# Power MOSFET, N Channel, 25 V, 8.5 A, 0.013 ohm, DFN2020, Surface Mount

![Product image](https://novapart.co/image/farnell:2725944/)

**URL**: https://novapart.co/products/IRFHS8242TRPBF/power-mosfet-n-channel-25-v-85-a-0013-ohm-dfn2020
**SKU**: IRFHS8242TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5910
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:8.5A; Drain Source Voltage Vds:25V; On Resistance Rds(on):0.01ohm; Rds; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | DFN2020 |
| Drain Source Voltage Vds | 25V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 8.5A |
| Drain Source On State Resistance | 0.013ohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725944/)

**==> picture [484 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
HEXFET ® Power MOSFET<br>VDS 25 V<br>VGS max ±20 V<br>R<br>DS(on) max  13.0 m Ω 5]T |7 oei} b=| | + D D<br>(@VGS = 10V)<br>LSE | 3 ce S<br>Q 3 ><br>g (typical)                   4.3 nC aa Cn ee D<br>( @ VGS = 4.5V)<br>ID  2mm x 2mm PQFN<br>8.5 A<br>(@Tc(Bottom) = 25°C) So] eee ee | Ds Ss<br>TOP VIEW<br>D 1 6 D<br>D 2 D 5 D<br>G 3 S 4 S<br>**----- End of picture text -----**<br>


## **Applications** 

- 

## **Features and Benefits** 

**Features** Low RDSon ( ≤ 13.0m Ω) Low Thermal Resistance to PCB ( ≤ 13°C/W) Low Profile ( ≤ 1.0 mm) Compatible with Existing Surface Mount Techniques RoHS Compliant Containing no Lead, no Bromide and no Halogen MSL1, Industrial Qualification 

**Resulting Benefits** Lower Conduction Losses Enable better thermal dissipation results in Increased Power Density Easier Manufacturing Environmentally Friendlier Increased Reliability 

~~PO~~ **Standard Pack Orderable part number Package Type Note** ~~ee~~ **Form Quantity** ~~a~~ IRFHS8242TRPbF ~~GG~~ PQFN 2mm x 2mm Tape and Reel 4000 ~~ee IRFHS8242TR2PbF i PQFN 2mm x 2mm Tape and Reel ee ee 400~~ EOL notice # 259 

## **Absolute Maximum Ratings** 

|~~CO~~|**Parameter**<br>~~CO~~|**Max.**<br>|**Units**<br>|
|---|---|---|---|
|VDS<br>~~CO~~|Drain-to-Source Voltage<br>~~CO~~|25<br>|V<br>~~a~~|
|VGS<br>~~CO~~|Gate-to-Source Voltage<br>~~COa~~|±20<br>~~a~~||
|ID@ TA= 25°C|Continuous Drain Current,VGS@ 10V|9.9|A<br>~~a~~|
|ID@ TA= 70°C|Continuous Drain Current,VGS@ 10V|8.0||
|ID@ TC(Bottom)= 25°C|Continuous Drain Current,VGS@ 10V<br>~~a~~|21<br>~~a~~||
|ID@ TC(Bottom)= 70°C<br>~~a~~|Continuous Drain Current,VGS@ 10V<br>~~a~~|17<br>~~a~~||
|ID@ TC(Bottom)= 25°C<br>~~a~~|Continuous Drain Current,VGS@ 10V(Package Limited)<br>~~a~~|8.5<br>~~a~~||
|IDM<br>~~a~~<br>~~a~~|Pulsed Drain Current<br>~~a~~<br>~~OO~~<br>~~a~~|84<br>~~a~~<br>~~OO~~||
|PD@TA= 25°C<br>~~a~~<br>~~a~~|Power Dissipation<br>~~a~~<br>~~a~~|2.1<br>|W<br>|
|PD@TA= 70°C<br>~~a~~<br>~~a~~|Power Dissipation<br>~~a~~<br>~~a~~|1.3<br>||
|~~a~~|Linear Derating Factor<br>~~a©~~|0.02<br>~~©~~|W/°C<br>~~©~~|
|TJ<br>TSTG<br>|Linear Derating Factor<br>Operating Junction and<br>Storage Temperature Range<br>~~©~~|-55  to + 150<br>~~©~~|°C<br>~~©~~|



Notes O) through © are on page 2 

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## **Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|25|–––|–––|V|VGS= 0V,ID= 250μA|
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|18|–––|mV/°C|Reference to 25°C,ID= 1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|10.0|13.0|mΩ|VGS= 10V,ID= 8.5A��|
|||–––|17.0|21.0||VGS= 4.5V,ID= 6.8A�|
|VGS(th)|Gate Threshold Voltage|1.35|1.8|2.35|V|VDS= VGS, ID= 25μA|
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-6.8|–––|mV/°C||
|IDSS|Drain-to-Source Leakage Current|–––|–––|1.0|μA|VDS= 20V,VGS= 0V|
|||–––|–––|150||VDS= 20V,VGS= 0V,TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V|
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -20V|
|gfs|Forward Transconductance|19|–––|–––|S|VDS= 10V,ID= 8.5A�|
|Qg|Total Gate Charge�|–––|4.3|–––|nC|VGS= 4.5V,VDS= 13V,ID= 8.5A�|
|Qg|Total Gate Charge�|–––|10.4|–––|nC|VDS= 13V<br>ID= 8.5A� (See Fig. 6 & 16)<br>VGS= 10V|
|Qgs|Gate-to-Source Charge�|–––|1.8|–––|||
|Qgd|Gate-to-Drain Charge�|–––|1.6|–––|||
|RG|Gate Resistance|–––|1.9|–––|Ω||
|td(on)|Turn-On DelayTime|–––|6.5|–––|ns|VDD= 13V, VGS= 4.5V�<br>RG=1.8Ω<br>ID= 8.5A�<br>See Fig.17|
|tr|Rise Time|–––|19|–––|||
|td(off)|Turn-Off DelayTime|–––|5.4|–––|||
|tf|Fall Time|–––|5.3|–––|||
|Ciss|Input Capacitance|–––|653|–––|pF|VGS= 0V<br>VDS= 10V<br>ƒ= 1.0MHz|
|Coss|Output Capacitance|–––|171|–––|||
|Crss|Reverse Transfer Capacitance|–––|78|–––|||
|**Diode Characteristics**|||||||
||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|
|IS|Continuous Source Current<br>(Body Diode)|–––|–––|8.5�|A|D<br>S<br>G<br>showing  the<br>integral reverse<br>p-n junction diode.<br>MOSFET symbol|
|ISM|<br>Pulsed Source Current<br>(Body Diode)��|–––|–––|84|||
|VSD|<br>Diode Forward Voltage|–––|–––|1.0|V|TJ= 25°C,IS= 8.5A�,VGS= 0V�|
|trr|Reverse RecoveryTime|–––|11|17|ns|TJ= 25°C, IF= 8.5A�, VDD= 13V<br>di/dt = 280 A/μs��|
|Qrr|Reverse RecoveryCharge|–––|11|17|nC||
|ton|Forward Turn-On Time|Time is dominated by parasitic Inductance|||||



## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJC (Bottom)|Junction-to-Case�|–––|13|°C/W|
|RθJC(Top)|Junction-to-Case�|–––|90||
|RθJA|Junction-to-Ambient�|–––|60||
|RθJA|Junction-to-Ambient(<10s) �|–––|42||



## **������** 

- Repetitive rating;  pulse width limited by max. junction temperature. 

- Current limited by package. 

- Pulse width ≤ 400μs; duty cycle ≤ 2%. 

- When mounted on 1 inch square copper board 

- R θ is measured at TJ of approximately 90°C. 

- For DESIGN AID ONLY, not subject to production testing. 

� ��������������������������������������������� ������������������������� ��������������������������������� 

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**----- Start of picture text -----**<br>
100<br>VGS<br>TOP           10V<br>7.0V<br>5.0V<br>10 4.5V<br>ZZ 4.0V |<br>3.5V<br>3.0V<br>BOTTOM 2.7V<br>ph |<br>1 att NT |<br>2.7V<br>0.1<br>≤ 60μs PULSE WIDTH<br>SSE<br>Tj = 25°C<br>0.01 Coir] Sani<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>100<br>es ee ee ee ee<br>eeaee e e ee eee<br>ee ee ee ee ee<br>PLA TJ = 150°C ff<br>T = 25°C<br>J<br>10 ft tt<br>ot  .|"*n. TT<br>ey | ee ee es ee<br>PAP ff<br>V DS  = 15V<br>≤ 60μs PULSE WIDTH<br>1.0 theft<br>2.0 3.0 4.0 5.0 6.0 7.0<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**==> picture [215 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000<br>VGS   = 0V,       f = 1 MHZ<br>Ciss   = C gs + Cgd,  C ds SHORTED<br>= C rss    = C gd<br>Coss   = Cds + Cgd<br>=<br>1000 eo<br>C<br>iss<br>—Ee ooo<br>aooeeee ee Coss aeeeeeeee eeeee<br>100 Co Crss te A<br>Pe,<br>ere<br>a eeee<br>10 se el<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

**==> picture [214 x 426] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>VGS<br>TOP           10V<br>7.0V<br>5.0V<br>4.5V<br>4.0V<br>| fr 3.5V<br>10 3.0V<br>Fa BOTTOM 2.7V<br>Aa oo<br>2.7V<br>1<br>≤ 60μs PULSE WIDTH<br>Tj = 150°C<br>0.1 lll lll<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.8<br>ID = 8.5A<br>1.6 V GS  = 10V LLLELLWr<br>1.4 TLL<br>TT<br>1.2<br>1.0 TA<br>0.8 rE LLL<br>0.6 PETE<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

**==> picture [212 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
14.0<br>ID= 8.5A<br>12.0<br>Po | | |<br>VDS= 20V<br>10.0 pe VDS= 13V LLbf |<br>VDS= 5.0V / |<br>8.0 | To<br>Si<br>ae A Ae<br>6.0 PLnY<br>4.0<br>| |<br>2.0 PreLy | tf<br>0.0 Vi | [ft fl<br>0 2 4 6 8 10 12<br> QG,  Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

**==> picture [211 x 426] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>——— i a ao<br>es es es > <A<br>es es A<br>TJ = 150°C<br>po ffl<br>T = 25°C<br>10 Ase,/ J  ||<br>Cf... f|. f_t....._|..._ f<br>pf<br>ey oe)<br>VGS = 0V<br>1.0<br>0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1<br>VSD, Source-to-Drain Voltage (V)<br>  Typical Source-Drain Diode Forward Voltage<br>25<br>Limited By Package<br>20 | fb ot<br>Sy<br>15<br>7Z<br>10 Ys)<br>pA<br>5<br>0<br>25 50 75 100 125 150<br> TC , Case Temperature (°C)<br>ISD, Reverse Drain Current (A)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 9.** Maximum Drain Current vs. Case (Bottom) Temperature 

**==> picture [210 x 428] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>mera meri<br>ATT a<br>100<br>Al<br>100μsec<br>Saat<br>1 ms ec<br>10 DeaPats si<br>ean<br>ee ERM<br>Limited by<br>Wire Bond 10msec<br>1 See See mann<br>Pill eck LI<br>Tc = 25°C<br>DC<br>Tj = 150°C<br>Single Pulse<br>PN<br>0.1<br>0 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 8.   Maximum Safe Operating Area<br>2.4<br>2.2<br>ENREEREEE<br>CPN TE<br>2.0<br>ID = 25μA<br>1.8<br>ERERN a<br>1.6<br>S<br>oN<br>1.4<br>PTT EEN LE<br>1.2<br>1.0<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>ID,  Drain-to-Source Current (A)<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 10.** Threshold Voltage vs. Temperature 

**==> picture [435 x 204] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>Pt TT<br>10 ae D = 0.50 ee eee<br>0.20<br>a a<br>0.10<br>1 eer<br>0.05<br>0.02<br>0.01<br>0.1 ateranReet UE| EAE CE<br>Notes:<br>SINGLE PULSE<br>1. Duty Factor D = t1/t2<br>( THERMAL RESPONSE )<br>0.01 |CATHIE ay GHASellFFE 2. Peak Tj = P dm x Zthjc + Tc ll HT<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJC ) °C/W<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case (Bottom) 

**==> picture [217 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
35<br>ID = 8.5A<br>30<br>25<br>20 T = 125°C<br>J<br>15<br>10 PNW<br>—|<br>T = 25°C<br>5 J<br>0 ==<br>0 5 10 15 20<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


VGS, Gate -to -Source Voltage  (V) **Fig 12.** On-Resistance vs. Gate Voltage 

**==> picture [209 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
30<br>25<br>Vgs = 4.5V<br>20<br>15<br>Vgs = 10V<br>10<br>5 a<br>0 20 40 60 80 100<br>ID, Drain Current (A)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

**==> picture [411 x 407] intentionally omitted <==**

**----- Start of picture text -----**<br>
600<br>500<br>400<br>300<br>200<br>100<br>TE<br>0<br>1E-5 1E-4 1E-3 1E-2 1E-1 1E+0<br>Time (sec)<br>Fig 14.   Typical Power vs. Time<br>® Driver Gate Drive<br>P.W.<br>D.U.T + { $ P.W. $ Period — — D = —— Period<br>) [©)] Circuit    •  Layout Considerations | V | f GS=10<br>|  — -  •   GroundLow S  PlaneInd<br> •   Low Leakage Inductance 2) D.U.T. ISD Waveform<br>+<br>Reverse<br>Recovery Body Diode Forward<br>oi - [l] Current Transformer - ® + Current r Current di/dt AN<br>00 ©) D.U.T. VDS Waveform Diode Recoverydv/dt \ ><br>VDD<br>•  Re-Applied<br>•   Driver same type as D.U.T. + Voltage Body Diode  Forward Drop<br>Ro (A •   vidt controlled by Rg Vo p - Inductor Curent re<br>•<br>D.U.T. - Device Under Test e s<br>Ripple  ≤ 5% ISD<br>Isp controlled by Duty Factor "D" @)<br>Single Pulse Power (W)<br>**----- End of picture text -----**<br>


**Fig 15.** eak Diode Recovery dv/dt Test HEXFET ® ower MOSFETs 

or N-Channel 

**==> picture [227 x 50] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>VCC<br>DUT<br>0<br>1K S<br>**----- End of picture text -----**<br>


**Fig 16a.** Gate Charge Test Circuit 

**==> picture [10 x 12] intentionally omitted <==**

**----- Start of picture text -----**<br>
 1<br> 0.1<br>**----- End of picture text -----**<br>


**Fig 17a.** Switching Time Test Circuit 

**==> picture [202 x 164] intentionally omitted <==**

**----- Start of picture text -----**<br>
Id<br>Vds 1<br>Vgs<br>1<br>!<br>Vgs(th)<br>! I<br>1vHi<br>><> Ft _§|¥§ 4 — ><br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 16b.** Gate Charge Waveform 

**==> picture [145 x 102] intentionally omitted <==**

**----- Start of picture text -----**<br>
V<br>DS<br>90%<br>7"<br>V/<br>10%<br>V<br>GS ee ee<br>14 i |<br>o—!<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 17b.** Switching Time Waveforms 

## **PQFN 2x2 Outline Package Details** 

http://www.irf.com/technical-info/appnotes/an-1154.pdf 

## **PQFN 2x2 Outline  Part Marking** 

**Note: For the most current drawing please refer to IR website at:** http://www.irf.com/package/ 

## **PQFN 2x2 Outline  Tape and Reel** 

**Note: For the most current drawing please refer to IR website at:** http://www.irf.com/package/ 

## **Qualification information** † 

||**Qualification information**<br>†|
|---|---|
||Qualification level<br>Industrial<br>†<br>(per JEDEC JES D47F<br>††guidelines)|
||MS L1<br>(per JEDEC J-STD-020D<br>††)<br>PQFN 2mm x 2mm<br>Moisture Sensitivity Level|
||RoHS compliant<br>Yes|
|Qualification standards can be found at International Rectifier’s web site<br>T||
||http://www.irf.com/product-info/reliability<br>re|
|tt|Applicable version of JEDEC standard at the time of product release.<br>tt|



## **Revision History** 

|**Date**<br>**Revision History**|**Comments**<br>**Revision History**|
|---|---|
|12/17/2013|•Updated ordering information to reflect the End-Of-life (EOL) of the mini-reel option  (EOL notice #259)<br>•Updated Qual level from "Consumer" to "Industrial" on page 1, 9<br>• Updated data sheet with new IR corporate template|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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- [Supplier page](https://es.farnell.com/infineon/irfhs8242trpbf/mosfet-n-ch-25v-8-5a-pqfn/dp/2725944)
---

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