# Power MOSFET, N Channel, 25 V, 100 A, 1400 µohm, QFN, Surface Mount

![Product image](https://novapart.co/image/farnell:2781124/)

**URL**: https://novapart.co/products/IRFH5250DTRPBF/power-mosfet-n-channel-25-v-100-a-1400-ohm-qfn
**SKU**: IRFH5250DTRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8160
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:100A; Drain Source Voltage Vds:25V; On Resistance Rds(on):0.001ohm; R; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET Series |
| Qualification | - |
| Power Dissipation | 156W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | QFN |
| Drain Source Voltage Vds | 25V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 1400µohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2781124/)

|~~ee~~|~~ee~~|~~ee~~|
|---|---|---|
|**VDS**<br>~~ee~~|**DS**<br>**25**<br>~~ee~~|**V**<br>~~ee~~|
|**RDS(on) max**<br>(@VGS= 10V)<br>~~ee~~|**1.4**<br>~~ee ~~|**m**Ω<br> ~~ee~~|
|**VSD  max**|**0.6**|**V**|
|(@IS= 5.0A)|||
|**trr(typical)**|**27**|**ns**|
|**ID **<br>(@Tmb= 25°C)|**100**|**A**|



## HEXFET . Power MOSFET Sie PQFN 5X6 mm 

## **Applications** 

- Synchronous MOSFET for high frequency buck converters 

## **Features and Benefits** 

|**Features**||**Benefits**|
|---|---|---|
|Low RDSon (<1.4mΩ)||Lower Conduction Losses|
|Schottky Intrinsic Diode with Low Forward Voltage||Lower Switching Losses|
|Low Thermal Resistance to PCB (<0.8°C/W)||Enable better thermal dissipation|
|100% Rg tested||Increased Reliability|
|Low Profile (<0.9 mm)|results in|Increased Power Density|
|Industry-Standard Pinout|⇒|Multi-Vendor Compatibility|
|Compatible with Existing Surface Mount Techniques|Compatible with Existing Surface Mount Techniques|Easier Manufacturing|
|RoHS Compliant Containing no Lead, no Bromide and no Halogen|RoHS Compliant Containing no Lead, no Bromide and no Halogen|Environmentally Friendlier|
|MSL1, Industrial Qualification||Increased Reliability|



|**Orderable part number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Note**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRFH5250DTRPBF|PQFN5mm x6mm|Tape and Reel|4000||
|~~IRFH5250DTR2PBF~~|~~PQFN 5mm x 6mm~~|~~Tape and Reel~~|~~400~~|EOL notice #259|



## **Absolute Maximum Ratings** 

|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**<br>**Parameter**|**Max.**|**Units**|
|---|---|---|---|
|VDS<br>~~a~~|Drain-to-Source Voltage<br>~~a~~|25<br>~~a~~|V|
|VGS<br>~~a~~<br>~~a~~|Gate-to-Source Voltage<br>~~a~~<br>~~a~~|± 20<br>~~a~~||
|ID@ TA= 25°C<br>~~a~~<br>~~aa~~|Continuous Drain Current,VGS@ 10V<br>~~a~~<br>~~aa~~|40<br>~~a~~|A<br>|
|ID@ TA= 70°C<br>~~aa~~|Continuous Drain Current,VGS@ 10V<br>~~aa~~|32||
|ID@ Tmb= 25°C<br>~~a~~<br>~~a~~|Continuous Drain Current,VGS@ 10V<br>~~a~~<br>~~a~~|100<br>~~a~~||
|ID@ Tmb= 100°C<br>~~a~~|Continuous Drain Current,VGS@ 10V<br>~~a~~|100<br>~~a~~||
|IDM<br>~~oe~~<br>~~a~~|Pulsed Drain Current<br>~~oe~~<br>~~a~~|400<br>~~oe~~<br>||
|PD@TA= 25°C<br>~~aa~~|Power Dissipation<br>~~aa~~|3.6<br>~~a~~|W<br>~~a~~|
|PD@Tmb= 25°C<br>~~aa~~|Power Dissipation<br>~~aa~~|156<br>~~a~~||
|~~a~~<br>~~a~~|Linear Derating Factor<br>~~a~~<br>~~a~~|0.029<br>~~a~~<br>~~a~~|W/°C<br>~~a~~<br>~~a~~|
|TJ<br>TSTG<br>~~a~~|Linear Derating Factor<br>Operating Junction and<br>Storage Temperature Range<br>~~a~~|-55  to + 150<br>~~a~~|°C<br>~~a~~|



������������ 

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**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|25|–––|–––|V|VGS= 0V,ID= 1.0mA||
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|-8.0|–––|mV/°C|Reference to 25°C,ID= 10mA||
|RDS(on)|Static Drain-to-Source On-Resistance|–––|1.0|1.4|mΩ|VGS= 10V,ID= 50A�||
|||–––|1.7|2.2||VGS= 4.5V,ID= 50A�||
|VGS(th)|Gate Threshold Voltage|1.35|1.80|2.35|V|VDS= VGS, ID= 150μA||
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-11|–––|mV/°C|||
|IDSS|Drain-to-Source Leakage Current|–––|–––|500|μA|VDS= 20V,VGS= 0V||
|||–––|–––|5.0|mA|VDS= 20V,VGS= 0V,TJ= 125°C||
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V||
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -20V||
|gfs|Forward Transconductance|120|–––|–––|S|VDS= 13V,ID= 50A||
|Qg|Total Gate Charge|–––|83|–––|nC|VGS= 10V,VDS= 13V,ID= 50A||
|Qg|Total Gate Charge|–––|39|59|nC|VDS= 13V<br>VGS= 4.5V<br>ID= 50A||
|Qgs1|Pre-Vth Gate-to-Source Charge|–––|11|–––||||
|Qgs2|Post-Vth Gate-to-Source Charge|–––|6.1|–––||||
|Qgd|Gate-to-Drain Charge|–––|12|–––||||
|Qgodr|Gate Charge Overdrive|–––|9.9|–––||||
|Qsw|Switch Charge(Qgs2+ Qgd)|–––|18.1|–––||||
|Qoss|Output Charge|–––|36|–––|nC|VDS= 16V,VGS= 0V||
|RG|Gate Resistance|–––|1.4|–––|Ω|||
|td(on)|Turn-On DelayTime|–––|23|–––|ns|VDD= 13V, VGS= 4.5V<br>RG=1.8Ω<br>ID= 50A||
|tr|Rise Time|–––|72|–––||||
|td(off)|Turn-Off DelayTime|–––|23|–––||||
|tf|Fall Time|–––|24|–––||||
|Ciss|Input Capacitance|–––|6115|–––|pF|VGS= 0V<br>VDS= 13V<br>ƒ= 1.0MHz||
|Coss|Output Capacitance|–––|1730|–––||||
|Crss|Reverse Transfer Capacitance|–––|610|–––||||
|**Avalanche Characteristics**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|EAS|Single Pulse Avalanche Energy�||–––|||470|mJ|
|IAR|Avalanche Current�||–––|||50|A|
|**Diode Characteristics**||||||||
||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**||
|IS|Continuous Source Current<br>(Body Diode)|–––|–––|100|A|S<br>D<br>G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-n junction diode.||
|ISM|<br>Pulsed Source Current<br>(Body Diode)��|–––|–––|400||||
|VSD|<br>Diode Forward Voltage|–––|–––|0.6|V|TJ= 25°C,IS= 5.0A,VGS= 0V�||
|VSD|Diode Forward Voltage|–––|–––|1.0|V|TJ= 25°C,IS= 50A,VGS= 0V�||
|trr|Reverse RecoveryTime|–––|27|41|ns|TJ= 25°C, IF= 50A, VDD= 13V<br>di/dt = 335A/μs��||
|Qrr|Reverse RecoveryCharge|–––|51|77|nC|||
|ton|Forward Turn-On Time|Time is dominated by parasitic Inductance||||||



## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJC-mb|Junction-to-MountingBase|0.5|0.8|°C/W|
|RθJC (Top)|Junction-to-Case�|–––|15||
|RθJA|Junction-to-Ambient�|–––|35||
|RθJA (<10s)|Junction-to-Ambient�|–––|22||



� ����������� ���������������������������������� ������������������������� ����������������������������������������������� 

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1000<br>VGS<br>TOP           10V<br>ees eee 5.0V<br>| fA 4.5V<br>3.5V<br>100 3.3V<br>PallaS SS SSE 3.0V<br>2.9V<br>BOTTOM 2.7V<br>10 BE all<br>met emaallieemenil<br>1 eee 2.7V lll<br>≤ 60μs PULSE WIDTH<br>PT Ty<br>Tj = 25°C<br>0.1 PI antill<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>1000<br>ee es ee<br>Ee es ee ee<br>100<br>ee ey , ey As<br>Ee eee 4 ee ee<br>TJ = 150°C T = 25°C<br>10 J<br>re 2 eee<br>Ee ey ee es ee<br>ee ee ee | sid<br>VDS = 15V<br>≤ 60μs PULSE WIDTH<br>1.0<br>1 2 3 4 5<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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100000<br>-——_ VGS   = 0V,       f = 1 MHZ<br>Ciss   = C gs + Cgd,  C ds SHORTED<br>|=| C rss    = C gd<br>C = C + C<br>= oss   ds  gd<br>10000<br>enHH Ciss<br>aee<br>EeAee ee C ee oss ee eeee e eee<br>FH<br>1000<br>SSSISSSS en Crss ee ee ee<br>Ee ee ee ee eeeee<br>—a ee ee<br>EC<br>100<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

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1000<br>VGS<br>TOP           10V<br>eeeRetinal! 5.0V<br>| | bb Ao 4.5V<br>3.5V<br>3.3V<br>| fh 7 3.0V<br>100 2.9V<br>BOTTOM 2.7V<br>Faoon<br>10 2.7V<br>Aeee<br>eecteee csc<br>≤ 60μs PULSE WIDTH<br>Tj = 150°C<br>1 Bim alll<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.6<br>ID = 50A<br>VGS = 10V<br>1.4<br>1.2<br>y<br>1.0<br>pa<br>0.8 "a 7<br>0.6<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

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**----- Start of picture text -----**<br>
14.0<br>ID= 50A<br>12.0 Po tT tt<br>4<br>| VDS= 20V fo<br>10.0<br>VDS= 13V<br>8.06.0 Pf| | BFWAAn| |<br>y<br>4.02.0 CtPAFAne/ |Yi|<br>0.0<br>0 20 40 60 80 100 120<br> QG,  Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

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**----- Start of picture text -----**<br>
1000<br>EO<br>Ee ee ee ee ee ee<br>T = 150°C<br>J<br>100<br>P| PO |<br>y/o<br>=<br>T = 25°C<br>J<br>10<br>Sy 2s ee A<br>Sa<br>V GS  = 0V<br>1.0 Th yy<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VSD, Source-to-Drain Voltage (V)<br>ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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**----- Start of picture text -----**<br>
300<br>Limited By Package<br>L))~Ss<br>250<br>200 PAAe| | ft<br>150<br>: a<br>vaake<br>100<br>50 [|<br>0 | | | |fT IN| \<br>25 50 75 100 125 150<br> TC , Case Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 9.** Maximum Drain Current vs. Case Temperature 

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**----- Start of picture text -----**<br>
10000<br>SSE OPERATION IN THIS AREA  SiS<br>1000 rT LIMITED BY R DS (on) ll<br>Poesy te ta |<br>100 Seam 100μsec<br>SS es en<br>Somes Nine 1msec<br>10 10msec<br>PT hE Er DC ee<br>1<br>Tc = 25°C atiicesiasi<br>Tj = 150°C<br>Single Pulse<br>ee ll<br>0.1<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 8.   Maximum Safe Operating Area<br>3.0<br>Pe<br>2.5<br>PEREENGan~San EEE<br>2.0<br>SSCP<br>ID = 150μA PSD FL<br>1.5 ID = 250μA<br>I D  = 1.0mA BS\Nae<br>ID = 1.0A<br>1.0<br>ZaN@Ne<br>0.5 ft}|}A,SEaNee| tt NY<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>ID,  Drain-to-Source Current (A)<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 10.** Threshold Voltage vs. Temperature 

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**----- Start of picture text -----**<br>
10<br>er<br>1 Na ee e e ee e e ee ee eee eel<br>D = 0.50<br>0.20<br>0.1 anne 0.10 2 eeae ——otcel ee ee<br>0.05<br>| | 0.02 Be ee ee ee<br>0.01 TT 0.01<br>Yt<br>0.001 =a SINGLE PULSE i<br>( THERMAL RESPONSE ) Notes:<br>1. Duty Factor D = t1/t2<br>ee ee ee ee ee ee ee 2. Peak Tj = P dm x Zthjc + Tc a<br>ee ee ell Ul]<br>0.0001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJC ) °C/W<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Mounting Base 

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**----- Start of picture text -----**<br>
4 2000<br>| ID = 50A 1800 | | ft | ID<br>TOP         18A<br>1600 24A<br>3 | LOE<br>BOTTOM 50A<br>1400 VE tt<br>1200<br>TJ = 125°C<br>2 Ne 1000 EN<br>800<br>‘ines KACEE EEE<br>600<br>1 ST BNNs<br>TJ = 25°C —— 400 INANE ET<br>0 2000 | | ft | |Cos<br>2 4 6 8 10 12 14 16 18 20 25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>VGS, Gate -to -Source Voltage  (V)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance vs. Gate Voltage 

**Fig 13.** Maximum Avalanche Energy vs. Drain Current 

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**----- Start of picture text -----**<br>
1000<br>Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming  Δ Tj = 125 ° C and<br>ee ee ee Tstart =25°C (Single Pulse) |<br>eet ae |<br>100 Poo<br>PN<br>RY YENI EEL ER RRL<br>10 PI CIP SSFPm<br>eeee eS ee ee ees 8 ee See ee os EG<br>ee Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming  ΔΤ j = 25°C and<br>Tstart = 125°C.<br>1 BoPESesTE EEE TT<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01<br>tav (sec)<br>Avalanche Current (A)<br>**----- End of picture text -----**<br>


**Fig 14.** Typical Avalanche Current vs.  Pulsewidth 

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**----- Start of picture text -----**<br>
Driver Gate Drive<br>P.W.<br>D.U.T + {¢$ P.W. Period —— | D = —— Period<br>) [©)] Circuit    • Layout Considerations | fi V t GS=10V<br>•<br>| 1] - LowGroundStray Inductance Plane<br>•  owLeakage Inductance @ D.U.T. ISD Waveform<br>+<br>Reverse<br>Recovery Body Diode Forward<br>oH - [l] Current Transformer - ® + Current r Current di/dt NN<br>® D.U.T. VDS Waveform Diode Recoverydv/dt ‘ '<br>o) 00 ny VDD<br>ay<br>•  Re-Applied<br>Re (A • •  vidtriversamecontrolledtype as by RgD.U.T. Vo p +- Voltage Inductor Curent Body Diode  Forward Drop<br>•  D.U.T. - Device Under Test e s ee<br>(7) sp controlled by Duty Factor"D" ® Ripple  ≤ 5% ISD<br>* Vgg = 5V for Logic Level Devices<br>Fig 15. eak Diode Recovery dv/dt Test Circuit or N-Channel<br>HEXFET ® ower MOSFETs<br>V(BR)DSS<br>15V qe tp -><br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS A<br>y 20V dt tp 0.01 Ω IAS _<br>**----- End of picture text -----**<br>


**Fig 16a.** Unclamped Inductive Test Circuit 

**Fig 16b.** Unclamped Inductive Waveforms 

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**----- Start of picture text -----**<br>
 1 = s<br> 0.1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
V<br>DS |<br>90%<br>10%<br>/\<br>V<br>GS tt en /<br>an<br>4—'<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


## **Fig 17a.** Switching Time Test Circuit 

**Fig 17b.** Switching Time Waveforms 

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L<br>VCC<br>DUT<br>0<br>1K S<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>Vgs(th)<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Fig 18a.   Gate Charge Test Circuit<br>**----- End of picture text -----**<br>


**Fig 18b.** Gate Charge Waveform 

## **PQFN 5x6 Outline "B" Package Details** 

## ~~So Rez os~~ 

## **PQFN 5x6 Outline "G" Package Details** 

For more information on board mounting, including footprint and stencil recommendation, please refer to application note AN-1136: http://www.irf.com/technical-info/appnotes/an-1136.pdf 

For more information on package inspection techniques, please refer to application note AN-1154: http://www.irf.com/technical-info/appnotes/an-1154.pdf 

**Note: For the most current drawing please refer to IR website at:** http://www.irf.com/package/ 

## **PQFN 5x6 Part Marking** 

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**----- Start of picture text -----**<br>
INTERNATIONAL<br>RECTIFIER LOGO<br>DATE CODE<br>XXXX P ART NUMBER<br>ASSEMBLY (“4 or 5 digits”)<br>SITE CODE XYWWX M ARKING CODE<br>(Per SCOP 200-002) (Per Marking Spec)<br>XXXXX<br>PIN 1<br>IDENTIFIER<br>LOT CODE<br>(Eng Mode - Min last 4 digits of EATI#)<br>(Prod Mode - 4 digits of SPN code)<br>**----- End of picture text -----**<br>


## **PQFN 5x6 Tape and Reel** 

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**----- Start of picture text -----**<br>
REEL DIMENSIONS<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
TAPE DIMENSIONS<br>| foreP olo-_— — Po1——_oo- ooo d |<br>1 WD Bo<br>el EY el?)<br>it | |<br>A o —<br>7<br>CODE DESCRIPTION<br>Ao Dimension design to accommodate the component width<br>Bo Dimension design to accommodate the component lenght<br>Ko Dimension design to accommodate the component thickness<br>W Overall width of the carrier tape<br>P1 Pitch between successive cavity centers<br>SS<br>**----- End of picture text -----**<br>


## **QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE** 

|Type<br>Package|Diameter<br>Reel<br>(Inch)|QTY|Width<br>Reel<br>(mm)<br>Ao<br>W1<br>(mm)|(mm)<br>Ao<br>(mm)<br>Bo<br>(mm)|(mm)<br>Ko<br>(mm)<br>P1|(mm)<br>W|Quadrant<br>Pin 1|
|---|---|---|---|---|---|---|---|
|5 X 6 PQFN|13|4000|12.4<br>6.300|6.300<br>5.300<br>1.20|1.20<br>8.00|12|Q1|



**Note: For the most current drawing please refer to IR website at:** http://www.irf.com/package/ 

## **Qualification information**[†] 

|**Qualification information**[†]|||
|---|---|---|
|Qualification level|Industrial<br>††<br>(per JEDEC JES D47F<br>†††guidelines)||
|Moisture Sensitivity Level|PQFN 5mm x 6mm|MS L1<br>(per JEDEC J-S T D-020D<br>†††)|
|RoHS compliant|Yes||



## Qualification standards can be found at International Rectifier’s web site 

http://www.irf.com/product-info/reliability 

TT Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ 

Applicable version of JEDEC standard at the time of product release. 

Repetitive rating;  pulse width limited by max. junction temperature. 

Starting TJ = 25°C, L = 0.37mH, RG = 25 Ω , IAS = 50A. 

Pulse width ≤ 400μs; duty cycle ≤ 2%. 

R θ is measured at TJ of approximately 90°C. 

When mounted on 1 inch square  2 oz copper pad on 1.5x1.5 in. board of FR-4 material. 

© Calculated continuous current based on maximum allowable junction temperature. Package is limited to 100A by production test capability. 

|**Revision History**<br>**Date**|**Revision History**<br>**Comment**|
|---|---|
|1/16/2014|• Updated ordering information to reflect the End-Of-Life (EOL) of the mini-reel option (EOL notice #259).<br>• Updated data sheet with the new IR corporate template.|
|3/16/2015|Updated data sheet with the new IR corporate template.<br>• Updated package outline and tape and reel on pages 7 and 8.|
|6/23/2015|Updated package outline and tape and reel on pages 7 and 8.<br>•Added package outline for “option G” on page 7.<br>• Updated"IFX logo"on page 1 and page 9.|



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFH5250DTRPBF/power-mosfet-n-channel-25-v-100-a-1400-ohm-qfn)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfh5250dtrpbf/mosfet-n-ch-25v-100a-qfn-8/dp/2781124)
---

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