# Power MOSFET, N Channel, 75 V, 100 A, 5900 µohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:2725933/)

**URL**: https://novapart.co/products/IRFH5007TRPBF/power-mosfet-n-channel-75-v-100-a-5900-ohm-pqfn
**SKU**: IRFH5007TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.8870
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:100A; Drain Source Voltage Vds:75V; On Resistance Rds(on):0.0051ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (08-Jul-2021) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 156W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 75V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 5900µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725933/)

## HEXFET ® Power MOSFET 

|International<br>.f-<br>~~AN INFINEON TECHNOLOGIESCOMPANY~~|||
|---|---|---|
|**VDS**|**75**|**V**|
|**RDS(on) max**<br>(@VGS= 10V)|**5.9**|**m**Ω|
|**Qg (typical)**|**65**|**nC**|
|**RG (typical)**|**1.2**|Ω|
|**ID **<br>(@Tmb= 25°C)|**100**|**A**|



**PQFN 5X6 mm** 

## **Applications** 

- Secondary Side Synchronous Rectification 

- Inverters for DC Motors 

- DC-DC Brick Applications 

- Boost Converters 

## **Features and Benefits** 

## **Features** 

Low RDSon ( ≤ 5.9m Ω ) Low Thermal Resistance to PCB ( ≤ 0.8°C/W) 100% Rg tested Low Profile ( ≤ 0.9 mm) Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant Containing no Lead, no Bromide and no Halogen MSL1, Industrial Qualification 

## **Benefits** 

Lower Conduction Losses Enables Better Thermal Dissipation Increased Reliability results in Increased Power Density ⇒ Multi-Vendor Compatibility Easier Manufacturing Environmentally Friendlier Increased Reliability 

||**Parameter**<br>~~a~~|**Max.**<br>~~a~~|**Units**<br>~~a~~|
|---|---|---|---|
|VDS|Drain-to-Source Voltage<br>~~ee~~|75<br>~~ee~~|V|
|VGS|Gate-to-Source Voltage<br>~~ee~~|±20<br>~~ee~~||
|ID@ TA= 25°C|Continuous Drain Current,VGS@ 10V<br>~~a~~|17<br>~~a~~|A|
|ID@ TA= 70°C|Continuous Drain Current,VGS@ 10V<br>~~ee~~|13<br>~~ee~~||
|ID@ Tmb= 25°C|Continuous Drain Current,VGS@ 10V<br>~~fe~~|100<br>~~fe~~||
|ID@ Tmb= 100°C<br>~~a~~|Continuous Drain Current,VGS@ 10V<br>~~ee~~<br>~~a~~|88<br>~~ee~~||
|IDM<br>~~a~~<br>~~ee~~|Pulsed Drain Current<br>~~a~~<br>~~ee~~|400||
|PD@TA= 25°C<br>~~a~~<br>~~ee~~<br>~~ek~~|Power Dissipation<br>~~a~~<br>~~ee~~<br>~~ek~~|3.6<br>|W<br>|
|PD@ Tmb= 25°C<br>~~ee~~<br>~~ek~~|Power Dissipation<br>~~ee~~<br>~~ek~~|156<br>||
|~~ek~~|Linear Derating Factor<br>~~ek©~~|0.029<br>~~©~~|W/°C<br>~~©~~|
|TJ<br>TSTG|Linear Derating Factor<br>Operating Junction and<br>Storage Temperature Range|-55  to + 150|°C|



Notes through  are on page 9 

IRFH5007PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|75|–––|–––|V|VGS= 0V, ID= 250μA||
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|0.09|–––|V/°C|Reference to 25°C, ID= 1mA||
|RDS(on)|Static Drain-to-Source On-Resistance|–––|5.1|5.9|mΩ|VGS= 10V, ID= 50A�||
|VGS(th)|Gate Threshold Voltage|2.0|–––|4.0|V|VDS= VGS, ID= 150μA||
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-8.4|–––|mV/°C|||
|IDSS|Drain-to-Source Leakage Current|–––|–––|20|μA|VDS= 75V, VGS= 0V||
|||–––|–––|250||VDS= 75V, VGS= 0V, TJ= 125°C||
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V||
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -20V||
|gfs|Forward Transconductance|100|–––|–––|S|VDS= 15V, ID= 50A||
|Qg|Total Gate Charge|–––|65|98|nC|See Fig.17 & 18<br>VDS= 38V<br>VGS= 10V<br>ID= 50A||
|Qgs1|Pre-Vth Gate-to-Source Charge|–––|11|–––||||
|Qgs2|Post-Vth Gate-to-Source Charge|–––|4.5|–––||||
|Qgd|Gate-to-Drain Charge|–––|20|–––||||
|Qgodr|Gate Charge Overdrive|–––|29.5|–––||||
|Qsw|Switch Charge (Qgs2+ Qgd)|–––|24.5|–––||||
|Qoss|Output Charge|–––|21|–––|nC|VDS= 16V, VGS= 0V||
|RG|Gate Resistance|–––|1.2|–––|Ω|||
|td(on)|Turn-On DelayTime|–––|10|–––|ns|See Fig.15<br>VDD= 38V, VGS= 10V<br>ID= 50A<br>RG=1.8Ω||
|tr|Rise Time|–––|14|–––||||
|td(off)|Turn-Off DelayTime|–––|30|–––||||
|tf|Fall Time|–––|11|–––||||
|Ciss|Input Capacitance|–––|4290|–––|pF|ƒ= 1.0MHz<br>VGS= 0V<br>VDS= 25V||
|Coss|Output Capacitance|–––|510|–––||||
|Crss|Reverse Transfer Capacitance|–––|210|–––||||
|**Avalanche Characteristics**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|EAS|Single Pulse Avalanche Energy�||–––|||250|mJ|
|IAR|Avalanche Current�||–––|||50|A|
|**Diode Characteristics**||||||||
||**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**||
|IS|Continuous Source Current<br>(BodyDiode) �|–––|–––|100|A|S<br>D<br>G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunction diode.||
|ISM|Pulsed Source Current<br>(BodyDiode)��|–––|–––|400||||
|VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ= 25°C, IS= 50A, VGS= 0V�||
|trr|Reverse RecoveryTime|–––|31|47|ns|TJ= 25°C, IF= 50A, VDD= 38V<br>di/dt = 500A/μs��||
|Qrr|Reverse RecoveryCharge|–––|170|255|nC|||
|ton|Forward Turn-On Time|Time is dominated by parasitic Inductance||||||



## **Thermal Resistance** 

|**Thermal Resistance**|||||
|---|---|---|---|---|
||**Parameter**|**Typ.**|**Max.**|**Units**|
|RθJC-mb|Junction-to-MountingBase|0.5|0.8|°C/W|
|RθJC (Top)|Junction-to-Case�|–––|15||
|RθJA|Junction-to-Ambient�|–––|35||
|RθJA (<10s)|Junction-to-Ambient�|–––|22||



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IRFH5007PbF 

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1000<br>VGS<br>TOP           10V<br>8.0V<br>PA 6.0V<br>5.0V<br>100 4.5V<br>Of 4.25V<br>4.0V<br>Soa BOTTOM 3.75V<br>10 ee |<br>1 eetEEEE mmaat amma ai me<br>CIT FNC<br>3.75V<br>≤ 60μs PULSE WIDTH<br>HE el |<br>Tj = 25°C<br>0.1 aSriSri aa 1<br>0.1 1 10 100 1000<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>1000<br>100 e d eaa a eaa<br>10 ney TJ = 150°CJ = 150°C= 150°C A) a T J  = 25°C 25°C°CC<br>ee 4)<br>ee ey A A | es es<br>1 ee yeYeAYeAA<br>Pf FP V = 25V<br>DS<br>a<br>≤ 60μs PULSE WIDTH<br>0.1 iLiLi<br>2 3 4 5 6 7<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1000 1000<br>VGS VGS<br>TOP           10V TOP           10V<br>8.0V 8.0V<br>PA 6.0V Ca 6.0V<br>5.0V 5.0V<br>100 4.5V 4.5V<br>Of 4.25V Senal 4.25V<br>4.0V 100 4.0V<br>Soa BOTTOM 3.75V Pe BOTTOM 3.75V<br>10 ee | prt<br>at ai 10 4 3.75V<br>1 eetEEEE mmaat amma me yr" |<br>CIT FNC og<br>3.75V<br>≤ 60μs PULSE WIDTH ≤ 60μs PULSE WIDTH<br>HE el |<br>Tj = 25°C Tj = 150°C<br>0.1 aSriSri aa 1 1 TNpf LT oy1 |<br>0.1 1 10 100 1000 0.1 1 10 100 1000<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br>1000 2.5<br>ID = 50A<br>VGS = 10V<br>100 e d eaa a eaa 2.0 PETE LEEL<br>10 ney TJ = 150°CJ = 150°C= 150°C A) a T J  = 25°C 25°C°CC 1.5 PEL ELLELETALL<br>ee 4) Z|<br>ee ey A A | es es "A,<br>1 ee yeYeAYeAA 1.0 ane KX7eneee<br>Pf FP V = 25V mee<br>DS<br>a i<br>≤ 60μs PULSE WIDTH<br>0.1 iLiLi 0.5 PEELEEL ELE<br>2 3 4 5 6 7 -60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>VGS, Gate-to-Source Voltage (V)<br>Fig 3.   Typical Transfer Characteristics Fig 4.   Normalized On-Resistance vs. Temperature<br>100000 14.0<br>VCGS  iss   = C = 0V,       f = 1 MHZgs + Cgd,  C ds SHORTED ID= 50A<br>=| C Crss  oss    = C = Cds gd + Cgd 12.0 V VDSDS = 60V = 38V<br>10000 ee 10.0 pe V DS = 15V LL_|<br>Yr<br>eee ee Ciss a 8.0<br>SS Ht 6.0 TT fy<br>1000 PSST C oss CT ih<br>Sesnie! eee 4.0 ammaf |_|<br>Crss<br>PSSee 2.0 7a<br>ee ll<br>100 en all 0.0 / | | | | |<br>1 10 100 0 20 40 60 80 100<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>C, Capacitance (pF)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

IRFH5007PbF 

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**----- Start of picture text -----**<br>
1000<br>T = 150°C<br>100 ——— J  a<br>T = 25°C<br>10 J<br>1 ee eee<br>eyrsee | ee ee VGS = 0V<br>0.1<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>VSD, Source-to-Drain Voltage (V)<br>ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


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10000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS (on)<br>1000<br>100 ied DS 5S 1 mse TL c 100μsec  TT<br>10<br>10msec<br>1<br>DC<br>0.1 Tc = 25°C Ht a il<br>Tj = 150°C ee eee,<br>Single Pulse DB<br>0.01<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 8.   Maximum Safe Operating Area<br>4.0 | Po=~t ff ft ft<br>3.5 ee<br>3.0 |PsaPsa<br>2.5<br>URS<br>ID = 150μAD = 150μA = 150μA ZENE<br>2.0<br>ID = 500μAD = 500μA = 500μA<br>ID = 1.0mAD = 1.0mA = 1.0mA Zea| eeNhmd|<br>1.5 reZea| | | | hmd|<br>ID = 1.0AD = 1.0A= 1.0A<br>P| UN<br>1.00.5 PLLPtPt | |Pot|}Pot|}|} ft||||| tt||}|||}||}|| ft |<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>ID,  Drain-to-Source Current (A)<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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120 4.0<br>Limited By Package | Po=~t ff ft ft<br>100 ~ 3.5 ee<br>3.0 |PsaPsa<br>80<br>2.5<br>Po] URS<br>60 \ ID = 150μAD = 150μA = 150μA ZENE<br>2.0<br>ID = 500μAD = 500μA = 500μA<br>40 \ 1.5 ID = 1.0mAD = 1.0mA = 1.0mA reZea| | | eeNhmd|<br>ID = 1.0AD = 1.0A= 1.0A<br>P|<br>20<br>0 || | | | 0.51.00.5 PLLPtPt | |Pot|}Pot|}|} ft||||| tt||}|||}||}|| ft<br>25 50 75 100 125 150 -75 -50 -25 0 25 50 75 100 125<br> TC , Case Temperature (°C) TJ , Temperature ( °C )<br>Fig 9.   Maximum Drain Current vs. Fig 10.   Threshold Voltage vs. Temperature<br>Case Temperature<br>1<br>D = 0.50<br>a ee | | | |<br>0.20<br>PINE A re I<br>0.1<br>Po 0.10 CN rrr—-s |<br>0.05<br>SS aii e220 ee<br>i HH SH A A A HH<br>0.02<br>ae A<br>0.01 er 0.01 EN|<br>a 0 OO OO A OO<br>pt EA SINGLE PULSE a a ee ee Notes: a eee el<br>( THERMAL RESPONSE ) 1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthjc + Tc<br>A oi PA A mail|<br>0.001 PALA I BO ll<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1<br>t1 , Rectangular Pulse Duration (sec)<br>ID,  Drain Current (A)<br>VGS(th), Gate threshold Voltage (V)<br>Thermal Response ( Z thJC ) °C/W<br>**----- End of picture text -----**<br>


**Fig 10.** Threshold Voltage vs. Temperature 

**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Mounting Base 

IRFH5007PbF ~~|~~ 

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**----- Start of picture text -----**<br>
16<br>ID = 50A<br>14<br>tH} : tt tp<br>12<br>AT tt tty<br>10 T J  = 125°C<br>WotPtTt Ed<br>8<br>AY | Pr<br>T = 25°C<br>6 ACEi —| J<br>42 PPTaaa —}—__| en ee ee<br>4 6 8 10 12 14 16 18 20<br>VGS, Gate -to -Source Voltage  (V)<br>)  Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


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1100<br>1000 I D<br>TOP         6.6A<br>900 NERen<br>13A<br>800 BOTTOM 50A<br>ACCC<br>700<br>600 PINNEE | tT tt tt<br>500<br>ERE<br>400<br>300 PSNhs is<br>200 SPAS<br>100<br>aSea.<br>0 ~S<br>25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance vs. Gate Voltage 

**Fig 13.** Maximum Avalanche Energy vs. Drain Current 

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**----- Start of picture text -----**<br>
1000<br>PT EE a Allowed avalanche Current vs avalanche  ee<br>100 ee ee ee pulsewidth, tav, assuming Δ Tj = 125°C and<br>Tstart =25°C (Single Pulse)<br>a ee eee ee eee<br>10 PZ)<br>pt tt A<br>1 Er<br>Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming  ΔΤ j = 25°C and<br>| a a a ee ee<br>ae Tstart = 125°C.<br>0.1 ee 0 ee<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01<br>tav (sec)<br>Avalanche Current (A)<br>**----- End of picture text -----**<br>


**Fig 14.** Typical Avalanche Current vs.  Pulsewidth 

IRFH5007PbF ~~—~~ 

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**----- Start of picture text -----**<br>
Driver Gate Drive<br>P.W.<br>D.U.T + { $ P.W. $ Period — — D = —— Period<br>) [©)] Circuit    • Layout Considerations | fi V t GS=10V<br>•<br>| 1] - LowGroundStray Inductance Plane<br>•  owLeakage Inductance @ D.U.T. ISD Waveform<br>+<br>Reverse<br>- a Current Transformer - ® + RecoveryCurrent r Body Diode ForwardCurrent di/dt<br>® D.U.T. VDS Waveform Diode Recoverydv/dt ‘ '<br>o) 00 - VDD<br>•  Re-Applied<br>Re (A • •  Drivervidt controlledsame type asby RgD.U.T. Vp p +- Voltage Inductor Curent Body Diode  Forward Drop ma<br>•  D.U.T. - Device Under Test e s ee<br>(7) sp controlled by Duty Factor"D" ® Ripple  ≤ 5% ISD<br>* Vos = 5V for Logic Level Devices<br>Fig 15. eak Diode Recovery dv/dt Test Circuit or N-Channel<br>HEXFET ® ower MOSFETs<br>V(BR)DSS<br>15V <e— tp —><br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>Ww IAS A aan<br>yp 20V ak tp 0.01 Ω IAS<br>**----- End of picture text -----**<br>


**Fig 16a.** Unclamped Inductive Test Circuit 

**Fig 16b.** Unclamped Inductive Waveforms 

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 1 = s<br> 0.1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
V<br>DS |<br>90%<br>10%<br>/\<br>V<br>GS on<br>tt Nn /<br>4<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 17a.** Switching Time Test Circuit 

**Fig 17b.** Switching Time Waveforms 

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L<br>DUT<br>0<br>1K<br>af}<br>**----- End of picture text -----**<br>


**Fig 18a.** Gate Charge Test Circuit 

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**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>Vgs(th)<br>Qgs1 Qgs2 Qgd Qgodr<br>t ee ! H ‘<br>**----- End of picture text -----**<br>


**Fig 18b.** Gate Charge Waveform 

## IRFH5007PbF 

## **PQFN 5x6 Outline "B" Package Details** 

## **PQFN 5x6 Outline "G" Package Details** 

IRFH5007PbF ~~—~~ 

## **PQFN 5x6 Part Marking** 

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INTERNATIONAL<br>RECTIFIER LOGO<br>DATE CODE<br>XXXX PART NUMBER<br>ASSEMBLY<br>SITE CODE XYWWX M ARKING CODE<br>(Per SCOP 200-002) (Per Marking Spec)<br>XXXXX<br>PIN 1<br>IDENTIFIER<br>LOT CODE<br>(Eng Mode - Min last 4 digits of EATI#)<br>(Prod Mode - 4 digits of SPN code)<br>**----- End of picture text -----**<br>


## **PQFN 5x6 Tape and Reel** 

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**----- Start of picture text -----**<br>
REEL DIMENSIONS TAPE DIMENSIONS<br>|<br>A<<ON aa | poke @ 6/6= P61 }6 o S 4 |<br>56) <-p Reel Diameter || || lel |<br>© © Bo<br>7 | ———<br>CODE DESCRIPTION<br>Ao Dimension design to accommodate the component width<br>Bo Dimension design to accommodate the component lenght<br>Ko Dimension design to accommodate the component thickness<br>W Overall width of the carrier tape<br>= P1 Pitch between successive cavity centers<br>**----- End of picture text -----**<br>


|||**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les|**QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE**<br>Sprocke~~t~~<br>~~Ho~~les||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||00000<br>O<br>Jos ~~[a4 |~~<br>Jos ~~[04 |~~||||||||4<br>User||||Direction of Feed|||||||||
||||||VV|||||||||||||||||||
|||||Pocke~~t~~<br>Quadran~~t~~s||||||||||||||||||||
|Note:  All dimension are nominal||||||||||||||||||||||||
|Package|Reel|QTY|Reel||Ao|||Bo|||Ko|||||||||P1||W|Pin 1|
|Type|Diameter||Width||(mm)||(mm)||||(mm)||||||||(mm)|||(mm)|Quadrant|
||(Inch)||W1|||||||||||||||||||||
||||(mm)|||||||||||||||||||||
|5 X 6 PQFN|13|4000|12.4||6.300||5.300||||1.20||||||||8.00|||12|Q1|



**Note: For the most current drawing please refer to IR website at:** http://www.irf.com/package/ 

IRFH5007PbF ~~|~~ 

## **Qualification information**[†] 

|**Qualification information**[†]|**Qualification information**[†]|**Qualification information**[†]|
|---|---|---|
|Qualification level|Industrial<br>(per JEDEC JES D47F<br>††guidelines)||
|Moisture Sensitivity Level|PQFN 5mm x 6mm|MSL1<br>(per JEDEC J-ST D-020D<br>††)|
|RoHS compliant|Yes||



Qualification standards can be found at International Rectifier’s web site http://www.irf.com/product-info/reliability 

Applicable version of JEDEC standard at the time of product release. 

Repetitive rating;  pulse width limited by max. junction temperature. 

Starting TJ = 25°C, L = 0.20mH, RG = 25 Ω , IAS = 50A. 

Pulse width ≤ 400μs; duty cycle ≤ 2%. 

R θ is measured at TJ of approximately 90°C. 

When mounted on 1 inch square  2 oz copper pad on 1.5x1.5 in. board of FR-4 material. 

Calculated continuous current based on maximum allowable junction temperature. Package is limited to 100A by production test capability. 

## **Revision History** 

|**Date**|**Comment**|
|---|---|
|4/28/2015|•Updated package outline for “option B” and  added package outline for “option G” on page 7<br>• Updated tape and reel on page 8.|
|5/19/2015|•Updated package outline for “option G” on page 7.<br>• Updated"IFX logo"on page 1 and page 9.|



## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRFH5007TRPBF/power-mosfet-n-channel-75-v-100-a-5900-ohm-pqfn)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irfh5007trpbf/mosfet-n-ch-75v-100a-pqfn/dp/2725933)
---

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