# Dual MOSFET, N Channel, 30 V, 30 V, 3.5 A, 3.5 A, 0.06 ohm

![Product image](https://novapart.co/image/farnell:2803419/)

**URL**: https://novapart.co/products/IRF9956TRPBF/dual-mosfet-n-channel-30-v-35-a-006-ohm
**SKU**: IRF9956TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.2910
**Stock**: 10+

## Description

Transistor Polarity:Dual N Channel; Continuous Drain Current Id:3.5A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.06ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET Series |
| Qualification | - |
| Transistor Case Style | SOIC |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 2W |
| Power Dissipation P Channel | 2W |
| Drain Source Voltage Vds N Channel | 30V |
| Drain Source Voltage Vds P Channel | 30V |
| Continuous Drain Current Id N Channel | 3.5A |
| Continuous Drain Current Id P Channel | 3.5A |
| Drain Source On State Resistance N Channel | 0.06ohm |
| Drain Source On State Resistance P Channel | 0.06ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2803419/)

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G1S1 12 87 D1D1 Voss = 30V<br>S2 3 6 D2<br>G2 4 5 D2 Rpsjon) = 0.10 Ω<br>Top View<br>**----- End of picture text -----**<br>


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SO-8<br>**----- End of picture text -----**<br>


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Absolute Maximum Ratings ( T, = 25°C Unless Otherwise Noted)<br>Maximum<br>Symbol | __ 30 | Units _|<br>V<br>#20<br>Continuous Drain Current© Ta = 28°C ID po<br>Ta = 70°C 2.8 A<br>16<br>17<br>. rer Ta = 25°C 2.0<br>PD<br>ee<br>**----- End of picture text -----**<br>


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Parameter————=(Min.[Typ.[Max.<br>[Viempss[| [Units] Conditions ‘|<br>∆ ∆<br>[ Vass Ty_|Drain-to-Source[Breakdown VoltagBr e akclownTemp. CoefficientVottage ||-—|0.01930 |——| — — || VI°CV || Vas=OV,lReference t o =250™A25°C, Ip=imA<br>Ω<br>Feson [Sate OaninsoureOnsestany | gostgay| | veg=asV 21080<br>[Vas [008] 020<br>fs [Gate Threshold Votage «(1.0 —-|——| V |Vos=Ves,lo=250A<br>= [Forward ewesnnatamecnes  Transconductance =| 12|——| S |Vos=15V,lp=35A<br>ELE [ Se fesse sorrare—<br>‘lossGss [ Gaieenurce Gateto-Source Rowe Leanne [xfSe:aaaoo | nA heeaa<br>fay Reverse Leakage || —| -100<br>Sg [Teta Gate Charge | 89] 14 || t= TBA<br>[Oy ——fesetnoe Coe S12 we [swtoy<br>Rion | Gate-to-Drain (Willer) Charge [| 18[S5 |__| Vas= 10V, See Fig. 100<br>ft, _[Turn-On Delay Time «|| 62 | 12 Voo = 10V<br>Ω<br>fgon -'([RiseTime(Tumor Delay—SS=~=<“C*~‘“*~*~s*SCBYTime ———=SS«d CB lp = 1.08<br>SSCs Ω<br>fe [Css siFaliTime | 18 8.  | 28 R=Ro=10_@ 60<br>[Coss [Input Capacitance ——=S=S~«* | 190] Vas = OV<br>**----- End of picture text -----**<br>


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| Min. |Typ. [Max. [Units] [Conditions] MOSFET symbol D<br>G<br>A integral reverse<br>[082 | 1.2 | V [y= 25°C, l= 125A, Ves=OVO S |<br>**----- End of picture text -----**<br>


> ISD ≤ 2.0A, di/dt ≤ 100A/s,Vp>p ≤ Ty ≤ 150°C 

Rg=25_ Ω , Ia~g= 2.0A. 

≤ 300ys; duty cycle ≤ 2%. on FR-4 board, t ≤ 

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100                    VGS 100                    VGS<br> TOP           15V  TOP           15V<br>                   10V                    10V<br>                   7.0V                    7.0V<br>                   5.5V                    5.5V<br>                   4.5V                    4.5V<br>                   4.0V ee ee                    4.0V ee eee<br>                   3.5V                    3.5V<br> BOTTOM   3.0V eelTg OI  BOTTOM   3.0V aFPLee el<br>10 ed 10<br>_  ——Tooo 7 (0AAne<br>ey 77.4 eee ee | VKee”<br>| yy \ — | Off |  3.0V<br> 3.0V<br>Uy  20µs PULSE WIDTH p or  20µs PULSE WIDTH<br>1 YS  T   = 25°CJ A 1 V i  T   = 150°CJ<br>0.1 1 10 0.1 1 10<br>V      , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br>100 PES] 100 SSS<br>es ee<br>ee ee ee ee ee ee es es ee ee<br>ee ee ee ee ee ee 10 PP eee<br>10 T  = 25°CJ T  = 150°CJ<br>T  = 150°CJ<br>|. ee ee / T  = 25°CJ<br>1<br>Yo4 lt i | B ee s=<br> V     = 10VDS<br>1 PE Pp  20µs PULSE WIDTH RR A 0.1 eeEARHf seJ yt oee| Pe V      = 0VGS<br>3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.4 0.6 0.8 1.0 1.2 1.4<br>V     , Gate-to-Source Voltage (V)GS V     , Source-to-Drain Voltage (V)SD<br>I    , Drain-to-Source Current (A)D I   , Drain-to-Source Current (A)D<br>I     , Reverse Drain Current (A)SD<br>D<br>I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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2.0 0.12<br>ID = 2.2A<br>e e ee ee<br>1.5 T ea D 0.10 LE  V      = 4.5VGS Ls<br>ee ee ee<br>1.0 0.08<br>Ce<br>eI ep<br> V      = 10VGS<br>0.5 0.06<br>VGS = 10V<br>0.0 CT T] 0.04 Pee Pe<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 0 2 4 6 8 10 12 [A]<br>T  , Junction TemperatureJ (  C)°<br>I   , Drain Current (A)D<br>Ω<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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0.16 100<br>                    IDD<br>TOP            0.89A<br>ee 0.14 eee Nae                    1.6A<br>a ae 8 ee 80 a BOTTOM    2.0A<br>8 0.12 ee<br>0.10<br>» HEAee ee eee 60<br>0.08<br>es Se eS  I     = 3.5AD NENG<br>0.06 40<br>ed ee Xt AL [[tt]]<br>fe 0.04 ee ee NNO eee<br>é NaN<br>ee 20<br>ee a PpOIAAADOIAAAD<br>0.02<br>eR] eswo 0.00 i a A 0 FSSeeeeee ~a<br>0 3 6 9 12 15 25 50 75 100 125<br>V       , Gate-to-Source Voltage (V)GS  Starting T  , Junction Temperature (°C)JJ<br>Ω<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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100<br>                    IDD<br>TOP            0.89A<br>Nae                    1.6A<br>80 a BOTTOM    2.0A<br>60 NENG<br>40<br>Xt AL [[tt]]<br>ee NNO eee<br>NaN<br>20<br>PpOIAAADOIAAAD<br>~a<br>FSSeeeeee<br>0<br>25 50 75 100 125 150<br>Starting T  , Junction Temperature (°C)JJ<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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350 20<br>V      = 0V,         f = 1MHzGS ID = 1.8A<br>300 C      = C     + C     ,   C     SHORTEDC      = Ciss         gs         gd         dsrss         gd VDS = 10V<br>= C      = C     + Coss        ds         gd 16 P T T<br>NS ee<br>250<br>Ciss<br>200 PINE C  S oss T 12 ae<br>pT Wa<br>NS PT tT TE ET [TAL]<br>150 KON 8 PTT PT rPrTM<br>SEE TE<br>100 pS Crss Nall rT YT TTY<br>ep es A<br>4<br>50<br>aPOSS) eel = Eest<br>0 el A 0 0 Yi 2 ti [tit] 4 6 i tt 8 10<br>1 10 100<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 9. Typical Capacitance Vs. Fig 10. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>Raa 0.500.20 om a ee<br> 10<br>0.10<br>0.05<br>enna er een —NN<br>ff<br>0.02 TI PDM |<br> 1 0.01<br>t1<br>SINGLE PULSE t2<br>an (THERMAL RESPONSE) ee<br>Notes:<br>ey ee<br>1. Duty factor D = t   / t1 2<br>a ayy IE 2. Peak TJ= P DM x  ZthJA + TA<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


## **SO-8 Package Outline** 

Dimensions are shown in millimeters (inches) 

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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A . 5 oe A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>7 —a— b .013 .020 0.33 0.51<br>8 7 6 5 c .0075 .0098 0.19 0.25<br>fa 6 ba H es D .189 .1968 4.80 5.00<br>E<br>0.25 [.010]  A E .1497 .1574 3.80 4.00<br>= 1 2 3 4 e .050  BASIC 1.27  BASIC<br>—— a<br>e1 .025  BASIC 0.635  BASIC<br>T o r r  | po H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>[TH J L .016 .050 0.40 1.27<br>y  0°  8°  0°  8°<br>7 e1 K x 45°<br>A<br>C ue<br>y<br>0.10 [.004]<br>e 8X b em A1 o ( 8X L fE EEn 8X c = E=t4<br>[eo] 0.25 [.010]  I C TT A B I 7<br>FOOTPRINT<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].<br>6.46 [.255] ; [ood] aan<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>0000S<br>3X 1.27 [.050] ee<br>8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## NOTES: 

1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 

2.  CONTROLLING DIMENSION: MILLIMETER 

3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 

4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 

- 5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 

- 7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 

## **SO-8 Part Marking** 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

XXXX INTERNATIONAL F7101 RECTIFIER LOGO ~~m~~ e 

## DATE CODE (YWW) 

P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) Y =  LAST DIGIT OF THE YEAR WW =  WEEK A =  ASSEMBLY SITE CODE 

LOT CODE 

PART NUMBER 

## **SO-8 Tape and Reel** 

Dimensions are shown in millimeters (inches) 

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TERMINAL NUMBER 1<br>oO Oo 6<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTION<br>|  330.00<br>(12.992)<br>  MAX.<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 09/04 



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- [Supplier page](https://es.farnell.com/infineon/irf9956trpbf/mosfet-dual-n-ch-30v-3-5a-soic/dp/2803419)
---

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