# Power MOSFET, N Channel, 150 V, 51 A, 0.032 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:3155144/)

**URL**: https://novapart.co/products/IRFS52N15DTRLP/power-mosfet-n-channel-150-v-51-a-0032-ohm-to-263
**SKU**: IRFS52N15DTRLP
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3600
**Stock**: 200+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:51A; Drain Source Voltage Vds:150V; On Resistance Rds(on):0.032ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 230W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 150V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 51A |
| Drain Source On State Resistance | 0.032ohm |
| Gate Source Threshold Voltage Max | 5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3155144/)

PD - 97002A IRFB52N15DPbF 

## **Applications** 

High frequency DC-DC converters Plasma Display Panel **Benefits** Low Gate-to-Drain Charge to Reduce\ Switching Losses ° 

Low Gate-to-Drain Charge to Reduce\ Switching Losses Fully Characterized Capacitance Including Effective COSS to Simplify Design, (See App. Note AN1001) Fully Characterized Avalanche Voltage and Current Lead-Free 

HEXFET Power MOSFET 

**Key Parameters** VDS 150 V VDS (Avalanche) min. 200 V RDS(ON) max @ 10V ~~ee~~ 32 m TJ max ~~ee~~ 175 °C ~~===~~ TO-220AB D[2] Pak TO-262 IRFB52N15DPbF IRFS52N15DPbF IRFSL52N15DPbF 

## **Absolute Maximum Ratings** 

|a|**Parameter**<br>a|**Max.**<br>a|**Max.**<br>a|**Max.**<br>a|**Units**<br>a|**Units**<br>a|
|---|---|---|---|---|---|---|
|ID@ TC= 25°C<br>ee|Continuous Drain Current, VGS@ 10V<br>ee|51*|||A||
|ID@ TC= 100°C|Continuous Drain Current, VGS@ 10V|36*|||||
|IDM|Pulsed Drain Current|240|||||
|PD@TA= 25°C<br>~~re~~<br>~~ee~~|Power Dissipation<br>~~re~~<br>~~ee~~|3.8<br>~~ee~~|||W<br>~~ee~~||
|PD@TC= 25°C<br>~~ee~~|Power Dissipation<br>~~ee~~|230*<br>~~ee~~|||||
|~~a~~|Linear DeratingFactor<br>|1.5*<br>|||W/°C<br>||
|VGS<br>~~——————~~|Gate-to-Source Voltage<br>~~——————~~|± 30<br>~~——————~~|||V<br>~~——————~~||
|dv/dt<br>~~——————~~<br>~~——~~<br>||Peak Diode Recoverydv/dt<br>~~——————~~<br>~~a~~<br>~~ee~~|5.5<br>~~——————~~<br>~~a~~<br>~~oe~~|||V/ns<br>~~——————~~<br>~~a~~<br>Oe||
|TJ<br>~~——~~<br>||Operating Junction and<br>~~a~~<br>~~ee~~|-55  to + 175<br>~~a~~<br>~~oe~~|||°C<br>~~a~~<br>Oe||
|TSTG<br>~~——~~<br>|es|Storage Temperature Range<br>~~a~~<br>~~ee~~||||||
|~~——~~<br>|es<br>ee|Soldering Temperature, for 10 seconds<br>~~a~~<br>~~ee~~|300 (1.6mm from case )<br>~~a~~<br>~~oe~~|||||
|~~——~~<br>|es<br>ee|Mounting  torqe,  6-32  or M3  screw<br>10 lbf•in (1.1N•m)<br>~~a~~<br>~~ee ~~|10 lbf•in (1.1N•m)<br>~~a~~<br> ~~oe~~|||~~a~~<br> Oe||
|**Thermal Resistance**<br>ee<br>—————————|||||||
|—————————<br>ee|**Parameter**<br>—————————||**Typ.**<br>—————————|**Max.**||**Units**|
|RθJC<br>—————————<br>ee|Junction-to-Case<br>—————————||–––<br>—————————|0.47*||°C/W|
|RθCS<br>—————————<br>ee<br>a|Case-to-Sink, Flat, Greased Surface<br>—————————||0.50<br>—————————|–––|||
|RθJA<br>—————————<br>a|Junction-to-Ambient<br>—————————||–––<br>—————————|62|||
|RθJA<br>—————————<br>a|Junction-to-Ambient<br>—————————||–––<br>—————————|40|||



* R θ JC (end of life) for D[2] Pak and TO-262 = 0.65°C/W. This is the maximum measured value after 1000 temperature cycles from -55 to 150°C and is accounted for by the physical wearout of the die attach medium. 

Notes (0) through @ are  on page 11 www.irf.com 

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IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

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||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|es|Parameter|ee|Min.|T|ee|yp.|Max.|Units|Conditions|
|V(BR)DSS|Re|Drain-to-Source Breakdown Voltage|150|–––|–––|V|VGS = 0V, ID = 250µA|
|∆|V(BR)DSS/|∆|TJ|es|Breakdown Voltage Temp. Coefficient|–––      0.16   –––     V/°C    Reference to 25°C, ID = 1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|–––|32|m|Ω|VGS = 10V, ID = 36A|
|es|®|
|VGS(th)|es|Gate Threshold Voltage|3.0|–––|5.0|V|VDS = VGS, ID = 250µA|
|IIGSSDSS|eeee|Gate-to-Source Forward LeakageGate-to-Source Reverse LeakageDrain-to-Source Leakage Current|||es|––––––––––––|ee|––––––––––––|ee|-10010025025|µAnA|VVVVDSDSGSGS = 150V, V = 120V, V = 30V = -30V|GSGS = 0V = 0V, TJ = 150°C|
|Dynamic @ TJ = 25°C (unless otherwise specified)|
|ee|Parameter|Min.|ee ee|Typ.|Max.|Units|Conditions|
|gfs|Rs|Forward Transconductance|19|–––|–––|S|VDS = 50V, ID = 36A|
|Qg|a|Total Gate Charge|–––      60      89                 ID = 36A|
|Qgs|ee|Gate-to-Source Charge|–––|18|27|nC|VDS = 75V|
|Qgd|Gate-to-Drain ("Miller") Charge|–––|28|42|VGS = 10V,|
|ee|@|
|td(on)|ee|Turn-On Delay Time|–––|16|–––|VDD = 75V|
|es|tr|Rise Time|–––|es|47|ee|–––|ns|ID = 36A|
|td(off)|Turn-Off Delay Time|–––|28|–––|RG = 2.5|Ω|
|ee|ee|
|tf|Fall Time|–––|25|–––|VGS = 10V|
|ee|Ciss|Input Capacitance|–––|2770|–––|VGS = 0V|°|
|Coss|Output Capacitance|–––|590|–––|VDS = 25V|
|es|||
|Crss|Reverse Transfer Capacitance|–––|110|–––|pF|ƒ = 1.0MHz|
|es|ee|
|Coss|Output Capacitance|–––|3940|–––|VGS = 0V,  VDS = 1.0V,  ƒ = 1.0MHz|
|es|es|
|Coss|Output Capacitance|–––|260|–––|VGS = 0V,  VDS = 120V,  ƒ = 1.0MHz|
|esee|
|Coss eff.|Effective Output Capacitance|–––|550|–––|VGS = 0V, VDS = 0V to 120V|
|es|®|
|Avalanche|Characteristics|
|Parameter|Min.|Typ.|Max.|Units|
|EAS|Single Pulse Avalanche Energy|–––|–––|470|mJ|
|a|-;|
|IAR|eo|Avalanche Current|–––|–––|36|A|
|EAR|Gn|Repetitive Avalanche Energy|–––|450|–––|mJ|
|VDS (Avalanche)|©|Repetitive Avalanche Voltage|en|Gs|200|–––|–––|V|
|Diode Characteristics|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|60|MOSFET symbol|D|
|>|(Body Diode)|showing  the|
|ISM|Pulsed Source Current|–––|–––|240|integral reverse|G|
|fwSa|(Body Diode)|p-n junction diode.|a|S|
|VSD|Diode Forward Voltage|–––|–––|1.5|V|TJ = 25°C, IS = 36A, VGS = 0V|
|Se|trr|es|Reverse Recovery Time|–––|Tf|140|210|nS|TJ = 25°C, IF = 36A|@|
|Qrr|Reverse RecoveryCharge|–––|780|1170|nC|di/dt = 100A/µs|
|+|ton|Po|Forward Turn-On Time|__|—_}—_—|Intrinsic turn-on time is negligible (turn-on is dominated by L|@|S+LD)|

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IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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1000 1000<br>VGS VGS<br>TOP           15V TOP           15V<br>                   12V                    12V<br>                   10V                    10V<br>                   8.0V                    8.0V<br>100                7.0V 100                7.0V<br>                   6.0V                    6.0V<br>                   5.5V                    5.5V<br>BOTTOM   5.0V BOTTOM   5.0V<br>10 10 5.0V<br>5.0V<br>1 TT 1<br>cue er) A TE<br>300µs PULSE WIDTH 300µs PULSE WIDTH<br>Tj = 25°C Tj = 175°C<br>0.1 ee e lll 0.1 0 a<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br>1000.00 3.0<br>I D = 60A<br>e e 2.5<br>ee<br>100.00 T = 175°C 2.0<br>J<br>o e s HHA<br>Ae ee ee 1.5 SERRE<br>TJ = 25°C<br>10.00 1.0<br>E e La |<br>a ee 0.5 +t | | | | TT Tt<br>VDS = 15V<br>1.00 P f} 300µs PULSE WIDTH 0.0 GRpt Ett et EE| V GS = 10V<br>5.0 7.0 9.0 11.0 13.0 15.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>VGS, Gate-to-Source Voltage (V) T  , Junction TemperatureJ (    C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>)<br>(Α<br>ID, Drain-to-Source Current<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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100000 12<br>VGS   = 0V,       f = 1 MHZ ID= 36A<br>pt CCiss    = C  = Cgs + Cgd,   Cds    SHORTED 10 || VDS= 120V — | | |<br>10000 a il Crss  oss   = Cgd ds + Cgd | | VDS= 75V LN |<br>8<br>Ciss<br>SS ae tH 6 Sf pe<br>1000 S ERRE<br>i = F EA<br>Coss<br>4<br>1]<br>100 I N Crss T 2 A<br>10 | a ee| el| 0 0 yV 10 | 20 |fl 30 40 50 60 70<br>1 10 100 1000<br> QG  Total Gate Charge (nC)<br>VDS, Drain-to-Source Voltage (V)<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>1000.00 1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>PP ff Patte e<br>100.00 TJ = 175°C 100 at So<br>2 a weddd bine = HtHttH<br>100µsec<br>10.00 e e ey Ay A ee 10 PEERS PARE 5<br>1msec<br>f f a acon em<br>TJ = 25°C<br>———— Sm ee<br>1.00 1 10msec<br>f f C i esisntoiemati A<br>Tc = 25°C<br>VGS = 0V Tj = 175°C<br>0.10 |esfife ee| 0.1 HE Single Pulse lll R re<br>0.0 0.5 1.0 1.5 2.0 2.5 1 10 100 1000<br>VSD, Source-toDrain Voltage (V) VDS  , Drain-toSource Voltage (V)<br>ISD, Reverse Drain Current (A)<br>VGS, Gate-to-Source Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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70<br>60 pi | i tt td} dt | tT<br>PNP Pp ey ey Ves DUT.<br>50 PLT PAE E EL LL [ Re -<br>Pf te Ay tt tt Voo<br>40 aN sf tov<br>P| | | tt | NEE EL Pulse Width ≤ 1  ys<br>≤ 0.1 %<br>30 Pi,P| | Tee| tttETNtT NEL[LE Duty Factor<br>Fig 10a.   Switching Time Test Circuit<br>20 See ee eee<br>PT[tee VDS<br>10 fFpi| | | || | Td TdT| PETE| |TdT|  LLNSTT| [IN 90% |<br>0 Ft tt tt} ft} ff fy |<br>25 50T   , Case TemperatureC 75 100 125 (    C)° 150 175 10% |<br>VGS | |<br>\« p< >! le<br>Fig 9.   Maximum Drain Current Vs. td(on) tr td(off) tf<br>Case Temperature<br>Fig 10b.   Switching Time Waveforms<br> 1 rere<br>i ee ses | eS) EE ee eee ae a eerereermneel<br>a D = 0.50 a se<br>0.1 an_ 0.20 i ee eeee EL LRee RALLE<br>e ee<br>e 0.10 eee<br>aa 0.05 ee 2eaea a8eeeee ee<br>0.02 SINGLE PULSE<br>0.01 (THERMAL RESPONSE) P DM<br>0.01 aea l | 0<br>t 1<br>a a ee ee ee ee ee ee ee Qe OO OG OG OO t 2<br>a a ee ee ee ee eee<br>Notes:<br>1. Duty factor D = t   / t1 2<br>i Co 2. Peak T J = P DM x  Z thJC + T C<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z          )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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15V<br>VDS L DRIVER<br>R G D.U.T +<br>- [V][DD]<br>IAS<br>20V<br>olf tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

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V(BR)DSS<br>| tp<br>/ al<br>|<br>IAS 7<br>**----- End of picture text -----**<br>


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900<br>ID<br>NEG<br>TOP 15A<br>26A<br>\ |<br>720 PN BOTTOM 36A<br>540<br>ONE<br>SENET<br>360 BNNENEPpONAN Eee<br>180<br>pot SSA<br>COOTPSSS<br>Pt tT tT UES<br>0<br>25 50 75 100 125 150 175<br>Starting Tj, Junction Temperature (   C)°<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy Vs. Drain Current 

**Fig 12b.** Unclamped Inductive Waveforms 

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QG<br>ov T O<br>QGS QGD<br>VG<br>be<br>/<br>Charge<br>**----- End of picture text -----**<br>


**Fig 13a.** Basic Gate Charge Waveform 

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Current Regulator<br>Same Type as D.U.T.<br>50K Ω<br>12V .2 µ F<br>| lst .3 µ F<br>+<br>D.U.T. -VDS<br>VGS<br>“6<br>3mA<br>a |<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13b.** Gate Charge Test Circuit 

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## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Rg •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>(1) Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>VGS=10V<br>t<br>D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ) Current ==<br>Ty) di/dt /<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  a Forward Drop<br>® Inductor Curent<br>S$<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


**Fig 14.** For N-Channel HEXFET ® Power MOSFETs 

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7 

## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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**----- Start of picture text -----**<br>
EXAMPLE: THIS IS AN IRF1010<br>LOT CODE 1789 INTERNATIONAL PART NUMBER<br>ASSEMBLED ON WW 19, 1997 RECTIFIER<br>IRF1010<br>IN THE ASSEMBLY LINE "C" LOGO I@aR 719C<br>17 89 DATE CODE<br>YEAR 7 =  1997<br>Note: "P" inassembly line position ASSEMBLY<br>indicates "Lead - Free" LOT CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


## **TO-220 package is not recommended for Surface Mount Application.** 

## **Notes:** 

**1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/** 

**2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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**----- Start of picture text -----**<br>
THIS IS AN IRF530S WITH PART NUMBER<br>LOT CODE 8024 INTERNATIONAL cS<br>ASSEMBLED ON WW 02, 2000 RECTIFIER F530S<br>IN THE ASSEMBLY LINE "L" LOGO IaR 002i<br>80 24 DATE CODE<br>YEAR 0 =  2000<br>ASSEMBLY<br>assembly"Lead line- Free”position LOT CODE H H WEEK 02LINE L<br>OR<br>PART NUMBER<br>INTERNATIONAL cS<br>RECTIFIER F530S<br>LOGO TeaR P002A DATE CODE<br>80 24 P =  DESIGNATES LEAD - FREE<br>PRODUCT (OPTIONAL)<br>ASSEMBLYLOT CODE W tUe U YeU YEAR 0 =  2000WEEK 02<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


## **Notes:** 

**1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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9 

## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

## TO-262 Package Outline 

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__ IG BT<br>1- GATE<br>**----- End of picture text -----**<br>


## TO-262 Part Marking Information 

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EXAMPLE: THIS IS AN IRL3103L<br>LOT CODE 1789 PART NUMBER<br>ASSEMBLED ON WW 19, 1997IN THE ASSEMBLY LINE "C" INTERNATIONALRECTIFIERLOGO cSIARIRL3103L719¢<br>17 89 DATE CODE<br>Note: "P”indicatesin assembly“Lead line- Free”position ASSEMBLYLOT CODE YEAR 7 =  1997WEEK 19<br>LINE C<br>OR<br>PART NUMBER<br>INTERNATIONAL a<br>RECTIFIER IRL3103L<br>LOGO Ie3R P7I9A<br>17 89 DATE CODE<br>ASSEMBLY P =  DESIGNATES LEAD-FREE<br>LOT CODE PRODUCT (OPTIONAL)<br>YEAR 7 =  1997<br>WEEK 19<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


## **Notes:** 

**1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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## IRFB52N15DPbF/IRFS52N15DPbF/IRFSL52N15DPbF 

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TRR<br>1.60 (.063)<br>1.50 (.059)<br>4.10 (.161)3.90 (.153) 1.60 (.063)1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 15.42 (.609) 24.30 (.957)<br>15.22 (.601) 23.90 (.941)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>FEED DIRECTION<br>13.50 (.532) 27.40 (1.079)<br>° 12.80 (.504) 23.90 (.941) _ 4 Ip<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>| F<br>30.40 (1.197)<br>NOTES : —— Aik       MAX.<br>1.   COMFORMS TO EIA-418.2.   CONTROLLING DIMENSION: MILLIMETER. 26.40 (1.039)24.40 (.961) It 4<br>5 3.   DIMENSION MEASURED @ HUB.4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 3<br>**----- End of picture text -----**<br>


Notes: ® 1% Duty cycle, 100 pulses,  limited by limited by ® Cossoss eff. is a fixed capacitance that gives the same charging time 

® 1% Duty cycle, 100 pulses,  limited by limited by ® Cossoss eff. is a fixed capacitance that gives the same charging time max. junction temperature. as Coss while VDS is rising from 0 to 80% VDSSoss while VDS is rising from 0 to 80% VDSSwhile VDS is rising from 0 to 80% VDSSDS is rising from 0 to 80% VDSSis rising from 0 to 80% VDSSDSS. @ Starting TJ = 25°C, L = 0.72mH © This is only applied to TO-220AB package. RG = 25 Ω , IAS = 36A. This is applied to D[[2]] © ISD ≤ 36A, di/dt ≤ 400A/µs, VDD ≤ V(BR)DSS,[[@]] TJ ≤ 175°C. techniques refer to application note #AN-994. ® Pulse width ≤ 300µs; duty cycle ≤ 2%. 

® Cossoss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSSoss while VDS is rising from 0 to 80% VDSSwhile VDS is rising from 0 to 80% VDSSDS is rising from 0 to 80% VDSSis rising from 0 to 80% VDSSDSS. © This is only applied to TO-220AB package. 

> [[@]] This is applied to D[[2]] Pak, when mounted on 1" square PCB (FR-4 or G-10 Material ).  For recommended footprint and soldering techniques refer to application note #AN-994. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 09/2010 

www.irf.com 

11 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFS52N15DTRLP/power-mosfet-n-channel-150-v-51-a-0032-ohm-to-263)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfs52n15dtrlp/mosfet-n-ch-150v-51a-175deg-c/dp/3155144)
---

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