# Power MOSFET, N Channel, 30 V, 116 A, 0.007 ohm, TO-263AB, Surface Mount

![Product image](https://novapart.co/image/farnell:2725997/)

**URL**: https://novapart.co/products/IRL2203NSTRLPBF/power-mosfet-n-channel-30-v-116-a-0007-ohm-to
**SKU**: IRL2203NSTRLPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3700
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Power Dissipation | 180W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 180W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.007ohm |
| Transistor Case Style | TO-263AB |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 116A |
| Drain Source On State Resistance | 0.007ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725997/)

PD - 95219A 

## IRL2203NSPbF IRL2203NLPbF 

Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated 100% RG Tested Lead-Free 

## HEXFET[®] Power MOSFET 

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D<br>VDSS = 30V<br>R  = 7.0m Ω<br>DS(on)<br>G<br>ID = 116A<br>S<br>**----- End of picture text -----**<br>


## **Description** 

Advanced HEXFET[®] Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

The D[2] Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D[2] Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRL2203NL) is available for low-profile applications. 

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D [2] Pak TO-262<br>IRL2203NSPbF IRL2203NLPbF<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|**Symbol**|**Parameter**|**Max**|**Units**|
|---|---|---|---|
|ID@ TC= 25°C|Continuous Drain Current, VGS@ 10V<br>~~a~~|116<br>~~a~~|A<br>~~a~~<br>~~a~~|
|ID@ TC= 100°C|Continuous Drain Current, VGS@ 10V<br>~~a~~|82<br>~~a~~||
|IDM|Pulsed Drain Current|400||
|PD@TA= 25°C|Power Dissipation<br>~~a~~|3.8<br>~~a~~|W<br>~~a~~|
|PD@TC= 25°C|Power Dissipation<br>~~a~~<br>~~a~~|180<br>~~a~~<br>~~a~~|W<br>~~a~~<br>~~a~~|
||Linear Derating Factor<br>~~a~~<br>~~a~~|1.2<br>~~a~~<br>~~a~~|W/°C<br>~~a~~<br>~~a~~|
|VGS|Gate-to-Source Voltage<br>~~a~~<br>~~**a**~~|± 16<br>~~a~~<br>~~**a**~~|V<br>~~a~~<br>~~**a**~~|
|IAR|Avalanche Current<br>~~**a**~~|60<br>~~**a**~~|A<br>~~**a**~~|
|EAR|Repetitive Avalanche Energy<br>~~2~~|18<br>~~2~~|mJ<br>~~2~~|
|dv/dt|Peak Diode Recovery dv/dt<br>~~2~~<br>~~a~~<br>~~rr~~|5.0<br>~~2~~<br>~~a~~|V/ns<br>~~2~~<br>~~a~~|
|TJ|Operating Junction and<br>Storage Temperature Range<br>~~a~~<br>~~rr~~|-55  to + 175<br>~~a~~|°C<br>~~a~~|
|TSTG|SolderingTemperature, for 10 seconds<br>~~rr~~|300(1.6mm from case)||



## **Thermal Resistance** 

|**Symbol**|**Parameter**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|
|RθJC|Junction-to-Case|–––|0.85|°C/W|
|RθJA|Junction-to-Ambient (PCB mount, steady state)<br>~~2~~|–––<br>~~2~~|40<br>~~2~~||



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## IRL2203NS/LPbF **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min**|**Typ**|**Max **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage<br>~~pe~~|30<br>~~pe~~|–––<br>~~pe~~|–––<br>~~pe~~|V<br>~~pe~~|VGS= 0V, ID= 250µA<br>~~pe~~|
|∆V(BR)DSS/∆TJ|Breakdown Voltage Temp. Coefficient<br>~~pe~~|–––<br>~~pe~~<br>~~|~~|0.029<br>~~pe~~<br>~~|~~|–––<br>~~pe~~<br>|V/°C<br>~~pe~~|Reference to 25°C, ID= 1mA<br>~~pe~~<br>~~——~~|
|RDS(on)|Static Drain-to-Source On-Resistance<br>~~a~~|–––<br>~~a~~<br>~~|~~|–––<br>~~a~~<br>~~|~~|7.0<br>~~a~~<br>|~~a~~|VGS= 10V, ID= 60A<br>~~a~~<br>~~——~~|
|||–––<br>~~a~~<br>~~|~~|–––<br>~~a~~<br>~~||~~|10<br>~~a~~<br>~~|~~||VGS= 4.5V, ID= 48A<br>~~a~~<br>~~——~~<br>~~®~~|
|VGS(th)|Gate Threshold Voltage<br>~~a~~<br>~~po~~|1.0<br>~~a~~<br>~~|~~<br>~~po~~|–––<br>~~a~~<br>~~| |~~<br>~~po~~<br>~~eG~~|3.0<br>~~a~~<br>~~|~~<br>~~po~~<br>~~eG~~|V<br>~~a~~<br>~~po~~<br>~~eG~~|VDS= VGS, ID= 250µA<br>~~a~~<br>~~——~~<br>~~®~~<br>~~po~~<br>~~eG~~|
|gfs|Forward Transconductance<br>~~po~~<br>~~Gs~~|73<br>~~|~~<br>~~po~~<br>~~Gs~~<br>~~ee~~|–––<br>~~| ~~<br>~~po~~<br>~~Gs~~<br>~~eG~~<br>~~ee~~|–––<br><br>~~po~~<br>~~Gs~~<br>~~eG~~<br>~~ee~~|S<br>~~po~~<br>~~Gs~~<br>~~eG~~<br>~~ee~~|VDS= 25V, ID= 60A<br>~~——~~<br>~~po~~<br>~~Gs~~<br>~~eG~~<br>~~eee~~|
|IDSS|Drain-to-Source Leakage Current<br>~~Gs~~<br>~~ee~~|–––<br>~~Gs~~<br>~~ee~~<br>~~ee~~<br>~~|~~|–––<br>~~Gs~~<br>~~eG~~<br>~~ee~~<br>~~ee~~<br>~~|~~|25<br>~~Gs~~<br>~~eG~~<br>~~ee~~<br>~~ee~~<br>|µA<br>~~Gs~~<br>~~eG~~<br>~~ee~~<br>~~ee~~|VDS= 30V, VGS= 0V<br>~~Gs~~<br>~~eG~~<br>~~ee~~<br>~~eee~~|
|||–––<br>~~ee~~<br>~~ee~~<br>~~|~~|–––<br>~~ee~~<br>~~ee~~<br>~~||~~|250<br>~~ee~~<br>~~ee~~<br>~~|~~||VDS= 24V, VGS= 0V, TJ= 125°C<br>~~ee~~<br>~~eee~~|
|IGSS|Gate-to-Source Forward Leakage<br>~~ee~~<br>~~————————_——~~|–––<br>~~ee~~<br>~~ee~~<br>~~|~~<br>~~————————_——~~|–––<br>~~ee~~<br>~~ee~~<br>~~||~~<br>~~————————_——~~|100<br>~~ee~~<br>~~ee~~<br>~~|~~<br>~~————————_——~~|nA<br>~~ee~~<br>~~ee ~~<br>~~————————_——~~|VGS= 16V<br>~~ee~~<br> ~~eee~~<br>~~————————_——~~|
||Gate-to-Source Reverse Leakage<br>~~————————_——~~|–––<br>~~————————_——~~<br>~~a~~|–––<br>~~————————_——~~<br>~~a~~|-100<br>~~————————_——~~<br>~~a~~||VGS= -16V<br>~~————————_——~~|
|Qg|Total Gate Charge<br>~~————————_——~~<br>~~ee~~|–––<br>~~————————_——~~<br>~~a~~<br>~~ee~~|–––<br>~~————————_——~~<br>~~a~~<br>~~ee~~|60<br>~~————————_——~~<br>~~a~~<br>~~ee~~|nC<br>~~————————_——~~|VGS= 4.5V, See Fig. 6 and 13<br>ID= 60A<br>VDS= 24V<br>~~————————_——~~|
|Qgs|Gate-to-Source Charge<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~|14<br>~~a~~|||
|Qgd|Gate-to-Drain ("Miller") Charge<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~|33<br>~~a~~|||
|RG|Gate Resistance<br>~~pe~~|0.2<br>~~pe~~<br>~~ee~~|–––<br>~~pe~~|3.0<br>~~pe~~|Ω<br>~~pe~~|~~pe~~|
|td(on)|Turn-On Delay Time<br>~~es~~|–––<br>~~es~~<br>~~ee~~<br>~~es~~|11<br>~~es~~<br>~~es~~|–––<br>~~es~~|~~To~~|VDD= 15V<br>ID= 60A<br>RG= 1.8Ω<br>VGS= 4.5V, See Fig. 10<br>~~To~~|
|tr|Rise Time<br>~~ee~~|–––<br>~~ee~~<br>~~ee~~<br>~~es~~|160<br>~~ee~~<br>~~es~~|–––<br>~~ee~~|||
|td(off)|Turn-Off Delay Time<br>~~Ds~~|–––<br>~~es~~<br>~~Ds~~|23<br>~~es~~<br>~~Ds~~|–––<br>~~Ds~~|||
|tf|Fall Time<br>|–––<br>|66<br>|–––<br>|||
|LD|Internal Drain Inductance<br>|–––<br>|4.5<br>|–––<br>|Nh<br>~~To~~|Between lead,<br>6mm (0.25in.)<br>from package<br>and center of die contact<br>~~To~~|
|LS|Internal Source Inductance<br>|–––<br>|7.5<br>|–––<br>|||
|Ciss|Input Capacitance<br><br>~~ee~~|–––<br><br>~~ee~~|3290<br><br>~~ee~~|–––<br><br>~~ee~~|pF<br>~~To~~|VGS= 0V<br>VDS= 25V<br>ƒ = 1.0MHz, See Fig. 5<br>~~To~~|
|Coss|Output Capacitance<br>~~a~~|–––<br>~~a~~|1270<br>~~a~~|–––<br>~~a~~|||
|Crss|Reverse Transfer Capacitance<br>~~a~~|–––<br>~~a~~|170<br>~~a~~|–––<br>~~a~~|||
|EAS|Single Pulse Avalanche Energy<br>~~a~~<br>~~pO~~|–––<br>~~a~~<br>~~pO~~|1320<br>~~a~~<br>~~pO~~|290<br>~~a~~<br>~~pO~~|mJ<br>~~pO~~|IAS= 60A, L = 0.16mH<br>~~pO~~|



® Repetitive rating;  pulse width limited by max. junction temperature. ( See fig. 11 ) ® Starting TJ = 25°C, L = 0.16mH RG = 25 Ω , IAS = 60A, VGS=10V (See Figure 12) 6) ISD ≤ 60A , di/d t ≤ 110A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C ® Pulse width ≤ 400µs; duty cycle ≤ 2%. 

This is a calculated value limited to TJ = 175°C . 

@ Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. 

When mounted on 1" square PCB (FR-4 or G-10 Material).  For recommended footprint and soldering techniques refer to application note #AN-994. 

θ 

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 1000  1000<br>VGS VGS<br>TOP 15V TOP 15V<br>10V 10V<br>4.5V 4.5V<br>3.7V 3.7V<br>3.5V 3.5V<br>3.3V 3.3V<br>3.0V 3.0V<br>BOTTOM 2.7V BOTTOM 2.7V<br>p p a e<br> 100  100<br>poe TT \ fp 2.7V<br> 10 2.7V  10<br>etal ele Sei eerie<br> 1 SCoe IT 20µs PULSE WIDTHT  = 25J °C  1 ToI HI ce 20µs PULSE WIDTHT  = 175J °C<br>0.1  1  10  100 0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br> 1000 2.5<br>ID = 100A<br>= = ° = A o<br>T  = 25  CJ 2.0<br>BER ERSRSE= FERRE EEE<br>H A T  = 175  CJ  ee ° FCCC!<br>1.5<br> 100 TAPPPA CCPCCCC eereer<br>a ee ee es es es ee eee<br>1.0<br>HP EERE HET<br>0.5<br>HR PTE EEE<br>V      = 15VDS<br> 10 A 20µs PULSE WIDTH 0.0 PCEEEPPPeee rt eS VGS = 10V<br>2.0 3.0 4.0 5.0 6.0 7.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>V     , Gate-to-Source Voltage (V)GS T  , Junction TemperatureJ (  C)°<br>I   ,  Drain-to-Source Current (A)D I   ,  Drain-to-Source Current (A)D<br>(Normalized)<br>D<br>I   ,  Drain-to-Source Current (A)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance Vs. Temperature 

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6000<br>VGS = 0V, f = 1MHz<br>TT] Ciss = Cgs + Cgd , C      SHORTEDds<br>5000 CCrssoss == CCgdds + Cgd<br>=<br>4000<br>RL<br>Ciss<br>SSE SHH<br>3000<br>2000 Coss<br>PE Ett<br>ll<br>1000 e e all<br>Crss<br>0 aePE TT e pS lTT<br> 1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


## **Fig 5.** Typical Capacitance Vs. Drain-to-Source Voltage 

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 1000<br> 100<br>T  = 175  CJ °<br> 10<br>T  = 25  CJ °<br> 1<br>V      = 0 V GS<br>0.1<br>0.0 0.4 0.8 1.2 1.6 2.0 2.4<br>V     ,Source-to-Drain Voltage (V)SD<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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15<br>ID = 60A<br>Po tT | EE<br>VDS = 24V<br>12 VDS = 15V<br>FEE S e<br>9 Pf fe fe t e<br>Cea<br>6<br>FAT<br>3 TT OAT TT<br>4<br>FOR TEST CIRCUIT<br>0 fVif|f }  oc SEE FIGURE       13<br>0 20 40 60 80<br>Q   , Total Gate Charge (nC)G<br>Fig 6.   Typical Gate Charge Vs.<br>Gate-to-Source Voltage<br>10000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>1000<br>100<br>100µsec<br>1msec<br>10<br>Tc = 25°C 10msec<br>Tj = 175°C<br>Single Pulse<br>1<br>1 10 100<br>VDS  , Drain-toSource Voltage (V)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 8.** Maximum Safe Operating Area 

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120<br>LIMITED BY PACKAGE<br>pan TT Von Re<br>100 | oO 7<br>80 pttitssJ tt tt tT | D.UT. -<br>PES a t vs<br>60 SS Seee Nee Vos ≤ 1<br>≤ 0.1 %<br>Pit} tt tt TNE TT buy Factor<br>40<br>N Fig 10a. Switching Time Test Circuit<br>20 FECESPitt VDS |<br>Pi tttttttT ty t ttt yyA 90% [\<br>0<br>25 50 75 100 125 150 175<br>T   , Case TemperatureC (  C)°<br>Pitt tT Tt TT tt 10% / \ OV/\<br>Fig 9.   Maximum Drain Current Vs. VGS l ee<br>Case Temperature td(on) tr td(off) tf<br>Fig 10b. Switching Time Waveforms<br> 1 ee<br>es es oc eee<br>P D = 0.50 E ere<br>ee er ty<br>e a e_ ee  eeeeeeeee<br>0.20<br>er<br>0.10 A<br>0.1<br>ee ca lS ee ee  ee| ee ee<br>0.05 —— a ee eee PDM<br>ES ee<br>SINGLE PULSE<br>0.02 (THERMAL RESPONSE) t1<br>0.01 cr enna<br>t2<br>a e RO eee eel<br>Notes:<br>1. Duty factor D = t   / t1 2<br>co n 2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 Co 0.001 0.01 0.1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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600<br>ID<br>Gana<br>TOP 24A<br>500 NERS 42A<br>BOTTOM 60A<br>PX ET TT<br>P NT<br>400 tT tt<br>GENEEE EeeEE Eee Eee<br>300<br>NIA<br>KNOX<br>PINAIACPy<br>200 Py PT RAKINC TT TT TT<br>100<br>potpfUSEee...USUSA USA<br>pfUSEee...USUSA<br>Eee...USUSA<br>0 ~S<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJJ (  C)°°<br>Fig 12c. MaximumVs. MaximumVs.Vs. Drain AvalaCurre AvalaCurreCurre n tche Energyche Energy Energy<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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15V D<br>TOP 24A<br>500 NERS 42A<br>VDS L DRIVER PX ET TT BOTTOM 60A<br>P NT<br>400 tT tt<br>RG D.U.T +<br>- [V][DD] GENEEE EeeEE Eee Eee<br>IAS A<br>ot 20VVGS 300 NIA<br>tp 0.01 Ω<br>“ly KNOX<br>12a. Unclamped Inductive| Test Circuit_ 200 PINAIACPy PT RAKINC TT TT TT<br>— tp V(BR)DSS 100 potpfUSEee...USUSA<br>0 ~S<br>25 50 75 100 125 150 175<br>/ Starting T  , Junction TemperatureJJ (  C)°°<br>/ y |\ Fig 12c. MaximumVs. MaximumVs.Vs. Drain AvalaCurre AvalaCurreCurre n tche Energyche Energy Energy<br>IAS<br>12b. Unclamped Inductive Waveforms<br>Current Regulator<br>Same Type as D.U.T.<br>50K Ω<br>12V .2 µ F !<br>QG .3 µ F<br>BE | +<br>CT | J \ D.U.T. -VDS<br>A QGS QGD<br>VGS<br>VG 3mA<br>Oe.<br>IG ID<br>Charge Current Sampling Resistors<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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‘* + Circuit Layout Considerations<br>D.U.T    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| | - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Re •   dv/dt controlled by Rg +<br>•   -<br>@ •   D.U.T. - Device Under Test<br>> Isp controlled by Duty Factor "D"<br>*Reverse Polarity of D.U.T for P-Channel<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>[<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ii Current di/dt /<br>©) D.U.T. VDS Waveform<br>Diode Recoverydv/dt \ F<br>L,<br>Re-Applied<br>Voltage Body Diode  Forward Drop<br>® Inductor Curent ee ee<br>Ripple  ≤ 5% [ ]<br>**----- End of picture text -----**<br>


For N-channel HEXFET[®] power MOSFETs 

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THIS IS AN IRF530S WITH PART NUMBER<br>LOT CODE 8024 INTERNATIONAL cS<br>ASSEMBLED ON WW 02, 2000 RECTIFIER F530S<br>IN THE ASSEMBLY LINE "L" LOGO TeaR 002.<br>80 24 DATE CODE<br>YEAR 0 =  2000<br>ASSEMBLY<br>assembly line position LOT CODE Le 7 WEEK 02<br>"Lead — Free” L J LINE L<br>OR<br>PART NUMBER<br>INTERNATIONAL cS<br>RECTIFIER F530S<br>LOGO TEAR P0024 DATE CODE<br>80 24 P =  DESIGNATES LEAD - FREE<br>PRODUCT (OPTIONAL)<br>ASSEMBLY WU<br>LOT CODE ‘| 1?U YEAR 0 =  2000WEEK 02<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


## **Notes:** 

**1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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## TO-262 Package Outline Dimensions are shown in millimeters (inches) 

## TO-262 Part Marking Information 

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EXAMPLE: THIS IS AN IRL3103L<br>LOT CODE 1789 PART NUMBER<br>ASSEMBLED ON WW 19, 1997IN THE ASSEMBLY LINE "C" INTERNATIONALRECTIFIERLOGO cSTORIRL3103L719C<br>17 89 DATE CODE<br>Note: "P”indicatesin assembly"Lead line- Free”position ASSEMBLYLOT CODE YEAR 7 =  1997WEEK 19<br>LINE C<br>OR<br>PART NUMBER<br>INTERNATIONAL —S<br>RECTIFIER IRL3103L<br>LOGO TOR P7i9A.<br>7 89 DATE CODE<br>ASSEMBLY P =  DESIGNATES LEAD-FREE<br>LOT CODE PRODUCT (OPTIONAL)<br>YEAR 7 =  1997<br>WEEK 19<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


**Notes: 1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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Dimensions are shown in millimeters (inches) 

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TRR<br>1.60 (.063)<br>1.50 (.059)<br>1.60 (.063)<br>4.10 (.161)3.90 (.153) 1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION ZS 1.85 (.073) — seeeaee 11.60 (.457) a |<br>1.65 (.065) 11.40 (.449) 24.30 (.957)<br>15.42 (.609)<br>23.90 (.941)<br>15.22 (.601)<br>TRL<br>1.75 (.069)<br>10.90 (.429) £ | 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>**----- End of picture text -----**<br>


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13.50 (.532) 27.40 (1.079)<br>° 12.80 (.504) 23.90 (.941) an<br>4<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>| OO |<br>30.40 (1.197)<br>NOTES : oo J       MAX.<br>1.   COMFORMS TO EIA-418.2.   CONTROLLING DIMENSION: MILLIMETER. 26.40 (1.039)24.40 (.961) It 4<br>3.   DIMENSION MEASURED @ HUB.<br>3<br>**----- End of picture text -----**<br>


4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 10/2010 

www.irf.com 

10 



## Links

- [View this product on Novapart](https://novapart.co/products/IRL2203NSTRLPBF/power-mosfet-n-channel-30-v-116-a-0007-ohm-to)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/infineon/irl2203nstrlpbf/mosfet-n-ch-30v-116a-to-263ab/dp/2725997)
---

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