# Power MOSFET, N Channel, 30 V, 7 A, 0.024 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2777384/)

**URL**: https://novapart.co/products/IRF9410TRPBF/power-mosfet-n-channel-30-v-7-a-0024-ohm-soic
**SKU**: IRF9410TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5070
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.024ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 7A |
| Drain Source On State Resistance | 0.024ohm |
| Gate Source Threshold Voltage Max | 1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2777384/)

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A<br>A<br>S OT 1 8 ao D<br>2 7<br>S | ; D Voss = 30V<br>S =_ 3 ar) ia 6 = D<br>G acy 4 | 5 Ho D Rpgvon) = 0.030 Ω<br>Top View<br>**----- End of picture text -----**<br>


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SO-8<br>**----- End of picture text -----**<br>


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Absolute Maximum Ratings ( T, = 25°C Unless Otherwise Noted)<br>Symbol_| Maximum<br>30 | _Units |<br>V<br>#20<br>Continuous Drain Current© Ta = 28°C ID pO<br>Ta = 70°C 5.8 A<br>37<br>28<br>; oo. Ta = 25°C 25<br>PD<br>ee<br>Single Pulse Avalanche Energy @<br>Thermal Resistance Ratings<br>Symbol_| Limit<br>| Units<br>θ<br>**----- End of picture text -----**<br>


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Vienoss [Parameter ‘Min.|Typ.|Max.[Units] Conditions ———_—_—<br>| Drain-to-Source Breakdown Voltage | 90 |—-|——| V | Ves=OV.lo=250uA<br>∆ ∆<br>Rpscon) Static Drain-to-Source On-Resistance || ———= |0.032/0.040|0.024)0.030| Ω<br>Vest ceomomonee ae —<br>dis____| | Gate Threshold Votage «| «1.0 [—-|—| V | Vos=Ves,lo=250HA =<br>Forward Transconductance «| —— | 14 |——| S| [Vos=15V,lp=70A——*]<br>tse , [ao]<br>[Gate-to-Source<br>Reverse Leakage | —— | — | 100,<br>iss [SSe|Desnt e souctaiagsererewetecin e —[—FT1—oePas |m Hipsav vas ST SSS<br>| Gate-to-Source Charge =| —— | 2.4 [ 3.6 | nc | Vos = 18V<br>| GueteDran Cwiter) arse — [4974] | veo 10¥.  see ig 100<br>tayon |Turn-On DelayTime | —~ | 7.3 | 15 | Vo = 25V<br>| RiseTime | | 83 | 17 | Ip = 1.08<br>Ω,<br>Ω<br>ti raltime<br>ee Ves = OV<br>— SSSC~wS CSC *‘d tC AT «8 Ro=25 ©<br>Coss | Output Capacitance ——=—=S~dC*~C~C~*diC pF | Vos = 25V<br>Source-Drain Ratings and Characteristics<br>[Parameter<br>D<br>Is Continuous Source Current = Min. [Typ [Max. [Units[ MOSFET ‘Conditions symbol<br>G<br>Io Pulsed Source Current A integral reverse<br>[Diode Forward Voltage —~—=SS=d| [0.78 | 1.0 | V [T= 25°C, ls=20A Ves=OVO | S<br>____freverse Reeoven Time f — Fao [00 [ng [115 280 2208<br>[Reverse RecoveryCharge (| —— | 63 | 180 | nC_|dilct = 100A/us @<br>Notes:<br>ISD ≤ ≤  ≤<br>**----- End of picture text -----**<br>


≤ 

≤ ≤ 

Rg=25 Ω , la~g= 4.6A. 

≤ 

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100 100<br>                   VGS                    VGS<br> TOP           15V  TOP           15V<br>                   10V                    10V<br>                   7.0V                    7.0V<br>                   5.5V ee eee                    5.5V ee eee<br>                   4.5V                   4.0V Ps ee eee                    4.5V                   4.0V Ps<br>                   3.5V                    3.5V<br> BOTTOM   3.0V fi  BOTTOM   3.0V ee eee<br>yy eam Snbe.77a<br>10 10<br>mu //s # aaanee Pf i 7/7 faeS> a<br> 3.0V<br>OT 77 K S<br>YP ff Uf§ ToT<br> 3.0V<br>A  20µs PULSE WIDTH Uff}  20µs PULSE WIDTH<br>1 P e  T   = 25°CJ a A 1 40h  T   = 150°CJ A<br>0.1 1 10 0.1 1 10<br>V      , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br>100 === eS ea ea 100 SSaa<br>a a a eT<br>}——}PT |——F— T  = 25°CJ  }+ ee a ><br>10<br>AT T  = 150°CJ aD T  = 150°CJ 2en<br>10 e ee<br>T  = 25°CJ<br>7 ee e S 2S<br>ED a7 4 Geeee ee eeeee eeeee<br>1<br>Off+} fF —pffjfef||__|<br>fo aa<br> V     = 10VDS<br>1 Pte  20µs PULSE WIDTH A 0.1 VA V      = 0VGS<br>3.0 3.5 4.0 4.5 5.0 5.5 0.4 0.6 0.8 1.0 1.2<br>V     , Gate-to-Source Voltage (V)GS V     , Source-to-Drain Voltage (V)SD<br>I    , Drain-to-Source Current (A)D I   , Drain-to-Source Current (A)D<br>I     , Reverse Drain Current (A)SD<br>D<br>I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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2.0 ID = 7.0A 0.05<br>1.5<br>COTE Saenueepan<br>EEE err 0.04 A<br>1.0 +]  V      = 4.5VGS<br>CEPT = |pee<br>EF [ETL]<br>0.03<br>een<br>0.5<br> V      = 10VGS<br>VGS = 10V<br>0.0 ANTNATOSUGHNONUGHIGIEe e 0.02 pptTTT<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 0 5 10 15 20 25<br>T  , Junction TemperatureJ (  C)° I   , Drain Current (A)D<br>Fig 5. Normalized On-Resistance Fig 6. Typical On-Resistance Vs. Drain<br>Vs. Temperature Current<br>S 0.14 Pt 200                     ITOP            2.1AD<br>0.12                    3.7A<br>160 BOTTOM    4.6A<br>£ re ee eee eee<br>0.10<br>¢ [Pp py Na Gee<br>Sf 0.08 120 OA<br>g5 PT) of | PON tf<br>0.06<br>80<br>Se 6 0.04 ~u} pp ee NENCaNeeeeeee<br>3 \ I    = 7.0AD NQ<br>a 40 PNA Nf<br>2 0.02 re ee ee eee Pk<br>es 0.00 es ee A 0 po SS<br>3 6 9 12 15 25 50 75 100 125 150<br>V      -Gate-to-Source Voltage (V)GS Starting T  , Junction Temperature (°C)J<br>)(Ω<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance DS(on)<br>R           ,  Drain-to-Source On Resistance<br>Ω<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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1000 20<br>V      = 0V,         f = 1MHzGS ID = 2.0A<br>C      = C     + C     ,   C     SHORTEDC      = Ciss         gs         gd         dsrss         gd VDS = 15V<br>800 L | | C      = C     + Coss        ds         gd 16 eee<br>ING See |<br>Ciss<br>SNA P t tt tt ty pt<br>600 PN ET 12 itt<br>Coss<br>400 ip]aS SEEI]| 8 piPiPi tetT TYE t T TyetYE ttTYEtytt<br>200 po| Crss foe 4 Anepif Yi tt | tt<br>0 Pt ET A 0 AEE EEEEEE<br>1 10 100 0 6 12 18 24 30<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 9. Typical Capacitance Vs. Fig 10. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>0.50<br>e e a eeealittle<br>Ee att<br> 10 0.20<br>0.10<br>0.05<br>Bene ad<br>Sa 0.02 sei eens => eet bal ea PDM<br> 1<br>0.01 t1<br>a | t2<br>Notes:<br>SINGLE PULSE<br>1. Duty factor D = t   / t1 2<br>(THERMAL RESPONSE)<br>0.1 Taiit am  ECMLUI EP 2. Peak T J= P DM x  Z thJA + TA<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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## **SO-8 Package Outline** 

Dimensions are shown in millimeters (inches) 

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INCHES MILLIMETERS<br>DIM ee eee<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>8 7 6 5 c .0075 .0098 0.19 0.25<br>7 6 lo an H |so D | .189 | .1968 fT 4.80 ft 5.00<br>E<br>0.25 [.010]  A E .1497 .1574 3.80 4.00<br>1 2 3 4<br>e .050  BASIC 1.27  BASIC<br>_ [gare to<br>e1 .025  BASIC 0.635  BASIC<br>HYjHEs 212 tta<br>H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X A e l bk ST L .016 .050 0.40 1.27<br>A y  0°  8°  0°  8°<br>: e1 K x 45°<br>A<br>C<br>y<br>0.10 [.004]<br>dhe 8X b v A1 o X S L 8X L 8X c ft<br>fe} 0.25 [.010]  C TTI A B 7<br>FOOTPRINT<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER<br>ane<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>roar<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. aii i<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>00003<br>3X 1.27 [.050] a oe<br>8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## NOTES: 

1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 

2.  CONTROLLING DIMENSION: MILLIMETER 

3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 

4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 

- 5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 

- 7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 

## **SO-8 Part Marking** 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

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XXXX<br>INTERNATIONAL F7101<br>RECTIFIER<br>LOGO<br>m e<br>**----- End of picture text -----**<br>


- DATE CODE (YWW) 

- P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) 

- Y =  LAST DIGIT OF THE YEAR 

- WW =  WEEK A =  ASSEMBLY SITE CODE LOT CODE 

PART NUMBER 

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## **SO-8 Tape and Reel** 

Dimensions are shown in millimeters (inches) 

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TERMINAL NUMBER 1<br>oo 6 © a)<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) ed FEED DIRECTION a<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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 330.00<br>(12.992)<br>  MAX.<br>SY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 09/04 

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- [Supplier page](https://es.farnell.com/en-ES/infineon/irf9410trpbf/mosfet-n-ch-40v-7a-soic/dp/2777384)
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