# Power MOSFET, P Channel, 30 V, 9.2 A, 0.0133 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2725929RL/)

**URL**: https://novapart.co/products/IRF9393TRPBF/power-mosfet-p-channel-30-v-92-a-00133-ohm-soic
**SKU**: IRF9393TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1940
**Stock**: 10+
**Lead Time**: 119 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-9.2A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.0133ohm; Rds(on) Test Voltage Vgs:-20V; Threshold Voltage Vgs:-1.8

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 20V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 9.2A |
| Drain Source On State Resistance | 0.0133ohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725929RL/)

## IRF9393PbF 

HEXFET Power MOSFET 

**==> picture [326 x 96] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDS -30 V<br>VGS max  ±25 V S 1 8 D<br>R S 2 7 D<br>DS(on) max  19.4 m Ω<br>(@VGS = -10V) S 3 6 D<br>ID  -9.2 A G 4 5 D<br>(@TA = 25°C)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
SO-8<br>**----- End of picture text -----**<br>


## **Applications** 

- Adaptor Input Switch for Notebook PC 

## **Features and Benefits** 

## **Features** 

25V VGS max - Industry Standard SO8 Package RoHS Compliant Containing no Lead, no Bromide and no Halogen 

## **Resulting Benefits** 

Direct Drive at High VGS Multi-Vendor Compatibility Environmentally Friendlier 

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|||||
|---|---|---|---|
|Orderable part number|Package Type|Standard Pack|Note|
|Form|Quantity|
|IRF9393PbF|SO8|Tube/Bulk|95|
|IRF9393TRPbF|SO8|Tape and Reel|4000|

**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

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**----- Start of picture text -----**<br>
||||||||
|---|---|---|---|---|---|---|
|Parameter|Max.|Units|
|VDS|Drain-to-Source Voltage|-30|
|V|
|VGS|Gate-to-Source Voltage|± 25|
|=|
|ID @ TA = 25°C|LO|Continuous Drain Current, VGS @ 10V|-9.2|
|ID @ TA = 70°C|Continuous Drain Current, VGS @ 10V|-7.3|A|
|IDM|a|Pulsed Drain Current|-75|oe|
|PD @TA = 25°C|a|Power Dissipation|2.5|
|W|
|PD @TA = 70°C|Power Dissipation|1.6|
|Linear Derating Factor|0.02|W/°C|
|TT|OO|Nn|-'9”W™"-||_||]|LT|
|TJ|Operating Junction and|-55  to + 150|°C|
|TSTG|Storage Temperature Range|
|ee ee|ee|

**----- End of picture text -----**<br>


Notes through are on page 2 www.irf.com 

1 

11/3/10 

## ���������� 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|-30|–––|–––|V|VGS= 0V, ID= -250μA||
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient|–––|0.019|–––|V/°C|Reference to 25°C, ID= -1mA||
|RDS(on)|Static Drain-to-Source On-Resistance|–––|13.3|–––|mΩ|VGS= -20V, ID= -9.2A�||
|||–––|15.6|19.4||VGS= -10V, ID= -9.2A�||
|||–––|25.6|32.5||VGS= -4.5V, ID= -7.5A�||
|VGS(th)|Gate Threshold Voltage|-1.3|-1.8|-2.4|V|VDS= VGS, ID= -25μA||
|ΔVGS(th)|Gate Threshold Voltage Coefficient|–––|-5.7|–––|mV/°C|||
|IDSS|Drain-to-Source Leakage Current|–––|–––|-1.0|μA|VDS= -24V, VGS= 0V||
|||–––|–––|-150||VDS= -24V, VGS= 0V, TJ= 125°C||
|IGSS|Gate-to-Source Forward Leakage|–––|–––|-10|μA|VGS= -25V||
||Gate-to-Source Reverse Leakage|–––|–––|10||VGS= 25V||
|gfs|Forward Transconductance|13|–––|–––|S|VDS= -10V, ID= -7.5A||
|Qg|Total Gate Charge�|–––|14|–––|nC|VDS= -15V,VGS= -4.5V,ID= - 7.5A||
|Qg|Total Gate Charge�|–––|25|38|nC|ID= -7.5A<br>VDS= -15V<br>VGS= -10V||
|Qgs|Gate-to-Source Charge�|–––|3.5|–––||||
|Qgd|Gate-to-Drain Charge�|–––|6.4|–––||||
|RG|Gate Resistance�|–––|15|–––|Ω|||
|td(on)|Turn-On DelayTime|–––|16|–––|ns|See Figs. 20a &20b<br>RG= 6.8Ω<br>VDD= -15V, VGS= -4.5V�<br>ID= -1.0A||
|tr|Rise Time|–––|44|–––||||
|td(off)|Turn-Off DelayTime|–––|55|–––||||
|tf|Fall Time|–––|49|–––||||
|Ciss|Input Capacitance|–––|1110|–––|pF|ƒ= 1.0MHz<br>VGS= 0V<br>VDS= -25V||
|Coss|Output Capacitance|–––|230|–––||||
|Crss|Reverse Transfer Capacitance|–––|160|–––||||
|**Avalanche Characteristics**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|EAS|Single Pulse Avalanche Energy �||–––|||100|mJ|
|IAR|Avalanche Current�||–––|||-7.5|A|
|**Diode Characteristics**||||||||
||**Parameter**|**Min.**|**Typ.**|**Max. **|**Units**|**Conditions**||
|IS|Continuous Source Current<br>(BodyDiode)|–––|–––|-2.5|A|G<br>D<br>S<br>showing  the<br>integral reverse<br>p-njunction diode.<br>MOSFET symbol||
|ISM|Pulsed Source Current<br>(BodyDiode)��|–––|–––|-75||||
|VSD|Diode Forward Voltage|–––|–––|-1.2|V|TJ= 25°C, IS= -2.5A, VGS= 0V�||
|trr|Reverse RecoveryTime|–––|24|36|ns|TJ= 25°C, IF= -2.5A, VDD= -24V<br>di/dt = 100A/μs�||
|Qrr|Reverse Recovery Charge|–––|15|23|nC|||
|**Thermal Resistance**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|RθJL|Junction-to-Drain Lead�||–––|||20|°C/W|
|RθJA|Junction-to-Ambient�||–––|||50||



## **������** 

- Repetitive rating;  pulse width limited by max. junction temperature. 

- Starting TJ = 25°C, L = 3.5mH, RG = 25 Ω , IAS = -7.5A. 

- Pulse width ≤ 400μs; duty cycle ≤ 2%. 

- When mounted on 1 inch square  copper board. 

- R θ is measured at TJ of approximately 90°C. 

- For DESIGN AID ONLY, not subject to production testing. 

www.irf.com 

2 

## ���������� 

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**----- Start of picture text -----**<br>
100<br>VGS<br>TOP           -10V<br>-5.0V<br>-4.5V<br>-4.0V<br>10 -3.5V<br>-3.0V<br>-2.8V<br>BOTTOM -2.5V<br>1<br>0.1 -2.5V<br>≤ 60μs PULSE WIDTH<br>Tj = 25°C<br>0.01<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

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**----- Start of picture text -----**<br>
100<br>10<br>T = 150°C<br>J<br>1<br>TJ = 25°C<br>0.1<br>VDS = -15V<br>≤  60μs PULSE WIDTH<br>0.01<br>1.0 2.0 3.0 4.0 5.0<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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**----- Start of picture text -----**<br>
10000<br>VGS   = 0V,       f = 1 MHZ<br>Ciss   = Cgs + Cgd,  Cds SHORTED<br>C  = C<br>rss   gd<br>Coss  = Cds + Cgd<br>Ciss<br>1000<br>C<br>oss<br>C<br>rss<br>100<br>1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

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**----- Start of picture text -----**<br>
100<br>VGS<br>TOP           -10V<br>-5.0V<br>-4.5V<br>-4.0V<br>-3.5V<br>-3.0V<br>10 -2.8V<br>BOTTOM -2.5V<br>-2.5V<br>1<br>≤ 60μs PULSE WIDTH<br>Tj = 150°C<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.6<br>ID = -9.2A<br>VGS = -10V<br>1.4<br>1.2<br>1.0<br>0.8<br>0.6<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>Fig 4.   Normalized On-Resistance vs. Temperature<br>14<br>ID= -7.5A<br>12 VDS= -24V<br>VDS= -15V<br>10 VDS= -6.0V<br>8<br>6<br>4<br>2<br>0<br>0 8 16 24 32<br> QG  Total Gate Charge (nC)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

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3 

## ���������� 

**==> picture [219 x 200] intentionally omitted <==**

**----- Start of picture text -----**<br>
100<br>T = 150°C<br>J<br>10<br>T = 25°C<br>J<br>1<br>VGS = 0V<br>0.1<br>0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1<br>-VSD, Source-to-Drain Voltage (V)<br>-ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**==> picture [210 x 429] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100<br>1msec<br>10<br>10msec<br>1<br>TA = 25°C<br>Tj = 150°C<br>Single Pulse DC<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 8.   Maximum Safe Operating Area<br>2.5<br>2.0 I D  = -25μA<br>1.5<br>1.0<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>-ID,  Drain-to-Source Current (A)<br>-VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**==> picture [447 x 438] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>8<br>2.0 I D  = -25μA<br>6<br>4<br>1.5<br>2<br>0 1.0<br>25 50 75 100 125 150 -75 -50 -25 0 25 50 75 100 125<br> TA , Ambient Temperature (°C) TJ , Temperature ( °C )<br>Fig 9.   Maximum Drain Current vs. Fig 10.   Threshold Voltage vs. Temperature<br>Ambient Temperature<br>100<br>D = 0.50<br>10 0.20<br>0.10<br>0.05<br>1 0.02<br>0.01<br>0.1<br>0.01 Notes:<br>SINGLE PULSE<br>1. Duty Factor D = t1/t2<br>( THERMAL RESPONSE )<br>2. Peak Tj = P dm x Zthja + T A<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>-ID,  Drain Current (A)<br>-VGS(th), Gate threshold Voltage (V)<br>Thermal Response ( Z thJA ) °C/W<br>**----- End of picture text -----**<br>


**Fig 10.** Threshold Voltage vs. Temperature 

**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

www.irf.com 

4 

**==> picture [205 x 206] intentionally omitted <==**

**----- Start of picture text -----**<br>
60<br>ID = -9.4A<br>50<br>40<br>30 .<br>TJ = 125°C<br>S<br>20<br>SEPT<br>TJ = 25°C<br>10 Ae EE<br>2 4 6 8 10 12 14 16 18 20<br>-VGS, Gate -to -Source Voltage  (V)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance vs. Gate Voltage 

**==> picture [207 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
80<br>70<br>60<br>50 V GS  = -4.5V<br>40 EEPanee<br>30<br>a<br>20 V GS  = -10V<br>—rtoe| |<br>10<br>0 10 20 30 40 50 60 70<br>-ID, Drain Current (A)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

**==> picture [210 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
420<br>ID<br>360 TOP         -2.1A<br>-3.0A<br>BOTTOM -7.5A<br>300<br>240 GAN REEEEE<br>180 NA<br>PNA EE<br>120 Saw<br>60<br>HN EARN EL<br>E i e ee e<br>0<br>25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 14.** Maximum Avalanche Energy vs. Drain Current 

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**----- Start of picture text -----**<br>
1000<br>800<br>600 \<br>400 i |<br>200<br>\WT<br>0 limTt<br>1E-5 1E-4 1E-3 1E-2 1E-1 1E+0<br>Time (sec)<br>Single Pulse Power (W)<br>**----- End of picture text -----**<br>


**Fig 16** Typical Power vs. Time 

**==> picture [186 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
+<br>)    •<br>r— ©) - Circuit  •   •   GroundLow LayoutLeakage lane ConsiderationsInductance<br>+<br>® - Current Transformer - +<br>a = ®<br>00<br>•<br>•   Driver same type as D.U.T. +<br>Re ( a8 •   di/dt controlled by Rg Vop -<br>•<br>**----- End of picture text -----**<br>


**==> picture [224 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
Driver Gate Drive<br>P.W.<br>a P.W. Period | D = —_— Period<br>VGS=10V<br>| f<br>|<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current Current =<br>r di/dt /<br>©) D.U.T. VDS Waveform Diode Recoverydv/dt \ ><br>VDD<br>Re-Applied<br>Voltage Body Diode  Forward Drop<br>ee<br>es ee<br>Ripple  ≤ 5% ISD<br>® t ¥<br>**----- End of picture text -----**<br>


or P-Channel HEXFET Power MOSFETs 

**Fig 17.** 

www.irf.com 

5 

**==> picture [451 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>L<br>VCC<br>DUT<br>0<br>SS Vgs(th)<br>201 K<br>n a l<br>Qgodr Qgd Qgs2 Qgs1<br>**----- End of picture text -----**<br>


**Fig 18a.** Gate Charge Test Circuit 

**Fig 18b.** Gate Charge Waveform 

**==> picture [188 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>VDS<br>RG D.U.T V<br>L. DD<br>IAS<br>DRIVER<br>eo tp 0.01 Ω<br>15V<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
IAS<br>ST]<br>a<br><— tp<br>V(BR)DSS<br>**----- End of picture text -----**<br>


**Fig 19a.** Unclamped Inductive Test Circuit 

**Fig 19b.** Unclamped Inductive Waveforms 

**==> picture [127 x 55] intentionally omitted <==**

**----- Start of picture text -----**<br>
-<br>+<br>≤ 1<br>≤ 0.1 %<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
td(on) tr td(off) tf<br>VGS<br>10% : a > -\/<br>90% X<br>VDS<br>**----- End of picture text -----**<br>


**Fig 20a.** Switching Time Test Circuit 

**Fig 20b.** Switching Time Waveforms 

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6 

���������� 

## **SO-8 Package Outline** (Mosfet & Fetky) 

Dimensions are shown in milimeters (inches) 

**==> picture [224 x 256] intentionally omitted <==**

**----- Start of picture text -----**<br>
D B<br>A 5<br>8 7 6 5<br>6<br>H<br>E<br>0.25 [.010]  A<br>1 2 3 4<br>6X e<br>e1<br>A<br>C<br>0.10 [.004]<br>8X b A1<br>0.25 [.010]  C A B<br>**----- End of picture text -----**<br>


## NOTES: 

1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 

2.  CONTROLLING DIMENSION: MILLIMETER 

3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 

4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 

- 5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 

- 6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 

- 7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 

|||||||||||||||||INCHES|INCHES|INCHES|INCHES|INCHES|INCHES||||MILLIMETERS|MILLIMETERS|MILLIMETERS|MILLIMETERS||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||DIM|||MIN||||||MAX||||MIN|||MAX||
|||||||||||||||A|.0532||||||.0688||||1.35|||1.75||
|||||||||||||||A1|.0040||||||.0098||||0.10|||0.25||
|||||||||||||||b|.013||||||.020||||0.33|||0.51||
|||||||||||||||D<br>E<br>e<br>c|.189<br>.1497<br>.050  BASIC<br>.1968<br>.1574<br>.0075<br>.0098||||||||||4.80<br>3.80<br>1.27  BASIC<br>5.00<br>4.00<br>0.19<br>0.25|||||
||||||||||||||e 1||.025|||BASIC|||||||0.635  BASIC|||||
|||||||||||||||H|.2284||||||.2440||||5.80|||6.20||
|||||||||||||||K|.0099||||||.0196||||0.25|||0.50||
|||||||||||||||L|.016||||||.050||||0.40|||1.27||
|||||||||||||||y|0°||||||8°|||||0°||8°||
|||||||||||||K x 45°||||||||||||||||||
|y||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
||||||||||8X|||L||||||8X|||c|||||||||
|||||||||||7||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
||||||||||||||||||FOOTPRINT|||||||||||||
||||||||||||||||||||||8X 0.72 [.028]|||||||||
|||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||||||6.46 [.255]||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||
|||3X|1.27 [.050]|||||||||||||||||||||||8X 1.78 [.070]||||



## SO-8 Part Marking Information 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

## DATE CODE (YWW) 

P =  DISGNATES LEAD - FREE PRODUCT (OPTIONAL) Y =  LAST DIGIT OF THE YEAR WW =  WEEK XXXX A =  ASSEMBLY SITE CODE INTERNATIONAL F7101 RECTIFIER LOT CODE LOGO PART NUMBER 

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

www.irf.com 

7 

SO-8 Tape and Reel (Dimensions are shown in milimeters (inches)) 

**==> picture [185 x 120] intentionally omitted <==**

**----- Start of picture text -----**<br>
TERMINAL NUMBER 1<br>oO Oo 6<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTION<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

**==> picture [164 x 73] intentionally omitted <==**

**----- Start of picture text -----**<br>
 330.00<br>(12.992)<br>  MAX.<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

## **Qualification Information[†]** 

|**Qualification Information[†]**|||
|---|---|---|
|Qualification level|Consumer††||
||(per JEDEC JESD47F†††guidelines)||
|Moisture Sensitivity Level|SO-8|MSL1<br>(per JEDEC J-STD-020D†††)|
|RoHS Compliant|Yes||



- A http://www.irf.com/product-info/reliability 

- ~~t~~ o 

Qualification standards can be found at International Rectifier’s web site 

Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ 

Applicable version of JEDEC standard at the time of product release. 

Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 11/2010 

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8 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRF9393TRPBF/power-mosfet-p-channel-30-v-92-a-00133-ohm-soic)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irf9393trpbf/mosfet-p-ch-30v-9-2a-soic/dp/2725929RL)
---

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