-Free" 17 89 DAT E  CODE<br>YE AR 7 =  1997<br>AS S EMBLY<br>LOT  CODE WEE K 19<br>LINE  C<br>**----- End of picture text -----**<br>


**==> picture [235 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
T HIS  IS  AN IRF530S  WITHLOT  CODE 8024AS S EMBLED ON WW 02, 2000 INT ERNAT IONALRECT IF IER a F 530S | PART  NUMBER<br>IN THE AS S EMBLY LINE "L" LOGO TeaR 002.<br>80 24 DAT E CODE<br>AS S E MBLY YE AR 0 =  2000<br>assembly line position LOT  CODE b HUY¢ 7 WEE K 02<br>t es "Lead - F ree” U U LINE L<br>OR<br>PART  NUMBER<br>INT ERNAT IONALRECT IF IER a F 530S |<br>LOGO TEAR 80 P002A24 I P =DAT E CODE DES IGNATES  LEAD - F REEPRODU CT (OPT IONAL)<br>AS S E MBLY qo YE AR 0 =  2000<br>LOT  CODE 44 a 4U ? WEEK 02<br>A =  AS S EMBLY S ITE CODE<br>**----- End of picture text -----**<br>


## TO-262 Package Outline Dimensions are shown in millimeters (inches) 

## TO-262 Part Marking Information 

**==> picture [262 x 139] intentionally omitted <==**

**----- Start of picture text -----**<br>
EXAMPL E: T HIS  IS  AN IRL 3103L<br>L OT  CODE 1789 PART  NUMBER<br>AS S EMBL ED ON WW 19, 1997IN THE  AS S EMBL Y LINE "C" INT ERNAT IONALRECT IFIERLOGO c TOR IRL3103L S 719<br>Note: "P" in ass embly line 17 89 DAT E CODE<br>pos ition indicates "Lead-Free" AS S EMBLY YEAR 7 =  1997<br>L OT  CODE WEE K 19<br>LINE  C<br>OR<br>PART NUMBER<br>INTERNAT IONAL |<br>RECT IF IER IRL3103L<br>L OGO TORP 719 A<br>17 89 DAT E CODE<br>P =  DES IGNAT ES  LEAD-F REE<br>AS S EMBLY PR ODU CT (OPTIONAL)<br>LOT CODE YEAR 7 =  1997<br>WEE K 19<br>A =  AS S EMBLY S ITE CODE<br>**----- End of picture text -----**<br>


Dimensions are shown in millimeters (inches) 

**==> picture [273 x 285] intentionally omitted <==**

**----- Start of picture text -----**<br>
TRR<br>oo°co<br>1.60 (.063)<br>1.50 (.059)<br>4.10 (.161)3.90 (.153) 1.60 (.063)1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 15.42 (.609)15.22 (.601) 24.30 (.957)23.90 (.941)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>ja EL | ie<br>FEED DIRECTION<br>13.50 (.532) 27.40 (1.079)<br>, 12.80 (.504) 23.90 (.941) IT<br>4<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>| oO |<br>30.40 (1.197)<br>NOTES :       MAX.<br>G 1.   COMFORMS TO EIA-418.2.   CONTROLLING DIMENSION: MILLIMETER.3.   DIMENSION MEASURED @ HUB.4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 26.40 (1.03924.40 (.961)3 I ) 4<br>**----- End of picture text -----**<br>


Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 1.4mH, RG = 25 Ω , IAS = 46A,VGS=10V. Pulse width ≤ 400μs; duty cycle ≤ 2%. 

This is only applied to TO-220A package. 

This is applied to D[2] Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).  For recommended footprint and soldering techniques refer to application note #AN-994. 

Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. 

θ 

|**Qualification information**<br>†|||
|---|---|---|
|Qualification level|Industrial<br>(per JEDEC JESD47F<br>††guidelines)||
|Moisture Sensitivity Level|TO-220 PAK|N/A|
||TO-262 PAK||
||D2-PAK|MS L1<br>(per JEDEC J-STD-020D<br>††)|
|RoHS compliant|(per JEDEC J<br>)<br>Yes||



- Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability ††   Applicable version of JEDEC standard at the time of product release 

|**Revision History**||
|---|---|
|**Date**<br>**Revision History**|**Comments**|
|6/17/2013|•Updated ds with New IR Corporate Template<br>•Updated Fig8-SOA curve with Spirito effect on page 4|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 



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