# MOSFET, N, SUPER-247

**URL**: https://novapart.co/products/IRFPS3815PBF/mosfet-n-super-247
**SKU**: IRFPS3815PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €4.5500
**Stock**: 10+

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1463255/)

PD - 93911 

## IRFPS3815 

## HEXFET[®] Power MOSFET 

Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated 

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D<br>VDSS = 150V<br>R  = 0.015Ω<br>DS(on)<br>G<br>ID = 105A<br>S<br>**----- End of picture text -----**<br>


## **Description** 

The HEXFET[®] Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low  on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

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Super - 247™<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

a **Parameter Max. Units** ~~Rs~~ ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 105 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 74 A ~~—©~~ IDM Pulsed Drain Current ~~ee~~ 390 ~~i a~~ PD @TC = 25°C Power Dissipation 441 W ~~SdH,~~ Linear Derating Factor 2.9 W/°C ~~SdH,~~ VGS Gate-to-Source Voltage ± 30 V ~~a~~ EAS Single Pulse Avalanche Energy 1610 mJ ~~a~~ IAR Avalanche Current 58 A ~~a~~ EAR Repetitive Avalanche Energy 38 mJ dv/dt Peak Diode Recovery dv/dt 3.0 V/ns TJ Operating Junction and -55  to + 175 ~~a~~ TSTG ~~ee~~ Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) ~~pf ee~~ 

## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJC|Junction-to-Case|–––|0.34||
|RθCS|Case-to-Sink, Flat, Greased Surface|0.24|–––|°C/W|
|RθJA|Junction-to-Ambient|–––|40||



www.irf.com 

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3/14/01 

## IRFPS3815 

## **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

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||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|ee|Parameter|Min.|ee|T|ee|yp.|Max.|ee|Units|Conditions|
|V(BR)DSS|ee|Drain-to-Source Breakdown Voltage|150|es|ee|–––|–––|V|VGS = 0V, ID = 250µA|
|∆V(BR)DSS/∆TJ|es|Breakdown Voltage Temp. Coefficient|–––|0.18|–––|V/°C|Reference to 25°C, ID = 1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|–––|0.015|Ω|VGS = 10V, ID = 63A|
|ee|es|ee|®|
|VGS(th)|es|Gate Threshold Voltage|3.0|es|–––|5.0|V|VDS = 10V, ID = 250µA|
|gfs|es|Forward Transconductance|Gs|47|es|–––|–––|S|VDS = 50V, ID = 58A|
|IDSS|Se|Drain-to-Source Leakage Current|||––––––|––––––|25025|µA|VVDSDS = 100V, V = 80V, VGSGS = 0V, T = 0V|J = 150°C|
|Gate-to-Source Forward Leakage|–––|–––|100|VGS = 30V|
|IGSS|ee|Gate-to-Source Reverse Leakage|–––|–––|-100|nA|VGS = -30V|
|Qg|Po—|Total Gate Charge|–––|260|390|ID = 58A|
|a|Qgs|Gate-to-Source Charge|–––|53|80|nC|VDS = 120V|
|Qgd|Gate-to-Drain ("Miller") Charge|–––|150|230|VGS = 10V|
|————|td(on)|es|Turn-On Delay Time|–––|22|–––|VDD = 75V|®|
|a|tr|Rise Time|–––|ee|130|–––|ns|ID = 58A|
|es|td(off)|ee|Turn-Off Delay Time|–––|51|–––|RG = 1.03Ω|
|tf|Fall Time|–––|60|–––|VGS = 10V|||
|LD|Internal Drain Inductance|–––|5.0|–––|Between lead,6mm (0.25in.)|D|
|LS|Internal Source Inductance|–––|13|=|–––|]|nH|from packageand center of die contact|G|S|
|Ciss|Input Capacitance|–––|6810|–––|VGS = 0V|
|pf}|
|a|Coss|Output Capacitance|–––|1570|–––|pF|VDS = 25V|
|Crss|Reverse Transfer Capacitance|–––|480|–––|ƒ = 1.0MHz, See Fig. 5|
|ee|ee|
|a|Coss|ee|Output Capacitance|–––|9820|re|–––|VGS = 0V,  VDS = 1.0V,  ƒ = 1.0MHz|
|DD|Coss|Output Capacitance|–––|670|–––|rs|VGS = 0V,  VDS = 120V,  ƒ = 1.0MHz|
|Coss eff.|Effective Output Capacitance|–––|1270|–––|VGS = 0V, VDS = 0V to 120V|

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## **Source-Drain Ratings and Characteristics** 

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||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|105|MOSFET symbol|D|
|(Body Diode)|A|showing  the|
|ISM|Pulsed Source Current|–––|–––|390|integral reverse|G|
|(Body Diode)|p-n junction diode.|S|
|VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ = 25°C, IS = 58A, VGS = 0V|
|trr|es|Reverse Recovery Time|–––|270|410|ns|TJ = 25°C, IF = 58A|
|Ce|Qrr|Reverse RecoveryCharge|–––|-|2990|4490|-|nC|di/dt = 100A/µs|°|
|Sn|ton|PT|Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by L|®|S+LD)|
|Notes:|

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~~©~~ Repetitive rating;  pulse width limited by ~~@~~ Pulse width ≤ 300µs; duty cycle ≤ 2%. max. junction temperature. (See fig. 11) © Coss eff. is a fixed capacitance that gives the same charging time © Starting TJ = 25°C, L = 0.96mH as Coss while VDS is rising from 0 to 80% VDSS RG = 25Ω, IAS = 58A. (See Figure 12) 

- ) ISD ≤ 58A, di/dt ≤ 450A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C 

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2 

## IRFPS3815 

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 1000<br>VGS<br>TOP 15V<br>12V<br>10V<br>8.0V<br> 100 7.0V<br>6.0V HN Zeatime<br>5.5V<br>BOTTOM 5.0V<br>er tH<br> 10 | ee |] [I<br>hee eet<br> 1 5.0V<br>= ae<br>-— — ee HH<br>a |<br>0.1<br>a<br>SS Se<br>50µs PULSE WIDTH<br>F eo T  = 25J °C<br>0.01<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


## **Fig 1.** Typical Output Characteristics 

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 1000 BSS SSS SS SSSS=<br>T  = 175  CJ ° i aa<br> 100 a t<br>HO SS SE=<br>T  = 25  CJ °<br>/<br> 10 27 dane SoEEEEET<br>VARREEEEEEEEEE<br>1 | f| | [| [| [| | f[ | [| | T fT f<br>V      = 50VDS<br>P EA 50µs PULSE WIDTH<br> 1 PEE ET<br>5 6 7 8 9 10 11 12<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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 1000<br>VGS<br>TOP 15V<br>12V<br>10V<br>8.0V<br>7.0V<br>6.0V<br>5.5V i oan a<br>BOTTOM 5.0V<br> 100 P N<br>a | A ||<br>me Zonet nn<br>5.0V<br>yA Tl<br> 10 — Pee<br>a” M00 ee<br>” MG A<br>AGG<br>50µs PULSE WIDTH<br>Tr Tr T  = 175J °C<br> 1<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


## **Fig 2.** Typical Output Characteristics 

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3.0<br>ID = 97A<br>TUTTI TUTTI<br>2.5<br>WA<br>2.0<br>V,<br>1.5<br>4<br>URE ae<br>1.0<br>See? 4eeeeee<br>0.5 |<br>PrP Py yy y yy VGS = 10V<br>0.0 PFET Tet [tt]]<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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3 

## IRFPS3815 

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20<br>12000 ID = 58A<br>VGS   = 0V,       f = 1 MHZ<br>T TT Ciss    = Cgs + Cgd,   Cds    SHORTED pt VDS =  120V ma<br>10000 S Ciss T CCrss  oss    = C = Cgd ds + Cgd 16 pt tt VVDSDS ==  75V 30V |<br>8000 Nee n SS<br>Coss 12<br>6000 e S INR FH pf | 4<br>N 8 VY |<br>4000 c Ntect = EY<br>Ie NET Crss h PT ELT aTnn’ ann<br>4<br>2000 N N d<br>P TR SST fi FOR TEST CIRCUIT<br>0 S e ll 0 Y | || || | SEE FIGURE       13<br>1 10 100 1000 0 100 200 300 400<br>VDS, Drain-to-Source Voltage (V) Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 1000  10000<br>OPERATION IN THIS AREA LIMITED<br>BY RDS(on)<br> 100 a7 ane  1000 6)<br>T  = 175  CJ °<br>ee ee ee ee ee ee ee ee a 10us<br> 10 ees  100 ae SE eS 100us enall<br>— Catia SSE T T<br>—— T  = 25  CJ ° SSS S555 Sree Sooo<br>1ms<br>ee FEE ss re<br> 1 | ee ee  10 aaaliinn mart 10ms PTT<br>fff | _ | ll<br> TC = 25  C°<br> TJ = 175  C°<br>0.1 LP|i/} tf ee | ee ee| tt ee ee V      = 0 V GS  eee  1 |  Single Pulse R1E CRIEEllHE<br>0.0 0.4 0.8 1.2 1.6 2.0  1  10  100  1000<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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4 

## IRFPS3815 

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120 RD<br>PT ey ty TE Ey VDS<br>100 Mt tT VGS<br>D.U.T.<br>PLN RG<br>+<br>80 - [V] DD<br>ptt EE<br>PT  PN<br>10V<br>60 PE TT | INA ETE ET Pulse Width ≤ 1 µs<br>Duty Factor ≤ 0.1 %<br>PE tTTT eTte PENTEINTT E<br>40 PEt ET<br>PT tT eTty ETet TTTT ININ| :<br>Pitt;<br>20 VDS<br>Pt tettT e tT eTtT TE TTyy A 90% f<br>0 PET TT TE TY Tt |<br>25 50 75 100 125 150 175<br>T   , Case TemperatureC (  C)°<br>10% /\ A.<br>Fig 9.   Maximum Drain Current Vs. VGS NY\« pi >| pe<br>Case Temperature td(on) tr td(off) tf<br> 1<br>a a ee ee<br>D = 0.50<br>= == ann<br>0.1<br>0.20<br>0 0.10 0 ee<br>0.05<br>a 0.02 nn | PDM<br>0.01 0.01 SINGLE PULSE<br>(THERMAL RESPONSE) t1<br>Be a  eeE E ee eeey t2<br>Notes:<br>1. Duty factor D = t   / t1 2<br>Cn 2. Peak T J = P DM x  Z thJC + TC<br>0.001 Cot<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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5 

## IRFPS3815 

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1 5V<br>V DS L DRIVER<br>R G D.U.T +<br>- [V][D D]<br>IA S<br>J<br>i 20V<br>tp 0.01Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

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V (BR)DSS<br>_. tp<br>/|\<br>“<br>/<br>y<br>I AS<br>**----- End of picture text -----**<br>


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4000<br>ID<br>TOP 24A<br>41A<br>BOTTOM 58A<br>StA oo<br>3000 PNE E<br>2000 KING| tt<br>NON<br>1000<br>SSN<br>TASS<br>0<br>25 pt 50 75 | PSS 100 125 150 175<br>Starting T  , Junction TemperatureJ (  C)°<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy Vs. Drain Current 

**Fig 12b.** Unclamped Inductive Waveforms 

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Current Regulator<br>Same Type as D.U.T.<br>QG<br>50KΩ<br>10 V 12V .2µF .3µF<br>o QGS QGD o Ths D.U.T. | +-VDS<br>VG VGS<br>an os _ 6<br>3mA<br>oe |<br>IG ID<br>Charge 7 Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13a.** Basic Gate Charge Waveform 

**Fig 13b.** Gate Charge Test Circuit 

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6 

## IRFPS3815 

## **Peak Diode Recovery dv/dt Test Circuit** 

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7 

## IRFPS3815 

## - **Super 247™** Package Outline 

Dimensions are shown in millimeters (inches) 

Data and specifications subject to change without notice. This product has been designed and qualified for the industrial market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 3/01 

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8 



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