# Power MOSFET, P Channel, 100 V, 23 A, 0.117 ohm, TO-247AC, Through Hole

![Product image](https://novapart.co/image/farnell:1653674/)

**URL**: https://novapart.co/products/IRFP9140NPBF/power-mosfet-p-channel-100-v-23-a-0117-ohm-to
**SKU**: IRFP9140NPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8400
**Stock**: 1000+
**Lead Time**: 113 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-23A; Drain Source Voltage Vds:-100V; On Resistance Rds(on):0.117ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-4V; Power Dissipation Pd:120W

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 120W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-247AC |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 23A |
| Drain Source On State Resistance | 0.117ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1653674/)

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D Voss = -100V<br>Ω<br>Rpsiony = 0.117<br>G<br>Ip = -23A<br>S<br>TO-247AC<br>**----- End of picture text -----**<br>


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|---|---|
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∆<br>Veross Ty | Breakdown Voltage Temp. Coefficient | —- |-0.11]<br>Ω<br>Rpsion) —- | V/°C | Reference to 25°C, Ip = -1mA®<br>Vestth) Static Drain-to-Source On-Resistance | —- | [0.117] | Ves = -10V, Ip =-13A ®<br>Dis GateForward  Threshold Transconductance Voltage || -2.05.3 |——-|—-| —-|  -4.0  || S$ V_ || Vps=Vos=-5OV,  Vas, Ip Ip  = =-250uA11A®<br>|_ Drain-to-Source; Leakage Current | ——- |—-| A VpsDS = -100V,<GSVes = OV<br>9 | —— [| -250| | Vos =-80V, Ves = OV, Ty = 150°C<br>loss Gate-to-Source Forward Leakage | —- | —-| 100 | nA Vas = 20V<br>Gate-to-Source Reverse Leakage | —- | —|-100 | Vos = -20V<br>Qg Total Gate Charge | —- |-—| 97 | ID=-11A<br>|Qgs__| Gate-to-Source Charge | —- |-—|15 | nc | Vps=-80Vv<br>Qga Gate-to-Drain ("Miller") Charge | —- | -—-[ 51 | Ves = -10V, See Fig. 6 and 13 @©<br>ta(on) Turn-On Delay Time | -—— | 15 | —- | Vpp = -50V<br>fe ([Risetime SS SC«d | OFT] | ott<br>Ω<br>tr Tumn-Off Delay Time p— Tat [=] ™| Ro =511 Ω,<br>Fall Time | -—- | 51 | — | Rp=4.2 See Fig. 10 ©@©<br>Lp Internal Drain Inductance 5.0 Betenween leadea , D<br>nH 6mm (0.25in.)<br>G<br>from package<br>Ls Internalmemal SSource Inductincucrance 13 and center of die contact S<br>**----- End of picture text -----**<br>


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≤ ≤ 

Uses IRF9540N data and test conditions 

Rg =25 Ω , I~ng=-11A. (See Figure ISD ≤ -11A, di/dt ≤ -470A/us, Vpp ≤ ≤ 

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100                    VGS 100                    VGS<br> TOP          - 15V Se ee  TOP          - 15V ii |Ps<br>                  - 10V                   - 10V<br>                  - 8.0V                   - 8.0V<br>                  - 7.0V er ett                   - 7.0V it isa aml<br>                  - 6.0V                  - 5.5V Ot ey 7 |                   - 6.0V                  - 5.5V Oteh)<br>                  - 5.0V                   - 5.0V<br> BOTTOM  - 4.5V ill | yf  BOTTOM  - 4.5V aa<br>fee Af fee<br>, all Z<br>10 ERE)INaa a 10 PZ<br>OY JA eee a eee /a<br>ee A Po<br>a //_a nl) // Mn) |<br>ae) //A | RR) / pee see -4.5V ell<br>i  / eee t el aay / ZA e e<br> -4.5V  20µs PULSE WIDTH  20µs PULSE WIDTH<br>1 UW ot  T   = 25°Cc A 1  )Mi. /A  T   = 175°CC<br>V [e] //A ee [i] ny 72m eee<br>0.1 1 10 100 0.1 1 10 100<br>-V     , Drain-to-Source Voltage (V)DS -V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br>100 2.5<br>I    = -19AD<br>a eeee ee ee ee ee<br>SS Se Poe EEE<br>T  = 25°CJ<br>a e —- 2.0 PEEP EEE EEE<br>><br>10 Pt) pa T  = 175°CJ a ee ZaVa<br>1.5<br>RSA ESS PEPE er<br>7 / 1.0 A |<br>1<br>jt | ft CCT<br>0.5<br>Po aT EP<br> V     = -25VDS<br>0.1 Ppet p  20µs PULSE WIDTH A 0.0 PEPE Pree ees  V      = -10VGS<br>4 5 6 7 8 9 10 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>-V     , Gate-to-Source Voltage (V)GS T   , Junction Temperature (°C)J<br>D D<br>-I   , Drain-to-Source Current (A) -I   , Drain-to-Source Current (A)<br>(Normalized)<br>D<br>-I   , Drain-to-Source Current (A)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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3000 20<br>V      = 0V,         f = 1MHzGS  I    = -11AD<br>2500 NS C      = C     + C     ,   C     SHORTEDC      = CC      = C     + Ciss         gs         gd         dsrss         gdoss        ds         gd 16 aan  V      = -50VV      = -80VDSDS =m<br> V      = -20VDS<br>SE ee c ee<br>PF \ Ree eo P| | TA<br>2000 Ciss<br>KOS ee 12 eee 4e<br>DN Bes| LL<br>1500<br>S | No Coss s)> 8 EEA V4,<br>1000<br>SMAPS TFT<br>C rss<br>ae Saal 4 Pry  sft ft<br>500<br>ll tT<br> FOR TEST CIRCUIT<br>0 aOO e e Tl A 0 AeATTTT     SEE FIGURE 13<br>1 10 100 0 20 40 60 80 100<br>-V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>100 1000<br> OPERATION IN THIS AREA LIMITED<br>                       BY RDS(on)<br>ee a a ed = nnn<br>SER e eee ||<br>10 8 9/0 Oe 0 100 |<br>ee T  = 175°CJJ ee) ee ee ee eee Po TT at Peete<br>T  = 25°CJJ<br>100µs<br>1 RAR 10 SP StH tt<br>ftSeeSee | TTTT I ET<br>eee SS SSS ae el<br>1ms<br>T     = 25°CC<br>T     = 175°CJ 10ms<br>0.1 eeptpt eeiy]iy] tt V      = 0VGSGS A 1 pp  Single Pulse 1 s<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 10 100 1000<br>-V     , Source-to-Drain Voltage (V)SDSD -V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>-V     , Gate-to-Source Voltage (V)<br>D<br>-I   , Drain Current (A)<br>SD<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


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100<br>ee a a ed<br>SER e eee<br>10<br>8 9/0 Oe 0<br>ee T  = 175°CJJ ee) ee ee ee eee<br>T  = 25°CJJ<br>1 RAR<br>ftSeeSee |<br>eee<br>V      = 0VGSGS<br>0.1 eeptpt eeiy]iy] tt<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>-V     , Source-to-Drain Voltage (V)SDSD<br>SD<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


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25 Ri tt Et Ey Vos ne<br>20<br>PSR es A<br>-<br>PLANE EEE Ro | + '<br>SERRE NEE »<br>15<br>POTN 100 ≤ 1<br>≤ 0.1 %<br>10 aves<br>\ Fig 10a. Switching Time Test Circuit<br>5 SERREPOCA] se<br>td(on) tr td(off) tf<br>tpi t tt tT ty VGS an _<br>0 10%<br>25 50 75 100 125 150 175<br>T   , Case TemperatureC (  C)°<br>FLT TT Tet yt i 90% vA\<br>Fig 9. Maximum Drain Current Vs. VDS 7<br>Case Temperature<br>Fig 10b. Switching Time Waveforms<br> 10<br>a<br>a ee eee eee<br> 1 AR<br>D = 0.50<br>r e<br>P S<br>0.20 |<br>| 0.10 [O_o] re PDM<br>0.1<br>0.05 t1<br>0.02 SINGLE PULSE t2<br>0.01 (THERMAL RESPONSE)<br>La EEeel 1. Duty factor D =Notes: t   / t1 2<br>| 2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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1200<br>                    ID<br>P| TOP            -4.7A<br>ht                    -8.1A<br>1000 tt BOTTOM    -11A<br>Nea<br>800 PX; PIN | fT | TTyt ty<br>600 PNNNER EEENNER EEE<br>400<br>WN KT<br>200 NNN<br>pO AINEN<br>ft |) UR: UR: ES A<br>Pe<br>0<br>25 50 75 100 125 150 175<br>Starting T  , Junction Temperature (°C)JJ<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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VDS L<br>P|<br>ht<br>RG D.U.T |. VDD 1000 tt<br>: Nea<br>IAS A<br>7 -20V at DRIVER 800 PX; fT<br>tp 0.01Ω<br>PIN | | yt ty<br>600<br>PNNNER EEENNER EEE<br>15V<br>400<br>WN KT<br>200 NNN<br>12a. Unclamped Inductive Test Circuit pO AINEN<br>ft |) UR: UR: ES A<br>Pe<br>0<br>25 50 75 100 125 150<br>IAS<br>Starting T  , Junction Temperature (°C)JJ<br>\ | Fig 12c. Maximum Avalanche<br>\ Vs. Drain Current<br>\<br>— tp<br>V(BR)DSS<br>12b. Unclamped Inductive Waveforms<br>Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>QG 12V .2µF<br>.3µF<br>QGS QGD D.U.T. +-VDS<br>VGS<br>VG<br>-3mA<br>ivan @ |<br>Ort.<br>IG ID<br>Charge Current Sampling Resistors<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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‘* + Circuit Layout Considerations<br>D.U.T    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| | - Current Transformer<br>+<br>- - +<br>et :<br>(0<br>®<br>Re •   dv/dt controlled by Rg +<br>•<br>-<br>@ •   D.U.T. - Device Under Test<br>> Isp controlled by Duty Factor "D"<br>*Reverse Polarity of D.U.T for P-Channel<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _i<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current "| Current di/dt a<br>©) D.U.T. VDS Waveform Diode Recovery<br>dv/dt<br>> ['<br>ma<br>Re-Applied<br>Voltage Body Diode  Forward Drop<br>® Inductor Curent ee ee<br>[ ]<br>Ripple  ≤ 5%<br>**----- End of picture text -----**<br>


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EXAMPLE: THIS IS AN IRFPE30<br>WITH ASSEMBLY  PART NUMBER<br>LOT CODE 5657 INTERNATIONAL<br>ASSEMBLED ON WW 35, 2000 RECTIFIER IRFPE30<br>IN THE ASSEMBLY LINE "H" LOGO 56           57 035H<br>Note:   "P" in assembly line = DATE CODE<br>position indicates "Lead-Free" ASSEMBLY YEAR 0 =  2000<br>LOT CODE WEEK 35<br>LINE H<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 07/04 

Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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---

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