# Power MOSFET, N Channel, 30 V, 15 A, 7100 µohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:1791563/)

**URL**: https://novapart.co/products/IRFH7921TR2PBF/power-mosfet-n-channel-30-v-15-a-7100-ohm-pqfn
**SKU**: IRFH7921TR2PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2560
**Stock**: 10+

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:15A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.0071ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.8V; Pow

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 2 - 1 year |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 3.1W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 7100µohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1791563/)

## **Applications** 

High Frequency Point-of-Load Synchronous Buck Converter for Applications in Neworking & Computing Systems Optimized for Control FET Applications 

## HEXFET Power MOSFET 

||HEXFET<br>Power MOSFET<br>®|Power MOSFET|
|---|---|---|
|**VDSS**|**RDS(on) max**|**Qg**|
|**30V**|**8.5m**Ω**@VGS = 10V**|**9.3nC**|



## **Benefits** 

Very low RDS(ON) at 4.5V VGS Low Gate Charge 

Fully Characterized Avalanche Voltage and Current 100% Tested for RG Lead-Free (Qualified up to 260°C Reflow) RoHS compliant (Halogen Free) Low Thermal Resistance Large Source Lead for more reliable Soldering 

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PQFN 5X6 mm<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|~~ns~~|**Parameter**<br>~~ns~~|**Max.**<br>~~ns~~|**Units**<br>~~ns~~|
|---|---|---|---|
|VDS|Drain-to-Source Voltage<br>~~a~~|30<br>~~a~~|V<br>~~ae~~|
|VGS|Gate-to-Source Voltage<br>~~es~~<br>~~—————~~|± 20<br>~~es~~<br>~~—————~~||
|ID@ TA= 25°C|Continuous Drain Current, VGS@ 10V<br>~~es~~<br>~~—————~~|15<br>~~es~~<br>~~—————~~|A<br>~~ae~~|
|ID@ TA= 70°C|Continuous Drain Current, VGS@ 10V<br>~~es~~<br>~~—————~~|12<br>~~es~~<br>~~—————~~||
|ID@ TC= 25°C|Continuous Drain Current, VGS@ 10V<br>~~es~~<br>~~—————~~|34<br>~~es~~<br>~~—————~~||
|IDM|Pulsed Drain Current<br>~~—————~~<br>~~NS~~|120<br>~~—————~~||
|PD@TA= 25°C|Power Dissipation<br>~~—————~~<br>~~NS~~|3.1<br>~~————— ~~|W<br> ~~ae~~|
|PD@TA= 70°C|Power Dissipation<br>~~NS~~<br>~~es~~|2.0<br>~~es~~<br>~~ee~~||
||Linear Derating Factor<br>~~NS~~<br>~~ee~~|0.025<br>~~ee~~<br>~~ee~~|W/°C<br>~~ee~~|
|TJ<br>TSTG|Linear Derating Factor<br>Operating Junction and<br>Storage Temperature Range<br>~~ee~~|-55  to + 150<br>~~ee~~<br>~~ee~~|°C<br>~~ee~~|



Notes oO) through ©) are on page 9 

## IRFH7921PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|30|–––|–––|V|VGS= 0V, ID= 250µA||
|∆ΒVDSS/∆TJ|Breakdown Voltage Temp. Coefficient|–––|0.02|–––|V/°C|Reference to 25°C, ID= 1mA||
|RDS(on)|Static Drain-to-Source On-Resistance|–––|7.1|8.5|mΩ|VGS= 10V, ID= 15A�||
|||–––|10.4|12.5||VGS= 4.5V, ID= 12A�||
|VGS(th)|Gate Threshold Voltage|1.35|1.8|2.35|V|VDS= VGS, ID= 25µA||
|∆VGS(th)|Gate Threshold Voltage Coefficient|–––|-6.2|–––|mV/°C|||
|IDSS|Drain-to-Source Leakage Current|–––|–––|1.0|µA|VDS= 24V, VGS= 0V||
|||–––|–––|150||VDS= 24V, VGS= 0V, TJ= 125°C||
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V||
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -20V||
|gfs|Forward Transconductance|27|–––|–––|S|VDS= 15V, ID= 12A||
|Qg|Total Gate Charge|–––|9.3|14|nC|See Fig.17 & 18<br>VGS= 4.5V<br>ID= 12A<br>VDS= 15V||
|Qgs1|Pre-Vth Gate-to-Source Charge|–––|2.2|–––||||
|Qgs2|Post-Vth Gate-to-Source Charge|–––|1.2|–––||||
|Qgd|Gate-to-Drain Charge|–––|3.2|–––||||
|Qgodr|Gate Charge Overdrive|–––|2.7|–––||||
|Qsw|Switch Charge (Qgs2+ Qgd)|–––|4.4|–––||||
|Qoss|Output Charge|–––|5.0|–––|nC|VDS= 16V, VGS= 0V||
|RG|Gate Resistance|–––|1.4|2.4|Ω|||
|td(on)|Turn-On DelayTime|–––|12|–––|ns|RG=1.8Ω<br>VDD= 15V, VGS= 4.5V<br>ID= 12A<br>See Fig.15||
|tr|Rise Time|–––|7.6|–––||||
|td(off)|Turn-Off DelayTime|–––|14|–––||||
|tf|Fall Time|–––|4.7|–––||||
|Ciss|Input Capacitance|–––|1210|–––|pF|VGS= 0V<br>VDS= 15V<br>ƒ= 1.0MHz||
|Coss|Output Capacitance|–––|240|–––||||
|Crss|Reverse Transfer Capacitance|–––|120|–––||||
|**Avalanche Characteristics**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|EAS|Single Pulse Avalanche Energy�||–––|||29|mJ|
|IAR|Avalanche Current�||–––|||12|A|



## **Diode Characteristics** 

|||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|---|
|IS||Continuous Source Current<br>(Body Diode)|–––|–––|3.9|A|S<br>D<br>G<br>showing  the<br>integral reverse<br>p-n junction diode.<br>MOSFET symbol|
|ISM||Pulsed Source Current<br>(Body Diode)��|–––|–––|120|||
|VSD||Diode Forward Voltage|–––|–––|1.0|V|TJ= 25°C, IS= 12A, VGS= 0V�|
|trr||Reverse RecoveryTime|–––|12|18|ns|TJ= 25°C, IF= 12A, VDD= 15V<br>di/dt = 300A/µs��|
|Qrr||Reverse RecoveryCharge|–––|11|17|nC||
|ton||Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)|||||
|||||||||
|�||���������������������������������������������������||||||



## IRFH7921PbF 

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1000<br>≤60µs PULSE WIDTHTj = 150°C60µs PULSE WIDTH TOP           VGS10V10V5.0V<br>Tj = 150°C60µs PULSE WIDTH eet 5.0V<br>4.5V3.5V<br>3.5V<br>100 3.0V<br>2.7V<br>2.5V<br>BOTTOM 2.3V<br>10 W G ee<br>ASS SSSS S S eee<br>1<br>| TM 2.3V LTTSSSSSS<br>FC te<br>0.1 C e i<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1000 1000<br>≤Tj = 25°C60µs PULSE WIDTH yp TOP           VGS10V5.0V ≤60µs PULSE WIDTHTj = 150°C60µs PULSE WIDTH eet TOP           VGS10V10V5.0V<br>100 4.5V3.5V 4.5V3.5V<br>3.0V 100 3.0V<br>2.7V 2.7V<br>2.5V 2.5V<br>10 BOTTOM 2.3V BOTTOM 2.3V<br>SS 10 W G ee<br>p e<br>1 | ASS SSSS S S eee<br>1<br>0.1 _—E ——— entl OH | TM 2.3V LTTSSSSSS<br>0.01 PEF= 2.3V ttt 0.1 FC te i<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br>1000 1.6<br>S S ss /<br>Es es es es ID = 15A<br>VGS = 10V<br>ee ee ee ee 1.4 y,<br>100<br>J | | | Nn<br>— es aee / Aea ee ee 1.2 7 Y<br>10 TJ = 150°C<br>Pt “wt | T TA yyy<br>1.0<br>TJ = 25°C<br>1<br>p t ff] | V4<br>0.8<br>VDS = 15V<br>≤60µs PULSE WIDTH<br>0.1 | PRE [ET] | YO 0.6 ALALLEE<br>1 2 3 4 5 6 -60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance vs. Temperature 

## IRFH7921PbF ~~|~~ 

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**----- Start of picture text -----**<br>
10000 5.0<br>||| — | VCCGS  iss rss    = C = 0V,       f = 1 MHZ = Cgs gd + Cgd,  Cds SHORTED 4.0 ID= 12A VDS= 24V — /|<br>r Coss   = Cds + Cgd VDS= 15V ay,<br>a ee n<br>Ciss 3.0<br>1000 T _ | orT LZ<br>e e ee<br>Ee ee ee ee ee ee 2.0 LY<br>a ee ee ee ee<br>Coss<br>ee eelee<br>1.0<br>PtPSLLT<br>C<br>rss<br>ae<br>100 0.0<br>1 10 100 0 2 4 6 8 10 12<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge vs. Gate-to-Source Voltage 

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1000 1000<br>= == aa OPERATION IN THIS AREA LIMITED BY R DS(on)<br>es rth mn<br>100 P | | | TT 100 A lll<br>10 0µsec<br>1msec<br>T = 150°C<br>J<br>10 PSf f YK TJ = 25°C I | 10 iER a S h)IOe<br>Ee ee es A es 2 ee ee ee iz, DC iv |] 10msec S l ee ee<br>es ee eA A |<br>1 f e 1 i ti on<br>en een ee TTj = 150°CA = 25°C a ll<br>VGS = 0V Single Pulse<br>0.1 | fe | hf  a tf | e 0.1 S SeCA Pe ll<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 1 10 100<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

## IRFH7921PbF 

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**----- Start of picture text -----**<br>
16 2.5<br>14<br>m f | PP EEEE<br>12 2.0<br>N ee P N<br>10<br>P oP NN PL EE<br>ID = 25µA<br>8 P | 1.5 N L<br>6 P | | NNTN| P tEE NEEEINE J<br>4 e ee\ee 1.0 a aa eeeeNN<br>2 P | | | AN E REIN<br>0 0.5<br>25 50 75 100 125 150 -75 -50 -25 0 25 50 75 100 125 150<br> TJ , Junction Temperature (°C) TJ , Temperature ( °C )<br>Fig 9.   Maximum Drain Current vs. Fig 10.   Threshold Voltage vs. Temperature<br>Ambient Temperature<br>100<br>D = 0.50<br>10 0.20 eee on Tt<br>0.10<br>S y Le Ltn ee ee |<br>0.05<br>1 em n 0.020.01 etnail τJ τ SOO J R 1 R 1 R 2 R 2 R 3 R 3 R 4R 4 τAτA Ri (°C/W)   2.4768     0.000496 τi (sec) i<br>0.1 —a P ofeeINee τ1 τ to 1 τ2 τ2 tL τ3 τ3 τ4 τ4 || 6.6412     0.014506 |<br>15.997     0.80399<br>Ci= τi/Ri<br>aET UA LeerRF I PP Ci= τi/Ri |. 14.892     34.4 a|<br>SINGLE PULSE<br>0.01 a 7?ee0 a | ee ee Notes: |<br>( THERMAL RESPONSE )<br>1. Duty Factor D = t1/t2<br>E PTFE<br>a PE P TAeeA eeEPTei 2. Peak Tj = P dm x Zthja + T A<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>ID,  Drain Current (A)<br>VGS(th), Gate Threshold Voltage (V)<br>Thermal Response ( Z  thJA ) °C/W<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

## IRFH7921PbF ~~ee~~ 

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**----- Start of picture text -----**<br>
20 120<br>ID = 15A ID<br>18<br>TOP         2.2A<br>100<br>3.1A<br>To. 1 11<br>16<br>BOTTOM 12A<br>PTW TLE Kanan<br>80<br>14<br>CANEETET<br>12 CCRC EET 60 P NELEEL EEL<br>TJ = 125°C<br>10<br>CORPSE 40 N N EEE EL<br>8<br>PERS R OBT<br>6 TJ = 25 ° C 20<br>4 HOCTE SEEeer 0 m iTE S S<br>0 2 4 6 8 10 12 14 16 18 20 25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>VGS, Gate -to -Source Voltage  (V)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance vs. Gate Voltage 

**Fig 13.** Maximum Avalanche Energy vs. Drain Current 

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**----- Start of picture text -----**<br>
15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>; 20V dt<br>tp 0.01Ω<br>**----- End of picture text -----**<br>


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 1<br> 0.1<br>**----- End of picture text -----**<br>


**Fig 14a.** Unclamped Inductive Test Circuit 

**==> picture [144 x 109] intentionally omitted <==**

**----- Start of picture text -----**<br>
V(BR)DSS<br>tp /<br>IAS<br>**----- End of picture text -----**<br>


**Fig 14b.** Unclamped Inductive Waveforms 

**Fig 15a.** Switching Time Test Circuit 

**==> picture [146 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
V<br>DS<br>90%<br>10% AY<br>V<br>GS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 15b.** Switching Time Waveforms 

## IRFH7921PbF 

**==> picture [415 x 164] intentionally omitted <==**

**----- Start of picture text -----**<br>
Driver Gate Drive<br>P.W.<br>D.U.T + Period — D = ——<br>+ P.W. Period<br>) ©) Circuit    • Layout Considerations fi V t GS=10V<br>•<br>| =] - LowGroundStray Inductance Plane<br>•  owLeakage Inductance ® D.U.T. ISD Waveform<br>+<br>Reverse<br>Recovery Body Diode Forward<br>oi - [l] Current Transformer - ® + Current r Current di/dt AN<br>©) D.U.T. VDS Waveform Diode Recoverydv/dt ‘ '<br>00 = VDD<br>•  Re-Applied<br>Re •  riversame type as D.U.T. + Voltage Body Diode  Forward Drop iv<br>( 4) •  vidt controlled by Rg Vop - Inductor Curent<br>•  D.U.T. - Device Under Test es ee<br>sp controlled by Duty Factor"D" ® Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


## **Fig 16.** 

## or N-Channel 

## HEXFET ® ower MOSFETs 

**==> picture [412 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
Current Regulator Id<br>ne Same Type as D.U.T. Vds<br>| |<br>|<br>|<br>| Vgs<br>| 50KΩ | |1<br>| 12V .2µF | \<br>| .3µF | \'<br>| [|]<br>_Et 11, | +<br>D.U.T. -VDS i<br>Vgs(th)<br>' 1<br>VGS ! 1<br>3mA LIL T '<br>ae<br><> 4t___»>'<> 1 4+W___<br>IG ID Qgs1 Qgs2 Qgd Qgodr<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


## **Fig 17.** Gate Charge Test Circuit 

**Fig 18.** Gate Charge Waveform 

## IRFH7921PbF 

## **PQFN 5x6 Option "E" Package Details** 

## **PQFN Part Marking** 

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**----- Start of picture text -----**<br>
INTERNATIONAL<br>RECTIFIER LOGO 6<br>DATE CODE<br>XXXX PART NUMBER<br>ASSEMBLY SITE CODE<br>(Per SCOP 200-002) XYWWX MARKING CODE(Per Marking Spec.)<br>XXXXX<br>PIN 1<br>IDENTIFIER<br>LOT CODE<br>(Eng Mode - Min. last 4 digits of EATI #)<br>(Prod Mode - 4 digits SPN code)<br>TOP MARKING (LASER)<br>**----- End of picture text -----**<br>


## IRFH7921PbF 

## **PQFN Tape and Reel** 

Repetitive rating;  pulse width limited by max. junction temperature. 

Starting TJ = 25°C, L = 0.39mH, RG = 25Ω, IAS = 12A. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. 

Rthjc is guaranteed by design 

When mounted on 1 inch square  2 oz copper pad on 1.5x1.5 in. board of FR-4 material. 

## **Revision History** 

|**Revision Historyy**||
|---|---|
|**Date**|**Comments**|
|08/05/2013|•Updated the package drawing, on page 1.<br>•Updated the package outline drawing, on page 8.<br>•This drawing change is related to PCN "Hana-GTBF-GEM 5x6 PQFN<br>Public."|





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- [Supplier page](https://es.farnell.com/infineon/irfh7921tr2pbf/mosfet-n-ch-30v-15a-pqfn56/dp/1791563)
---

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