# Dual MOSFET, Complementary N and P Channel, 30 V, 30 V, 6.8 A, 6.8 A, 0.022 ohm

![Product image](https://novapart.co/image/farnell:4319006/)

**URL**: https://novapart.co/products/IRF9389TRPBF/dual-mosfet-complementary-n-and-p-channel-30-v-68
**SKU**: IRF9389TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.1220
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | Complementary N and P Channel |
| Product Range | HEXFET Series |
| Qualification | - |
| Transistor Case Style | SOIC |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 2W |
| Power Dissipation P Channel | 2W |
| Drain Source Voltage Vds N Channel | 30V |
| Drain Source Voltage Vds P Channel | 30V |
| Continuous Drain Current Id N Channel | 6.8A |
| Continuous Drain Current Id P Channel | 6.8A |
| Drain Source On State Resistance N Channel | 0.022ohm |
| Drain Source On State Resistance P Channel | 0.022ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4319006/)

||**N-CH**|**P-CH**||
|---|---|---|---|
|**VDS**|**30**|**-30**|**V**|
|**RDS(on) max**|**27**|**64**|**m**|
|**Qg (typical)**|**6.8**|**8.1**|**nC**|
|**g(yp)**<br>**ID **<br>(@TA= 25°C)|**6.8**|**-4.6**|**A**|



HEXFET[®] Power MOSFET 

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N-CHANNEL MOSFET<br>S1 1 8 D1<br>G1 2 7 D1<br>a Ca t  re<br>S2 3 6 D2<br>G2 at 4 5 D2<br>P-CHANNEL MOSFET<br>Top View SO-8<br>**----- End of picture text -----**<br>


## **Applications** 

## **Features** 

## **Benefits** 

|High and low-side MOSFETs in a singlepackage||Increasedpower density|
|---|---|---|
|High-side P-Channel MOSFET||Easier drive circuitry|
|Industry-standardpinout|results in|Multi-vendor compatibility|
|Compatible with existingsurface mount techniques||Easier manufacturing|
|RoHS compliant containingno Lead,no Bromide and no Halogen||Environmentallyfriendlier|
|MSL1,Consumerqualification||Increased reliability|



|**Base Part Number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Orderable part number**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRF9389PbF|SO-8|Tube/Bulk|95|IRF9389PbF|
|||Tape and Reel|4000|IRF9389TRPbF|



**Absolute Maximum Ratings** 

||**Parameter**|**Max.**|**Max.**|**Units**|
|---|---|---|---|---|
|||**N-Channel**|**P-Channel**<br>~~a~~|~~a~~|
|VGS|Gate-to-Source Voltage<br>~~a~~|±20<br>~~a~~|±20<br>~~a~~|V<br>~~a~~|
|ID@ TA= 25°C|Continuous Drain Current,VGS@ 10V<br>~~a~~<br>~~ee~~|6.8<br>~~a~~<br>~~ee~~|-4.6<br>~~a~~<br>~~ee~~|A<br>~~a~~|
|ID @TA= 70°C<br>~~a~~|ContinuousDrainCurrent,VGS @10V<br>~~ee~~<br>~~a~~|5.4<br>~~ee~~|-3.7<br>~~ee~~||
|IDM<br>~~a~~|PulsedDrainCurrent<br>~~a~~|34|-23||
|PD @TA= 25°C<br>~~a~~|Power Dissipation<br>~~a~~<br>~~es~~|2.0<br>~~es~~||W|
|PD@TA= 70°C|Power Dissipation<br>~~ee~~|1.3<br>~~ee~~|||
||Linear Derating Factor<br>~~ee~~<br>~~ee ee~~|0.016<br>~~ee~~<br>~~ee~~||W/°C<br>~~ee~~|
|TJ<br>TSTG|Linear Derating Factor<br>Operating Junction and<br>Storage Temperature Range<br>~~ee ee~~|-55  to + 150<br>~~ee~~||°C<br>~~ee~~|



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**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**||**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|N-Ch|30|–––|–––|V|VGS =0V, ID =250μA|
|||P-Ch|-30|–––|–––||VGS =0V, ID = -250μA|
|VDSS/TJ|Breakdown Voltage Temp. Coefficient|N-Ch|–––|0.03|–––|V/°C|Reference to 25°C, ID =1mA|
|||P-Ch|–––|0.02|–––||Reference to 25°C, ID = -1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|N-Ch|–––|22|27|m|VGS =10V, ID =6.8A�|
||||–––|33|40||VGS =4.5V, ID =5.4A�|
|||P-Ch|–––|51|64|m|VGS = -10V, ID = -4.6A�|
||||–––|82|103||VGS = -4.5V, ID = -3.7A�|
|VGS(th)|Gate Threshold Voltage|N-Ch|1.3|1.8|2.3|V|VDS= VGS,ID= 10μA|
|||P-Ch|-1.3|-1.8|-2.3||VDS= VGS,ID= -10μA|
|IDSS|Drain-to-Source Leakage Current|N-Ch|–––|–––|1.0|μA|VDS =24V, VGS =0V|
|||P-Ch|–––|–––|-1.0||VDS = -24V, VGS =0V|
|||N-Ch|–––|–––|150||VDS =24V, VGS =0V, TJ =125°C|
|||P-Ch|–––|–––|-150||VDS = -24V, VGS =0V, TJ =125°C|
|IGSS|Gate-to-Source Forward Leakage|N-Ch|–––|–––|100|nA|VGS =20V|
|||P-Ch|–––|–––|-100||VGS = -20V|
||Gate-to-Source Reverse Leakage|N-Ch|–––|–––|-100||VGS = -20V|
|||P-Ch|–––|–––|100||VGS =20V|
|gfs|Forward Transconductance|N-Ch|8.2|–––|–––|S|VDS =15V, ID =5.4A|
|||P-Ch|4.1|–––|–––||VDS = -15V, ID = -3.7A|
|Qg|Total Gate Charge|N-Ch|–––|6.8|14|nC|VGS= -10V, VDS= -15V, ID= -4.6A<br>N-Channel<br>P-Channel<br>VGS= 10V, VDS= 15V, ID= 6.8A|
|||P-Ch|–––|8.1|16|||
|Qgs|Gate-to-Source Charge|N-Ch|–––|1.4|–––|||
|||P-Ch|–––|1.3|–––|||
|Qgd|Gate-to-Drain ("Miller") Charge|N-Ch|–––|0.98|–––|||
|||P-Ch|–––|2.1|–––|||
|RG|Gate Resistance|N-Ch|–––|2.2|4.4|||
|||P-Ch|–––|9.4|19|||
|td(on)|Turn-On Delay Time|N-Ch|–––|5.1|–––|ns|N-Channel<br>ID= 1.0A, RG= 6.2<br>VDD= 15V, VGS= 4.5V�<br>VDD= -15V, VGS= -4.5V�<br>ID= -1.0A, RG= 6.8<br>P-Channel|
|||P-Ch|–––|8.0|–––|||
|tr|Rise Time|N-Ch|–––|4.8|–––|||
|||P-Ch|–––|14|–––|||
|td(off)|Turn-Off Delay Time|N-Ch|–––|4.9|–––|||
|||P-Ch|–––|17|–––|||
|tf|Fall Time|N-Ch|–––|3.9|–––|||
|||P-Ch|–––|15|–––|||
|Ciss|Input Capacitance|N-Ch|–––|398|–––|pF|P-Channel<br>N-Channel<br>VGS= 0V, VDS= 15V, ƒ = 1.0MHz<br>VGS= 0V, VDS= -15V, ƒ = 1.0KHz|
|||P-Ch|–––|383|–––|||
|Coss|Output Capacitance|N-Ch|–––|82|–––|||
|||P-Ch|–––|104|–––|||
|Crss|Reverse Transfer Capacitance|N-Ch|–––|36|–––|||
|||P-Ch|–––|64|–––|||



## **Diode Characteristics** 

||**Parameter**||**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|---|
|IS|Continuous Source Current (Body Diod|eN-Ch|–––|–––|2.0|A||
|||P-Ch|–––|–––|-2.0|||
|ISM|Pulsed Source Current (Body Diode)|N-Ch|–––|–––|34|||
|||P-Ch|–––|–––|-23|||
|VSD|Diode Forward Voltage|N-Ch|–––|–––|1.2|V|TJ= 25°C,IS= 2.0A,VGS= 0V�|
|||P-Ch|–––|–––|-1.2||TJ= 25°C,IS= -2.0A,VGS= 0V�|
|trr|Reverse Recovery Time|N-Ch|–––|8.4|13|ns|N-Channel: TJ= 25°C, IF= 2.0A,<br>VDD= -15V,di/dt = 102/μs�<br>VDD= 15V, di/dt = 102/μs�<br>P-Channel: TJ= 25°C, IF= -2.0A,|
|||P-Ch|–––|11|17|||
|Qrr|Reverse Recovery Charge|N-Ch|–––|2.3|3.5|nC||
|||P-Ch|–––|4.8|7.2|||



## **Notes:** 

- Repetitive rating;  pulse width limited by 

- max. junction temperature. (See fig. 16) 

   - Surface mounted on 1 in square Cu board 

   - ����  ������������������������������������ 

- Pulse width 400μs; duty cycle 2%. 

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� 

## N-Channel 

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100<br>VGS<br>eeea eeeteeeereeeeer ee TOP           7.5V<br>i 6.5V<br>SE “AR 5.5V4.5V<br>4.0V<br>ERY Zcmnnn 3.5V<br>3.0V<br>BOTTOM 2.75V<br>ae<br>10<br>oe /7/ eee<br>DD /7 Qe eeeee<br>PWY//derfii26 eeAA<br>Ye 2.75V<br>60μs PULSE WIDTH<br>Tj = 25°C<br>1<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>100<br>rs es es —— a<br>10 P| TJ = 150°C LAR<br>es ey 2 Ae ee<br>1 Pfftes TJ  ee = 25°C ee<br>ee i a<br>V DS  = 15V<br>60μs PULSE WIDTH<br>2 a<br>0.1<br>1 2 3 4 5 6<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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100<br>VGS<br>eeea eeeeeetereeeeer TOP           7.5V<br>oe oo 6.5V<br>eal 5.5V4.5V<br>4.0V<br>ee 3.5V<br>3.0V<br>BOTTOM 2.75V<br>ff<br>10<br>GP<br>ED /// 2 eePea<br>m/e, eer<br>2.75V<br>Yon aa<br>MY fi a ell<br>60μs PULSE WIDTH<br>Tj = 150°C<br>1<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>2.0<br>ID = 5.4A<br>V GS  = 4.5V<br>1.5 LLL EL<br>SaanPdneee<br>1.0 ea<br>|<br>PEELE<br>0.5 ELL ELL<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

## N-Channel 

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10000<br>VGS   = 0V,       f = 1 MHZGS   = 0V,       f = 1 MHZ = 0V,       f = 1 MHZ<br>Ciss   = Ciss   = C  = C gs + Cgd,  C+ Cgd,  Cgd,  C,  C ds SHORTEDSHORTED<br>C  = C<br>iz Crss  oss  rss  oss  oss   = Cds gd + Cgdds gd + Cgdgd + Cgd+ Cgdgd<br>en<br>1000<br>Ciss<br>iss<br>C<br>oss<br>100 Sealine<br>tel |<br>Crssrss<br>EC<br>10<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


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10000 14.0<br>VGS   = 0V,       f = 1 MHZGS   = 0V,       f = 1 MHZ = 0V,       f = 1 MHZ<br>Ciss   = Ciss   = C  = C gs + Cgd,  C+ Cgd,  Cgd,  C,  C ds SHORTEDSHORTED ID= 6.8A<br>C  = C 12.0 V DS = 24V<br>iz Crss  oss  rss  oss  oss   = Cds gd + Cgdds gd + Cgdgd + Cgd+ Cgdgd VDS= 15V<br>en 10.0 V DS = 6.0V |<br>1000<br>Ciss 8.0<br>C 6.0<br>oss<br>100 Sealine PY<br>tel | HF |i<br>4.0<br>Crssrss<br>EC 2.0 YL EEL<br>10 0.0<br>1 10 100 0 1 2 3 4 5 6 7 8 9<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>Fig 5.   Typical Capacitance vs. Fig 6.   Typical Gate Charge vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>100 100<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br>1 00μsec<br>10 1msec<br>TJ = 150°C<br>10<br>1 10msec<br>a a HNMl<br>TJ = 25°C<br>1 DC<br>0.1<br>es ey Aa A Tc = 25°C Soee<br>V GS  = 0V Tj = 150°CSingle Pulse<br>0.1 ppp 0.01 = aee:eee<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 10 100<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>VGS, Gate-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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7<br>6<br>5 S eT<br>4<br>TINT<br>3<br>TIN<br>2 TN<br>TTT<br>1 TET<br>0<br>25 50 75 100 125 150<br> TA , Ambient Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 9.** Maximum Drain Current vs. Ambient Temperature 

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Vos<br>“ ae| +<br>-<br>SN<br><br>a <br>**----- End of picture text -----**<br>


**Fig 10a.** Switching Time Test Circuit 

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VDS<br>90%<br>10%<br>VGS AX. | |<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 10b.** Switching Time Waveforms 

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100<br>ID = 6.8A<br>80<br>60<br>40<br>20<br>2 4 6 8 10 12 14 16 18 20<br>VGS, Gate -to -Source Voltage  (V)<br>)<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 11.** Typical On-Resistance vs. Gate Voltage 

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120<br>110 pt tt tt tt<br>ptt<br>100<br>90 pt tT tt tt<br>80 Pt tT tT tt yt tT<br>70 pt tT tT tt tT<br>60 pt |tT tttT tyty tT<br>Vgs = 4.5V<br>pt<br>50<br>Vgs = 10V<br>40 | | | peete<br>30 eT<br>+ fy Ee<br>20 rr ttttt<br>0 5 10 15 20 25 30 35 40 45<br>ID, Drain Current (A)<br>)<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 12.** Typical On-Resistance vs. Drain Current 

## N-Channel 

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2.0<br>1.8<br>PNGHNTTT<br>1.6<br>TTT<br>1.4<br>ID = 10μA<br>PP  NT<br>1.2<br>1.0<br>tit tt NEtN<br>0.8<br>PCE<br>0.6<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


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20000<br>TA<br>16000<br>a<br>12000 A AANA<br>{<br>80004000 A AN A<br>Wigan<br>0<br>1E-8 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2<br>Time (sec)<br>Power (W)<br>**----- End of picture text -----**<br>


**Fig 13.** Threshold Voltage vs. Temperature 

Typical Power vs. Time 

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QG<br>oo<br>QGS QGD<br>| ;<br>VG<br>FS<br>Charge -<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50K<br>12V .2F<br>.3F<br>re<br>+<br>D.U.T. -VDS<br>I - LLit 4<br>VGS<br>(st<br>3mA<br>ot<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 15a.** Basic Gate Charge Waveform 

**Fig 15b.** Gate Charge Test Circuit 

## N and P-Channel 

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100<br>D = 0.50<br>cme<br>0.20<br>10 a ee ert I PETe<br>0.10<br>| | 0.05 Hi} | tera te<br>1 0.02<br>SS 0.01 Sa<br>i a ea ee eel<br>0.1 eea ee ell<br>ir<br>SINGLE PULSE<br>0.01 me ee ee Notes: ee el<br>( THERMAL RESPONSE ) 1. Duty Factor D = t1/t2<br>a ini 2. Peak Tj = P dm x Zthja + T A<br>aill iemc oa ce<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJA ) °C/W<br>**----- End of picture text -----**<br>


**Fig 16.** Typical Effective Transient Thermal Impedance, Junction-to-Ambient 

## P-Channel 

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100<br>VGS<br>TOP           -8.0V<br>-7.0V<br>-6.0V 7 ae |<br>-5.0V<br>-4.5V Zo<br>-3.5V<br>10 -3.0V<br>BOTTOM -2.75V<br>| aSe oo<br>O70 eo<br>1<br>-2.75V<br>60μs PULSE WIDTH<br>Tj = 25°C<br>0.1 ie(Fo caelmilli<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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100<br>VGS<br>TOP           -8.0V<br>-7.0V<br>-6.0V Ao<br>-5.0V<br>-4.5V 7 eae<br>-3.5V<br>10 -3.0V<br>BOTTOM -2.75V<br>| fh7 Sasa eee<br>hoo—<br>1<br>-2.75V<br>60μs PULSE WIDTH<br>Tj = 150°C<br>0.1 pfBim allee l<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 17.** Typical Output Characteristics 

**Fig 18.** Typical Output Characteristics 

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**----- Start of picture text -----**<br>
100 a ee ee ns Ens Dns<br>10<br>P| er<br>T = 150°C<br>J<br>ey ae<br>1 T J  = 25°C<br>=<br>VDS = -15V<br>| 60μs PULSE WIDTH<br>0.1 et<br>1 2 3 4 5 6 7<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1.6<br>ID = -3.7A<br>VGS = -4.5V<br>1.41.2 |}| 4]<br>4<br>1.0<br>|<br>0.8<br>0.6 ALLELE<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 19.** Typical Transfer Characteristics 

**Fig 20.** Normalized On-Resistance vs. Temperature 

P-Channel 

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10000 14.0<br>VCGS  iss   = C = 0V,       f = 1 MHZgs + Cgd,  C ds SHORTED ID= -4.6A<br>= C rss    = C gd  12.0 fs |<br>V = -24V<br>Se Coss   = Cds + Cgd DS LL<br>oe ee 10.0 VDS= -15V ee<br>1000 VDS= -6.0V<br>oot | =f<br>C 8.0<br>iss<br>C<br>oss 6.0<br>C<br>rss<br>100 Ssecsliimna)iii anTAne<br>peHHTI 4.0 i /1/WY | |<br>2.0<br>TEEr ttAe tt<br>10 0.0<br>1 10 100 0 2 4 6 8 10 12<br>-VDS, Drain-to-Source Voltage (V)  QG  Total Gate Charge (nC)<br>Fig 21.   Typical Capacitance vs. Fig 22.   Typical Gate Charge vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>100.00 100<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br>100μsec<br>10 1msec<br>10.00<br>= TJ = 150°C a ee ell 10msec e<br>1<br>1.00 TJ = 25°C DC<br>0.1<br>Tc = 25°C<br>A a V GS  = 0V TSingle Pulsej = 150°C a<br>0.10 PETE 0.01 sii sii<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 10 100<br>-VSD, Source-to-Drain Voltage (V) -VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>-ISD, Reverse Drain Current (A) -ID,  Drain-to-Source Current (A)<br>-VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 23.** Typical Source-Drain Diode Forward Voltage 

**Fig 24.** Maximum Safe Operating Area 

P-Channel 

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5.0<br>4.0<br>STI “ e a -<br>+<br>ChE] |<br>3.0<br><br><br>SERRE, |  ee<br>2.0 GL<br>1.0 Fig 26a.   Switching Time Test Circuit<br>0.0 EEE td(on) tr td(off) tf<br>25 50 75 100 125 150 VGS<br>oe<br>10%<br> TA , Ambient Temperature (°C) 90% VK<br>Fig 25.   Maximum Drain Current vs. VDS<br>Ambient Temperature<br>Fig 26b.   Switching Time Waveforms<br>200 600<br>ID = -4.6A<br>500<br>160 Li ptt Vgs = -4.5V  ptt<br>400<br>120 TTP) © 300 PtSeetft<br>200<br>ALLELE ts<br>80 Vgs = -10V<br>100<br>WOOT pt iit ft<br>40 PN 0 SSSttt<br>2 4 6 8 10 12 14 16 18 20 0 5 10 15 20 25 30<br>-ID, Drain Current (A)<br>-VGS, Gate -to -Source Voltage  (V)<br>) <br>RDS(on),  Drain-to -Source On Resistance (m<br>-ID,  Drain Current (A)<br>)<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 27.** Typical On-Resistance vs. Gate Voltage 

**Fig 28.** Typical On-Resistance vs. Drain Current 

## P-Channel 

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2.2<br>2.0<br>{ett ttt<br>1.8<br>AN<br>1.6<br>EEE ID = -10μA<br>1.4<br>EN<br>1.2<br>BEEERERNE<br>1.0<br>SRR REAN<br>TTP<br>0.8<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>-VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


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20000<br>16000<br>Tya<br>AAT<br>12000<br>i<br>8000<br>a aa<br>Oi A On a<br>4000<br>a a<br>0 Mint<br>1E-8 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2<br>Time (sec)<br>Power (W)<br>**----- End of picture text -----**<br>


**Fig 29.** Threshold Voltage vs. Temperature 

**Fig 30** Typical Power vs. Time 

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QG<br>QGS QGD<br>VG<br>—<br>Charge<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50K<br>12V .2F<br>ma .3F<br>D.U.T. +-VDS<br>VGS<br>-3mA<br>5 & |<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 31a.** Basic Gate Charge Waveform 

**Fig 31b.** Gate Charge Test Circuit 

## **SO-8 Package Details** 

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Pb [ois [oa [oss fost_|<br>[0075<br>**----- End of picture text -----**<br>


## **SO-8 Part Marking** 

## **Tape and Reel** 

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TERMINAL NUMBER 1<br>**----- End of picture text -----**<br>


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12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) FEED DIRECTION<br>|  330.00<br>(12.992)<br>  MAX.<br>14.40 ( .566 )<br>[Xx 12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

|**Qualification information**†|||
|---|---|---|
|Qualification level|Cons umer<br>(per JE DE C JE S D47F †† guidelines )||
|Moisture Sensitivity Level|(per JE DE C JE S D47F<br>SO-8|MS L1<br>(per JE DE C J-S TD-020D††)<br>(per JE DE C JE S D47Fguidelines )|
|RoHS compliant|Yes||



**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245 To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 



## Links

- [View this product on Novapart](https://novapart.co/products/IRF9389TRPBF/dual-mosfet-complementary-n-and-p-channel-30-v-68)
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- [Supplier page](https://es.farnell.com/infineon/irf9389trpbf/mosfet-n-p-ch-30v-6-8a-soic/dp/4319006)
---

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