# Power MOSFET, N Channel, 100 V, 72 A, 0.014 ohm, TO-247AC, Through Hole

![Product image](https://novapart.co/image/farnell:8658609/)

**URL**: https://novapart.co/products/IRFP4710PBF/power-mosfet-n-channel-100-v-72-a-0014-ohm-to
**SKU**: IRFP4710PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.4700
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Power Dissipation | 190W |
| Transistor Mounting | Through Hole |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 190W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.014ohm |
| Transistor Case Style | TO-247AC |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 72A |
| Drain Source On State Resistance | 0.014ohm |
| Gate Source Threshold Voltage Max | 5.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8658609/)

PD - 95055 

## IRFP4710PbF 

## HEXFET Power MOSFET 

## **Applications** 

High frequency DC-DC converters Motor Control Uninterruptible Power Supplies Lead-Free 

## **Benefits** 

Low Gate-to-Drain Charge to Reduce Switching Losses 

Fully Characterized Capacitance Including Effective COSS to Simplify Design, (See App. Note AN1001) 

|**VDSS**|**RDS(on)max**|**ID**|
|---|---|---|
|**100V**|**0.014**Ω|**72A**|
||TO-247AC||



Fully Characterized Avalanche Voltage and Current 

## **Absolute Maximum Ratings** 

|**Absolute Maximum Ratings**<br>~~a~~|**Absolute Maximum Ratings**||~~=x~~|
|---|---|---|---|
|Se<br>~~a—~~|**Parameter**<br>Se<br>~~ee~~|**Max.**<br>Se<br>~~i~~|**Units**<br>Se<br>~~=x~~<br>~~i~~|
|ID@ TC= 25°C<br>~~a—~~|Continuous Drain Current, VGS@ 10V<br>~~ee~~|72<br>~~i~~|A<br>~~=x~~<br>~~i~~|
|ID@ TC= 100°C<br>~~—~~|Continuous Drain Current, VGS@ 10V<br>~~ee~~|51<br>~~i~~||
|IDM<br>~~—~~<br>~~©~~<br>~~>.~~|Pulsed Drain Current<br>~~ee~~<br>~~©~~<br>~~>.~~<br>~~od~~|300<br>~~i~~<br>~~©~~<br>~~od~~||
|PD@TC= 25°C<br>~~—~~<br>~~>.~~<br>~~II,~~|Power Dissipation<br>~~ee~~<br>~~>.~~<br>~~od~~<br>~~II, Tod~~|190<br>~~i~~<br>~~od~~<br>~~Tod~~|W<br>~~i~~<br>~~Tod~~|
|~~>.~~<br>~~II,~~|Linear DeratingFactor<br>~~>.~~<br>~~od~~<br>~~II, Tod~~|1.2<br>~~od~~<br>~~Tod~~|W/°C<br>~~Tod~~|
|VGS<br>dv/dt<br>~~II,~~<br>~~a~~|Gate-to-Source Voltage<br>Peak Diode Recoverydv/dt<br>~~II, Tod~~<br>|± 20<br>8.2<br>~~Tod~~<br>|V<br>V/ns<br>~~Tod~~<br>|
|TJ<br>TSTG<br>~~ee~~|Operating Junction and<br>Storage Temperature Range<br>~~ee~~|-55  to + 175<br>~~ee~~|°C<br>~~ee~~|
|~~ee~~|Soldering Temperature, for 10 seconds<br>~~ee~~|300 (1.6mm from case )<br>~~ee~~||
|~~ee~~<br>~~a~~|Mounting  torqe,  6-32  or M3  screw                                     10 lbf•in (1.1N•m)<br>~~ee~~<br>~~a~~|Mounting  torqe,  6-32  or M3  screw                                     10 lbf•in (1.1N•m)<br>~~ee~~<br>~~a~~|~~ee~~|



## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJC|Junction-to-Case|–––|0.81|°C/W|
|RθCS|Case-to-Sink, Flat, Greased Surface|0.24|–––||
|RθJA|Junction-to-Ambient|–––|40||



Notes through are  on page 8 www.irf.com 

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## IRFP4710PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**<br>ee|**Min. **<br>ee<br>~~ee~~|**Typ. **<br>ee<br>~~ee~~|**Max.**<br>ee<br>~~ee~~|**Units**<br>ee|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage<br>~~es~~<br>~~es~~|100<br>~~ee ~~<br>~~es~~<br>~~es~~|–––<br> ~~ee~~<br>~~es~~<br>~~ee~~|–––<br>~~ee~~<br>~~es~~|V<br>~~es~~|VGS= 0V, ID= 250µA<br>~~@~~|
|∆V(BR)DSS/∆TJ|JBreakdown Voltage Temp. Coefficient –––     0.11    –––    V/°C   Reference to 25°C, I<br>~~es~~<br>~~es~~|–––     0.11    –––    V/°C   Reference to 25°C, I<br>~~es~~<br>~~es~~|–––     0.11    –––    V/°C   Reference to 25°C, I<br>~~es~~<br>~~ee~~|–––     0.11    –––    V/°C   Reference to 25°C, I<br>~~es~~|–––     0.11    –––    V/°C   Reference to 25°C, I<br>~~es~~|–––     0.11    –––    V/°C   Reference to 25°C, ID= 1mA<br>~~@~~|
|RDS(on)|Static Drain-to-Source On-Resistance<br>~~es~~<br>~~ee~~|–––<br>~~es~~<br>~~**e**s~~|0.011 <br>~~ee~~<br>~~ee~~|0.014|Ω|VGS= 10V, ID= 45A<br>~~@~~|
|VGS(th)|Gate Threshold Voltage<br>~~es~~<br>~~es~~<br>~~ee~~|3.5<br>~~es ~~<br>~~es~~<br>~~**e**s~~|–––<br> ~~ee~~<br>~~es~~<br>~~ee~~|5.5<br>~~es~~|V<br>~~es~~|VDS= VGS, ID= 250µA<br>~~@~~|
|IDSS|Drain-to-Source Leakage Current<br>~~ee~~<br>~~|~~|–––<br>~~**e**s~~<br>~~|~~<br>~~|~~|–––<br>~~ee~~<br>~~se~~<br>~~||~~|1.0<br>~~se~~<br>~~|~~|µA<br>~~se~~<br>~~|~~|VDS= 95V, VGS= 0V|
|||–––<br>~~**e**s~~<br>~~|~~<br>~~|~~|–––<br>~~ee~~<br>~~se~~<br>~~||~~|250<br>~~se~~<br>~~|~~||VDS= 80V, VGS= 0V, TJ= 150°C|
|IGSS|Gate-to-Source Forward Leakage<br>~~ee~~<br>~~|~~<br>~~ee~~|–––<br>~~**e**s ~~<br>~~|~~<br>~~|~~<br>~~ee~~|–––<br> ~~ee~~<br>~~||~~<br>~~ee~~|100<br>~~|~~<br>~~ee~~|nA<br>~~|~~|VGS= 20V|
||Gate-to-Source Reverse Leakage<br>~~ee~~|–––<br>~~ee~~|–––<br>~~ee~~|-100<br>~~ee~~||VGS= -20V|



**Dynamic @ TJ = 25°C (unless otherwise specified)** 

||||~~ee~~|~~ee~~|~~ee~~|~~ee~~|||||
|---|---|---|---|---|---|---|---|---|---|---|
||**Parameter**<br>ee||**Min. **<br>ee<br>~~ee~~|**Typ. **<br>ee<br>~~ee~~|**Max.**<br>ee<br>~~ee~~||**Units**<br>ee|**Conditions**|||
|gfs|Forward Transconductance<br>~~es~~||35<br>~~ee ~~<br>~~es~~|–––<br> ~~ee ~~<br>~~es~~|–––<br> ~~ee~~<br>~~es~~||S<br>~~es~~|VDS= 50V, ID= 45A|||
|Qg|Total Gate Charge<br>~~a~~||–––<br>~~a~~|110    170                I<br>~~a~~|110    170                I<br>~~a~~||110    170                I<br>nC|110    170                ID= 45A<br>VDS= 50V<br>VGS= 10V,|||
|Qgs|Gate-to-Source Charge<br>~~ee~~||–––<br>~~ee~~<br>~~es~~|43<br>~~ee~~|–––<br>~~ee~~||||||
|Qgd<br>~~Rs~~|Gate-to-Drain("Miller")Charge<br>~~ee~~||–––<br>~~ee~~<br>~~es~~<br>es|40<br>~~ee~~<br>ee|–––<br>~~ee~~||||||
|td(on)<br>~~Rs~~|Turn-On Delay Time<br>~~ee~~||–––<br>~~es~~<br>~~ee~~<br>es|35<br>~~ee~~<br>ee|–––<br>~~ee~~||ns|VDD= 50V<br>ID= 45A<br>RG= 4.5Ω<br>VGS= 10V<br>~~°~~|||
|tr<br>~~Rs~~<br>~~ee~~|Rise Time<br>~~ee~~||–––<br>es<br>~~ee~~|130<br>ee|–––||||||
|td(off)<br>~~Rs~~<br>a<br>~~ee~~|Turn-Off Delay Time<br>~~ee~~<br>~~ee~~||–––<br>es <br>~~ee~~<br>~~ee~~|41<br> ee<br>~~ee~~|–––<br>~~ee~~||||||
|tf<br>~~ee~~|Fall Time<br>~~ee~~||–––<br>~~ee~~|38|–––||||||
|Ciss<br>~~ee~~|Input Capacitance<br>~~ee~~||–––<br>~~ee~~|6160|–––||pF|VGS= 0V<br>VDS= 25V<br>ƒ = 1.0MHz<br>~~°~~|||
|Coss<br>~~ee~~<br>a|Output Capacitance<br>~~ee~~<br>~~es~~||–––<br>~~ee~~<br>~~es~~|440<br>~~es~~|–––<br>~~es~~||||||
|Crss<br>a~~es~~|Reverse Transfer Capacitance<br>~~es~~||–––<br>~~es~~|250<br>~~es~~|–––<br>~~es~~||||||
|Coss<br>a|Output Capacitance||–––|1580|–––|||VGS= 0V,  VDS= 1.0V,  ƒ = 1.0MHz|||
|Coss<br>a<br>a|Output Capacitance||–––|280|–––|||VGS= 0V,  VDS= 80V,  ƒ = 1.0MHz|||
|Cosseff.|Effective Output Capacitance||–––|430|–––|||VGS= 0V, VDS= 0V to 80V<br>=|||
|**Avalanche Characteristics**<br>eses|||||||||||
|es<br>ns||**Parameter**<br>es<br>eG||||**Typ.**<br>es<br>eG|||**Max.**<br>es<br>eG|**Units**<br>es<br>eG|
|EAS<br>es<br>ns<br>**e**S||Single Pulse Avalanche Energy<br>es<br>eG||||–––<br>es<br>eG|||190<br>es<br>eG|mJ<br>es<br>eG|
|IAR<br>ns<br>**e**S<br>e||Avalanche Current<br>eG<br>©||||–––<br>eG|||45<br>eG|A<br>eG|
|EAR<br>**e**S<br>e||Repetitive Avalanche Energy<br>©||||–––|||20|mJ|



## **Avalanche Characteristics** 

|**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>EAS<br>Single Pulse Avalanche Energy<br>–––<br>190<br>mJ<br>IAR<br>Avalanche Current<br>–––<br>45<br>A<br>EAR<br>Repetitive Avalanche Energy<br>–––<br>20<br>mJ<br>eses<br>nseG<br>**e**S<br>e<br>©|
|---|
|**Diode Characteristics**|
|S<br>D<br>G<br>**Parameter**<br>**Min.**<br>**Typ. Max. Units**<br> **Conditions**<br>IS<br>Continuous Source Current<br>MOSFET symbol<br>(Body Diode)<br>–––<br>–––<br>showing  the<br>ISM<br>Pulsed Source Current<br>integral reverse<br>(BodyDiode)<br>–––<br>–––<br>p-njunction diode.<br>72<br>300<br>~~ne~~<br>~~ae~~|
|VSD<br>Diode Forward Voltage<br>–––<br>–––<br>1.3<br>V<br>TJ= 25°C, IS= 45A, VGS= 0V<br>trr<br>Reverse Recovery Time<br>–––<br>74<br>110<br>ns<br>TJ= 25°C, IF= 45A<br>Qrr<br>Reverse RecoveryCharge<br>–––<br>180<br>260<br>nC<br>di/dt = 100A/µs<br>ton<br>Forward Turn-On Time<br>Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)<br>~~Se~~<br>~~@~~<br>~~es~~<br>~~—+—_~~<br>~~—_}—_~~<br>~~@~~<br>~~PT~~|
|2<br>www.irf.com|



IRFP4710PbF 

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 1000<br>VGS<br>TOP 15V<br>12V<br>10V<br>8.0V<br> 100 7.5V7.0V eT CHT<br>6.5V<br>BOTTOM 6.0V<br>gr<br> 10<br>eR Fae een ee<br>ae ll<br> 1<br>PAZ ae 6.0V<br>0.1<br>20µs PULSE WIDTH<br>0.01 ePH tF e T  = 25J °C<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


## **Fig 1.** Typical Output Characteristics 

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 1000 SSS<br>T  = 175  CJ °<br> 100 es<br>ee a ee<br>VA Ae ee ee eee<br> 10<br>ay<br>= T  = 25  CJ ° —————<br> 1<br>—————ee ee V      = 50VDS<br>20µs PULSE WIDTH<br>0.1 | | f[ | |<br>6.0 7.0 8.0 9.0 10.0<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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 1000<br>VGS<br>TOP 15V<br>12V<br>10V<br>8.0V<br>7.5V<br>7.0V i nat ee<br>6.5V<br>BOTTOM 6.0V<br> 100 P | tett<br>a |<br>6.0V<br> 10<br>A<br>20µs PULSE WIDTH<br> 1 AWaGnat t, T  = 175J °C<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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3.0<br>ID = 75A<br>T—TTLLLLLL<br>2.5 CECE<br>2.0 fT tT et tee etl ye<br>| Z|<br>1.5<br>PEE<br>See<br>1.0<br>0.5<br>SS<br>0.0 || ttt tttif VGS = 10V<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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10000<br>VGS   = 0V,       f = 1 MHZ 20 ID = 45A<br>Ciss    = Cgs + Cgd,   Cds    SHORTED VDS = 80V<br>8000 = Crss    = Cgd  TL VDS = 50V<br>Coss   = Cds + Cgd 16 VDS = 20V<br>m al Tr N e<br>Ciss<br>6000<br>=st o | 12 He<br>a i ot ee<br>4000<br>P OI FTP 8 gf<br>C OI | ARERR R-A-H+<br>2000<br>P Coss OP PP 4 ee<br>Con |<br>Crss<br>0 FOR TEST CIRCUIT<br>1 S 10 | 100 0 fAonoo fe SEE FIGURE       13<br>0 40 80 120 160 200<br>VDS, Drain-to-Source Voltage (V)<br>Q   , Total Gate Charge (nC)G<br>GS<br>V     , Gate-to-Source Voltage (V)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


## **Fig 5.** Typical Capacitance Vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge Vs. Gate-to-Source Voltage 

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**----- Start of picture text -----**<br>
 1000<br> 100<br>| ez<br>T  = 175  CJ ° A) A<br> 10<br>T  = 25  CJ °<br> 1<br>a ee 0 ee ee ee ee ee ee<br>i V      = 0 V GS<br>0.1<br>0.0 0.4 0.8 1.2 1.6<br>V     ,Source-to-Drain Voltage (V)SD<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100<br>i a lll POON<br>P AEa S 100µsec<br>10<br>1msec<br>1<br>Tc = 25°C 10msec<br>Tj = 175°C a<br>eee Single Pulse<br>0.1 | | ll<br>1 10 100 1000<br>VDS  , Drain-toSource Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


## **Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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## IRFP4710PbF 

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80<br>Pet Rp<br>> EE Yes )<br>PANEmS EEE Vv¥ (peer<br>60<br>-<br>Py EINE| IN Re<br>40 Pe EE NEELIN tovPulse Width ≤ 1  us<br>PEEL eee ≤ 0.1 %<br>Fig 10a.   Switching Time Test Circuit<br>20<br>VDSDS<br>90%<br>|<br>0 PEt EEL EE ) |<br>25 50 75 100 125 150 175<br>T   , Case TemperatureC (    C)° |<br>I   , Drain Current (A)D<br>**----- End of picture text -----**<br>


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VDSDS<br>90% )<br>10%<br>VGS | |<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


## **Fig 9.** Maximum Drain Current Vs. Case Temperature 

**Fig 10b.** Switching Time Waveforms 

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**----- Start of picture text -----**<br>
 10<br>a ee ee ee Oe OO GO GOD GGG OG GG SG GG GOO<br>a 8 0 OO OO<br> 1<br>D = 0.50<br>— ee<br>ce<br>0.20<br>A}Ar P DM<br>0.1 L 0.10 ener a |<br>t 1<br>0.05<br>e ern SINGLE PULSE OO t 2<br>0.020.01 (THERMAL RESPONSE)<br>Notes:<br>ee [|!] t , a PEotTTT Gn OO<br>= [a] 1. Duty factor D = t   / t1 2<br>0.01 eR lll 2. Peak T J = P DM x  Z thJC + T C<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>thJC<br>(Z          )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>y 20VVGS fti tp 0.01 A Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

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V(BR)DSS<br>— tp<br>‘|<br>a<br>IAS<br>**----- End of picture text -----**<br>


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350<br>ID<br>PT<br>TOP 18A<br>300 KRINyyfo BOTTOM 32A 45A<br>ENB<br>250 G a<br>200 NINKANNaNNENDEE TE EE<br>150 PTRWG<br>PENNN<br>100 Pi |) PS AAL  T<br>50 PoyeeeTUSA TT<br>Ne<br>0 PT tT ety tyUUSS<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJ (  C)°<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy Vs. Drain Current 

**Fig 12b.** Unclamped Inductive Waveforms 

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QG<br>QGS QGD<br>VG<br>Charge<br>**----- End of picture text -----**<br>


**Fig 13a.** Basic Gate Charge Waveform 

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Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>12V .2µF<br>1.! .3µ & F |<br>+<br>D.U.T. -VDS<br>VGS<br>3mA<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13b.** Gate Charge Test Circuit 

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D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Rg •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>(1) Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>VGS=10V<br>t<br>D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ) Current ==<br>Ty) di/dt /<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  ae Forward Drop<br>® Inductor Curent<br>a<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


**Fig 14.** For N-Channel HEXFET ® Power MOSFETs 

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3.65 (.143) - D -<br>15.90 (.626) 3.55 (.140) 5.30 (.209)<br>15.30 (.602) 0.25 (.010) M D B M 4.70 (.185)<br>= - B - - A - _ 2.50 (.089)<br>1.50 (.059)<br>Ae 5.50 (.217) 4<br>| 0 | m5<br>ped Ee<br>20.30 (.800)<br>19.70 (.775) 2X 5.50 (.217) NOTES:<br>4.50 (.177) 1  DIMENSIONING & TOLERANCING<br>    PER ANSI Y14.5M, 1982.<br>1 2 3 2  CONTROLLING DIMENSION : INCH.<br>3  CONFORMS TO JEDEC OUTLINE<br>- C -      TO-247-AC.<br>14.80 (.583)<br>4.30 (.170)<br>14.20 (.559) 3.70 (.145)<br>LEAD ASSIGNMENTS<br>|| Hexfet IGBT<br>2.40 (.094)2.00 (.079) 3X 1.40 (.056)1.00 (.039) 3X [0.80 (.031)] 0.40 (.016) 1 - Gate2 - Drain LEAD 1 - GATE ASSIG NMENTS 1 - Gate2 - Collector<br>__-| 5.45 (.215)2X : 3.40 (.133)0.25 (.010) M C A S || 2.60 (.102)2.20 (.087) OO 3 - Source4 - Drain2 - DRAIN3 - SOURCE4 - DRAIN3 - Emitter4 - Collector<br>2X 3.00 (.118)<br>**----- End of picture text -----**<br>


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EXAMPLE: THIS IS AN IRFPE30<br>WITH ASSEMBLY  PART NUMBER<br>LOT CODE 5657 INTERNATIONAL<br>ASSEMBLED ON WW 35, 2000 RECTIFIER IRFPE30<br>IN THE ASSEMBLY LINE "H" Note:   "P" in assembly line LOGO | IgR 56           57 035H DATE CODE<br>position indicates "Lead-Free" ASSEMBLY YEAR 0 =  2000<br>LOT CODE WEEK 35<br>LINE H<br>**----- End of picture text -----**<br>


Repetitive rating;  pulse width limited by max. junction temperature. 

Starting TJ = 25°C, L = 190µH 

Pulse width ≤ 400µs; duty cycle ≤ 2%. © Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS . 

RG = 25Ω, IAS = 45A, VGS = 10V. 

©) ISD ≤ 45A, di/dt ≤ 420A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C . 

Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 02/04 

www.irf.com 

8 

Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 



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- [Supplier page](https://es.farnell.com/en-ES/infineon/irfp4710pbf/mosfet-n-100v-72a-to-247ac/dp/8658609)
---

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