# Power MOSFET, N Channel, 60 V, 240 A, 1400 µohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2406522/)

**URL**: https://novapart.co/products/IRFS7530TRL7PP/power-mosfet-n-channel-60-v-240-a-1400-ohm-to-263
**SKU**: IRFS7530TRL7PP
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.5100
**Stock**: 1000+
**Lead Time**: 99 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:240A; Drain Source Voltage Vds:60V; On Resistance Rds(on):0.00115ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3.7V

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 7Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 375W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 240A |
| Drain Source On State Resistance | 1400µohm |
| Gate Source Threshold Voltage Max | 3.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2406522/)

Strong _IR_ FET™ IRFS7530-7PPbF 

## **Application** 

HEXFET[® ] Power MOSFET 

-  Brushed Motor drive applications 

-  BLDC Motor drive applications 

-  Battery powered circuits 

-  Half-bridge and full-bridge topologies 

-  Synchronous rectifier applications 

-  Resonant mode power supplies 

-  OR-ing and redundant power switches 

||||D|**VDSS**|**60V**|
|---|---|---|---|---|---|
|||||||
|G||||**RDS(on)typ.**<br>**max**|**1.15m**<br>**1.4m**|
||||S|**ID (Silicon Limited)**<br>**ID (Package Limited)**|**338A**<br>**240A**|



## **Benefits** 

-  Improved  Gate, Avalanche and Dynamic dV/dt Ruggedness 

-  Fully Characterized Capacitance and Avalanche SOA 

-  Enhanced body diode dV/dt and dI/dt Capability 

-  Lead-Free, RoHS Compliant 

|**G**|**D**|**S**|
|---|---|---|
|Gate|Drain|Source|



|**Base Part Number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Complete Part Number**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRFS7530-7PPbF|D2Pak-7PIN|Tube<br>Tape and Reel Left|50<br>800|IRFS7530-7PPbF<br>IRFS7530TRL7PP|



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6<br>ID = 100A<br>5 Hf if<br>4<br>fet Pt<br>3 Lee<br>TJ = 125°C<br>2 ane<br>1 CET TT |<br>TJ = 25°C<br>0<br>Saaennen<br>4 8 12 16 20<br>VGS, Gate-to-Source Voltage (V)<br>)<br><br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**==> picture [211 x 200] intentionally omitted <==**

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350<br>Limited By  Package<br>300 iee<br>250<br>| pte] |<br>200<br>Nee<br>150<br>pi] | | NI<br>100<br>Pt[ | | TN<br>50<br>pitt<br>| | | LN<br>0 {| | A<br>25 50 75 100 125 150 175<br> TC , Case Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical On-Resistance vs. Gate Voltage 

**Fig 2.** Maximum Drain Current vs. Case Temperature 

1 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback                   March 5, 2015 ~~—9°00...~~ 

~~TéaR~~ 

IRFS7530-7PPbF ~~[TT~~ 

## **Absolute Maximium Rating** 

|**Absolute Maximium Rating**||||||||
|---|---|---|---|---|---|---|---|
|**Symbol**<br>**Parameter**|||||**Max.**||**Units**|
|ID @TC= 25°C<br>Continuous Drain Current,VGS @10V(Silicon Limited)|||||338|||
|ID @TC= 100°C<br>Continuous Drain Current,VGS @10V(Silicon Limited)<br>ID @TC= 25°C<br>Continuous Drain Current,VGS @10V(Wire Bond Limited)|||||239<br>240||A|
|IDM<br>Pulsed Drain Current|||||1450|||
|PD @TC= 25°C<br>Maximum Power Dissipation|||||375||W|
|Linear DeratingFactor|||||2.5||W/°C|
|VGS<br>Gate-to-Source Voltage|||||± 20||V|
|TJ<br>Operating Junction and||||||||
||||||-55  to + 175|||
|TSTG<br>Storage Temperature Range|||||||°C|
|SolderingTemperature, for 10 seconds(1.6mm from case)|||||300|||
|**Avalanche Characteristics**||||||||
|EAS(Thermallylimited)<br>Single Pulse Avalanche Energy<br>526<br>mJ<br>EAS(Thermallylimited)<br>Single Pulse Avalanche Energy<br>1029<br>IAR<br>Avalanche Current<br>See Fig 14, 15, 23a, 23b<br>A<br>EAR<br>Repetitive Avalanche Energy<br>mJ<br>~~a~~||||||||
|**Thermal Resistance**||||||||
|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RJC<br>Junction-to-Case<br>–––<br>0.40<br>°C/W<br>RJA<br>Junction-to-Ambient<br>–––<br>40<br>~~————————~~||||||||
|**Static@ TJ = 25°C(unless otherwise specified)**||||||||
|**Symbol**<br>**Parameter**|**Min.**|**Typ. Max.**|**. Max.**||**Units**<br>**Conditions**|||
|V(BR)DSS<br>Drain-to-Source Breakdown Voltage|60|–––|–––||V<br>VGS= 0V,ID= 250µA|||
|V(BR)DSS/TJBreakdown Voltage Temp. Coefficient|–––|33|–––|mV/°C Reference to 25°C,I||ID= 1mA|= 1mA|
|RDS(on)<br>Static Drain-to-Source On-Resistance|–––|1.15|1.4||m<br>VGS= 10V,ID= 100A|||
||–––|1.4|–––||m<br>VGS= 6.0V,ID= 50A|||
|VGS(th)<br>Gate Threshold Voltage|2.1|–––|3.7||V<br>VDS= VGS,ID= 250µA|||
|IDSS<br>Drain-to-Source Leakage Current<br>–––<br>–––<br>1.0<br>µA<br>VDS= 60 V,VGS= 0V<br>–––<br>–––<br>150<br>VDS= 60V,VGS= 0V,TJ=125°C<br>IGSS<br>Gate-to-Source Forward Leakage<br>–––<br>–––<br>100<br>nA<br>VGS= 20V<br>Gate-to-Source Reverse Leakage<br>–––<br>–––<br>-100<br>VGS= -20V<br>RG<br>Gate Resistance<br>–––<br>2.2<br>–––<br><br>~~FS~~||||||||
|**Notes:**||||||||
|Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 240A.||||||||



   - Note that current limitations arising from heating of the device leads may occur with some lead mounting arrangements. (Refer to AN-1140) 

- Repetitive rating; pulse width limited by max. junction temperature. 

-   Limited by TJmax, starting TJ = 25°C, L = 105µH, RG = 50, IAS = 100A, VGS =10V. 

- ISD  100A, di/dt  1575A/µs, VDD  V(BR)DSS, TJ 175°C. 

- Pulse width  400µs; duty cycle  2%. 

-  Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. 

-  Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. 

-  R is measured at TJ approximately 90°C. 

-  Limited by TJmax, starting TJ = 25°C, L = 1mH, RG = 50, IAS = 45A, VGS =10V. 

- When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994: http://www.irf.com/technical-info/appnotes/an-994.pdf 

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Submit Datasheet Feedback                   March 5, 2015 

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IRFS7530-7PPbF ~~ees~~ 

## **Dynamic  Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**<br>~~sD~~<br>~~es~~|**Parameter**<br>~~sD~~|**Min.**<br>~~sD~~<br>~~GD~~|**Typ. Max. Units**<br>~~sD~~<br>~~GO~~<br>~~GO~~|**. Max. Units**<br>~~sD~~<br>~~OO~~<br>~~OO~~|**. Max. Units**<br>~~sD~~<br>~~OO~~<br>~~OO~~|**. Max. Units**<br>**Conditions**<br>~~sD~~|
|---|---|---|---|---|---|---|
|gfs<br>~~GD~~<br>~~es~~|Forward Transconductance<br>~~GD~~|249<br>~~GD ~~<br>~~GD~~|–––<br> ~~GO~~<br>~~GD~~<br>~~GO~~|–––<br>~~OO~~<br>~~GD~~<br>~~OO~~|S<br>~~OO~~<br>~~GD~~<br>~~OO~~|VDS= 10V,ID=100A<br>~~GD~~|
|Qg<br>~~es~~|Total Gate Charge|–––|236<br>~~GO~~|354<br>~~OO~~|nC<br>~~OO~~|ID= 100A<br>VDS= 30V<br>VGS= 10V|
|Qgs<br>~~es~~|Gate-to-Source Charge|–––|62<br>~~GO~~|–––<br>~~OO~~|||
|Qgd<br>~~a~~|Gate-to-Drain Charge|–––|73|–––|||
|Qsync|Total Gate Charge Sync.(Qg-Qgd)|–––|163|–––|||
|td(on)<br>~~a~~<br>~~es~~|Turn-On DelayTime<br>~~a~~<br>|–––<br>~~a~~|24<br>~~a~~|–––<br>~~a~~|ns|VDD= 30V<br>ID= 100A<br>RG= 2.7<br>VGS= 10V|
|tr<br><br>~~es~~|Rise Time<br>~~a~~<br>|–––<br>~~a~~|102<br>~~a~~|–––<br>~~a~~|||
|td(off)<br><br>~~esee~~|Turn-Off DelayTime<br>~~a~~<br>~~ee~~|–––<br>~~a~~|168<br>~~a~~|–––<br>~~a~~|||
|tf<br>~~ee~~|Fall Time<br>~~ee~~|–––|79|–––|||
|Ciss<br>~~ee~~|Input Capacitance<br>~~ee~~|––– 12960 –––|––– 12960 –––|––– 12960 –––|pF<br>~~es~~|VGS= 0V<br>VDS= 25V<br>ƒ= 1.0MHz|
|Coss<br>~~ee~~|Output Capacitance<br>~~ee~~|–––|1270|–––|||
|Crss<br>~~ee~~|Reverse Transfer Capacitance|–––|760|–––|||
|Coss eff.(ER)<br>~~ee~~<br>~~es~~|Effective Output Capacitance(EnergyRelated)<br>~~FD~~|–––<br>~~FD~~|1248<br>~~FD~~|–––<br>~~FD~~||VGS= 0V,VDS= 0V to 48V|
|Coss eff.(TR)<br>~~ee~~<br>~~es~~|Output Capacitance(Time Related)<br>~~FD~~|–––<br>~~FD~~|1590<br>~~FD~~|–––<br>~~FD~~||VGS= 0V,VDS= 0V to 48V|
|**Diode Characteristics**<br>~~esFDes~~<br>~~OO~~|||||||
|**Symbol**<br>~~O~~|**Parameter **<br>~~O~~|**Min.**<br>~~Oe~~|**Typ. M**<br>~~e~~|**. Max.**<br>~~e~~<br>~~OO~~|**Units**<br>~~e~~<br>~~OO~~|**Conditions**<br>~~e~~|
|IS<br>~~O~~<br>~~a~~|Continuous Source Current<br>(Body Diode)<br>~~O~~<br>~~a~~|–––<br>~~Oe~~<br>~~a~~|––– 338<br>~~e~~<br>~~a~~|––– 338<br>~~e~~<br>~~OO~~<br>~~a~~|A<br>~~e~~<br>~~OO~~<br>~~a~~|D<br>S<br>G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunctiondiode.<br>~~e~~<br>~~a~~|
|ISM<br>~~a~~|Pulsed Source Current<br>(BodyDiode)<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~|1450<br>~~a~~|||
|VSD<br>~~a~~<br>~~ee~~|Diode Forward Voltage<br>~~a~~<br>~~Ge~~<br>~~ee~~|–––<br>~~a~~<br>~~Ge~~<br>~~ee~~|–––<br>~~a~~<br>~~GO~~<br>~~ee~~|1.2<br>~~a~~<br>~~GO~~<br>~~ee~~|V<br>~~a~~<br>~~ee~~|TJ= 25°C,IS= 100A,VGS= 0V<br>~~a~~<br>~~ee~~|
|dv/dt<br>~~ee~~<br>~~pf~~|Peak Diode Recoverydv/dt<br>~~ee~~<br>~~pf~~|–––<br>~~ee~~<br>|8.5<br>~~ee~~<br>|–––<br>~~ee~~<br>|V/ns T<br>~~ee~~<br>|V/ns TJ= 175°C,IS=100A,VDS= 60V<br>~~ee~~|
|trr<br>~~ee~~<br>~~pf~~|Reverse Recovery Time<br>~~ee~~<br>~~pf~~|–––<br>~~ee~~<br>|48<br>~~ee~~<br>|–––<br>~~ee~~<br>|ns<br>~~ee~~<br>|TJ =25°CVDD= 51V<br>TJ =125°CIF= 100A,<br>TJ =25°Cdi/dt = 100A/µs<br>TJ =125°C <br>TJ= 25°C <br>~~ee~~<br>~~a~~|
|||–––<br>~~ee~~<br>|50<br>~~ee~~<br>|–––<br>~~ee~~<br>|||
|Qrr<br>~~pfee~~|Reverse Recovery Charge<br>~~pfee~~|–––<br>~~ee~~|72<br>~~ee~~|–––<br>~~ee~~|nC<br>~~ee~~||
|||–––<br>~~ee~~|83<br>~~ee~~|–––<br>~~ee~~|||
|IRRM<br>~~ee~~<br>~~a~~|Reverse Recovery Current<br>~~ee~~<br>~~a~~|–––<br>~~ee~~<br>~~a~~|2.5<br>~~ee~~<br>~~a~~|–––<br>~~ee~~<br>~~a~~|A<br>~~ee~~<br>~~a~~||



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IRFS7530-7PPbF ~~Se~~ 

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10000 10000<br>VGS VGS<br>TOP           15V TOP           15V<br>10V 10V<br>8.0V 8.0V<br>1000 7.0V 7.0V<br>6.0V 6.0V<br>1000<br>5.5V 5.5V<br>He 5.0V 5.0V Wl<br>BOTTOM 4.5V BOTTOM 4.5V<br>100<br>100<br>10 Pra | | ype 4.5V<br>4.5V<br> 60µs PULSE WIDTH  60µs PULSE WIDTH<br>Tj = 25°C Tj = 175°C<br>1 10 ill<br>0.1 aii 1 [Ge] 10 100 0.1 1 10 | 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 3.   Typical Output Characteristics  Fig 4.   Typical Output Characteristics<br>10000 2.5<br>ID = 100AD = 100A= 100A<br>1000 VGS = 10VGS = 10V= 10V<br>tte TJ = 175°C 2.0 ty<br>100<br>1.5<br>10 yA T J  = 25°C TT<br>1.0<br>1<br>VDS = 25V<br>7 LAT<br> 60µs PULSE WIDTH<br>0.1 LI 0.5 TUTTLE<br>2.0 4.0 6.0 8.0<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>VGS, Gate-to-Source Voltage (V)<br>TJ , Junction Temperature (°C)<br>Fig 5.   Typical Transfer Characteristics  Fig 6.   Normalized On-Resistance vs. Temperature<br>1000000 14<br>VGS   = 0V,       f = 1 MHZ<br>Ciss    = Cgs  + Cgd,  Cds  SHORTED 12 ID=  1 00A V DS=  48 V<br>Crss    = Cgd  V DS=  30 V<br>100000 Tt C oss   = C ds  + C gd 10 VDS= 12 V<br>| 8 Foy<br>Ciss<br>10000<br>TT 38 36 6 HA<br>San al<br>Coss 4<br>1000 See<br>Crss<br>Fh | 2 ee<br>100 UU TEMRee 0 AZr<br>0 50 100 150 200 250 300<br>1 10 100<br> QG  Total Gate Charge (nC)<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>VGS, Gate-to-Source Voltage (V)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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2.5<br>ID = 100AD = 100A= 100A<br>VGS = 10VGS = 10V= 10V<br>2.0 ty<br>1.5<br>TT<br>1.0<br>LAT<br>0.5 TUTTLE<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>TJ , Junction Temperature (°C)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 6.** Normalized On-Resistance vs. Temperature 

**Fig 8.** Typical Gate Charge vs. Gate-to-Source Voltage 

**Fig 7.** Typical Capacitance vs. 

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IRFS7530-7PPbF ~~Ld~~ 

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TesaR Ld<br>10000<br>10000<br>1000<br>1000<br>EEEEEE=S TJ = 175°C Sie) Set) 100µsec  Si<br>100 a) 100 ae<br>1msec<br>Limited by<br>10 T J  = 25°C 10 Package<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on) 10msec<br>1 anee 1 Tc = 25°C<br>Tj = 175°C<br>VGS = 0V Single Pulse DC<br>0.1 ATA} 0.1 Poe<br>0.2 FEEERe 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1 10 kt 100<br>VSD, Source-to-Drain Voltage (V) VDS,  Drain-toSource Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 9.** Typical Source-Drain Diode Forward Voltage 

**==> picture [209 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
80<br>Id = 1.0mA<br>70<br>60<br>-60 -40 -20 0 20 40 60 80 100120140160180<br>TJ , Temperature ( °C )<br>V(BR)DSS, Drain-to-Source Breakdown Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 10.** Maximum Safe Operating Area 

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2.0<br>1.5 TLLLY<br>1.0 LY<br>0.5<br>|<br>0.0 BZannn<br>0 10 20 30 40 50 60<br>VDS, Drain-to-Source Voltage (V)<br>Energy (µJ)<br>**----- End of picture text -----**<br>


**Fig 11.** Drain-to-Source Breakdown Voltage 

**Fig 12.** Typical Coss Stored Energy 

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**----- Start of picture text -----**<br>
2.2<br>VGS = 5.5V<br>2.0 V GS  = 6.0V<br>VGS = 7.0V<br>VGS = 8.0V<br>1.8<br>VGS = 10V<br>|<br>1.6<br>1.4 4b<br>1.2<br>— | ++—<br>Za<br>1.0<br>0 50 100 150 200<br>ID, Drain Current (A)<br>)<br><br>m<br>RDS(on),  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

5 ~~—~~ 

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IRFS7530-7PPbF ~~oy~~ 

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1<br>fen SEE<br>D = 0.50<br>0.1<br>0.20<br>0.10<br>0.05<br>0.01 0.02<br>0.01<br>SBEAAol nf vom<br>0.001 SINGLE PULSE<br>( THERMAL RESPONSE ) Notes:<br>1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthjc + Tc<br>0.0001<br>1E-006 the 1E-005 ieee 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>Fig 14.   Maximum Effective Transient Thermal Impedance, Junction-to-Case<br>1000<br>Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming Tj = 150°C and<br>Tstart =25°C (Single Pulse)<br>Tt 25a<br>100<br>10<br>Allowed avalanche Current vs avalanche<br>BULL pulsewidth, tav, assuming  Zak j = 25°C and  Si SS |<br>Tstart = 150°C. (Single Pulse)<br>broom<br>1<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01<br>El || EPire<br>tav (sec)<br>Fig 15. Avalanche Current vs. Pulse Width<br>2400<br>Notes on Repetitive Avalanche Curves , Figures 14, 15:<br>                 I D (For further info, see AN-1005 at www.irf.com)<br>2000 TOP           21A 1.Avalanche failures assumption:<br>                44A Purely a thermal phenomenon and failure occurs at a<br>1600 cca BOTTOM   100A temperature far in excess of Tjmaxjmax. This is validated for every<br>Ne part type.<br>2. Safe operation in Avalanche is allowed as long asTjmaxjmax is not<br>   exceeded.<br>1200<br>3. Equation below based on circuit and waveforms shown in Figures<br>XE<br>    23a, 23b.<br>800 4. PD (ave) = Average power dissipation per single avalanche pulse. D (ave) = Average power dissipation per single avalanche pulse. = Average power dissipation per single avalanche pulse.<br>NEN ET 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage<br> increase during avalanche).<br>400 6. Iav = Allowable avalanche current.<br>PNT<br>7. T = Allowable rise in junction temperature, not to exceed TT = Allowable rise in junction temperature, not to exceed TT = Allowable rise in junction temperature, not to exceed Tjmax<br>    (assumed as 25°C in Figure 14, 15).<br>0 | |Sal tav = Average time in avalanche.<br>25 50 75 100 125 150 175 D = Duty cycle in avalanche =  tav ·f<br>ZthJC(D, tav) = Transient thermal resistance, see Figures 13) thJC(D, tav) = Transient thermal resistance, see Figures 13) (D, tav) = Transient thermal resistance, see Figures 13) av) = Transient thermal resistance, see Figures 13) ) = Transient thermal resistance, see Figures 13)<br>Starting TJ, Junction Temperature (°C)<br>EAS, Single Pulse Avalanche Energy (mJ)<br>Avalanche Current (A)<br>Thermal Response ( Z thJC ) °C/W<br>**----- End of picture text -----**<br>


   - Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmaxjmax. This is validated for every part type. 

2. Safe operation in Avalanche is allowed as long asTjmaxjmax is not exceeded. 

3. Equation below based on circuit and waveforms shown in Figures 23a, 23b. 

4. PD (ave) = Average power dissipation per single avalanche pulse. D (ave) = Average power dissipation per single avalanche pulse. = Average power dissipation per single avalanche pulse. 

5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 

7. T = Allowable rise in junction temperature, not to exceed TT = Allowable rise in junction temperature, not to exceed TT = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 14, 15). 

   - ZthJC(D, tav) = Transient thermal resistance, see Figures 13) thJC(D, tav) = Transient thermal resistance, see Figures 13) (D, tav) = Transient thermal resistance, see Figures 13) av) = Transient thermal resistance, see Figures 13) ) = Transient thermal resistance, see Figures 13) PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC Iav = 2T/ [1.3·BV·Zth] 

      - EAS (AR) = PD (ave)·tav 

**Fig 16.** Maximum Avalanche Energy vs. Temperature 

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**----- Start of picture text -----**<br>
4.0 16<br>IF = 60A<br>3.5 VR = 51V<br>Oo 12 T J = 25°C ry<br>3.0 TJ = 125°C<br>2.5 PSSST ID = 250µA 8 Poe<br>ID = 1.0mA<br>2.0 I D  = 1.0A<br>RN 4 Bann<br>1.5 FANG et7<br>TONS a<br>1.0 PECECECES 0 “TELL<br>-75 -50 -25 0 25 50 75 100 125 150 175 0 200 400 600 800 1000<br>TJ , Temperature ( °C ) diF /dt (A/µs)<br>Fig 17.   Threshold Voltage vs. Temperature  Fig 18.   Typical Recovery Current vs. dif/dt<br>16 500<br>IF = 100A IF = 60A<br>VR = 51V VR = 51V<br>12 T J  = 25°C 400 TJ = 25°C<br>TJ = 125° C TJ = 125°C<br>300<br>OleB24 ssBe<br>8<br>200<br>4<br>YO Bean<br>100<br>cai) = HGEeE<br>0 tT Ed 0 mT TLL<br>0 200 400 600 800 1000 0 200 400 600 800 1000<br>diF /dt (A/µs) diF /dt (A/µs)<br>Fig 19.   Typical Recovery Current vs. dif/dt  Fig 20.   Typical Stored Charge vs. dif/dt<br>IRRM (A)<br>VGS(th) Gate threshold Voltage (V)<br>IRRM (A) QRR (nC)<br>**----- End of picture text -----**<br>


**Fig 18.** Typical Recovery Current vs. dif/dt 

**Fig 19.** Typical Recovery Current vs. dif/dt 

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**----- Start of picture text -----**<br>
500<br>IF = 100A<br>VR = 51V<br>400<br>TJ = 25°C<br>TJ = 125°C<br>HE| Le<br>300<br>200<br>ERs<br>100 Be=64n<br>TL<br>0<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br>


**Fig 21.** Typical Stored Charge vs. dif/dt 

7 ~~—~~ 

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**Fig 22.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET[® ] Power MOSFETs 

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**----- Start of picture text -----**<br>
15V<br>VDS L DRIVER<br>R G D.U.T +<br>- [V][DD]<br>20V aeJL IAS<br>tp 0.01<br>**----- End of picture text -----**<br>


**Fig 23a.** Unclamped Inductive Test Circuit 

**Fig 24a.** Switching Time Test Circuit 

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V(BR)DSS<br>< tp ><br>IAS<br> Unclamped Inductive Waveforms<br>90% IK |<br>|<br>|<br>, | |<br>10% |<br>ta(on) tr taco)<br>Fig 24b.   Switching Time Waveforms<br>Id<br>Vds !<br>Vgs<br>fi<br>Vgs(th)<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 23b.** Unclamped Inductive Waveforms 

**Fig 24b.** Switching Time Waveforms 

**Fig 25a.** Gate Charge Test Circuit 

**Fig 25b.** Gate Charge Waveform 

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**D[2] Pak-7Pin  Package Outline** (Dimensions are shown in millimeters (inches)) 

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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## **D[2] Pak-7Pin  Part Marking Information** 

## **D2Pak-7Pin Tape and Reel** 

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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## **Qualification Information[† ]** 

|**Qualification Information[† ]**|||
|---|---|---|
|**Qualification Level**|Industrial<br>(per JEDEC JESD47F)††||
|**Moisture Sensitivity Level**|D2Pak-7Pin|MSL1<br>(per JEDEC J-STD-020D††)|
|**RoHS Compliant**|Yes||



- Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/ 

††  Applicable version of JEDEC standard at the time of product release. 

## **Revision History** 

|**Date**|**Comment**|
|---|---|
|03/05/2015|Updated EAS (L =1mH)= 1029mJ  on page 2<br>Updated note 9  “Limited by TJmax, starting TJ= 25°C, L = 1mH, RG= 50, IAS= 45A, VGS=10V” on page 2<br>Updated package outline on page 9 .|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ © 2015 International Rectifier Submit Datasheet Feedback                   March 5, 2015                    March 5, 2015 ~~_~~ 

11 www.irf.com ~~=~~ 

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## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFS7530TRL7PP/power-mosfet-n-channel-60-v-240-a-1400-ohm-to-263)
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---

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