# Power MOSFET, N Channel, 75 V, 120 A, 4100 µohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2839493RL/)

**URL**: https://novapart.co/products/IRFS3207ZTRRPBF/power-mosfet-n-channel-75-v-120-a-4100-ohm-to-263
**SKU**: IRFS3207ZTRRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.3700
**Stock**: 500+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:120A; Drain Source Voltage Vds:75V; On Resistance Rds(on):0.0033ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Pow

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 300W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 75V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 120A |
| Drain Source On State Resistance | 4100µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2839493RL/)

IRFB3207ZPbF IRFS3207ZPbF IRFSL3207ZPbF 

**Applications** e High Efficiency Synchronous Rectification in SMPS Uninterruptible Power Supply ° ° High Speed Power SwitchingHard Switched and High Frequency Circuits 

## **Benefits** 

Improved  Gate, Avalanche and Dynamic dv/dt Ruggedness Fully Characterized Capacitance and Avalanche SOA Enhanced body diode dV/dt and dI/dt Capability 

Lead-Free RoHS Compliant, Halogen-Free 

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HEXFET [®]  Power MOSFET<br>D ee VDSS 75V ee<br>RDS(on)   typ. 3.3m Ω<br>eee               max. Pe 4.1m Ω<br>G<br>I 170A<br>D (Silicon Limited)<br>ee Oe<br>S ee ID (Package Limited) 120A ee<br>D D<br>D<br>S<br>S S D<br>D G G<br>G<br>TO-220AB D [2] Pak TO-262<br>IRFB3207ZPbF IRFS3207ZPbF IRFSL3207ZPbF<br>**----- End of picture text -----**<br>


|**G**|**D**|**S**|
|---|---|---|
|Gate|Drain|Source|



|**Base Part Number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Orderable Part Number**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRFB3207ZPbF|TO-220|Tube|50|IRFB3207ZPbF|
|IRFSL3207ZPbF|TO-262|Tube|50|IRFSL3207ZPbF|
|IRFS3207ZPbF|D2Pak|Tube|50|IRFS3207ZPbF|
|||Tape and Reel Left|800|IRFS3207ZTRLPbF|
|||Tape andReel Right|800|IRFS3207ZTRRPbF|



## **Absolute Maximum Ratings** 

|**Absolute Maximum Ratings**<br>**Symbol**<br>**Parameter**<br>**Units**<br>ID@ TC= 25°C<br>Continuous Drain Current,VGS @ 10V(Silicon Limited)<br>ID@ TC= 100°C<br>Continuous Drain Current,VGS@ 10V(Silicon Limited)<br>A<br>ID@ TC= 25°C<br>Continuous Drain Current,VGS@ 10V(Wire Bond Limited)<br>IDM<br>Pulsed Drain Current<br>PD@TC= 25°C<br>Maximum Power Dissipation<br>W<br>Linear DeratingFactor<br>W/°C<br>VGS<br>Gate-to-Source Voltage<br>V<br>300<br>± 20<br>2.0<br>**Max.**<br>170<br>120<br>670<br>120<br>~~es~~<br>~~NG~~<br>~~ee ee~~<br>~~esQO~~<br>~~>~~<br>~~eeen~~<br>~~Re~~<br>~~esGO~~|
|---|
|dv/dt<br>Peak Diode Recovery<br>V/ns<br>16|
|TJ<br>Operating Junction and<br>°C<br>TSTG<br>Storage Temperature Range<br>Soldering Temperature, for 10 seconds<br>(1.6mm from case)<br>-55  to + 175<br>300<br>~~$$$~~|
|Mountingtorque,6-32 or M3 screw<br>10lb in(1.1N m)|
|**Avalanche Characteristics**|
|EAS (Thermally limited)<br>Single Pulse Avalanche Energy<br>mJ<br>IAR<br>Avalanche Current<br>A<br>EAR<br>Repetitive Avalanche Energy<br>mJ<br>**Thermal Resistance**<br>170<br>See Fig. 14, 15, 22a, 22b<br>~~PO~~<br>~~se~~<br>~~SS~~<br>~~ee~~<br>~~eeGn~~<br>~~©~~<br>~~|~~|
|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RθJC<br>Junction-to-Case<br>–––<br>0.50<br>RθCS<br>Case-to-Sink,Flat Greased Surface,TO-220<br>0.50<br>–––<br>°C/W<br>~~esQO~~<br>~~>~~<br>~~Se~~<br>~~nO~~|
|RθJA<br>Junction-to-Ambient,TO-220<br>–––<br>62<br>RθJA<br>Junction-to-Ambient (PCB Mount) , D2Pak<br>–––<br>40<br>~~a~~<br>~~nD~~<br>~~>~~|



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**Static @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min. **|**Typ. **|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage|75|–––|–––|V|VGS= 0V, ID= 250µA|
|∆V(BR)DSS/∆TJ|Breakdown Voltage Temp. Coefficient|–––|0.091|–––|V/°C|Reference to 25°C, ID= 5mA�|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|3.3|4.1|mΩ|VGS= 10V, ID= 75A�|
|VGS(th)|Gate Threshold Voltage|2.0|–––|4.0|V|VDS= VGS, ID= 150µA|
|RG(int)|Internal Gate Resistance|–––|0.80|–––|Ω||
|IDSS|Drain-to-Source Leakage Current|–––|–––|20|µA|VDS= 75V, VGS= 0V|
|||–––|–––|250||VDS= 75V, VGS= 0V, TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V|
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -20V|



## **Dynamic @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min. **|**Typ. **|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|gfs|Forward Transconductance|280|–––|–––|S|VDS= 50V, ID= 75A|
|Qg|Total Gate Charge|–––|120|170|nC|ID= 75A<br>VDS= 38V<br>VGS= 10V�|
|Qgs|Gate-to-Source Charge|–––|27|–––|||
|Qgd|Gate-to-Drain("Miller")Charge|–––|33|–––|||
|Qsync|Total Gate Charge Sync. (Qg- Qgd)|–––|87|–––||ID= 75A, VDS=0V, VGS= 10V|
|td(on)|Turn-On DelayTime|–––|20|–––|ns|VGS= 10V�<br>ID= 75A<br>RG= 2.7Ω<br>VDD= 49V|
|tr|Rise Time|–––|68|–––|||
|td(off)|Turn-Off DelayTime|–––|55|–––|||
|tf|Fall Time|–––|68|–––|||
|Ciss|Input Capacitance|–––|6920|–––|pF|VGS= 0V<br>VDS= 50V<br>ƒ= 1.0MHz|
|Coss|Output Capacitance|–––|600|–––|||
|Crss|Reverse Transfer Capacitance|–––|270|–––|||
|Cosseff. (ER)|Effective Output Capacitance(EnergyRelated)�|–––|770|–––||VGS= 0V, VDS= 0V to 60V�|
|Cosseff. (TR)|Effective Output Capacitance(Time Related)�|–––|960|–––||VGS= 0V, VDS= 0V to 60V�|



## **Diode Characteristics** 

|**Symbol**|**Parameter**|**Min. **|**Typ. **|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|IS|Continuous Source Current<br>(BodyDiode)|–––|–––|170�|A|S<br>D<br>G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunction diode.|
|ISM|Pulsed Source Current<br>(BodyDiode)��|–––|–––|670|||
|VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ= 25°C, IS= 75A, VGS= 0V�|
|trr|Reverse Recovery Time|–––|36|54|ns|TJ= 25°C<br>VR= 64V,<br>TJ= 125°C<br>IF= 75A<br>TJ= 25°C<br>di/dt = 100A/µs�<br>TJ= 125°C<br>TJ= 25°C|
|||–––|41|62|||
|Qrr|Reverse Recovery Charge|–––|50|75|nC||
|||–––|67|100|||
|IRRM|Reverse RecoveryCurrent|–––|2.4|–––|A||
|ton|Forward Turn-On Time|Intrinsic turn-on time is negligible(turn-on is dominated byLS+LD)|||||



## **Notes:** 

- Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 120A. Note that current limitations arising from heating of the device leads may occur with some lead mounting arrangements. 

- Repetitive rating;  pulse width limited by max. junction temperature. 

- Limited by TJmax, starting TJ = 25°C, L = 0.033mH 

- RG = 25 Ω , IAS = 102A, VGS =10V. Part not recommended for use above this value. 

- ISD ≤ 75A, di/dt ≤ 1730A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. 

- Pulse width ≤ 400µs; duty cycle ≤ 2%. 

- Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. 

- Coss eff. (ER) is a fixed capacitance that gives the same energy as 

- Coss while VDS is rising from 0 to 80% VDSS. 

- When mounted on 1" square PCB (FR-4 or G-10 Material).  For recom mended footprint and soldering techniques refer to application note #AN-994. 

- R θ is measured at TJ approximately 90°C. 

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1000 1000<br>VGS VGS<br>TOP           15V TOP           15V<br>10V 10V<br>8.0V 8.0V<br>6.0V 6.0V<br>5.5V 5.5V<br>5.0V 5.0V<br>4.8V 4.8V<br>BOTTOM 4.5V BOTTOM 4.5V<br>4.5V<br>100 100<br>4.5V<br>≤ 60µs PULSE WIDTH ≤ 60µs PULSE WIDTH<br>Tj = 25°C Tj = 175°C<br>10 10<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br>1000 2.5<br>ID = 75A<br>VGS = 10V<br>100 2.0<br>TJ = 175°C<br>10 TJ = 25°C 1.5<br>1 1.0<br>VDS = 25V<br>≤ 60µs PULSE WIDTH<br>0.1 0.5<br>2 3 4 5 6 7 -60 -40 -20 0 20 40 60 80 100120140160180<br>TJ , Junction Temperature (°C)<br>VGS, Gate-to-Source Voltage (V)<br>Fig 4.   Normalized On-Resistance vs. Temperature<br>Fig 3.   Typical Transfer Characteristics<br>100000 12.0<br>VCGS  iss CGS  iss GS  iss iss    = C = 0V,       f = 1 MHZgs + Cgd,  C = 0V,       f = 1 MHZgs + Cgd,  Cgs + Cgd,  C+ Cgd,  Cgd,  C,  C ds SHORTEDSHORTED ID= 75A<br>Crss  rss    = Cgd gd  10.0 VDS= 60V<br>Coss  oss   = Cds + Cgdds + Cgd+ Cgdgd VDS= 38V<br>10000 8.0 VDS= 15V<br>Cississ<br>6.0<br>Cossoss<br>1000 4.0<br>Crssrss<br>2.0<br>100 0.0<br>1 10 100 0 20 40 60 80 100 120 140<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

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100000<br>VCGS  iss CGS  iss GS  iss iss    = C = 0V,       f = 1 MHZgs + Cgd,  C = 0V,       f = 1 MHZgs + Cgd,  Cgs + Cgd,  C+ Cgd,  Cgd,  C,  C ds SHORTEDSHORTED<br>Crss  rss    = Cgd gd<br>Coss  oss   = Cds + Cgdds + Cgd+ Cgdgd<br>10000<br>Cississ<br>Cossoss<br>1000<br>Crssrss<br>100<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge vs. Gate-to-Source Voltage 

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1000<br>TJ = 175°C<br>100<br>10 TJ = 25°C<br>1<br>VGS = 0V<br>0.1<br>0.0 0.5 1.0 1.5 2.0 2.5<br>VSD, Source-to-Drain Voltage (V)<br>ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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180<br>160 Limited By Package<br>140<br>120<br>100<br>80<br>60<br>40<br>20<br>0<br>25 50 75 100 125 150 175<br> TC , Case Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 9.** Maximum Drain Current vs. Case Temperature 

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2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>0.0<br>-10 0 10 20 30 40 50 60 70 80<br>VDS, Drain-to-Source Voltage (V)<br>Energy (µJ)<br>**----- End of picture text -----**<br>


**Fig 11.** Typical COSS Stored Energy 

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10000<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br>1000<br>100µsec<br>100<br>1msec<br>1 0msec<br>10<br>DC<br>1<br>Tc = 25°C<br>Tj = 175°C<br>Single Pulse<br>0.1<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 8.   Maximum Safe Operating Area<br>100<br>Id = 5mA<br>95<br>90<br>85<br>80<br>75<br>70<br>-60 -40 -20 0 20 40 60 80 100120140160180<br>TJ , Temperature ( °C )<br>ID,  Drain-to-Source Current (A)<br>V(BR)DSS, Drain-to-Source Breakdown Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 10.** Drain-to-Source Breakdown Voltage 

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700<br>ID<br>600 TOP         17A<br>30A<br>500 BOTTOM 102A<br>400<br>300<br>200<br>100<br>0<br>25 50 75 100 125 150 175<br>Starting TJ , Junction Temperature (°C)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12.** Maximum Avalanche Energy vs. DrainCurrent 

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1<br>D = 0.50<br>0.1 0.20<br>0.10<br>0.05 R1 R1 R2 R2 R3R3 Ri (°C/W)     τ i (sec)<br>τ J τ J τ C τ 0.1049    0.000099<br>0.01 0.02 τ 1 τ 1 τ 2 τ 2 τ 3 τ 3 0.2469    0.001345<br>0.01<br>Ci=  τ i / Ri 0.1484    0.008469<br>Ci τ i / Ri<br>SINGLE PULSE Notes:<br>( THERMAL RESPONSE ) 1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthjc + Tc<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>Fig 13.   Maximum Effective Transient Thermal Impedance, Junction-to-Case<br>1000<br>Duty Cycle =<br>Single Pulse<br>Allowed avalanche Current vs avalanche<br>100 pulsewidth, tav, assuming  ∆ Tj = 150°C and<br>0.01 Tstart =25°C (Single Pulse)<br>0.05<br>10 0.10<br>1<br>Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming  ∆Τ j = 25°C and<br>Tstart = 150°C.<br>0.1<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01<br>tav (sec)<br>Fig 14.   Typical Avalanche Current vs.Pulsewidth<br>200 Notes on Repetitive Avalanche Curves , Figures 14, 15:<br>TOP          Single Pulse                 (For further info, see AN-1005 at www.irf.com)<br>180<br>BOTTOM   1.0% Duty Cycle 1. Avalanche failures assumption:<br>160 ID = 102A Purely a thermal phenomenon and failure occurs at a temperature far in<br>excess of Tjmax. This is validated for every part type.jmax. This is validated for every part type.. This is validated for every part type.<br>140 2. Safe operation in Avalanche is allowed as long asTjmaxjmax is not exceeded.<br>3. Equation below based on circuit and waveforms shown in Figures 16a, 16b.<br>120 4. PD (ave) = Average power dissipation per single avalanche pulse.D (ave) = Average power dissipation per single avalanche pulse.= Average power dissipation per single avalanche pulse.<br>100 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase<br>during avalanche).<br>80 6. Iav = Allowable avalanche current.<br>7.  ∆ T = Allowable rise in junction temperature, not to exceed = Allowable rise in junction temperature, not to exceedAllowable rise in junction temperature, not to exceed Tjmax jmax (assumed as<br>60 25°C in Figure 14, 15).<br>40 tav = Average time in avalanche.<br>D = Duty cycle in avalanche =  tav ·f<br>20 ZthJC(D, tav) = Transient thermal resistance, see Figures 13)<br>0<br>PD (ave) = 1/2 ( 1.3·BV·Iav) =  ∆ T/ ZthJC<br>25 50 75 100 125 150 175<br>Iav = 2 ∆ T/ [1.3·BV·Zth]<br>Starting TJ , Junction Temperature (°C) EAS (AR) = PD (ave)·tavAS (AR) = PD (ave)·tav = PD (ave)·tavD (ave)·tav·tavav<br>EAR , Avalanche Energy (mJ)<br>Avalanche Current (A)<br>Thermal Response ( Z  thJC )<br>**----- End of picture text -----**<br>


- Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type.jmax. This is validated for every part type.. This is validated for every part type. 

2. Safe operation in Avalanche is allowed as long asTjmaxjmax is not exceeded. 

3. Equation below based on circuit and waveforms shown in Figures 16a, 16b. 

4. PD (ave) = Average power dissipation per single avalanche pulse.D (ave) = Average power dissipation per single avalanche pulse.= Average power dissipation per single avalanche pulse. 

5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 

7. ∆ T = Allowable rise in junction temperature, not to exceed = Allowable rise in junction temperature, not to exceedAllowable rise in junction temperature, not to exceed Tjmax jmax (assumed as 25°C in Figure 14, 15). 

**EAS (AR) = PD (ave)·tavAS (AR) = PD (ave)·tav = PD (ave)·tavD (ave)·tav·tavav** 

**Fig 15.** Maximum Avalanche Energy vs. Temperature 

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4.5<br>4.0<br>3.5<br>3.0<br>2.5<br>2.0 I D = 150µA<br>ID = 250µA<br>1.5 I D = 1.0mA<br>ID = 1.0A<br>1.0<br>0.5<br>-75 -50 -25 0 25 50 75 100 125 150 175 200<br>TJ , Temperature ( °C )<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 16.** Threshold Voltage vs. Temperature 

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20<br>IF = 45A<br>VR = 64V<br>15 TJ = 25°C<br>TJ = 125°C<br>10<br>5<br>0<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>IRR (A)<br>**----- End of picture text -----**<br>


**Fig. 18** - Typical Recovery Current vs. dif/dt 

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20<br>IF = 30A<br>VR = 64V<br>15 TJ = 25°C<br>TJ = 125°C<br>10<br>5<br>0<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>IRR (A)<br>**----- End of picture text -----**<br>


**Fig. 17** - Typical Recovery Current vs. dif/dt 

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340<br>IF = 30A<br>VR = 64V<br>260 T J  = 25°C<br>TJ = 125°C<br>180<br>100<br>20<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br>


**Fig. 19** - Typical Stored Charge vs. dif/dt 

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340<br>IF = 45A<br>VR = 64V<br>260 T J  = 25°C<br>TJ = 125°C<br>180<br>100<br>20<br>0 200 400 600 800 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br>


**Fig. 20** - Typical Stored Charge vs. dif/dt 

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Driver Gate Drive<br>P.W.<br>D.U.T + P.W. Period D = Period<br>*<br>� Circuit Layout Considerations VGS=10V<br>   •   Low Stray Inductance<br> •   Ground Plane<br>-       Current Transformer  •   Low Leakage Inductance D.U.T. ISD Waveform<br>+<br>�- - � + ReverseRecoveryCurrent Body Diode ForwardCurrent di/dt<br>D.U.T. VDS Waveform Diode Recovery<br>� dv/dt VDD<br>RG •  •   Driver same type as D.U.T.dv/dt controlled by RG VDD + Re-AppliedVoltage Body Diode  Forward Drop<br>•   ISD controlled by Duty Factor "D" - Inductor CurrentInductor Curent<br>•   D.U.T. - Device Under Test<br>Ripple  ≤ 5% ISD<br>* VGS = 5V for Logic Level Devices<br>Fig 20.  Peak Diode Recovery dv/dt Test Circuit for N-Channel<br>HEXFET [®]  Power MOSFETs<br>V(BR)DSS<br>15V tp<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS A<br>20VVGS<br>tp 0.01 Ω IAS<br>Fig 21a.   Unclamped Inductive Test Circuit Fig 21b.   Unclamped Inductive Waveforms<br>LD<br>VDS VDS<br>90%<br>+<br>VDD -<br>D.U.T 10%<br>VGS VGS<br>Pulse Width < 1µs<br>Duty Factor < 0.1% td(on) tr td(off) tf<br>Fig 22a.   Switching Time Test Circuit Fig 22b.   Switching Time Waveforms<br>Id<br>Vds<br>Vgs<br>L<br>VCC<br>DUT<br>0 Vgs(th)<br>1K<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 21b.** Unclamped Inductive Waveforms 

**Fig 21a.** Unclamped Inductive Test Circuit 

**Fig 23a.** Gate Charge Test Circuit 

**Fig 23b.** Gate Charge Waveform 

Submit Datasheet Feedback August 18, 2015 

7 www.irf.com © 2015 International Rectifier 

IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF 

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## TO-220AB Package Outline (Dimensions are shown in millimeters (inches)) 

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## TO-220AB Part Marking Information 

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**----- Start of picture text -----**<br>
INTERNATIONAL  PART NUMBER INTERNATIONAL  PART NUMBER<br>RECTIFIER LOGO RECTIFIER LOGO<br>FB3207Z DATE CODE OR FB3207Z DATE CODE<br>ASSEMBLY  P = LEAD-FREE ASSEMBLY  Y = LAST DIGIT OF YEAR<br>LOT CODE PYWW? Y = LAST DIGIT OF YEAR LOT CODE YWWP WW = WORK WEEK<br>LC       LC WW = WORK WEEK LC       LC P = LEAD-FREE<br>? = ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


TO-220AB packages are not recommended for Surface Mount Application. 

**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

8 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback August 18, 2015 

IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF 

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## D[2] Pak (TO-263AB) Package Outline 

Dimensions are shown in millimeters (inches) 

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## D[2] Pak (TO-263AB) Part Marking Information 

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**----- Start of picture text -----**<br>
INTERNATIONAL  INTERNATIONAL<br>RECTIFIER LOGO PART NUMBER RECTIFIER LOGO PART NUMBER<br>IRFS3207Z OR IRFS3207Z<br>ASSEMBLY  PYWW? ASSEMBLY  YWWP<br>LOT CODE LC       LC DATE CODEP = LEAD-FREE LOT CODE LC       LC DATE CODEY = LAST DIGIT OF YEAR<br>Y = LAST DIGIT OF YEAR WW = WORK WEEK<br>WW = WORK WEEK P = LEAD-FREE<br>? = ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

9 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback August 18, 2015 

IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF 

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## TO-262 Package Outline 

Dimensions are shown in millimeters (inches) 

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## TO-262 Part Marking Information 

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INTERNATIONAL  PART NUMBER INTERNATIONAL  PART NUMBER<br>RECTIFIER LOGO FSL3207Z OR RECTIFIER LOGO FSL3207Z<br>ASSEMBLY  PYWW? DATE CODE ASSEMBLY  YWWP DATE CODE<br>LOT CODE P = LEAD-FREE LOT CODE Y = LAST DIGIT OF YEAR<br>LC     LC Y = LAST DIGIT OF YEAR LC     LC WW = WORK WEEK<br>WW = WORK WEEK P = LEAD-FREE<br>? = ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

10 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback August 18, 2015 

IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF 

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## D[2] Pak (TO-263AB) Tape & Reel Information 

Dimensions are shown in millimeters (inches) 

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**----- Start of picture text -----**<br>
TRR<br>1.60 (.063)<br>1.50 (.059)<br>1.60 (.063)<br>4.10 (.161)<br>3.90 (.153) 1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 24.30 (.957)<br>15.42 (.609)<br>23.90 (.941)<br>15.22 (.601)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>FEED DIRECTION<br>13.50 (.532) 27.40 (1.079)<br>12.80 (.504) 23.90 (.941)<br>4<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>30.40 (1.197)<br>NOTES :       MAX.<br>1.   COMFORMS TO EIA-418.<br>26.40 (1.039) 4<br>2.   CONTROLLING DIMENSION: MILLIMETER. 24.40 (.961)<br>3.   DIMENSION MEASURED @ HUB.<br>3<br>4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE.<br>**----- End of picture text -----**<br>


**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

11 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback August 18, 2015 

IRFB3207ZPbF/IRFS3207ZPbF/IRFSL3207ZPbF 

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**Qualification information** † 

|**Qualification information**<br>†|||
|---|---|---|
|Qualification level|Industrial||
||(per JEDEC JESD47F<br>†† guidelines)||
|Moisture Sensitivity Level|TO-220|N/A|
||D2Pak|MSL1|
||TO-262||
|RoHS compliant|Yes||



- Qualification standards can be found at International Rectifier’s web site:  http://www.irf.com/product-info/reliability/ ††  Applicable version of JEDEC standard at the time of product release. 

## **Revision History** 

|**Revision History**||
|---|---|
|**Date**|**Comment**|
|4/24/2014|· Updated data sheet with new IR corporate template.|
||•Updated package outline & part marking on page 8, 9 & 10.|
||· Updated typo on the fig.19 and fig.20, unit of y-axis from "A" to "nC" on page 6.|
||•Added bulletpoint in the  Benefits  "RoHS Compliant,Halogen -Free" onpage 1.|
|8/18/2015|•Ordering Table - Base Part Number - IRFS3207ZPbF - Corrected Orderable Part Numbers<br>for Tape & Reel Left and Right  to IRFS3207ZTRLPbF and IRFS3207ZTRRPbF resp-page 1|



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**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 

12 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback August 18, 2015 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFS3207ZTRRPBF/power-mosfet-n-channel-75-v-120-a-4100-ohm-to-263)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfs3207ztrrpbf/mosfet-n-ch-75v-120a-to-263/dp/2839493RL)
---

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