# Power MOSFET, N Channel, 800 V, 1.8 A, 6.5 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:1463254/)

**URL**: https://novapart.co/products/IRFBE20PBF/power-mosfet-n-channel-800-v-18-a-65-ohm-to-220ab
**SKU**: IRFBE20PBF
**Manufacturer**: VISHAY
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5520
**Stock**: 500+
**Lead Time**: 491 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:1.8A; Drain Source Voltage Vds:800V; On Resistance Rds(on):6.5ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power Dissipation

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (04-Feb-2026) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 54W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 800V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 1.8A |
| Drain Source On State Resistance | 6.5ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1463254/)

**IRFBE20** 

Vishay Siliconix 

www.vishay.com 

## **Power MOSFET** 

**==> picture [137 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
D<br>G<br>S<br>D<br>G S<br>N-Channel MOSFET<br>**----- End of picture text -----**<br>


**==> picture [40 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-220AB<br>**----- End of picture text -----**<br>


|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|**PRODUCT SUMMARY**|
|---|---|---|
|VDS(V)|800||
|RDS(on)(Ω)|VGS= 10 V|6.5|
|Qgmax. (nC)|38||
|Qgs(nC)|5.0||
|Qgd(nC)|21||
|Configuration|Single||



## **FEATURES** 

- Dynamic dV/dt rating 

Available Available RoHS 

- Repetitive avalanche rated 

- Fast switching 

- Ease of paralleling 

- Simple drive requirements 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 

**Note** 

- This    datasheet    provides    information    about    parts    that    are RoHS-compliant and / or parts that are non RoHS-compliant.  For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details 

## **DESCRIPTION** 

Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. 

The TO-220AB package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220AB contribute to its wide acceptance throughout the industry. 

## **ORDERING INFORMATION** 

|Package|TO-220AB|
|---|---|
|Lead (Pb)-free|IRFBE20PbF|
|Lead (Pb)-free and halogen-free|IRFBE20PbF-BE3|



|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)<br>~~CO~~|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)<br>~~CO~~|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)<br>~~CO~~|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)<br>~~CO~~|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)<br>~~CO~~|**ABSOLUTE MAXIMUM RATINGS**(TC= 25 °C, unless otherwise noted)<br>~~CO~~|
|---|---|---|---|---|---|
|**PARAMETER**<br>~~CO~~<br>~~GO~~<br>~~SSS~~|||**SYMBOL**<br>~~GO~~<br>~~SS~~|**LIMIT**<br>~~GO~~<br>~~SS~~|**UNIT**<br>~~GO~~|
|Drain-source voltage<br>~~SSS~~|||VDS<br>~~SS~~|800<br>~~SS~~|V|
|Gate-source voltage<br>~~SSS~~<br>~~|~~<br>~~eeee~~<br>~~ee~~|||VGS<br>~~SS~~<br>~~PE~~<br>~~ee~~|± 20<br>~~SS~~<br>~~PE~~||
|Continuous drain current<br>~~SSS~~<br>~~ee~~|VGSat 10 V<br>~~SS~~<br>~~|~~<br>~~ee~~|TC= 25 °C<br>~~SS~~<br>~~|~~<br>~~ee~~|ID<br>~~SS~~<br>~~PE~~<br>~~ee~~<br>~~(~~|1.8<br>~~SS~~<br>~~PE~~|A|
|||TC= 100 °C<br>~~|~~<br>~~ee~~||1.2<br>~~PE~~||
|Pulsed drain currenta<br>~~|~~<br>~~eeee~~<br>~~ee~~<br>~~a~~|||IDM<br>~~PE~~<br>~~ee~~<br>~~a~~<br>~~(~~|7.2<br>~~PE~~<br>~~a~~||
|Linear deratingfactor<br>~~|~~<br>~~ee ee~~<br>~~ee~~<br>~~a~~<br>~~DG~~|||~~PE~~<br>~~ee~~<br>~~a~~<br>~~(~~<br>~~DG~~|0.43<br>~~PE~~<br>~~a~~<br>~~DG~~|W/°C<br>~~DG~~|
|Single pulse avalanche energyb<br>~~DG~~<br>~~DG~~|||EAS<br>~~DG~~<br>~~DG~~|180<br>~~DG~~<br>~~DG~~|mJ<br>~~DG~~<br>~~DG~~|
|Repetitive avalanche currenta<br>~~DG~~<br>~~DG~~|||IAR<br>~~DG~~<br>~~DG~~|1.8<br>~~DG~~<br>~~DG~~|A<br>~~DG~~<br>~~DG~~|
|Repetitive avalanche energya<br>~~I~~|||EAR<br>~~I~~|5.4<br>~~I~~|mJ<br>~~I~~|
|Maximum power dissipation<br>~~CO~~|TC= 25 °C<br>~~CO~~||PD<br>~~CO~~|54<br>~~CO~~|W<br>~~CO~~|
|Peak diode recovery dV/dtc<br>~~GO~~<br>~~nn~~|||dV/dt<br>~~GO~~|2.0<br>~~GO~~<br>~~es~~|V/ns<br>~~GO~~<br>~~es~~|
|Operatingjunction and storage temperature range<br>~~nn~~|||TJ, Tstg|-55 to +150<br>~~es~~|°C<br>~~es~~<br>~~**ee**~~<br>~~e~~|
|Solderingrecommendations (peak temperature)d<br>~~nn~~<br>~~ee~~|For 10 s<br>~~nn~~||~~ee~~|300<br>~~es~~<br>~~ee~~||
|Mounting torque<br>~~nn~~<br>~~ee~~|6-32 or M3 screw<br>~~nn~~||~~ee~~|10<br>~~es~~<br>~~ee~~|lbf · in<br>~~es~~<br>~~**ee**~~<br>~~e~~|
|||||1.1<br>~~ee~~|N · m<br>~~**ee**~~<br>~~e~~|



a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) b. VDD = 50 V, starting TJ = 25 °C, L = 104 mH, Rg = 25 Ω, IAS = 1.8 A (see fig. 12) c. ISD ≤ 1.8 A, dI/dt ≤ 80 A/μs, VDD ≤ 600, TJ ≤ 150 °C d. 1.6 mm from case 

S21-0868-Rev. C, 16-Aug-2021 

**1** For technical questions, contact: hvm@vishay.com 

Document Number: 91117 

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**IRFBE20** 

www.vishay.com 

Vishay Siliconix 

|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|**THERMAL RESISTANCE RATINGS**|
|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TYP.**|**MAX.**|**UNIT**|
|Maximum junction-to-ambient|RthJA|-|62|°C/W|
|Case-to-sink, flat,greased surface|RthCS|0.50|-||
|Maximum junction-to-case (drain)|RthJC|-|2.3||



|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|**SPECIFICATIONS**(TJ= 25 °C, unless otherwise noted)|||||
|---|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**||**MIN.**|**TYP.**|**MAX.**|**UNIT**|
|**Static**||||||||
|Drain-source breakdown voltage|VDS|VGS= 0 V, ID= 250 μA||800|-|-|V|
|VDStemperature coefficient|ΔVDS/TJ|Reference to 25 °C, ID= 1 mA||-|0.98|-|V/°C|
|Gate-source threshold voltage|VGS(th)|VDS= VGS, ID= 250 μA||2.0|-|4.0|V|
|Gate-source leakage|IGSS|VGS= ± 20 V||-|-|± 100|nA|
|Zero gate voltage drain current|IDSS|VDS= 800 V, VGS= 0 V||-|-|100|μA|
|||VDS= 640 V, VGS= 0 V, TJ= 125 °C||-|-|500||
|Drain-source on-state resistance|RDS(on)|VGS= 10 V|ID= 1.1 Ab|-|-|6.5|Ω|
|Forward transconductance|gfs|VDS= 100 V, ID= 1.1 Ab||0.80|-|-|S|
|**Dynamic**||||||||
|Input capacitance|Ciss|VGS= 0 V,<br>VDS= 25 V,<br>f = 1.0 MHz, see fig. 5||-|530|-|pF|
|Output capacitance|Coss|||-|150|-||
|Reverse transfer capacitance|Crss|||-|90|-||
|Totalgate charge|Qg|VGS= 10 V|ID= 1.8 A, VDS= 400 V,<br>see fig. 6 and 13b|-|-|38|nC|
|Gate-source charge|Qgs|||-|-|5.0||
|Gate-drain charge|Qgd|||-|-|21||
|Turn-on delay time|td(on)|VDD= 400 V, ID= 1.8 A,<br>Rg= 18Ω, RD= 230Ω, see fig. 10b||-|8.2|-|ns|
|Rise time|tr|||-|17|-||
|Turn-off delay time|td(off)|||-|58|-||
|Fall time|tf|||-|27|-||
|Gate input resistance|Rg|f = 1 MHz, open drain||0.6|-|4.2|Ω|
|Internal drain inductance|LD|Between lead,<br>6 mm (0.25") from<br>package and center of<br>die contact<br>D<br>S<br>G||-|4.5|-|nH|
|Internal source inductance|LS|||-|7.5|-||
|**Drain-Source Body Diode Characteristics**||||||||
|Continuous source-drain diode current|IS|MOSFET symbol<br>showing the<br>integral reverse<br>p - n junction diode<br>S<br>D<br>G||-|-|1.8|A|
|Pulsed diode forward currenta|ISM|||-|-|7.2||
|Body diode voltage|VSD|TJ= 25 °C, IS= 1.8 A, VGS= 0 Vb||-|-|1.4|V|
|Body diode reverse recovery time|trr|TJ= 25 °C, IF= 1.8 A, dI/dt = 100 A/μsb||-|380|570|ns|
|Body diode reverse recovery charge|Qrr|||-|0.94|1.4|μC|
|Forward turn-on time|ton|Intrinsic turn-on time is negligible (turn-on is dominated by LSand LD)||||||



## **Notes** 

a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11) 

b. Pulse width ≤ 300 μs; duty cycle ≤ 2 % 

S21-0868-Rev. C, 16-Aug-2021 

Document Number: 91117 

**2** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**IRFBE20** ~~ce~~ Vishay Siliconix 

## www.vishay.com 

## **TYPICAL CHARACTERISTICS** (25 °C, unless otherwise noted) 

**Fig. 1 - Typical Output Characteristics, TC = 25 °C** 

**Fig. 3 - Typical Transfer Characteristics** 

**Fig. 2 - Typical Output Characteristics, TC = 150 °C** 

**Fig. 4 - Normalized On-Resistance vs. Temperature** 

S21-0868-Rev. C, 16-Aug-2021 

Document Number: 91117 

**3** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**IRFBE20** Vishay Siliconix 

## www.vishay.com 

**Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage** 

**Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage** 

**Fig. 7 - Typical Source-Drain Diode Forward Voltage** 

**Fig. 8 - Maximum Safe Operating Area** 

S21-0868-Rev. C, 16-Aug-2021 

Document Number: 91117 

**4** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**IRFBE20** 

www.vishay.com 

## Vishay Siliconix 

**Fig. 9 - Maximum Drain Current vs. Case Temperature** 

**==> picture [148 x 219] intentionally omitted <==**

**----- Start of picture text -----**<br>
RD<br>VDS<br>VGS<br>D.U.T.<br>RG +- VDD<br>10 V<br>Pulse width ≤ 1 µs<br>Duty factor ≤ 0.1 %<br> Fig. 10a - Switching Time Test Circuit<br>VDS<br>90 %<br>r/__\ |<br>|<br>|<br>10 %VGS t itr d(on) e t $ r +YY I t l d(off) /et [\_| tf | VU<br>**----- End of picture text -----**<br>


**Fig. 10a - Switching Time Test Circuit** 

**Fig. 10b - Switching Time Waveforms** 

**Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case** 

**==> picture [456 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>VDS VDS<br>Vary tp to obtain t<br>required IAS *— p —_ VDD<br>RG D.U.T +<br>Ww IAS - [V][DD] VDS / Lo<br>> 10 V Jt / i<br>tp 0.01 Ω IAS —_—_ LHe<br> Fig. 12a - Unclamped Inductive Test Circuit  Fig. 12b - Unclamped Inductive Waveforms<br>**----- End of picture text -----**<br>


S21-0868-Rev. C, 16-Aug-2021 

Document Number: 91117 

**5** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**IRFBE20** ~~a~~ Vishay Siliconix 

www.vishay.com 

**Fig. 12c - Maximum Avalanche Energy vs. Drain Current** 

**==> picture [152 x 112] intentionally omitted <==**

**----- Start of picture text -----**<br>
QG<br>10 V<br>QGS QGD<br>VG<br>lal<br>Charge<br>**----- End of picture text -----**<br>


**Fig. 13a - Basic Gate Charge Waveform** 

**==> picture [144 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Current regulator<br>Same type as D.U.T.<br>50 kΩ<br>12 V 0.2 µF<br>0.3 µF<br>+<br>D.U.T. - VDS<br>VGS<br>3 mA<br>IG ID<br>Current sampling resistors<br>**----- End of picture text -----**<br>


**Fig. 13b - Gate Charge Test Circuit** 

S21-0868-Rev. C, 16-Aug-2021 

Document Number: 91117 

**6** For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**IRFBE20** 

Vishay Siliconix 

**==> picture [77 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
www.vishay.com<br>**----- End of picture text -----**<br>


**==> picture [170 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Peak Diode Recovery dV/dt Test Circuit<br>**----- End of picture text -----**<br>


**==> picture [283 x 463] intentionally omitted <==**

**----- Start of picture text -----**<br>
+ Circuit layout considerations<br>D.U.T.<br>•  Low stray inductance<br>•  Ground plane<br>•  Low leakage inductance<br>current transformer<br>-<br>+<br>- - +<br>Rg •  dV/dt controlled by Rg +<br>••   Driver same type as D.U.T.ISD controlled by duty factor “D” - VDD<br>•  D.U.T. - device under test<br>Driver gate drive<br>Period D = P.W.<br>P.W. Period<br>VGS = 10 V [a]<br>D.U.T. lSD waveform<br>Reverse<br>recovery Body diode forward<br>current current dI/dt<br>D.U.T. VDS waveform Diode recovery<br>dV/dt<br>VDD<br>Re-applied<br>voltage<br>Body diode forward drop<br>Inductor current<br>Ripple ≤ 5 % ISD<br>Note<br>a. VGS = 5 V for logic level devices<br>**----- End of picture text -----**<br>


**Fig. 14 - For N-Channel** 

_Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91117._ 

Document Number: 91117 

S21-0868-Rev. C, 16-Aug-2021 

**7** 

For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Legal Disclaimer Notice** Vishay 

www.vishay.com 

## **Disclaimer** 

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. 

Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein. 

Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. 

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. 

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 

_**© 2023 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED**_ 

Revision: 01-Jan-2023 

Document Number: 91000 

**1** 



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