# Power MOSFET, P Channel, 30 V, 5.8 A, 0.04 ohm, TSOP, Surface Mount

![Product image](https://novapart.co/image/farnell:2114660/)

**URL**: https://novapart.co/products/IRFTS9342TRPBF/power-mosfet-p-channel-30-v-58-a-004-ohm-tsop
**SKU**: IRFTS9342TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1440
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-5.8A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.032ohm; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 6Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TSOP |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 5.8A |
| Drain Source On State Resistance | 0.04ohm |
| Gate Source Threshold Voltage Max | 1.3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2114660/)

## PD-96411A IRFTS9342PbF 

## HEXFET Power MOSFET 

**==> picture [434 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|VDS|-30|V|
|A|
|VGS max|±20|V|D|1|6|D|
|R|
|DS(on) max|40|m|Ω|D|2|5|D|
|(@VGS = -10V)|
|RDS(on) max|3|4|
|66|m|Ω|G|S|
|(@VGS = -4.5V)|
|Qg typ|12|nC|Top View|TSOP-6|
|ID|-5.8|A|
|(@TA= 25°C)|

**----- End of picture text -----**<br>


## **Applications** 

Battery operated DC motor inverter MOSFET System/Load Switch 

## **Features and Benefits** 

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||||
|---|---|---|
|Features|Benefits|
|Industry-Standard TSOP-6  Package|results in|Multi-Vendor Compatibility|
|RoHS Compliant Containing no Lead, no Bromide and no Halogen|⇒|Environmentally Friendlier|
|MSL1,|Consumer Qualification|Increased Reliability|

**----- End of picture text -----**<br>


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|||||
|---|---|---|---|
|Orderable part number|Package Type|Standard Pack|Note|
|Form|Quantity|
|IRFTS9342TRPbF|TSOP-6|Tape and Reel|3000|

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## **Absolute Maximum Ratings** 

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**----- Start of picture text -----**<br>
||||||
|---|---|---|---|---|
|Parameter|Max.|Units|
|VDS|Drain-to-Source Voltage|-30|
|V|
|VGS|Gate-to-Source Voltage|±20|
|ID|@ TA = 25°C|Continuous Drain Current, VGS @ 4.5V|-5.8|
|ID @ TA = 70°C|a|Continuous Drain Current, VGS @ 4.5V|-4.6|A|
|IDM|a|Pulsed Drain Current|-46|
|PD|@TA = 25°C|Power Dissipation|2.0|
|W|
|PD @TA = 70°C|i|Power Dissipation|1.3|pe|
|oo|Linear Derating Factor|0.02|W/°C|
|TJ|Operating Junction and|-55  to + 150|
|°C|
|TSTG|ee|Storage Temperature Range|

**----- End of picture text -----**<br>


Notes through  are on page 2 

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02/29/12 

## ������������ 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|-30|–––|–––|V|VGS= 0V, ID= -250μA|
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|19|–––|mV/°C|Reference to 25°C, ID= -1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|32|40|mΩ|VGS= -10V, ID= -5.8A�|
|||–––|53|66||VGS= -4.5V, ID= -4.6A�|
|VGS(th)|Gate Threshold Voltage|-1.3|–––|-2.4|V|VDS= VGS, ID= -25μA|
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-5.5|–––|mV/°C||
|IDSS|Drain-to-Source Leakage Current|–––|–––|-1.0|μA|VDS= -24V, VGS= 0V|
|||–––|–––|-150||VDS= -24V, VGS= 0V, TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|-100|nA|VGS= -20V|
||Gate-to-Source Reverse Leakage|–––|–––|100||VGS= 20V|
|gfs|Forward Transconductance|6.8|–––|–––|S|VDS= -10V, ID= -4.6A|
|Qg|Total Gate Charge|–––|12|–––|nC|VDS= -15V<br>ID= -4.6A<br>VGS= -10V|
|Qgs|Gate-to-Source Charge|–––|1.8|–––|||
|Qgd|Gate-to-Drain Charge|–––|3.1|–––|||
|RG|Gate Resistance|–––|17|–––|Ω||
|td(on)|Turn-On DelayTime|–––|4.6|–––|ns|VDD= -15V, VGS= -10V<br>RG= 6.8Ω<br>ID= -4.6A|
|tr|Rise Time|–––|13|–––|||
|td(off)|Turn-Off DelayTime|–––|45|–––|||
|tf|Fall Time|–––|28|–––|||
|Ciss|Input Capacitance|–––|595|–––|pF|VGS= 0V<br>VDS= -25V<br>ƒ= 1.0KHz|
|Coss|Output Capacitance|–––|133|–––|||
|Crss|Reverse Transfer Capacitance|–––|85|–––|||



## **Diode Characteristics** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|IS|Continuous Source Current<br>(Body Diode)|–––|–––|-2.0|A|G<br>D<br>S<br>showing  the<br>integral reverse<br>p-n junction diode.<br>MOSFET symbol|
|ISM|<br>Pulsed Source Current<br>(Body Diode)��|–––|–––|-46|||
|VSD|<br>Diode Forward Voltage|–––|–––|-1.2|V|TJ= 25°C, IS= -4.6A, VGS= 0V�<br>|
|trr|Reverse RecoveryTime|–––|20|30|ns|TJ= 25°C, IF= -4.6A, VDD= -24V<br>di/dt = 100A/μs��|
|Qrr|Reverse RecoveryCharge|–––|11|17|nC||
|ton|Forward Turn-On Time|Time is dominated by parasitic Inductance|||||



## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJA|Junction-to-Ambient�|–––|62.5|°C/W|



## **������** 

> � Repetitive rating;  pulse width limited by max. junction temperature. 

> � Pulse width ≤ 400μs; duty cycle ≤ 2%. 

> � When mounted on 1 inch square  copper board. 

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## ������������ 

**==> picture [211 x 430] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>VGS<br>TOP           -10V<br>-7.0V<br>-5.0V<br>-4.5V<br>-4.0V<br>-3.5V<br>10 -3.0V<br>BOTTOM -2.8V<br>1<br>-2.8V<br>≤ 60μs PULSE WIDTH<br>Tj = 25°C<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>100<br>10<br>T = 150°C<br>J<br>1<br>TJ = 25°C<br>V DS  = -15V<br>≤ 60μs PULSE WIDTH<br>0.1<br>1 2 3 4 5 6 7<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**==> picture [216 x 203] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000<br>VGS   = 0V,       f = 1 MHZ<br>Ciss   = C gs + Cgd,  C ds SHORTED<br>C  = C<br>rss   gd<br>C = C + C<br>oss   ds  gd<br>1000<br>C<br>iss<br>C<br>oss<br>C<br>100 rss<br>10<br>1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

**==> picture [214 x 659] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>VGS<br>TOP           -10V<br>-7.0V<br>-5.0V<br>-4.5V<br>-4.0V<br>10 -3.5V<br>-3.0V<br>BOTTOM -2.8V<br>-2.8V<br>1<br>≤ 60μs PULSE WIDTH<br>Tj = 150°C<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.6<br>ID = -5.8A<br>VGS = -10V<br>1.4<br>1.2<br>1.0<br>0.8<br>0.6<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>Fig 4.   Normalized On-Resistance vs. Temperature<br>14.0<br>ID= -4.6A<br>12.0<br>VDS= -24V<br>10.0 V DS = -15V<br>VDS= -6.0V<br>8.0<br>6.0<br>4.0<br>2.0<br>0.0<br>0 2 4 6 8 10 12 14 16<br> QG  Total Gate Charge (nC)<br>-ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>-VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

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## ������������ 

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**----- Start of picture text -----**<br>
100 1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS (on)<br>100<br>T = 150°C<br>J<br>10 100μsec<br>10 1msec<br>T = 25°C<br>J<br>10msec<br>1<br>1<br>DC<br>0.1 Tc = 25°C<br>Tj = 150°C<br>V GS  = 0V Single Pulse<br>0.1 0.01<br>0.01 0.1 1 10 100<br>0.4 0.6 0.8 1.0 1.2 1.4<br>VDS, Drain-to-Source Voltage (V)<br>-VSD, Source-to-Drain Voltage (V)<br>  Typical Source-Drain Diode Forward Voltage Fig 8.   Maximum Safe Operating Area<br>6 3.0<br>2.8<br>5<br>2.6<br>4 2.4<br>2.2<br>3 2.0<br>1.8 ID = -25μA<br>2 ID = -250μA<br>1.6<br>ID = -1.0mA<br>1 1.4 ID = -10mA<br>ID = -1.0A<br>1.2<br>0 1.0<br>25 50 75 100 125 150 -75 -50 -25 0 25 50 75 100 125 150<br> TA , Ambient Temperature (°C) TJ , Temperature ( °C )<br>Fig 9.   Maximum Drain Current vs. Fig 10.   Threshold Voltage vs. Temperature<br>Case Temperature<br>100<br>D = 0.50<br>0.20<br>10<br>0.10<br>0.05<br>0.02<br>1<br>0.01<br>0.1<br>SINGLE PULSE<br>0.01 ( THERMAL RESPONSE ) Notes:<br>1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthja + TA<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>-ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>-ID,  Drain Current (A)<br>-VGS(th), Gate threshold Voltage (V)<br>Thermal Response ( Z thJA ) °C/W<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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**==> picture [227 x 447] intentionally omitted <==**

**----- Start of picture text -----**<br>
TER Rectifier<br>100<br>ID = -5.8A<br>80 Ate|<br>60 IN<br>TJ = 125°C<br>40<br>2<br>20 S| pe T J  = 25°C<br>TET EEE|<br>0<br>2 4 6 8 10 12 14 16 18 20<br>-VGS, Gate -to -Source Voltage  (V)<br>Fig 12.  On-Resistance vs. Gate Voltage<br>120<br>ID<br>Gaal TOP         -0.91A<br>100<br>-1.4A<br>BOTTOM -4.6A<br>Nea<br>80<br>60 PNT TTT TTT<br>NENG<br>40<br>20 PENGSN= | dd<br>oT  SSS PPSS<br>0<br>25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>)  Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**==> picture [241 x 640] intentionally omitted <==**

**----- Start of picture text -----**<br>
220<br>200<br>or e<br>180<br>160<br>Vgs = -4.5V<br>140 Po, FT<br>120<br>100 PF te<br>80<br>FP tyTttT Vgs = -10V<br>60<br>40<br>poySetrT|<br>20 |<br>0 10 20 30 40 50<br>-ID, Drain Current (A)<br>Fig 13.  Typical On-Resistance vs. Drain Current<br>100<br>90<br>UI AT ETM ATI ETT<br>80<br>70 NT CT TT<br>60<br>50 BUENAN<br>40 IN ETAT ETT ATT ET<br>a<br>30<br>ELTIING<br>20<br>CTT SE T ATET A T TTTATTEN<br>10<br>0 SU00TMS TT=<br>0.0001 0.001 0.01 0.10 1 10<br>Time (sec)<br>Fig 15 Typical Power vs. Time<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. Period<br>— —r { a 7<br>VGS=10V<br>_.<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current Current<br>r di/dt val<br>® D.U.T. VDS Waveform Diode Recoverydv/dt \ +<br>VDD<br>Re-Applied<br>Voltage Body Diode  Forward Drop<br>7 ( ie<br>I<br>e s ee<br>® t Ripple  ≤ 5% ISD<br>Power (W)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

**Fig 14.** Maximum Avalanche Energy vs. Drain Current 

**==> picture [186 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
+<br>D.U .T*<br>   •<br>( aa ©) Creu avourConsiderations<br>•<br>| - •  owow Leakageotray InauctanceInductance<br>+ Current Transformer<br>- - +<br>o 8 1 ®<br>00<br>•<br>•  Driver same type as D.U.T. +<br>Re (a8 •  di/dt controlled by Rg Vp p -<br>•<br>**----- End of picture text -----**<br>


> or P-Channel HEXFET ® ower MOSFETs 

**Fig 16.** 

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5 

**==> picture [227 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>VCC<br>DUT<br>0<br>20K1K SS<br>nal<br>**----- End of picture text -----**<br>


**Fig 17a.** Gate Charge Test Circuit 

**==> picture [188 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>VDS<br>RG D.U.T V<br>L. DD<br>IAS<br>DRIVER<br>ix tp 0.01 Ω<br>15V<br>**----- End of picture text -----**<br>


**Fig 18a.** Unclamped Inductive Test Circuit 

**==> picture [181 x 100] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ves D.U.T. | -<br>+<br> 1<br> 0.1 %<br>ser |.<br>**----- End of picture text -----**<br>


**Fig 19a.** Switching Time Test Circuit 

**==> picture [176 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>Vgs(th)<br>Qgodr Qgd Qgs2 Qgs1<br>**----- End of picture text -----**<br>


**Fig 17b.** Gate Charge Waveform 

**==> picture [152 x 120] intentionally omitted <==**

**----- Start of picture text -----**<br>
IAS<br>—]<br>‘|<br><< tp<br>V(BR)DSS<br>**----- End of picture text -----**<br>


**Fig 18b.** Unclamped Inductive Waveforms 

**==> picture [173 x 109] intentionally omitted <==**

**----- Start of picture text -----**<br>
td(on) tr td(off) tf<br>VGS<br>10%<br>mn VN<br>90%<br>VDS VX<br>**----- End of picture text -----**<br>


**Fig 19b.** Switching Time Waveforms 

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6 

## ������������ 

## **TSOP-6 Package Outline** 

**==> picture [492 x 277] intentionally omitted <==**

## **TSOP-6 Part Marking Information** 

Y =  YEAR W =  WEEK PART NUMBER LOT CODE TOP PART NUMBER CODE REFERENCE: A =  SI3443DV O =  IRLTS6342TRPBF B =  IRF5800 P =  IRFTS8342TRPBF C =  IRF5850 R =  IRFTS9342TRPBF D =  IRF5851 S =  Not applicable E =  IRF5852 T =  IRLTS2242TRPBF F =  IRF5801 G =  IRF5803 H =  IRF5804 I =  IRF5805 J =  IRF5806 K =  IRF5810 N =  IRF5802 Note: A line above the work week (as shown here) indicates Lead-Free. 

## DATE CODE MARKING INSTRUCTIONS 

WW =  (1-26) IF PRECEDED BY LAST DIGIT OF CALENDAR YEAR 

||||WORK|WORK|||
|---|---|---|---|---|---|---|
|YEAR||Y|WEEK||W||
|2011|2001|1|01||A||
|2012|2002|2|02||B||
|2013|2003|3|03||C||
|2014|2004|4|04||D||
|2015|2005|5|||||
|2016|2006|6|||||
|2017|2007|7|||||
|2018|2008|8|||||
|2019|2009|9|||||
|2020|2010|0|24||X||
||||25||Y||
||||26||Z||
|WW =|(27-52)|IF PRECEDED BY A LETTER|||||
||||WORK||||
|YEAR||Y|WEEK||W||
|2011|2001|A|27||A||
|2012|2002|B|28||B||
|2013|2003|C|29||C||
|2014|2004|D|30||D||
|2015|2005|E|||||
|2016|2006|F|||||
|2017|2007|G|||||
|2018|2008|H|||||
|2019|2009|J|||||
|2020|2010|K|50||X||
||||51||Y||
||||52||Z||



**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

www.irf.com 

7 

## **TSOP-6 Tape and Reel Information** 

**==> picture [270 x 279] intentionally omitted <==**

**----- Start of picture text -----**<br>
8mm<br>| Merellexl<br>4mm FEED DIRECTION<br>NOTES :<br>1.  OUTLINE CONFORMS TO EIA-481 & EIA-541.<br>|   178.00<br>( 7.008 )<br>    MAX.<br>9.90 ( .390 )<br>8.40 ( .331 )<br>**----- End of picture text -----**<br>


NOTES: 

1.  CONTROLLING DIMENSION : MILLIMETER. 

2.  OUTLINE CONFORMS TO EIA-481 & EIA-541. 

## **Qualification information**[†] 

|**Qualification information**[†]|||
|---|---|---|
|Qualification level|Consumer<br>††<br>(per JEDEC JES D47F<br>†††guidelines)||
|Moisture Sensitivity Level|TSOP-6|MS L1<br>(per IPC/JEDEC J-S T D-020D<br>†††)|
|RoHS compliant|Yes||



- Qualification standards can be found at International Rectifier’s web site 

http://www.irf.com/product-info/reliability 

- ††       Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: 

http://www.irf.com/whoto-call/salesrep/ 

- †††    Applicable version of JEDEC standard at the time of product release. 

Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 02/2012 

www.irf.com 

8 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFTS9342TRPBF/power-mosfet-p-channel-30-v-58-a-004-ohm-tsop)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfts9342trpbf/mosfet-p-ch-30v-5-8a-6tsop/dp/2114660)
---

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