# Power MOSFET, P Channel, 30 V, 13 A, 0.037 ohm, DFN2020, Surface Mount

![Product image](https://novapart.co/image/farnell:2580013/)

**URL**: https://novapart.co/products/IRFHS9301TRPBF/power-mosfet-p-channel-30-v-13-a-0037-ohm-dfn2020
**SKU**: IRFHS9301TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1690
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-13A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.03ohm; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 2 - 1 year |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | DFN2020 |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 13A |
| Drain Source On State Resistance | 0.037ohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2580013/)

HEXFET ® Power MOSFET 

|International<br>~~TGR Rectifier~~|||
|---|---|---|
|**VDS**|**-30**|**V**|
|**VGS max**|**±20**<br>~~|~~|**V**<br>~~|~~|
|**RDS(on) max**<br>(@VGS= -10V)|**37**<br>~~|~~|**m**Ω<br>~~|~~|
|**Qg(typical)**|**13**|**nC**|
|**Qg (typical)**<br>**ID **<br>(@TC= 25°C)|**13**<br>**-8.5**<br>@|**nC**<br>**A**|



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**----- Start of picture text -----**<br>
TOP VIEW<br>Se<br>D 1 6 D<br>D 2 4a I D I} opL L 5 D N ><br>3 D<br>G 3 S 4 S<br>ee | 2mm x 2mm PQFN<br>**----- End of picture text -----**<br>


## **Applications** 

Charge and Discharge Switch for Battery Application System/load switch 

## **Features and Benefits** 

## **Features** 

## **Benefits** 

|**Features**||**Benefits**|
|---|---|---|
|Low RDSon (≤ 37mΩ)||LowerConduction Losses|
|Low Thermal Resistance to PCB (≤13°C/W)||Enable better thermal dissipation|
|Low Profile (≤1.0 mm)|results in|Increased Power Density|
|Compatible with Existing Surface Mount Techniques||Easier Manufacturing|
|RoHS Compliant Containing no Lead, no Bromide and no Halogen||Environmentally Friendlier|
|MSL1, Industrial Qualification||Increased Reliability|



|**Orderable part number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Note**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRFHS9301TRPBF|PQFN 2mm x 2mm|Tape and Reel|4000||
|~~IRFHS9301TR2PBF~~|~~PQFN 2mm x 2mm~~|~~Tape and Reel~~|~~400~~|EOL notice # 259|



## **Absolute Maximum Ratings** 

||**Parameter**|**Max.**|**Units**|
|---|---|---|---|
|VDS|Drain-to-Source Voltage|-30|V|
|VGS|Gate-to-Source Voltage|± 20||
|ID@ TA= 25°C|Continuous Drain Current, VGS@ -10V|-6.0|A|
|ID@ TA= 70°C|Continuous Drain Current, VGS@ -10V|-4.8||
|ID@ TC= 25°C|Continuous Drain Current, VGS@ -10V<br>~~a~~|-13<br>~~a~~||
|ID@ TC= 70°C|Continuous Drain Current, VGS@ -10V<br>~~a~~|-10<br>~~a~~||
|ID@ TC= 25°C|Continuous Drain Current, VGS@ 10V(Package Limited)<br>~~a~~|-8.5<br>~~a~~||
|IDM|Pulsed Drain Current<br>~~a~~|-52<br>~~a~~||
|PD@TA= 25°C|Power Dissipation<br>~~a~~<br>~~a~~|2.1<br>~~a~~<br>~~a~~|W|
|PD@ TA= 70°C|Power Dissipation<br>~~a~~|1.3<br>~~a~~||
||Linear Derating Factor<br>~~a~~|0.02<br>~~a~~|W/°C|
|TJ<br>TSTG|Operating Junction and<br>Storage Temperature Range|-55  to + 150|°C|



> Notes ® through © are on page 2 

������������ 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|-30|–––|–––|V|VGS= 0V, ID= -250μA|
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|0.02|–––|V/°C|Reference to 25°C, ID= -1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|30|37|mΩ|VGS= -10V, ID= -7.8A�|
|||–––|52|65||VGS= -4.5V, ID= -6.2A�|
|VGS(th)|Gate Threshold Voltage|-1.3|-1.8|-2.4|V|VDS= VGS, ID= -25μA|
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-4.8|–––|mV/°C||
|IDSS|Drain-to-Source Leakage Current|–––|–––|-1.0|μA|VDS= -24V, VGS= 0V|
|||–––|–––|-150||VDS= -24V, VGS= 0V, TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|-100|nA|VGS= -20V|
||Gate-to-Source Reverse Leakage|–––|–––|100||VGS= 20V|
|gfs|Forward Transconductance|9.3|–––|–––|S|VDS= -10V, ID= -7.8A|
|Qg|Total Gate Charge|–––|6.9|–––|nC|VDS= -15V,VGS= -4.5V,ID= - 7.8A|
|Qg|Total Gate Charge|–––|13|–––|nC|ID= -7.8A<br>VDS= -15V<br>VGS= -10V|
|Qgs|Gate-to-Source Charge|–––|2.1|–––|||
|Qgd|Gate-to-Drain Charge|–––|3.9|–––|||
|RG|Gate Resistance|–––|17|–––|Ω||
|td(on)|Turn-On DelayTime|–––|12|–––|ns|VDD= -15V, VGS= -4.5V�<br>ID= -7.8A<br>RG= 2.0Ω<br>See Figs. 19a & 19b|
|tr|Rise Time|–––|80|–––|||
|td(off)|Turn-Off DelayTime|–––|13|–––|||
|tf|Fall Time|–––|25|–––|||
|Ciss|Input Capacitance|–––|580|–––|pF|ƒ= 1.0KHz<br>VGS= 0V<br>VDS= -25V|
|Coss|Output Capacitance|–––|125|–––|||
|Crss|Reverse Transfer Capacitance|–––|79|–––|||



## **Diode Characteristics** 

||**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|IS|Continuous Source Current<br>(BodyDiode)|–––|–––|-8.5�|A|G<br>D<br>S<br>showing  the<br>integral reverse<br>p-njunction diode.<br>MOSFET symbol|
|ISM|Pulsed Source Current<br>(BodyDiode)��|–––|–––|-52|||
|VSD|Diode Forward Voltage|–––|–––|-1.2|V|TJ= 25°C, IS= -7.8A, VGS= 0V�|
|trr|Reverse RecoveryTime|–––|30|45|ns|TJ= 25°C, IF= -7.8A, VDD= -15V<br>di/dt = 280/μs�|
|Qrr|Reverse Recovery Charge|–––|110|170|nC||



## **Thermal Resistance** 

||**Parameter**|**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|---|
|RθJC (Bottom)|Junction-to-Case�||–––|13|°C/W|
|RθJC (Top)|Junction-to-Case�||–––|90||
|RθJA|Junction-to-Ambient�|||60||
|RθJA|Junction-to-Ambient(t<10s) �||–––|42||



## **������** 

- Repetitive rating;  pulse width limited by max. junction temperature. 

- Current limited by package. 

- Pulse width ≤ 400μs; duty cycle ≤ 2%. 

- When mounted on 1 inch square  copper board. 

- R θ is measured at TJ of approximately 90°C. 

. 

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1000<br>VGS<br>TOP           -10V<br>PT Ta -8.0V-5.0V<br>-4.5V<br>100 | -3.5V<br>-3.3V<br>-3.0V<br>| | Ae TT BOTTOM -2.8V<br>10<br>-2.8V<br>1 Cz eee ae<br>Zag ett) ||<br>Ell ≤ 60μs PULSE WIDTH nl<br>HH Tj = 25°C HH<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>100<br>ssee ee<br>Ee ee ee ee ee<br>10<br>TJ = 150°C<br>1<br>T = 25°C<br>J<br>————————<br>hn) 2 i |<br>V DS  = -15V<br>0.1 |tt| ≤ 60μs PULSE WIDTH<br>1 2 3 4 5 6<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**==> picture [216 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000<br>VGS   = 0V,       f = 1 KHZ<br>Ciss   = Cgs + Cgd,  Cds SHORTED<br>= C  = C<br>rss   gd<br>C = C + C<br>oss   ds  gd<br>1000 =ooo<br>C<br>iss<br>Er<br>pot HH<br>Coss<br>ea<br>100 C<br>ae rss se al<br>a eee el<br>el<br>10<br>1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

**==> picture [215 x 427] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>VGS<br>TOP           -10V<br>Eee -8.0V-5.0V<br>-4.5V<br>100 0eee -3.5V<br>-3.3V<br>-3.0V<br>ee Sa BOTTOM -2.8V<br>10<br>1 Gorm) -2.8V ICT<br>AT| EI TI<br>Eel ≤ 60μs PULSE WIDTH CI<br>Tj = 150°C<br>Col Cou<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.6<br>ID = -7.8A<br>VGS = -10V /<br>1.4<br>1.2<br>1.0<br>0.8 A<br>0.6<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

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**----- Start of picture text -----**<br>
14<br>ID= -7.8A VDS= -24V<br>12 P| V DS = -15V ||<br>VDS= -6V<br>an TM)<br>10<br>_|<br>8 TTT<br>Y<br>6<br>P| | YYJ | |<br>4 fan//40en/\<br>/ |<br>2 Zane<br>0<br>0 2 4 6 8 10 12 14 16 18<br> QG,  Total Gate Charge (nC)<br>-VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

**==> picture [461 x 670] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 1000<br>ee — as OPERATION IN THIS AREA  Perey<br>ee Pr LIMITED BY R DS (on)<br>100<br>ee A ee es<br>10 1msec 100μsec<br>T = 150°C<br>J<br>10<br>ee ee Ay Ay Ae “ 2 rr<br>1<br>T J  = 25°C 0.1 °<br>Tc = 25 C DC<br>pf Tj = 150°C Hove AP 10msec<br>VGS = 0VGS = 0V= 0V Single Pulse SesSTnnn<br>0.01<br>1.0<br>0.1 1 10 100<br>0.4 0.6 0.8 1.0<br>VDS, Drain-to-Source Voltage (V)<br>-VSD, Source-to-Drain Voltage (V)<br>  Typical Source-Drain Diode Forward Voltage Fig 8.   Maximum Safe Operating Area<br>14 2.0<br>LIMITED BY PACKAGE<br>12<br>10 ID = -25uA<br>PNG ><br>S a 1.5 et<br>E LL<br>8 PA ><br>6<br>4 Po} tt 1.0 PEE LLLLIGN<br>2 TTY Seeeeeeee<br>0<br>25 50 75 100 125 150 0.5<br>-75 -50 -25 0 25 50 75 100 125 150<br> TC,  Case Temperature (°C)<br>TJ , Temperature ( °C )<br>Fig 9.   Maximum Drain Current vs. Fig 10.   Threshold Voltage vs. Temperature<br>Case Temperature<br>100<br>a a a ee<br>10 ee<br>ee D = 0.50 ee eee ee ee eee<br>eeTT 0.20 eer<br>1 0.10<br>0.05<br>SS<br>0.02<br>es es ee eee el<br>0.1 0.01<br>ees er<br>| a aee<br>SINGLE PULSE<br>0.01 aes ( THERMAL RESPONSE ) Notes: ee<br>1. Duty Factor D = t1/t2<br>a ee ee eee ee ee eee 2. Peak Tj = P dm x Zthjc + Tc<br>0.001 fs<br>1E-006 1E-005 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>-VGS(th), Gate threshold Voltage (V)<br>-ID,  Drain-to-Source Current (A)<br>ID,  Drain Current (A)<br>Thermal Response ( Z thJC )<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
100<br>ee<br>ee<br>ee A ee<br>T = 150°C<br>J<br>10<br>ee ee Ay Ay Ae<br>T J  = 25°C<br>pf<br>VGS = 0VGS = 0V= 0V<br>1.0<br>0.4 0.6 0.8 1.0<br>-VSD, Source-to-Drain Voltage (V)<br>-ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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**----- Start of picture text -----**<br>
100<br>ID = -7.8A<br>80<br>60<br>40 T J  = 125°C<br>T = 25°C<br>J<br>20<br>0 5 10 15 20<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


-VGS, Gate -to -Source Voltage  (V) **Fig 12.** On-Resistance vs. Gate Voltage 

**==> picture [207 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>Vgs = -4.5V<br>80<br>60<br>40<br>Vgs = -10V<br>20<br>0 5 10 15 20 25 30<br>-ID, Drain Current (A)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

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**----- Start of picture text -----**<br>
600<br>500<br>400<br>300<br>200<br>100 NJ<br>ae<br>0<br>1E-5 1E-4 1E-3 1E-2 1E-1 1E+0<br>Time (sec)<br>Power (W)<br>**----- End of picture text -----**<br>


**Fig 14** Typical Power vs. Time 

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**----- Start of picture text -----**<br>
Driver Gate Drive<br>P.W.<br>Period D =<br>D.U.T * + O O P.W. | —_— Period<br>   •  Circuit Layout Considerations V | GS=10V<br>cc [©)] ] t<br> •<br>| —| - GroundLow StrayPla I n eductance<br> •   Low Leakage Inductance @ D.U.T. ISD Waveform<br>+<br>Reverse<br>Recovery Body Diode Forward<br>oi - [l] Current Transformer - ® + Current r Current di/dt NN<br>00 ©) D.U.T. VDS Waveform Diode Recoverydv/dt \ ><br>VDD<br>•   Re-Applied<br>•   Driver same type as D.U.T. + Voltage Body Diode  Forward Drop<br>Re (a4 •   di/dt controlled by Rg Vo p - =<br>•   D.U.T. - Device Under Test e s ee<br>Ripple  ≤ 5% ISD<br>Isp controlled by Duty Factor "D" ® t<br>**----- End of picture text -----**<br>


**Fig 15.** iode Reverse Recovery Test Circuit or P-Channel HEXFET ® ower MOSFETs 

**==> picture [451 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>L<br>VCC<br>DUT<br>0<br>SS Vgs(th)<br>201 K<br>Qgodr Qgd Qgs2 Qgs1<br>**----- End of picture text -----**<br>


**Fig 16a.** Gate Charge Test Circuit 

**Fig 16b.** Gate Charge Waveform 

**==> picture [128 x 55] intentionally omitted <==**

**----- Start of picture text -----**<br>
-<br>+<br>≤ 0.1 %≤ 1  us<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
td(on) tr td(off) tf<br>VGS r T . -<br>| fs<br>10%<br>N<br>\/<br>90% X<br>VDS \<br>**----- End of picture text -----**<br>


**Fig 17a.** Switching Time Test Circuit 

**Fig 17b.** Switching Time Waveforms 

## **PQFN Package Details** 

## **PQFN Part Marking** 

**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

## **PQFN Tape and Reel** 

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**----- Start of picture text -----**<br>
CORE -<br>TAPE<br>aed<br>ie )<br>a No)<br>Remark:<br>Width  - Dimension above are typical dimensions.<br>Table 2:COVERTAPE TOLERANCE  - Cover tape thickness is 0.048mm +/- 0.005mm. - Surface resistivity 10E5 < Rs <10E9.<br> (WIDTH)<br>5.4 mm +/- 0.1 mm<br>9.5 mm +/- 0.1 mm<br>**----- End of picture text -----**<br>


**Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/** 

## **Qualification information** † 

|**Qualification information**<br>†|||
|---|---|---|
|Qualification level|Industrial<br>††<br>(per JEDEC JES D47F<br>†††guidelines)||
|Moisture Sensitivity Level|PQFN 2mm x 2mm|MS L1<br>(per IPC/JEDEC J-S TD-020D<br>†††)|
|RoHS compliant|Yes||



+ Qualification standards can be found at International Rectifier’s web site http://www.irf.com/product-info/reliability Tt Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ 

Applicable version of JEDEC standard at the time of product release. 

|**Revision History**||
|---|---|
|**Date**|**Comment**|
|5/12/2014|•Updated ordering information to reflect the End-Of-life (EOL) of the mini-reel option  (EOL notice #259)<br>•Updated data sheet based on corporate template.|
|5/21/2014|• Updated qual level from"Consumer"to"Industrial"on page 1 & 9.|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfhs9301trpbf/mosfet-p-ch-30v-13a-pqfn-8/dp/2580013)
---

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