# Power MOSFET, N Channel, 60 V, 48 A, 0.023 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:8650217/)

**URL**: https://novapart.co/products/IRFZ44EPBF/power-mosfet-n-channel-60-v-48-a-0023-ohm-to-220ab
**SKU**: IRFZ44EPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3270
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:48A; Drain Source Voltage Vds:60V; On Resistance Rds(on):0.023ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power Dis

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Qualification | - |
| Transistor Mounting | Through Hole |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8650217/)

## PD - 94822 

## IRFZ44EPbF 

## HEXFET[®] Power MOSFET 

Advanced Process Technology Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated Lead-Free 

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D<br>VDSS = 60V<br>R  = 0.023Ω<br>DS(on)<br>G<br>ID = 48A<br>S<br>**----- End of picture text -----**<br>


## **Description** 

Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low  on-resistance per silicon area.  This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts.  The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry. 

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TO-220AB<br>**----- End of picture text -----**<br>


**Absolute Maximum Ratings Parameter Max. Units** ~~TO —.-nmN>"--0nwvNvWv-f_ a~~ ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 48 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 34 A ~~aes~~ IDM Pulsed Drain Current 192 ~~ae a~~ PD @TC = 25°C Power Dissipation 110 W ~~ee~~ Linear Derating Factor 0.71 W/°C VGS Gate-to-Source Voltage ± 20 V ~~—— ee~~ EAS Single Pulse Avalanche Energy 220 mJ ~~eo~~ IAR Avalanche Current 29 A ~~ie~~ EAR Repetitive Avalanche Energy 11 mJ ~~ie~~ dv/dt Peak Diode Recovery dv/dt 5.0 V/ns TJ Operating Junction and -55  to + 175 TSTG Storage Temperature Range °C a ~~re~~ Soldering Temperature, for 10 seconds 300 (1.6mm from case ~~ee~~ ) ~~oo~~ Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m) 

## **Thermal Resistance** 

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||||||
|---|---|---|---|---|
|Parameter|Typ.|Max.|Units|
|RθJC|Junction-to-Case|–––|1.4|
|RθCS|Case-to-Sink, Flat, Greased Surface|0.50|–––|°C/W|
|RθJA|Junction-to-Ambient|–––|62|
|www.irf.com|1|

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www.irf.com 

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## IRFZ44EPbF 

## **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

|||~~es ee~~|~~ee~~|~~ee~~|||
|---|---|---|---|---|---|---|
||**Parameter**<br>ee|**Min.**<br>ee<br>~~es ee~~<br>~~es~~|**Typ. **<br>ee<br>~~ee~~<br>~~ee~~|**Max. **<br>ee<br>~~ee~~<br>~~ee~~|**Units**<br>ee|**Conditions**|
|V(BR)DSS|Drain-to-Source Breakdown Voltage<br>~~es~~<br>~~es~~|60<br>~~es ee~~<br>~~es~~<br>~~es~~<br>~~ee~~<br>|–––<br>~~ee ~~<br>~~es~~<br>~~ee~~<br>~~es~~<br>|–––<br> ~~ee~~<br>~~es~~<br>~~ee~~<br>|V<br>~~es~~|VGS= 0V, ID= 250µA|
|∆V(BR)DSS/∆TJ|Breakdown Voltage Temp. Coefficient<br>~~ee~~<br>~~es~~|–––<br>~~es ~~<br>~~ee~~<br>~~ee~~<br>~~es~~|0.063<br> ~~ee ~~<br>~~ee~~<br>~~es~~<br>~~es~~|–––<br> ~~ee~~<br>~~ee~~<br>~~es~~|V/°C<br>~~ee~~|Reference to 25°C, ID= 1mA<br>~~®~~|
|RDS(on)|Static Drain-to-Source On-Resistance<br>~~es~~<br>~~es~~|–––<br>~~ee~~<br>~~es~~<br>~~**e**e~~|––– <br>~~es~~<br>~~es~~<br>~~**e**d~~|0.023<br>~~es~~|Ω|VGS= 10V, ID= 29A<br>~~®~~|
|VGS(th)|Gate Threshold Voltage<br>~~es ~~<br>~~ee~~<br>~~es~~|2.0<br>~~ee ~~<br> ~~es ~~<br>~~ee~~<br>~~**e**e~~<br>~~s~~|–––<br> ~~es~~<br> ~~es ~~<br>~~ee~~<br>~~**e**d~~<br>~~s~~|4.0<br> ~~es~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~|VDS= VGS, ID= 250µA<br>~~®~~<br>~~©~~|
|gfs|Forward Transconductance<br>~~es~~|15<br>~~**e**e~~<br>~~s~~|–––<br>~~**e**d~~<br>~~s~~|–––<br>~~ee~~|S|VDS= 30V, ID= 29A<br>~~©~~|
|IDSS|Drain-to-Source Leakage Current<br>~~es~~<br>~~ES~~|–––<br>~~**e**e ~~<br>~~s~~<br>~~ES~~|–––<br> ~~**e**d~~<br>~~s ~~<br>~~ES~~|25<br> ~~ee~~<br>~~ES~~|µA<br>~~ES~~|VDS= 60V, VGS= 0V<br>~~©~~|
|||–––<br>~~ES~~|–––<br>~~ES~~|250<br>~~ES~~||VDS= 48V, VGS= 0V, TJ= 150°C|
|IGSS<br>~~ee~~|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V|
||Gate-to-Source Reverse Leakage<br>~~es~~<br>|–––<br>~~es~~<br>ee<br>|–––<br>~~es~~<br>|-100<br>~~es~~<br>||VGS= -20V|
|Qg<br>~~ee~~<br>~~Se~~|Total Gate Charge<br>~~ee~~<br>|–––<br>~~ee~~<br>ee<br><br>~~ee~~|–––<br>~~ee~~<br>|60<br>~~ee~~<br>|nC|ID= 29A<br>VDS= 48V<br>VGS= 10V, See Fig. 6 and 13<br>~~°~~|
|Qgs<br>~~ee~~<br>~~Se~~|Gate-to-Source Charge<br>~~ee~~|–––<br>ee<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~|13<br>~~ee~~|||
|Qgd<br>~~ee~~<br>~~Se~~<br>~~a~~|Gate-to-Drain("Miller")Charge<br>|–––<br>ee<br><br>~~ee~~<br>ee|–––<br>|23<br>|||
|td(on)<br>~~Se~~<br>~~a~~|Turn-On Delay Time<br>~~es~~|–––<br>~~ee~~<br>~~es~~<br>ee|12<br>~~es~~|–––<br>~~es~~|ns|VDD= 30V<br>ID= 29A<br>RG= 15Ω<br>RD= 1.1Ω, See Fig. 10<br>~~°~~<br>||
|tr<br>~~Se~~<br>~~a~~<br>es|Rise Time<br>~~ee~~|–––<br>~~ee~~<br>ee<br>~~ee~~|60<br>~~ee~~|–––<br>~~ee~~|||
|td(off)<br>~~a~~<br>es|Turn-Off Delay Time<br>~~ee~~|–––<br>ee<br>~~ee~~|70<br>~~ee~~|–––<br>~~ee~~|||
|tf<br>es|Fall Time<br>~~ee~~|–––<br>~~ee~~|70<br>~~ee~~|–––<br>~~ee~~|||
|LD|Internal Drain Inductance|–––|4.5|–––<br>~~|~~|nH<br>~~|~~|Between lead,<br>6mm (0.25in.)<br>from package<br>and center of die contact<br>S<br>D<br>G|
|LS<br>~~pf~~|Internal Source Inductance<br>~~pf~~|–––|7.5|–––<br>~~|~~|nH<br>~~|~~||
|Ciss<br>~~pf~~<br>ee<br>ee|Input Capacitance<br>~~pf~~<br>~~ee~~<br>|–––<br>~~ee~~<br>ee<br>|1360<br>~~ee~~<br>|–––<br>~~ee~~<br>|pF|VGS= 0V<br>VDS= 25V<br>ƒ = 1.0MHz, See Fig. 5|
|Coss<br>~~pf~~<br>ee<br>ee|Output Capacitance<br>~~pf~~<br>~~ee~~<br>|–––<br>~~ee~~<br>ee<br><br>ee|420<br>~~ee~~<br>|–––<br>~~ee~~<br>|||
|Crss<br>ee<br>ee|Reverse Transfer Capacitance<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~<br>ee<br>~~ee~~<br>ee|160<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~<br>~~ee~~|||



## **Source-Drain Ratings and Characteristics** 

|~~ee~~|**Parameter**<br>~~ee~~|**Min. **|**Typ. **|**Max.**|**Units**|**Conditions**<br>~~a~~|**Conditions**<br>~~a~~|
|---|---|---|---|---|---|---|---|
|IS<br>~~ee~~|Continuous Source Current<br>(Body Diode)<br>~~ee~~|–––|–––|48|A|G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunction diode.<br>~~a~~<br>~~°~~|S<br>D<br>~~a~~|
|ISM<br>~~ee~~<br>~~ee~~|Pulsed Source Current<br>(BodyDiode)<br>~~ee~~<br>~~ee~~|–––|–––|192||||
|VSD<br>~~ee~~<br>~~Sn~~|Diode Forward Voltage<br>~~ee~~<br>~~Sn~~|–––|–––|1.3|V|TJ= 25°C, IS= 29A, VGS= 0V<br>~~°~~||
|trr<br>~~ee~~<br>~~Sn~~<br>~~—.>~~|Reverse Recovery Time<br>~~ee~~<br>~~Sn~~<br>~~—.>~~<br>~~HHH~~|–––<br>~~HHH~~|69<br>~~HHH~~|104<br>~~HHH~~|ns<br>~~HHH~~|TJ= 25°C, IF= 29A<br>di/dt = 100A/µs<br>~~°~~<br>~~®~~||
|Qrr<br>~~ee~~<br>~~Sn~~<br>~~—.>~~|Reverse RecoveryCharge<br>~~ee~~<br>~~Sn~~<br>~~—.>~~<br>~~HHH~~|–––<br>~~HHH~~|177<br>~~HHH~~|266<br>~~HHH~~|nC<br>~~HHH~~|||
|ton<br>~~Sn~~<br>~~—.>~~|Forward Turn-On Time<br>~~Sn~~<br>~~—.>~~<br>~~HHH~~<br>~~ee~~|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)<br>~~HHH~~<br>~~®~~<br>~~ee~~||||||



- ®© Repetitive rating;  pulse width limited by ISD ≤ 29A, di/dt ≤ 320A/µs, VDD ≤ V(BR)DSS, max. junction temperature. ( See fig. 11 ) TJ ≤ 175°C 

- @ Starting TJ = 25°C, L = 520µH[@] RG = 25Ω, IAS = 29A. (See Figure 12) 

Pulse width ≤ 300µs; duty cycle ≤ 2%. 

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## IRFZ44EPbF 

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 1000<br>VGS<br>TOP 15V<br>10V De<br>8.0V<br>7.0V 0 |<br>6.0V<br>5.5V<br>5.0V<br>BOTTOM 4.5V 0 a<br> 100 ren t ttSY Zz2ctill ll<br>Pa t Ht<br>Ee<br>ee)<br>a<br>ey a<br> 10 CATIL meeilll<br>4.5V<br>C7Me<br>YA TT<br>20µs PULSE WIDTH<br>T  = 25J °C<br> 1<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

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 1000 ==aee== SSS<br>eeee es<br>T  = 25  CJ °<br> 100 PPLT E PERL ee<br>ty pet<br>er | T  = 175  CJ °<br>ee ee ee eee eee<br> 10 OlPTILWA1 ee| TreEi tLrerereeee aeti<br>ey se ee ee ee ee ee eee<br>> 2 ee ee ee ee ee eee eee ee<br>V      = 25VDS<br>20µs PULSE WIDTH<br> 1 PeEPP EP<br>4 5 6 7 8 9 10<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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 1000<br>VGS<br>TOP 15V<br>10V a<br>8.0V<br>7.0V Ht<br>6.0V<br>5.5V<br>5.0V<br>BOTTOM 4.5V 1 a<br> 100 r eill<br>a e eee ee eee<br>on<br>a ee a eee ee<br>SR)” Zon<br>7<br>4.5V<br> 10 a alll<br>my 6M ee ee eee eel<br>V CM |ee<br>20µs PULSE WIDTH<br>T  = 175J °C<br> 1<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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2.5<br>ID = 48A<br>T LE<br>2.0 TENE ATNUONUAANORENERDZcf<br>A<br>1.5 .<br>pr AI<br>1.0 TTT<br>TTTatLETTTTT TTT<br>|<br>0.5<br>VGS = 10V<br>0.0 ELLE E EE<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRFZ44EPbF 

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2500 20<br>VGS = 0V, f = 1MHz ID = 29<br>Ciss = Cgs + Cgd , C      SHORTEDds VDS = 48V<br>Crss = Cgd VDS = 30V<br>2000 |aaa Coss = Cds + Cgd 16 epiPT TT Tyf ibe Na<br>Ciss<br>1500 - N e CT lll- 12 PiPTET Tt TTT TTT |TTAy Pe<br>Coss<br>1000 | UT all| 8 PiFi tttTTT |ttAATA<br>a ell Pit | LA<br>500 Crss 4<br>e e e ener PIA tt tt<br>e FOR TEST CIRCUIT<br>SEE FIGURE       13<br>0 a lll l l 0 fVitifof tlor 8<br> 1  10  100 0 10 20 30 40 50 60<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 1000  1000<br>OPERATION IN THIS AREA LIMITED<br>BY RDS(on)<br>a ee t<br>10us<br> 100 T  = 175  CJ °  100<br>100us<br> 10 4 a  10 Sea eti M eat<br>A ° ) S ih 1ms<br>—— T  = 25  CJ —————— HEE SEH<br>(a oo — S E<br> TC = 25  C° 10ms<br> TJ = 175  C°<br> 1 orFtoe| tT | | V      = 0 V GS  1 p  Single Pulse f WE | ELT y ETT]e<br>0.5 1.0 1.5 2.0 2.5  1  10  100  1000<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


**Fig 7. Typical Source-Drain Diode Forward Voltage** 

## **Fig 8.** Maximum Safe Operating Area 

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## IRFZ44EPbF 

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RD<br>50 VDS<br>50<br>NETTE ET yy VGS<br>D.U.T.<br>4040 PSSSEEE EEE RG 1 V+- DD<br>PLEA EEEEET T )<br>10V<br>30 SERENE REEE }<br>30 Pulse Width ≤ 1 µs<br>PTT Duty Factor ≤ 0.1 %<br>[EEN] ;<br>20 Pe [tte] TE EAL EL<br>20 Fig 10a.   Switching Time Test Circuit<br>RRR<br>VDS<br>10 CERES 90% —<br>10<br>SRR N |<br>0<br>0 25 50 75 100 125 150 175<br>25 Pit; 50 T   , Case TemperatureC 75  e et 100 125 ty °(  C)150° yy 175 10% I.<br>T   , Case TemperatureC (  C) VGS<br>rf |<br>td(on) tr td(off) tf<br>Fig 9.   Maximum Drain Current Vs. Fig 10b.   Switching Time Waveforms<br>Case Temperature<br> 10<br>P| TE TE TT TT TT<br> 1<br>D = 0.50<br>0.20<br>0.10 ett tt PDM<br>0.1 0.05<br>t1<br>0.02 SINGLE PULSE<br>0.01 (THERMAL RESPONSE) t2<br>= aeen Co oo<br>m— | TT 1. Duty factor D =Notes: t   / t1 2<br>ee ll 2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case** 

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## IRFZ44EPbF 

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15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>20V<br>y Jt tp 0.01Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

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<— tp — V(BR)DSS<br>ma<br>/ \<br>IAS<br>**----- End of picture text -----**<br>


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500<br>ID<br>NEG TOP 12A<br>21A<br>KGa<br>400 ENGR BOTTOM 29A<br>300 SaNSSe Eee<br>NAP Pp<br>200<br>NN KE<br>ES NNaNEEEE<br>100 PpENAAN[<br>pfSS a<br>0 Pett| SS<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJ (  C)°<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy Vs. Drain Current 

**Fig 12b.** Unclamped Inductive Waveforms 

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QG<br>—— —<br>10 V<br>QGS QGD<br>V Moo G<br>Charge<br>**----- End of picture text -----**<br>


**Fig 13a.** Basic Gate Charge Waveform 

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Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>12V .2µF<br>.3µF<br>Oe<br>LLit| +<br>D.U.T. -VDS<br>VGS<br>(a<br>3mA<br>Oral<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13b.** Gate Charge Test Circuit 

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## IRFZ44EPbF 

## **Peak Diode Recovery dv/dt Test Circuit** 

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**----- Start of picture text -----**<br>
+ Circuit Layout Considerations<br>D.U.T<br>   •  Low Stray Inductance<br> •  Ground Plane<br> •  Low Leakage Inductance<br>(a3) «       Current Transformer<br>| -<br>+<br>- - +<br>a<br>00)<br>RG •  dv/dt controlled by RG +<br>l ls •  Driver same type as D.U.T. - VDD<br>•  ISD controlled by Duty Factor "D"<br>•  D.U.T. - Device Under Test<br>**----- End of picture text -----**<br>


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O) Driver Gate Drive<br>P.W.<br>Period D =<br> es P.W. | Period<br>;<br>VGS=10V *<br>| _|<br>® D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current " Current di/dt va<br>® D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ov<br>Re-Applied ai<br>Voltage Body Diode  Forward Drop<br>® Inductor Curent<br>a<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


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* VGS = 5V for Logic Level Devices<br>**----- End of picture text -----**<br>


**Fig 14.** For N-Channel HEXFETS 

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## IRFZ44EPbF 

## TO-220AB Package Outline 

Dimensions are shown in millimeters (inches) 

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**----- Start of picture text -----**<br>
10.54 (.415) 3.78 (.149) - B -<br>2.87 (.113) 10.29 (.405) 3.54 (.139) 4.69 (.185)<br>2.62 (.103) - A - 4.20 (.165) 1.32 (.052)<br>| cc ~ 1.22 (.048)<br>6.47 (.255)<br>rt = 4 “| 6.10 (.240)<br>15.24 (.600)<br>14.84 (.584)<br>LEAD ASSIGNMENTS<br>1.15 (.045)     MIN HEXFETLEAD ASSIGNMENTS       1 - GATE  IGBTs, CoPACK<br>1     2    3 1- GATE       2 - DRAIN 1- GATE<br>2- DRAIN       3 - SOURCE 2- COLLECTOR<br>| darrt 3- SOURCE4- DRAIN       4 - DRAIN 3- EMITTER4- COLLECTOR<br>14.09 (.555)<br>13.47 (.530) 4.06 (.160)<br>3.55 (.140)<br>3X [1.40 (.055)] 1.15 (.045) 3X0.36  (.014)        M    B   A   M [0.93 (.037)] 0.69 (.027) T 2.92 (.115)3X [0.55 (.022)] 0.46 (.018)<br>2.64 (.104)<br>2.54 (.100) || I<br>2X<br>NOTES:<br>     1  DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.             3  OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.<br>**----- End of picture text -----**<br>


- 2  CONTROLLING DIMENSION : INCH                                                       4  HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS. 

## TO-220AB Part Marking Information 

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EXAMPLE: THIS IS AN IRF1010<br>LOT CODE 1789<br>ASSEMBLED ON WW 19, 1997 INTERNATIONAL PART NUMBER<br>IN THE ASSEMBLY LINE "C" RECTIFIER<br>LOGO<br>Note: position indicates "Lead-Free"  "P" in assembly line DATE CODE<br>ASSEMBLY YEAR 7 =  1997<br>LOT CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. 

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TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 11/03 

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Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFZ44EPBF/power-mosfet-n-channel-60-v-48-a-0023-ohm-to-220ab)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfz44epbf/mosfet-n-60v-48a-to-220/dp/8650217)
---

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