# Power MOSFET, N Channel, 30 V, 90 A, 2200 µohm, TO-252AA, Surface Mount

![Product image](https://novapart.co/image/farnell:2725974/)

**URL**: https://novapart.co/products/IRFR8314TRPBF/power-mosfet-n-channel-30-v-90-a-2200-ohm-to-252aa
**SKU**: IRFR8314TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.1700
**Stock**: 500+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:90A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.0016ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.7V; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 125W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252AA |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 90A |
| Drain Source On State Resistance | 2200µohm |
| Gate Source Threshold Voltage Max | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725974/)

## IRFR8314PbF ~~[|~~ 

HEXFET[® ] Power MOSFET 

|**Application**<br>Optimized for UPS/Inverter Applications<br>Low Voltage Power Tools<br>**Benefits**<br>Fully Characterized Avalanche Voltage and Current<br>Lead-Free, RoHS Compliant|**Application**<br>Optimized for UPS/Inverter Applications<br>Low Voltage Power Tools<br>**Benefits**<br>Fully Characterized Avalanche Voltage and Current<br>Lead-Free, RoHS Compliant|**Application**<br>Optimized for UPS/Inverter Applications<br>Low Voltage Power Tools<br>**Benefits**<br>Fully Characterized Avalanche Voltage and Current<br>Lead-Free, RoHS Compliant||G|||D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**2.2**<br>**m**<br>(@ VGS= 4.5V)<br>**3.1**<br>**Qg (typical)**<br>**40**<br>**nC**<br>**ID (Silicon Limited)**<br>**179**<br>**ID (Package Limited)**<br>**90A**<br>**A**<br>D-Pak<br>D<br>G<br>S<br>~~=—e~~|D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**2.2**<br>**m**<br>(@ VGS= 4.5V)<br>**3.1**<br>**Qg (typical)**<br>**40**<br>**nC**<br>**ID (Silicon Limited)**<br>**179**<br>**ID (Package Limited)**<br>**90A**<br>**A**<br>D-Pak<br>D<br>G<br>S<br>~~=—e~~|D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**2.2**<br>**m**<br>(@ VGS= 4.5V)<br>**3.1**<br>**Qg (typical)**<br>**40**<br>**nC**<br>**ID (Silicon Limited)**<br>**179**<br>**ID (Package Limited)**<br>**90A**<br>**A**<br>D-Pak<br>D<br>G<br>S<br>~~=—e~~|D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**2.2**<br>**m**<br>(@ VGS= 4.5V)<br>**3.1**<br>**Qg (typical)**<br>**40**<br>**nC**<br>**ID (Silicon Limited)**<br>**179**<br>**ID (Package Limited)**<br>**90A**<br>**A**<br>D-Pak<br>D<br>G<br>S<br>~~=—e~~|D<br>S<br>**VDSS**<br>**30**<br>**V**<br>**RDS(on)max**<br>(@ VGS=10V)<br>**2.2**<br>**m**<br>(@ VGS= 4.5V)<br>**3.1**<br>**Qg (typical)**<br>**40**<br>**nC**<br>**ID (Silicon Limited)**<br>**179**<br>**ID (Package Limited)**<br>**90A**<br>**A**<br>D-Pak<br>D<br>G<br>S<br>~~=—e~~|
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||**G**||**D**||**S**||
|||||||Gate||Drain||Source||
|||||||||||||
|**Base part number**<br>**Package Type**||**Standard Pack**<br>**Form**|**Standard Pack**<br>**Quantity**|||||**Orderable Part Number**||**Orderable Part Number**|**Orderable Part Number**|
|IRFR8314PbF<br>D-Pak||Tape and Reel||2000||||IRFR8314TRPbF||||



## **Absolute Maximum Rating** 

|**Symbol**|**Parameter**|**Max.**|**Units**|
|---|---|---|---|
|VDS|Drain-to-Source Voltage|30|V|
|VGS|Gate-to-Source Voltage|± 20||
|ID @TC= 25°C|Continuous Drain Current,VGS @10V(Silicon Limited)|179|A|
|ID @TC= 100°C|Continuous Drain Current,VGS @10V(Silicon Limited)|127||
|ID @TC= 25°C|Continuous Drain Current,VGS @10V(Package Limited)|90||
|IDM|Pulsed Drain Current|357||
|PD @TC= 25°C|Maximum Power Dissipation|125|W|
|PD @TC= 100°C|Maximum Power Dissipation|63|W|
||Linear DeratingFactor|0.83|W/°C|
|TJ<br>TSTG|Operating Junction and<br>Storage Temperature Range|-55  to + 175|°C|
||SolderingTemperature,for 10 seconds (1.6mm fromcase)|300||



## **Thermal Resistance** 

|**Symbol**|**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RJC|Junction-to-Case|–––|1.2|°C/W|
|RJA|Junction-to-Ambient(PCB Mount) |–––|50||
|RJA|Junction-to-Ambient|–––|110||



Notes through are on page 9 

1 

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IRFR8314PbF ~~[TT~~ 

**Static @ TJ = 25°C (unless otherwise specified)** 

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**----- Start of picture text -----**<br>
|||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Min.|Typ. Max. Units|Conditions|
|BVDSS|Drain-to-Source Breakdown Voltage|30|–––|–––|V|VGS = 0V, ID = 250µA|
|————_——|BVDSS/TJ|Breakdown Voltage Temp. Coefficient|–––|18|––– mV/°C Reference to 25°C, ID = 1mA |
|RDS(on)|Static Drain-to-Source On-Resistance|–––|1.6|2.2|m|VGS = 10V, ID = 90A |
|–––|2.6|3.1|VGS = 4.5V, ID = 72A |
|OF|EE|
|VGS(th)|Gate Threshold Voltage|1.2|1.7|2.2|V|VDS = VGS, ID = 100µA|
|VGS(th)/TJ|Gate Threshold Voltage Coefficient|–––|-7.0|––– mV/°C|
|SnennaEEE|
|–––|–––|1.0|
|IDSS|Drain-to-Source Leakage Current|–––|–––|150|µA|V|[V][DS]|DS|[ =24 V]|=24V,V|[,][ V]|GS|[GS]|=|[ = ]|0V,T|[0][V ]|J|=125°C|
|OE|Gate-to-Source Forward Leakage|–––|–––|100|
|IGSS|Gate-to-Source Reverse Leakage|–––|–––|-100|nA|V|[V][GS]|GS|[ = 20V ]|= -20V|
|gfs|Forward Transconductance|189|–––|–––|S|VDS = 15V, ID =72A|
|——|Qg|Total Gate Charge|–––|36|54|
|ae|Qgs1|ee|Pre-Vth Gate-to-Source Charge|–––|ee|10|–––|VDS = 15V|
|Qgs2|Post-Vth Gate-to-Source Charge|–––|7.7|–––|nC|VGS = 4.5V|
|Qgd|Gate-to-Drain Charge|–––|10|–––|ID = 72A|
|Qgodr|Gate Charge Overdrive|–––|8.3|–––|
|a|Qsw|Switch Charge (Qgs2 + Qgd)|–––|20|–––|
|RG|Gate Resistance|–––|2.0|–––||
|te|td(on)|Turn-On Delay Time|–––|19|–––|VDD = 15V|
|tr|Rise Time|–––|98|–––|ns|ID = 72A|
|aene|
|td(off)|Turn-Off Delay Time|–––|28|–––|RG= 1.8|
|tf|Fall Time|–––|30|–––|VGS = 4.5V |
|oo|ee|
|Ciss|Input Capacitance|–––|4945|–––|VGS = 0V|
|eees|
|Coss|Output Capacitance|–––|908|–––|pF|VDS = 15V|
|Crss|Reverse Transfer Capacitance|–––|493|–––|ƒ = 1.0MHz|
|——————————|ne|
|Avalanche Characteristics|
|EAS (Thermally limited)|Single Pulse Avalanche Energy |180|mJ|
|EAS (tested)|Single Pulse Avalanche Energy Tested Value||279|
|St|IA|Avalanche Current|72|A|
|Diode Characteristics|
|Symbol|Parameter|Min.|Typ. Max.|Units|Conditions|
|Continuous Source Current|MOSFET symbol|
|IS|(Body Diode)||–––|––– 179|showing  the|
|A|
|Pulsed Source Current|integral reverse|
|ISM|(Body Diode)|–––|–––|357|p-n junction diode.|
|VSD|Diode Forward Voltage|–––|–––|1.0|V|TJ = 25°C,IS = 72A,VGS = 0V |
|trr|Reverse Recovery Time|–––|31|47|ns  TJ = 25°C IF = 72A ,VDD=15V|
|Qrr|Reverse Recovery Charge|–––|87|130|nC   di/dt = 360A/µs |

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2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback ~~ee~~ 

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IRFR8314PbF<br>—_____/_<br>1000 1000<br>VGS VGS<br>TOP           10V TOP           10V<br>5.5V 9.0V<br>4.5V 7.0V<br>4.0V 5.5V<br>3.5V 4.5V<br>3.3V 4.0V<br>100 3.0V 3.5V<br>BOTTOM 2.8V BOTTOM 3.0V<br>100<br>10 2.8V<br>2.8V<br>60µs PULSE WIDTH  60µs PULSE WIDTH<br>Tj = 25°C Tj = 175°C<br>1 oa 10 fn<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics  Fig 2.   Typical Output Characteristics<br>1000<br>2.0<br>ID = 90A<br>V GS  = 10V<br>100<br>TE TJ = 175°C<br>1.5<br>10 TJ = 25 ° C<br>1.0<br>1 4hff<br>VDS = 15V<br>60µs PULSE WIDTH<br>0.1 File:<br>0.5<br>1 2 3 4 5 6<br>-60 -40 -20 0 20 40 60 80 100120140160180<br>VGS, Gate-to-Source Voltage (V) TJ , Junction Temperature (°C)<br>Fig 3.   Typical Transfer Characteristics  Fig 4.   Normalized On-Resistance vs. Temperature<br>100000 VGS   = 0V,       f = 1 MHZ 14<br>Ciss    = C gs + Cgd,  C ds SHORTED ID= 72A<br>C rss    = C gd  12<br>Coss   = Cds + Cgd VDS= 24V<br>10 V DS = 15V<br>10000<br>Ciss 8<br>6<br>Coss<br>1000<br>Crss 4<br>tl<br>2<br>100 0<br>1 Tue 10 100 =  FREE 0 20 40 60 80 100<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>C, Capacitance (pF)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge vs. Gate-to-Source Voltage 

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1000<br>1 00 µsec<br>100<br>100 EGeeecee TJ = 175°C 1msec<br>LIMITED BY PACKAGE<br>10 TJ = 25°C 10 OPERATION IN THIS AREA LIMITED BY R DS(on)<br>10msec<br>1 vA 1<br>Tc = 25°C<br>V GS  = 0V TSingle Pulsej = 175°C DC<br>0.1 0.1<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1 10<br>VDS, Drain-toSource Voltage (V)<br>VSD, Source-to-Drain Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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200<br>180<br>Limited By Package<br>160<br>140120 A<br>100<br>80<br>60<br>40 Pf |EN<br>200 | | | | lhv| CcdT CN<br>25 50 75 100 125 150 175<br> TC , Case Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 8.** Maximum Safe Operating Area 

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2.5<br>2.0<br>1.5 Saws<br>ID = 150µA<br>ID =  250µA<br>1.0 I D  = 1.0mA<br>ID = 1.0A<br>0.5<br>0.0<br>-75 -50 -25 0 25 50 75 100 125 150 175 200<br>TJ , Temperature ( °C )<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 9.** Maximum Drain Current vs. Case Temperature 

**Fig 10.** Threshold Voltage vs. Temperature 

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10<br>1 ————<br>SS<br>i=<br>er<br>0.1<br>C—O | |<br>eT<br>0.01<br>SET TE HE Ll<br>TillPall ELIE| EEA EH ET<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z  thJC ) °C/W<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

4 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback ~~©.~~ 

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IRFR8314PbF<br>IvR .. . .. £4—a<br>8<br>800<br>ID = 90A ID<br>700 TOP         16A<br>33A<br>6<br>600 BOTTOM 72A<br>A Re<br>500<br>4<br>400<br>TJ = 125°C<br>IMITATE accaaeer<br>300<br>2<br>200<br>TJ = 25°C<br>100<br>0<br>0<br>2 Littl} 4 6 8 10 12 14 16 18 20 = RRS<br>25 50 75 100 125 150 175<br>VGS, Gate -to -Source Voltage  (V) Starting TJ , Junction Temperature (°C)<br>)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 12.** Typical On-Resistance vs. Gate Voltage 

**Fig 13.** Maximum Avalanche Energy vs. Drain Current 

5 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback ~~SO~~ 

IRFR8314PbF 

**Fig 14.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET[® ] Power MOSFETs 

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15V<br>VDS L DRIVER<br>R G D.U.T +<br>- [V][DD]<br>IAS<br>20V<br>tp 0.01<br>**----- End of picture text -----**<br>


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IAS<br>**----- End of picture text -----**<br>


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V(BR)DSS<br>tp ><br>**----- End of picture text -----**<br>


**Fig 15a.** Unclamped Inductive Test Circuit 

**Fig 15b.** Unclamped Inductive Waveforms 

**Fig 16a.** Switching Time Test Circuit 

**Fig 16b.** Switching Time Waveforms 

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Vds H! Id<br>Vgs<br>f<br>Vgs(th)<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 17a.** Gate Charge Test Circuit 

**Fig 17b.** Gate Charge Waveform 

6 www.irf.com © 2014 International Rectifier 

IRFR8314PbF ~~LT~~ 

## ~~IvaR~~ 

D-Pak (TO-252AA) Package Outline Dimensions are shown in millimeters (inches) 

## D-Pak (TO-252AA) Part Marking Information 

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**----- Start of picture text -----**<br>
EXAMPLE: THIS IS AN IRFR120<br>PART NUMBER<br>WITH ASSEMBLY<br>INTERNATIONAL<br>LOT CODE 1234 RECTIFIER IRFR120 DATE CODE<br>ASSEMBLED ON WW 16, 2001 LOGO 116A YEAR 1 =  2001<br>IN THE ASSEMBLY LINE "A" 12 34 WEEK 16<br>LINE A<br>Note: "P" in assembly line position ASSEMBLY<br>i n al<br>indicates "Lead-Free" LOT CODE<br>"P" in assembly line position indicates<br>"Lead-Free" qualification to the consumer-level<br>PART NUMBER<br>INTERNATIONAL<br>OR DATE CODE<br>RECTIFIER IRFR120 P =  DESIGNATES LEAD-FREE<br>LOGO<br>PRODUCT (OPTIONAL)<br>12 34<br>P =  DESIGNATES LEAD-FREE<br>PRODUCT QUALIFIED TO THE<br>ASSEMBLY<br>LOT CODE ~ CONSUMER LEVEL (OPTIONAL)<br>YEAR 1 =  2001<br>WEEK 16<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

7 ~~=~~ www.irf.com © 2014 International Rectifier Submit Datasheet Feedback ~~°°°°”.”.”.”.”}™”™”—~~ 

~~TOR~~ 

IRFR8314PbF ~~a~~ 

D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches) 

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TR TRR TRL<br>16.3 ( .641 ) 16.3 ( .641 )<br>15.7 ( .619 ) 15.7 ( .619 )<br>12.1 ( .476 )11.9 ( .469 ) FEED DIRECTION 8.1 ( .318 )7.9 ( .312 ) FEED DIRECTION<br>NOTES :<br>1.  CONTROLLING DIMENSION : MILLIMETER.<br>2.  ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).<br>3.  OUTLINE CONFORMS TO EIA-481 & EIA-541.<br>  13 INCH<br>16 mm<br>NOTES :<br>1. OUTLINE CONFORMS TO EIA-481.<br>**----- End of picture text -----**<br>


Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

8 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback ~~a~~ 

LeaR 

IRFR8314PbF 

## **Qualification Information[† ]** 

|**Qualification Information[† ]**|||
|---|---|---|
|**Qualification Level**|Industrial<br>(per JEDEC JESD47F)††||
|**Moisture Sensitivity Level**|D-Pak|MSL1|
|**RoHS Compliant**|Yes||



- Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/ 

- ††  Applicable version of JEDEC standard at the time of product release. 

## **Notes:** 

- Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 90A by source bonding technology. Note that current limitations arising from heating of the device leads may occur with some lead mounting arrangements. (Refer to AN-1140) 

-     Repetitive rating; pulse width limited by max. junction temperature. 

- Limited by TJmax, starting TJ = 25°C, L = 0.07mH, RG = 50, IAS = 72A, VGS =10V. 

- Pulse width  400µs; duty cycle  2%. 

-     R is measured at TJ approximately 90°C. 

- This value determined from sample failure population, starting TJ =25°C, 

- L=0.07mH, RG = 50, IAS = 72A, VGS =10V. 

-     When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994.please refer to application note to AN-994:  http://www.irf.com/technical-info/appnotes/an-994.pdf 

|**Revision History**||
|---|---|
|**Date**|**Comments**|
|07/01/2014|The Device is active without bulk part which is removed from Table on page 1|



**IR WORLD HEADQUARTERS:** 101N Sepulveda Blvd, El Segundo, California 90245, USA 

9 

www.irf.com © 2014 International Rectifier 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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---

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