# Power MOSFET, StrongIRFET™, N Channel, 75 V, 85 A, 0.0056 ohm, TO-263AB, Surface Mount

![Product image](https://novapart.co/image/farnell:2781144/)

**URL**: https://novapart.co/products/IRFS7762TRLPBF/power-mosfet-strongirfettm-n-channel-75-v-85-a
**SKU**: IRFS7762TRLPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5260
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Power Dissipation | 140W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 140W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0056ohm |
| Transistor Case Style | TO-263AB |
| Drain Source Voltage Vds | 75V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 85A |
| Drain Source On State Resistance | 0.0056ohm |
| Gate Source Threshold Voltage Max | 3.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2781144/)

## International T@R Rectifier 

## Strong _IR_ FET™ IRFS7762PbF IRFSL7762PbF 

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Application  HEXFET [® ] Power MOSFET<br> Brushed motor drive applications<br> BLDC motor drive applications  D VDSS  75V<br> Battery powered circuits<br> Half-bridge and full-bridge topologies  G RDS(on) typ. 5.6m <br> Synchronous rectifier applications              max  6.7m <br> Resonant mode power supplies  S<br> OR-ing and redundant power switches  == ID  85A<br> DC/DC and AC/DC converters<br> DC/AC inverters<br>D  D<br>Benefits<br>S  S<br> Improved  gate, avalanche and dynamic dV/dt ruggedness  G  G  [D ]<br> Fully characterized capacitance and avalanche SOA<br> Enhanced body diode dV/dt and dI/dt capability    D2Pak  TO-262<br>IRFS7762PbF  IRFSL7762PbF<br> Lead-free, RoHS compliant<br>G  D  S<br>Gate  Drain  Source<br>-—_}—_}—_<br>Standard Pack<br>Base part number  Package Type  Form  Quantity  Orderable Part Number<br>IRFSL7762PbF  TO-262   Tube   50  IRFSL7762PbF<br>Tube   50  IRFS7762PbF<br>IRFS7762PbF    D [2] -Pak<br>Tape and Reel Left   800  IRFS7762TRLPbF<br>18 100<br>ID = 51AD = 51A= 51A<br>16 TLL.<br>80<br>14<br>TELELELL TJ = 125°CJ = 125°C= 125°C 60 SEE<br>12<br>CAT —~<br>10<br>TREE 40 tT IKE.<br>8<br>TELEL TJ = 25°CJ = 25°C= 25°C  ELL 20 seca<br>6<br>NT tt tt<br>4 CERES 0 | iLL<br>4 6 8 10 12 14 16 18 20 25 50 75 100 125 150 175<br> TC , Case Temperature (°C)<br>)<br> <br>RDS(on),  Drain-to -Source On Resistance (m<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


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18<br>ID = 51AD = 51A= 51A<br>16 TLL.<br>14<br>TELELELL TJ = 125°CJ = 125°C= 125°C<br>12<br>CAT<br>10<br>TREE<br>8<br>TELEL TJ = 25°CJ = 25°C= 25°C  ELL<br>6<br>NT tt tt<br>4 CERES<br>4 6 8 10 12 14 16 18 20<br>VGS, Gate -to -Source Voltage  (V)<br>)<br> <br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 1.** Typical On-Resistance vs. Gate Voltage 

**Fig 2.** Maximum Drain Current vs. Case Temperature 

1 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback                   February 19, 2015 ~~SN~~ 

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## **Absolute Maximum Rating** 

|**Absolute Maximum Rating**|||||||
|---|---|---|---|---|---|---|
|**Symbol**<br>**Parameter**|||||**Max.**|**Units**|
|ID @TC= 25°C<br>Continuous Drain Current,VGS @10V|||||85||
|ID @TC= 100°C<br>Continuous Drain Current,VGS @10V|||||60|A|
|IDM<br>Pulsed Drain Current|||||335||
|PD @TC= 25°C<br>Maximum Power Dissipation|||||140|W|
|Linear DeratingFactor|||||0.95|W/°C|
|VGS<br>Gate-to-Source Voltage|||||± 20|V|
|TJ<br>TSTG<br>Operating Junction and<br>Storage Temperature Range|||||-55  to + 175|°C|
|Soldering Temperature, for 10 seconds (1.6mm from case)||||Soldering Temperature, for 10 seconds (1.6mm from case)|300||
|**Avalanche Characteristics**|||||||
|**Symbol**<br>**Parameter**|||||**Max.**|**Units**|
|EAS (Thermallylimited)<br>SinglePulseAvalancheEnergy <br>EAS (Thermallylimited)<br>SinglePulseAvalancheEnergy |||||160<br>243|mJ|
|IAR<br>Avalanche Current<br>EAR<br>Repetitive Avalanche Energy|||||See Fig 15, 16, 23a, 23b|A<br>mJ|
|**Thermal Resistance**|||||||
|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RJC<br>Junction-to-Case<br>–––<br>1.05<br>°C/W<br>RJA<br>Junction-to-Ambient(PCB Mount) <br>–––<br>40<br>~~——~~|||||||
|**Static @ TJ = 25°C (unless otherwise specified)**|||||||
|**Symbol**<br>**Parameter**<br>**Min.**<br>**Typ. Max. Units**<br>**Conditions**<br>V(BR)DSS<br>Drain-to-Source Breakdown Voltage<br>75<br>–––<br>–––<br>V<br>VGS= 0V,ID= 250µA<br>V(BR)DSS/TJBreakdown Voltage Temp. Coefficient<br>–––<br>58<br>––– mV/°C Reference to 25°C,ID= 1mA<br>RDS(on)<br>Static Drain-to-Source On-Resistance<br>–––<br>5.6<br>6.7<br>VGS= 10V,ID= 51A<br>–––<br>6.6<br>–––<br>VGS =6.0V, ID =26A<br>VGS(th)<br>GateThresholdVoltage<br>2.1<br>–––<br>3.7<br>V<br>VDS= VGS,ID= 100µA<br>m<br>~~—_=--~~|||||||
|IDSS<br>Drain-to-Source Leakage Current<br>–––<br>–––<br>1.0<br>µA<br>VDS =75V, VGS =0V<br>–––<br>–––<br>150<br>VDS= 75V,VGS=0V,TJ= 125°C<br>IGSS<br>Gate-to-Source Forward Leakage<br>–––<br>–––<br>100<br>nA<br>VGS= 20V<br>Gate-to-Source Reverse Leakage<br>–––<br>–––<br>-100<br>VGS = -20V<br>RG<br>Gate Resistance<br>–––<br>2.5<br>–––<br><br>~~=~~|||||||
|**Notes:**|||||||
|Repetitive rating; pulse width limited by max. junction temperature.|Repetitive rating; pulse width limited by max. junction temperature.||||||



-   Limited by TJmax, starting TJ = 25°C, L = 120µH, RG = 50, IAS = 51A, VGS =10V. 

- ISD  51A, di/dt  735A/µs, VDD  V(BR)DSS, TJ 175°C. 

- Pulse width  400µs; duty cycle  2%. 

-  Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. 

-  Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. 

-  R is measured at TJ approximately 90°C. 

-  Limited by TJmax, starting TJ = 25°C, L = 1mH, RG = 50, IAS = 22A, VGS =10V. 

- When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques 

- refer to application note #AN-994: http://www.irf.com/technical-info/appnotes/an-994.pdf 

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## **Dynamic  Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**<br>~~a~~|**Parameter**<br>|**Min.**<br>|**Typ.**<br>|**Max. Units**<br>|**Max. Units**<br>|**Max. Units**<br>**Conditions**<br>|
|---|---|---|---|---|---|---|
|gfs<br>~~aDG~~|Forward Transconductance<br>~~DG~~|180<br>~~DG~~|–––<br>~~DG~~|–––<br>~~DG~~|S<br>~~DG~~|VDS= 10V,ID= 51A<br>~~DG~~|
|Qg<br>~~a~~|Total Gate Charge|–––|85|130|nC|ID= 51A<br>VDS= 38V<br>VGS= 10V|
|Qgs|Gate-to-Source Charge|–––|21|–––|||
|Qgd<br>~~a~~|Gate-to-Drain Charge|–––|26|–––|||
|Qsync<br>~~a~~|Total Gate Charge Sync.(Qg–Qgd)<br>~~GO~~|–––<br>~~GO~~|60<br>~~GO~~|–––<br>~~GO~~|||
|td(on)<br>~~a~~|Turn-On DelayTime|–––|11|–––|ns<br>~~Co~~|VDD= 38V<br>ID= 51A<br>RG= 2.7<br>VGS= 10V<br>~~Co~~|
|tr<br>~~a~~|Rise Time|–––|49|–––|||
|td(off)|Turn-Off DelayTime|–––|57|–––|||
|tf<br>~~a~~<br>~~Ee~~|Fall Time<br>~~Ee~~|–––<br>~~Ee~~|40<br>~~Ee~~|–––<br>~~Ee~~|||
|Ciss<br>~~a~~<br>~~Ee~~|Input Capacitance<br>~~Ee~~|–––<br>~~Ee~~|4440<br>~~Ee~~|–––<br>~~Ee~~|pF<br>~~Co~~|VGS= 0V<br>VDS= 25V<br>ƒ= 1.0MHz,  See Fig.7<br>~~Co~~|
|Coss<br>~~a~~<br>~~Ee~~|Output Capacitance<br>~~Ee~~|–––<br>~~Ee~~|370<br>~~Ee~~|–––<br>~~Ee~~|||
|Crss<br>~~a~~<br>~~Ee~~|Reverse Transfer Capacitance<br>~~Ee~~|–––<br>~~Ee~~|230<br>~~Ee~~|–––<br>~~Ee~~|||
|Coss eff.(ER)<br>~~a~~<br>~~Ee~~|Effective Output Capacitance<br>(Energy Related)<br>~~Ee~~|–––<br>~~Ee~~<br>~~GF~~|330<br>~~Ee~~<br>~~GF~~|–––<br>~~Ee~~<br>~~GF~~||VGS= 0V, VDS= 0V to 60V<br>~~Co~~|
|Coss eff.(TR)<br>~~Ee~~<br>~~a~~|Output Capacitance(Time Related)<br>~~Ee~~<br>~~a~~|–––<br>~~Ee~~<br>~~a~~<br>~~GF~~|430<br>~~Ee~~<br>~~a~~<br>~~GF~~|–––<br>~~Ee~~<br>~~a~~<br>~~GF~~||VGS= 0V,VDS= 0V to 60V<br>~~Co~~|
|**Diode Characteristics**<br>~~a~~<br>~~GF~~<br>~~CO OG~~<br>~~oe~~|||||||
|**Symbol**<br>~~CO~~<br>~~oe~~<br>~~a~~|**Parameter **<br>~~CO~~<br>~~rs~~|**Min.**<br>~~CO~~|**Typ. **<br>~~CO~~<br>~~CO~~|**Max.**<br>~~CO~~<br>~~CO OG~~<br>~~es~~|**Units**<br>~~CO~~<br>~~OG~~<br>~~es~~|**Conditions**<br>~~CO~~<br>~~OG~~<br>~~es~~|
|IS<br>~~oe~~<br>~~a~~|Continuous Source Current<br>(BodyDiode)<br>~~rs~~|–––|–––<br>~~CO~~|85<br>~~CO OG~~<br>~~es~~|A<br>~~OG~~<br>~~es~~|MOSFET symbol<br>showing  the<br>integral reverse<br>p-n junction diode.<br>D<br>S<br>G<br>~~OG~~<br>~~es~~|
|ISM<br>~~oe~~<br>~~a~~|Pulsed Source Current<br>(Body Diode)<br>~~rs~~|–––|–––<br>~~CO~~|335<br>~~CO OG~~<br>~~es~~|||
|VSD<br>~~oe ~~<br>~~a~~|Diode Forward Voltage<br> ~~rs~~|–––|–––<br>~~CO~~|1.2<br>~~CO OG~~<br>~~es~~|V<br>~~OG~~<br>~~es~~|TJ= 25°C,IS= 51A,VGS= 0V<br>~~OG~~<br>~~es~~|
|dv/dt<br>~~a ~~|Peak Diode Recoverydv/dt<br> ~~a~~|–––|13|–––|V/ns T|V/ns TJ= 175°C,IS= 51A,VDS= 75V|
|trr<br>~~ee~~|Reverse Recovery Time<br>~~ee~~|–––<br>~~ee~~|34<br>~~ee~~|–––<br>~~ee~~|ns<br>~~ee~~|TJ =25°CVDD= 64V<br>TJ =125°CIF= 51A,<br>TJ =25°Cdi/dt = 100A/µs<br>TJ =125°C <br>TJ= 25°C|
|||–––<br>~~ee~~|46<br>~~ee~~|–––<br>~~ee~~|||
|Qrr<br>~~ee~~<br>~~**a**~~|Reverse Recovery Charge<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~<br>~~ee~~|54<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~<br>~~ee~~|nC<br>~~ee~~<br>~~ee~~||
|||–––<br>~~ee~~|69<br>~~ee~~|–––<br>~~ee~~|||
|IRRM<br>~~**a** ~~|Reverse RecoveryCurrent<br> ~~ee ~~|–––<br> ~~ee~~|2.7<br>~~ee~~|–––<br>~~ee~~|A<br>~~ee~~||



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IRFS/SL7762PbF ~~LLL~~ 

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IRFS/SL7762PbF<br>16é4aR<br>1000 1000<br>VGS VGS<br>TOP           15V TOP           15V<br>10V 10V<br>8.0V 8.0V<br>7.0V 7.0V<br>6.0V 6.0V<br>100 5.5V 100 5.5V<br>5.0V 5.0V<br>BOTTOM 4.5V BOTTOM 4.5V<br>4.5V<br>10 10<br>4.5V<br>60µs PULSE WIDTH 60µs PULSE WIDTH<br>Tj = 25°C Tj = 175°C<br>1 a 1 aebe<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 3.   Typical Output Characteristics  Fig 4.   Typical Output Characteristics<br>1000 3.0<br>ID = 51A<br>VGS = 10V<br>2.5<br>100<br>PTT TJ = 175°C |e 2.0 a<br>10<br>n5740 TJ = 25°C 1.5 He<br>1<br>B/SY_H 1.0 nteciilewa<br>VDS = 25V<br>60µs PULSE WIDTH<br>0.1 PAL. | 0.5 TTT<br>2.0 3.0 4.0 5.0 6.0 7.0 -60 -40 -20 0 20 40 60 80 100120140160180<br>VGS, Gate-to-Source Voltage (V) TJ , Junction Temperature (°C)<br>Fig 5.   Typical Transfer Characteristics  Fig 6.   Normalized On-Resistance vs. Temperature<br>100000 14.0<br>VCGS  iss   = C= 0V,       f gs + Cgd= 1 MHZ,  C ds SHORTED ID= 51A<br>C Crss  oss    = C = Cds gd + Cgd 12.0 VDS= 60V<br>10.0 VDS= 38V<br>10000 _ py<br>VDS= 15V<br>=ee Ciss eee 8.0 a<br>6.0<br>1000 Coss<br>rel Crss ii antl 4.0 - ff<br>2.0<br>100 ~ ICUITHise ERETT 0.0 o>72ane<br>1 10 100 0 20 40 60 80 100 120<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>C, Capacitance (pF)<br>VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 6.** Normalized On-Resistance vs. Temperature 

**Fig 8.** Typical Gate Charge vs. Gate-to-Source Voltage 

**Fig 7.** Typical Capacitance vs. Drain-to-Source Voltage 

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IRFS/SL7762PbF ~~_~~ 

## ~~TOR~~ 

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1000<br>100µsec<br>100 1m sec<br>100 TJ = 175°C a ee<br>OPERATION<br>10<br>IN THIS<br>AREA<br>(ie x<br>LIMITED BY<br>10 TJ = 25°C RDS(on)<br>1 10msec<br>Tc = 25°C<br>VGS = 0V T Single Pulse j = 175°C DC<br>1.0 HE 0.1<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 10<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-toSource Voltage (V)<br>Fig 9.   Typical Source-Drain Diode Forward Voltage  Fig 10.   Maximum Safe Operating Area<br>95 0.9<br>Id = 1.0mA<br>0.8<br>0.7<br>90<br>0.6<br>0.5<br>Val<br>85<br>0.4<br>ATTDer<br>0.3<br>80 ALLL 0.2<br>0.1<br>ALLL ELLE<br>75 0.0<br>-60 -40 -20 0 20 40 60 80 100120140160180 -10 0 10 20 30 40 50 60 70 80<br>TJ , Temperature ( °C )<br>VDS, Drain-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A)<br>V(BR)DSS, Drain-to-Source Breakdown Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>Energy (µJ)<br>**----- End of picture text -----**<br>


**Fig 11.** Drain-to-Source Breakdown Voltage 

**Fig 12.** Typical Coss Stored Energy 

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18.0<br>16.0 TILL<br>14.0<br>Vgs = 5.5V<br>| Ty<br>Vgs = 6.0V<br>12.0 Vgs = 7.0V<br>| Vgs = 8.0V ‘ane<br>Vgs = 10V<br>10.0<br>Ch SSS<br>8.0<br>TLL BRS<br>6.0 Be2s2>-7<br>4.0 TTT LLLa0<br>0 20 40 60 80 100 120 140 160 180 200<br>ID, Drain Current (A)<br>)<br><br> m<br>RDS(on),  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

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10<br>1<br>D = 0.50<br>1 —— sail)<br>0.20<br>0.1 0.10<br>0.05<br>0.02<br>0.01<br>0.01<br>Se SINGLE PULSE aul ONL A Notes: A<br>( THERMAL RESPONSE ) 1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthjc + Tc<br>0.001<br>Bail MeRrerran a | Gaeo<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJC ) °C/W<br>**----- End of picture text -----**<br>


**Fig 14.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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1000<br>Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming  Tj  = 150°C and<br>100 Ble|| Tstart = 25°C (Single Pulse)<br>|<br>10<br>Seite stlimeet BH<br>Allowed avalanche Current vs avalanche<br>1<br>pulsewidth, tav, assuming j = 25°C and<br>Tstart = 150°C.<br>Re eae an seal<br>0.1<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02<br>tav (sec)<br>Avalanche Current (A)<br>**----- End of picture text -----**<br>


**Fig 15.** Avalanche Current vs. Pulse Width 

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200<br>TOP          Single Pulse<br>BOTTOM   1.0% Duty Cycle<br>160 I D  = 51A<br>ctf<br>120<br>NSUAAREREREE<br>80<br>ST<br>40<br>TST<br>TPS<br>0<br>25 50 75 100 125 150 175<br>Starting TJ , Junction Temperature (°C)<br>EAR , Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 at www.irf.com)** 

1.Avalanche failures assumption: 

   - Purely a thermal phenomenon and failure occurs at a 

   - temperature far in excess of Tjmax. This is validated for every part type. 

2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 

3. Equation below based on circuit and waveforms shown in Figures 23a, 23b. 

4. PD (ave) = Average power dissipation per single avalanche pulse. 

5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 

6. Iav = Allowable avalanche current. 

7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 15, 16). 

   - tav = Average time in avalanche. 

   - D = Duty cycle in avalanche =  tav ·f 

   - ZthJC(D, tav) = Transient thermal resistance, see Figures 13) PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC 

      - Iav = 2T/ [1.3·BV·Zth] 

**Fig 16.** Maximum Avalanche Energy vs. Temperature 

- EAS (AR) = PD (ave)·tav 

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IRFS/SL7762PbF<br>TOR<br>4.0 20<br>IF = 34A<br>3.5 VR = 64V<br>TART 15 T J = 25°C 25°C°CC TY].<br>3.0<br>TJ = 125°C<br>ESSGRnS Gn e<br>2.5<br>PP SSSUT BPZ<br>ID = 100µA 10<br>2.0 I D  = 250µA<br>ID = 1.0mA<br>1.5 BAE—NS EEZEn<br>ID = 1.0A 5<br>1.0<br>0.5 SH E EGEKNEN 0 cannn<br>-75 -50 -25 0 25 50 75 100 125 150 175 0 200 400 600 800 1000<br>TJ , Temperature ( °C ) diF /dt (A/µs)<br>VGS(th), Gate threshold Voltage (V)<br>IRRM (A)<br>**----- End of picture text -----**<br>


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20<br>IF = 34A<br>VR = 64V<br>15 T J = 25°C 25°C°CC TY].<br>TJ = 125°C<br>e<br>BPZ<br>10<br>EEZEn<br>5 cannn<br>0<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>IRRM (A)<br>**----- End of picture text -----**<br>


**Fig 18.** Typical Recovery Current vs. dif/dt 

**Fig 17.** Threshold Voltage vs. Temperature 

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20 400<br>IF = 51A IF = 34A<br>VR = 64V VR = 64V<br>15 T J = 25°C 300 T J = 25°C<br>TJ = 125°C TJ = 125°C<br>10 ce] 200 Lhe<br>Reza se<br>5 EEeZan 100 | ke]<br>0 ATE) 0 6<br>0 200 400 600 800 1000 0 200 400 600 800<br>diF /dt (A/µs) diF /dt (A/µs)<br>IRRM (A) QRR (nC)<br>**----- End of picture text -----**<br>


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0 200 400 600 800 1000<br>diF /dt (A/µs)<br>**----- End of picture text -----**<br>


**Fig 19.** Typical Recovery Current vs. dif/dt 

**Fig 20.** Typical Stored Charge vs. dif/dt 

**==> picture [217 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
300<br>IF = 51A<br>250 V R = 64V Pte<br>TJ = 25°C<br>200 T J = 125°C mee<br>150 lA<br>100 Le|<br>“tt<br>50 | |<br>0 || tf<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br>


**Fig 21.** Typical Stored Charge vs. dif/dt 

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**Fig 22.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET[® ] Power MOSFETs 

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**----- Start of picture text -----**<br>
15V<br>VDS L DRIVER<br>R G D.U.T +<br>- [V][DD]<br>IAS<br>20V<br>tp 0.01<br>**----- End of picture text -----**<br>


**Fig 23a.** Unclamped Inductive Test Circuit 

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V(BR)DSS<br>< tp > |<br>IAS<br>**----- End of picture text -----**<br>


**Fig 23b.** Unclamped Inductive Waveforms 

**Fig 24a.** Switching Time Test Circuit 

**Fig 24b.** Switching Time Waveforms 

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VDD<br>**----- End of picture text -----**<br>


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Id<br>Vds<br>Vgs<br>|<br>Vgs(th) |<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 25a.** Gate Charge Test Circuit 

**Fig 25b.** Gate Charge Waveform 

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## ~~IR~~ 

**TO-262 Package Outline** (Dimensions are shown in millimeters (inches) 

## **TO-262 Part Marking Information** 

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**----- Start of picture text -----**<br>
EXAMPLE: THIS IS AN IRL3103L<br>LOT CODE 1789 PART NUMBER<br>INTERNATIONAL<br>ASSEMBLED ON WW 19, 1997<br>RECTIFIER<br>IN THE ASSEMBLY LINE "C"<br>LOGO<br>DATE CODE<br>YEAR 7 = 1997<br>ASSEMBLY<br>LOT CODE WEEK 19<br>LINE C<br>|<br>OR<br>PART NUMBER<br>INTERNATIONAL<br>RECTIFIER<br>LOGO<br>DATE CODE<br>P = DESIGNATES LEAD-FREE<br>ASSEMBLY<br>LOT CODE PRODUCT (OPTIONAL)<br>YEAR 7 = 1997<br>WEEK 19<br>A = ASSEMBLY SITE CODE<br>|<br>**----- End of picture text -----**<br>


Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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## **D[2] Pak (TO-263AB) Package Outline** (Dimensions are shown in millimeters (inches)) 

## **D[2] Pak (TO-263AB) Part Marking Information** 

**==> picture [296 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
THIS IS AN IRF530S WITH<br>PART NUMBER<br>LOT CODE 8024 INTERNATIONAL<br>ASSEMBLED ON WW 02, 2000 RECTIFIER F530S j s<br>IN THE ASSEMBLY LINE "L" LOGO Ie@R ~<br>DATE CODE<br>YEAR 0 =  2000<br>ASSEMBLY<br>LOT CODE WEEK 02<br>LINE L<br>OR<br>PART NUMBER<br>INTERNATIONAL<br>RECTIFIER F530S<br>LOGO DATE CODE<br>P =  DESIGNATES LEAD - FREE<br>a PRODUCT (OPTIONAL)<br>ASSEMBLY WU<br>LOT CODE vg YEAR 0 =  2000<br>U U WEEK 02<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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## **D[2] Pak (TO-263AB) Tape & Reel Information** (Dimensions are shown in millimeters (inches)) 

**==> picture [387 x 193] intentionally omitted <==**

**----- Start of picture text -----**<br>
TRR<br>1.60 (.063)<br>1.50 (.059)<br>1.60 (.063)<br>4.10 (.161)<br>3.90 (.153) 1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 24.30 (.957)<br>15.42 (.609)<br>23.90 (.941)<br>15.22 (.601)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>FEED DIRECTION<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
13.50 (.532) 27.40 (1.079)<br>12.80 (.504) 23.90 (.941)<br>4<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>30.40 (1.197)<br>NOTES :       MAX.<br>1.   COMFORMS TO EIA-418.<br>26.40 (1.039) 4<br>2.   CONTROLLING DIMENSION: MILLIMETER. 24.40 (.961)<br>3.   DIMENSION MEASURED @ HUB.<br>3<br>**----- End of picture text -----**<br>


4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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## **Qualification Information[† ]** 

|**Qualification Information[† ]**|||
|---|---|---|
|**Qualification Level**|Industrial<br>(per JEDEC JESD47F)††||
|**Moisture Sensitivity Level**|D2Pak|MSL1|
||TO-262||
|**RoHS Compliant**|Yes||



- Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/ 

- ††  Applicable version of JEDEC standard at the time of product release. 

## **Revision History** 

|**Revision History**|**Revision History**|
|---|---|
|**Date**|**Comments**|
|2/19/2015|Updated EAS (L =1mH)= 243mJ  on page 2<br>Updated note 8  “Limited byTJmax,startingTJ= 25°C,L = 1mH,RG= 50,IAS= 22A,VGS=10V” onpage 2|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 12 www.irf.com        © 2015 International Rectifier Submit Datasheet Feedback                   February 19, 2015 ~~L _~~ 

12 ~~_~~ 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFS7762TRLPBF/power-mosfet-strongirfettm-n-channel-75-v-85-a)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/infineon/irfs7762trlpbf/mosfet-n-ch-75v-85a-to-263ab/dp/2781144)
---

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