# Power MOSFET, N Channel, 55 V, 104 A, 8000 µohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:8650918/)

**URL**: https://novapart.co/products/IRL2505PBF/power-mosfet-n-channel-55-v-104-a-8000-ohm-to
**SKU**: IRL2505PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3700
**Stock**: 200+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:104A; Drain Source Voltage Vds:55V; On Resistance Rds(on):0.008ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Power D

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (23-Jan-2024) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 200W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 55V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 104A |
| Drain Source On State Resistance | 8000µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8650918/)

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D<br>Voss = 55V<br>Rpgion) = 0.008 Ω<br>G<br>Ip = 104A@<br>S<br>**----- End of picture text -----**<br>


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TO-220AB<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|a|**Parameter**<br>ee|**Max.**<br>©|**Units**|
|---|---|---|---|
|ID@ TC= 25°C<br>a|Continuous Drain Current, VGS@ 10V<br>ee|104<br>©|A|
|ID@ TC= 100°C<br>a|Continuous Drain Current, VGS@ 10V<br>ee|74<br>©||
|IDM<br>a|Pulsed Drain Current<br>|360<br>||
|PD@TC= 25°C<br>|Power Dissipation<br>|200<br>|W|
||Linear DeratingFactor<br>|1.3<br>|W/°C|
|VGS<br>|Gate-to-Source Voltage<br>|± 16<br>|V|
|EAS<br>~~Oe~~|Single Pulse Avalanche  Energy<br>~~Oe~~|500<br>~~Oe~~|mJ|
|IAR<br>~~a~~<br>~~es~~|Avalanche Current<br>~~©~~|54|A|
|EAR<br>~~se~~<br>~~es~~|Repetitive Avalanche Energy<br>~~se~~<br>~~©~~|20<br>~~se~~|mJ|
|dv/dt<br>~~es~~|Peak Diode Recovery dv/dt<br>~~©~~<br>~~©~~|5.0|V/ns|
|TJ<br>TSTG<br>~~es~~|Operating Junction and<br>Storage Temperature Range<br>~~©~~|55  to + 175|°C|
||SolderingTemperature, for 10 seconds|300(1.6mm from case)||
||Mounting torque, 6-32 or M3 srew<br>10 lbf•in (1.1N•m)|10 lbf•in (1.1N•m)||



1 8/3/04 

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[ [[Parameter]<br>[Vieaoss ———_—~| Min. Typ.Max. [Units]<br>∆ ∆<br>F Viewose! Ty]| BD r ainto-Sourceeakdown VoltageBreakdownTemp. CoefficiVoltag e nt|| ———85 [ 0.033—|—-— | Vi"CV |Vas=OV,ip=250HA| Reference to 26°C,<br>Rps(on) Static Drain-to-Source On-Resistance | —- |-— |0.010] Ω<br>[Vest = |= foois<br>fas ||GateForwardThresholdTransconductanceVoltage «1.0‘| 89 [ ——|—-=| 20 | VS || V op s= 28VVos , fl o =250KA=54A<br>ce | [— [7s<br>[Sunesorainmorones<br>-_ [= |= [a | ran<br>Gute [Gat Sourc e Fond to-Source tentage |—[— [100 | [Yess ty<br>Q,[TotalGate Reverse Leakage | —— |— |-100<br>Qs Charge | — [| 130 |_| fo = SAA<br>| [Gate-to-Sou][rce]<br>Qg; Charge |  —— [=| 28 | n© | Vos = 44V<br>tavon | Gatesto-Drain (‘miler’) Charge | ——— |— | 67 Ves = 5.0V, See Fig.<br>tr [Turn-OnDelayTime | —~ | 12 | Vop = 28V<br>[RiseTime | —~ | 1060 | Ip = 54A<br>Ω,<br>Ω,<br>Y FaiTime S*YSS«*d; Ro=0.50 See Fig.<br>**----- End of picture text -----**<br>


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_Min.|Typ|Max.[Units| MOSFETConditions symbol _—_—| D<br>integral reverse G<br>|| 13 | V | Ty=25°C,lg=54A Ves=0VO S<br>ff rae] aio | ng [T5251 SAR<br> _——| 680] 970 | nC | dilat = 100A/us @<br>@® Pulse width ≤  300us; duty cycle  ≤ 2%.<br>**----- End of picture text -----**<br>


Ω ISD ≤ 54A, di/dt: ≤ 230A/uUs, Vpp ≤ ≤ 

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1000 1000<br> TOP           15V  TOP           15V<br>                   12V                    12V<br>                   10V                    10V<br>                   8.0V                    8.0V<br>                   6.0V                    6.0V<br>                   4.0V                    4.0V<br>                   3.0V BOTTOM   2.5V Hey cdi                    3.0V BOTTOM   2.5V OP a eel<br>100 an) Aaa ae 100 lll AIT<br>sr ail! sts tl eat fi ——<———<br>foo ae 7 a 2.5V<br>10 10<br>El 2.5V 4 ET<br> 20µs PULSE WIDTH  20µs PULSE WIDTH<br>1 epAnimal  T   = 25°CJ A 1 pepPEEL  T   = 175°CJ<br>0.1 1 10 100 0.1 1 10 100<br>V     , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br>1000 2.5<br>ID = 90A<br>== PPveeU TUN URRI OUORENIIEN<br>e T  = 25°CJ S s—— 2.0 SUERTERR RR ERED<br>100 PP ea T  = 175°CJ e TTT Tty<br>1.5<br>a oe oe ae<br>1.0<br>10 HE} BERRUA ED? ccQU RARER<br>PSs<br>0.5<br>a GITOATOOT<br> V     = 25VDS VGS = 5V<br>1 PTTT E espone  esepunse worewor A 0.0-60 EE -40 -20 0 20 40 OATH 60 80  NATEOTONID 100 E 120 140 160 180<br>2.5 V     , Gate-to-Source Voltage (V)GS3.5 4.5 5.5 6.5 7.5 T  , Junction TemperatureJ (  C)°<br>I   , Drain-to-Source Current (A)D I   , Drain-to-Source Current (A)D<br>(Normalized)<br>D<br>I   , Drain-to-Source Current (A)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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10000<br>V      = 0V,         f = 1MHzGS<br>C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds<br>C      = Crss         gd<br>8000 | || C      = C     + Coss        ds         gd<br>s<br>6000 Se SA 00<br>a |<br>4000 ss<br>So,<br>ETE<br>2000 et |<br>ss<br>0 REa lll<br>1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


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15<br>I    = 54AD<br>129 pp ee pop pf t eee| aw SN | ee me<br>Pt LL YA<br>6<br>Pt A<br>P| OF |<br>3 pot | |<br> FOR TEST CIRCUIT<br>0 fffAna     SEE FIGURE 13 fl |<br>0 40 80 120 160 200<br>Q   , Total Gate Charge (nC)G<br>GS<br>V     , Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


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1000 1000<br> OPERATION IN THIS AREA LIMITED<br>=== OS                        BY RDS(on)<br>10µs<br>tite] ERNE<br>100<br>ae a<br>100µs<br>100<br>T  = 175°CJ _7F_| | | | | eh e a<br>1ms<br>A T  = 25°CJ 10 L N<br>e s 10ms<br>po<br>10 | “ov A 1  Single Pulse ll<br>0.4 0.8 1.2 1.6 2.0 2.4 2.8 1 10 100<br>V     , Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>I   , Drain Current (A)D<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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120<br>LIMITED BY PACKAGE<br>See “ee<br>100<br>an ae v 7 D.U.T.<br>80 Pt}PREECE R L .<br>i tT eet Tt tT Tt<br>ot )}5.0V<br> 1<br>60 ERRPt tT TETRERNEEETE] NET Sayeecer ≤ 0.1 % z<br>40 PtPt tTtettT tTETtT tTETNTIN Fig VDS 10a. Switching Time Test Circuit<br>20 PTT;Pi ttttTttyte tttty ty 90% r,<br>0<br>25 50 75 100 125 150 175<br>Pitti T   , Case TemperatureC  tT tT tT ttt (  C)°  tt 10% . /\<br>VGS l ee<br>td(on) tr td(off) tf<br>Fig 9. Maximum Drain Current Vs.<br>Case Temperature Fig 10b. Switching Time Waveforms<br> 1 — aesee ee es ee eee<br>na 0eleg ne a ic<br>D = 0.50<br>f e<br>et ee ee<br>e e ell<br>0.20<br>0.1 — 0.10 ieeCr | ee ean 4+ee rE” A rom ee | AIIM e | TTI C ETT<br>a — 68) ee ee ee PDM<br>e 0.05 e t1<br>0.02 SINGLE PULSE t2<br>SH 0.01 (THERMAL RESPONSE) Notes:<br>1. Duty factor D = t   / t1 2<br>2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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L<br>VDS<br>D.U.T.<br>RG +<br>i - VDD<br>IAS<br>soy J L<br>tp 0.01Ω<br>wd<br> 12a. Unclamped Inductive Test Circuit<br>V(BR)DSS<br>t<br>+ p<br>/ VDD<br>/ .<br>VDS<br>/ yp |e<br>/ \\<br>IAS oO OO<br>12b. Unclamped Inductive Waveforms<br>QG<br>[V] a<br>QGS QGD<br>VG<br>| 7<br>Charge<br>**----- End of picture text -----**<br>


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1200<br>                    ID<br>Ga TOP            22A<br>                   38A<br>1000 NER P\ [tf] BOTTOM    54A<br>pNP<br>800<br>600 N S E RV NS E Ee ee<br>PXEINC EE<br>400 NeNE  NSE<br>P| WNOEONG tt<br>200<br>P|  SSAA<br>pfPSAK<br> V      = 25V ae. DD<br>0<br>25 50 75 100 125 150 175<br>Starting T  , Junction Temperature (°C)J<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>12V .2µF<br>.3µF<br>0TatSS SS +<br>D.U.T. -VDS<br>VGS<br>3mA PIL<br>a<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


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D.U.T + Circuit Layout Considerations<br>_    •  Low Stray Inductance<br>@ •  Ground Plane<br> •   Low Leakage Inductance<br>| I - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Re •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>(1) Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. Period<br>——| 7<br>t<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current "| Current di/dt a<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  __ Forward Drop a<br>® Inductor Curent UW<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


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## Dimensions are shown in millimeters (inches) 

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10.54 (.415) 3.78 (.149) - B -<br>2.87 (.113) 10.29 (.405) 3.54 (.139) 4.69 (.185)<br>2.62 (.103) - A - 4.20 (.165) 1.32 (.052)<br>| gy 1.22 (.048)<br>6.47 (.255)<br>4 6.10 (.240)<br>maey CO =<br>15.24 (.600)<br>14.84 (.584)<br>LEAD ASSIGNMENTS<br>1.15 (.045)     MIN HEXFETLEAD ASSIGNMENTS       1 - GATE  IGBTs, CoPACK<br>1     2    3 1- GATE       2 - DRAIN 1- GATE<br>2- DRAIN       3 - SOURCE 2- COLLECTOR<br>| dar_ 3- SOURCE4- DRAIN       4 - DRAIN 3- EMITTER4- COLLECTOR<br>14.09 (.555)<br>13.47 (.530) 4.06 (.160)<br>3.55 (.140)<br>3X [0.93 (.037)] 0.69 (.027) 3X [0.55 (.022)] 0.46 (.018)<br>3X aii [1.40 (.055)] 1.15 (.045) 0.36  (.014)        M    B   A   M = 2.92 (.115)<br>2.64 (.104)<br>a, 2.54 (.100) || T<br>2X<br>**----- End of picture text -----**<br>


NOTES: 

1  DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.             3  OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB. 

- 2  CONTROLLING DIMENSION : INCH                                                       4  HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS. 

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E XAMPLE: T HIS  IS  AN IRF1010<br>LOT  CODE 1789<br>AS S EMBLED ON WW 19, 1997 INT ERNAT IONAL PART  NUMBER<br>IN T HE AS S E MBLY LINE "C" RE CT IFIER<br>LOGO<br>Note: position indicates "Lead-Free"  "P" in assembly line DAT E CODE<br>YEAR  7 =  1997<br>AS SE MBLY<br>LOT  CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 08/04 

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Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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---

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