# Power MOSFET, P Channel, 30 V, 9.8 A, 0.0175 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2687600/)

**URL**: https://novapart.co/products/IRF9332TRPBF/power-mosfet-p-channel-30-v-98-a-00175-ohm-soic
**SKU**: IRF9332TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.2200
**Stock**: 10+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-9.8A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.0136ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 9.8A |
| Drain Source On State Resistance | 0.0175ohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2687600/)

## IRF9332PbF 

## HEXFET ® Power MOSFET 

|**VDS**|**-30**|**V**|
|---|---|---|
|**RDS(on) max**<br>(@VGS= -10V)|**17.5**|**m**Ω|
|**RDS(on) max**<br>(@VGS= -4.5V)|**28.1**|**m**Ω|
|**Qg (typical)**|**14**|**nC**|
|**ID **<br>(@TA= 25°C)|**-9.8**|**A**|



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SO-8<br>**----- End of picture text -----**<br>


## **Applications** 

## • 

- 

## **Features and Benefits** 

## **Features** 

Industry-Standard SO-8 Package RoHS Compliant Containing no Lead, no Bromide and no Halogen 

## **Resulting Benefits** 

results in Multi-Vendor Compatibility ⇒ Environmentally Friendlier 

|**Orderable part number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Note**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRF9332PbF|SO8|Tube/Bulk|**Quantity**<br>95||
|IRF9332TRPbF|SO8|Tape and Reel|4000||



## **Absolute Maximum Ratings** 

||**Parameter**<br>~~a~~|**Max.**<br>~~a~~|**Units**<br>~~a~~|
|---|---|---|---|
|VDS|Drain-to-Source Voltage<br>~~a~~<br>~~a~~|-30<br>~~a~~<br>~~a~~|V<br>~~a~~<br>~~a~~<br>~~a~~|
|VGS|Gate-to-Source Voltage<br>~~a~~|±20<br>~~a~~||
|ID@ TA= 25°C|Continuous Drain Current, VGS@ -10V<br>~~a~~<br>~~a~~|-9.8<br>~~a~~<br>~~a~~|A<br>~~a~~<br>~~a~~|
|ID@ TA= 70°C|Continuous Drain Current, VGS@ -10V<br>~~ee~~<br>~~a~~<br>~~oe~~|-7.8<br>~~ee~~||
|IDM|Pulsed Drain Current<br>~~a~~<br>~~oe~~|-80||
|PD@TA= 25°C|Power Dissipation<br>~~a~~<br>~~oe~~<br>~~ee~~|2.5<br>~~ee~~|W|
|PD@TA= 70°C|Power Dissipation<br>~~a~~|1.6<br>~~a~~||
||Linear Derating Factor<br>~~QO~~|0.02<br>~~QO~~|W/°C<br>~~QO~~|
|TJ<br>TSTG|Linear Derating Factor<br>Operating Junction and<br>Storage Temperature Range|-55  to + 150|°C|



> Notes ® through  are on page 2 © 

www.irf.com 

1 

09/01/2010 

## ���������� 

**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage|-30|–––|–––|V|VGS= 0V, ID= -250µA||
|∆ΒVDSS/∆TJ|Breakdown Voltage Temp. Coefficient|–––|0.021|–––|V/°C|Reference to 25°C, ID= -1mA||
|RDS(on)|Static Drain-to-Source On-Resistance|–––|13.6|17.5|mΩ|VGS= -10V, ID= -9.8A�||
|||–––|22.5|28.1||VGS= -4.5V, ID= -7.8A�||
|VGS(th)|Gate Threshold Voltage|-1.3|-1.9|-2.4|V|VDS= VGS, ID= -25µA||
|∆VGS(th)|Gate Threshold Voltage Coefficient|–––|-5.7|–––|mV/°C|||
|IDSS|Drain-to-Source Leakage Current|–––|–––|-1.0|µA|VDS= -24V, VGS= 0V||
|||–––|–––|-150||VDS= -24V, VGS= 0V, TJ= 125°C||
|IGSS|Gate-to-Source Forward Leakage|–––|–––|-100|nA|VGS= -20V||
||Gate-to-Source Reverse Leakage|–––|–––|100||VGS= 20V||
|gfs|Forward Transconductance|36|–––|–––|S|VDS= -10V, ID= -7.8A||
|Qg|Total Gate Charge�|–––|14|–––|nC|VDS= -15V,VGS= -4.5V,ID= -7.8A||
|Qg|Total Gate Charge�|–––|27|41|nC|ID= -7.8A<br>VDS= -15V<br>VGS= -10V||
|Qgs|Gate-to-Source Charge�|–––|4.1|–––||||
|Qgd|Gate-to-Drain Charge�|–––|6.6|–––||||
|RG|Gate Resistance�|–––|18|–––|Ω|||
|td(on)|Turn-On DelayTime|–––|15|–––|ns|See Figs. 19a & 19b<br>RG= 6.8Ω<br>VDD= -15V, VGS= -4.5V�<br>ID= -1.0A||
|tr|Rise Time|–––|47|–––||||
|td(off)|Turn-Off DelayTime|–––|73|–––||||
|tf|Fall Time|–––|58|–––||||
|Ciss|Input Capacitance|–––|1270|–––|pF|ƒ= 1.0KHz<br>VGS= 0V<br>VDS= -25V||
|Coss|Output Capacitance|–––|250|–––||||
|Crss|Reverse Transfer Capacitance|–––|180|–––||||
|**Avalanche Characteristics**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|EAS|Single Pulse Avalanche Energy �||–––|||102|mJ|
|IAR|Avalanche Current�||–––|||-7.8|A|
|**Diode Characteristics**||||||||
||**Parameter**|**Min.**|**Typ.**|**Max.**|**Units**|**Conditions**||
|IS|Continuous Source Current<br>(BodyDiode)|–––|–––|-2.5|A|G<br>D<br>S<br>showing  the<br>integral reverse<br>p-njunction diode.<br>MOSFET symbol||
|ISM|Pulsed Source Current<br>(BodyDiode)��|–––|–––|-80||||
|VSD|Diode Forward Voltage|–––|–––|-1.2|V|TJ= 25°C, IS= -2.5A, VGS= 0V�||
|trr|Reverse RecoveryTime|–––|36|54|ns|TJ= 25°C, IF= -2.5A, VDD= -24V<br>di/dt = 100/µs�||
|Qrr|Reverse RecoveryCharge|–––|20|30|nC|||
|**Thermal Resistance**||||||||
||**Parameter**||**Typ.**|||**Max.**|**Units**|
|RθJL|Junction-to-Drain Lead�||–––|||20|°C/W|
|RθJA|Junction-to-Ambient�||–––|||50||



## **������** 

- Repetitive rating;  pulse width limited by max. junction temperature. 

- Starting TJ = 25°C, L = 3.3mH, RG = 25 Ω , IAS = -7.8A. 

- Pulse width ≤ 400µs; duty cycle ≤ 2%. 

- When mounted on 1 inch square  copper board. 

- R θ is measured at TJ of approximately 90°C. 

- For DESIGN AID ONLY, not subject to production testing. 

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## ���������� 

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100<br>VGS<br>TOP           -10V<br>-5.0V<br>-4.5V<br>-4.0V<br>10 -3.5V<br>-3.0V<br>-2.7V<br>BOTTOM -2.5V<br>1<br>0.1<br>-2.5V<br>≤ 60µs PULSE WIDTH<br>Tj = 25°C<br>0.01<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>100<br>10<br>TJ = 150°C<br>TJ = 25°C<br>1<br>VDS = -10V<br>≤ 60µs PULSE WIDTH<br>0.1<br>1 2 3 4 5 6<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>-ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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10000<br>VGS   = 0V,       f = 1 KHZ<br>Ciss   = C gs + Cgd,  C ds SHORTED<br>C  = C<br>rss   gd<br>Coss   = Cds + Cgd<br>C<br>iss<br>1000<br>C<br>oss<br>Crss<br>100<br>1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs.Drain-to-Source Voltage 

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100<br>VGS<br>TOP           -10V<br>-5.0V<br>-4.5V<br>-4.0V<br>-3.5V<br>-3.0V<br>10 -2.7V<br>BOTTOM -2.5V<br>1<br>-2.5V<br>≤ 60µs PULSE WIDTH<br>Tj = 150°C<br>0.1<br>0.1 1 10 100<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 2.   Typical Output Characteristics<br>1.6<br>ID = -9.8A<br>VGS = -10V<br>1.4<br>1.2<br>1.0<br>0.8<br>0.6<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>Fig 4.   Normalized On-Resistance vs. Temperature<br>14.0<br>ID= -7.8A<br>12.0<br>VDS= -24V<br>10.0 VDS= -15V<br>VDS= -6.0V<br>8.0<br>6.0<br>4.0<br>2.0<br>0.0<br>0 10 20 30 40<br> QG,  Total Gate Charge (nC)<br>-VGS, Gate-to-Source Voltage (V)<br>-ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance vs. Temperature 

**Fig 6.** Typical Gate Charge vs.Gate-to-Source Voltage 

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## ���������� 

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100<br>T = 150°C<br>J<br>T = 25°C<br>J<br>10<br>VGS = 0V<br>1.0<br>0.3 0.5 0.7 0.9 1.1 1.3<br>-VSD, Source-to-Drain Voltage (V)<br>  Typical Source-Drain Diode Forward Voltage<br>10<br>8<br>6<br>4<br>2<br>0<br>25 50 75 100 125 150<br> TA , Ambient Temperature (°C)<br>-ID,  Drain Current (A)<br>-ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 9.** Maximum Drain Current vs. Ambient Temperature 

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1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100<br>100µsec<br>10<br>1msec<br>DC<br>1<br>10msec<br>0.1 T A = 25°C<br>Tj = 150°C<br>Single Pulse<br>0.01<br>0.01 0.1 1 10 100 1000<br>-VDS, Drain-to-Source Voltage (V)<br>Fig 8.   Maximum Safe Operating Area<br>2.4<br>2.2<br>2.0<br>1.8<br>ID = -25µA<br>1.6<br>1.4<br>1.2<br>1.0<br>-75 -50 -25 0 25 50 75 100 125 150<br>TJ , Temperature ( °C )<br>-ID,  Drain-to-Source Current (A)<br>-VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 10.** Threshold Voltage vs. Temperature 

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100<br>D = 0.50<br>10 0.20<br>0.10<br>0.05<br>1 0.02<br>0.01<br>0.1<br>0.01 Notes:<br>SINGLE PULSE 1. Duty Factor D = t1/t2<br>( THERMAL RESPONSE ) 2. Peak Tj = P dm x Zthja + TA<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJA ) °C/W<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

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50<br>ID = -9.8A<br>40<br>30<br>T = 125°C<br>20 J<br>10<br>ONS [{r=]<br>T = 25°C<br>J<br>0<br>0 5 10 15 20 25<br>-VGS, Gate -to -Source Voltage  (V)<br>Fig 12.  On-Resistance vs. Gate Voltage<br>)  Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


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50<br>40<br>Vgs = -4.5V<br>30<br>20<br>10 Vgs = -10V<br>0<br>0 10 20 30 40 50 60 70 80<br>-ID, Drain Current (A)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On-Resistance vs. Drain Current 

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**----- Start of picture text -----**<br>
500<br>ID<br>TOP         -2.0A<br>400 -2.8A<br>BOTTOM -7.8A<br>300<br>200<br>N UTT<br>100<br>ee<br>0<br>25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 14.** Maximum Avalanche Energy vs. Drain Current 

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**----- Start of picture text -----**<br>
1000<br>800<br>600<br>400<br>e e<br>200<br>tr<br>0<br>1E-5 1E-4 1E-3 1E-2 1E-1 1E+0<br>Time (sec)<br>Fig 15 Typical Power vs. Time<br>Single Pulse Power (W)<br>**----- End of picture text -----**<br>


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+<br>) [©)]    •  Circuit Layout Considerations<br> •<br>| —| - GroundLow StrayPla I n eductance<br> •   Low Leakage Inductance<br>+<br>oi - [l] Current Transformer - ® +<br>00<br>Re •  •   Driver same type as D.U.T. Vv +<br>( a8 •   di/dtIsp controlled controlled bybyDuty Rg Factor "D" DD -<br>•<br>**----- End of picture text -----**<br>


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Driver Gate Drive<br>P.W.<br>a P.W. Period | D = —_— Period<br>| V | GS=10V<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current Current<br>r di/dt NN<br>©) D.U.T. VDS Waveform Diode Recoverydv/dt \ ><br>VDD<br>Re-Applied i<br>Voltage Body Diode  Forward Drop<br>® t<br>Ripple  ≤ 5% e s ISD ee<br>**----- End of picture text -----**<br>


> or P-Channel HEXFET ® ower MOSFETs 

**Fig 16.** 

www.irf.com 

5 

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**----- Start of picture text -----**<br>
L<br>VCC<br>DUT<br>0<br>201 K SS<br>n a l<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>Vgs(th)<br>Qgodr Qgd Qgs2 Qgs1<br>**----- End of picture text -----**<br>


**Fig 17a.** Gate Charge Test Circuit 

**Fig 17b.** Gate Charge Waveform 

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**----- Start of picture text -----**<br>
L<br>VDS IAS<br>RG D.U.T V<br>L. DD \ |]<br>IAS A<br>DRIVER<br>:i<br>tp 0.01 Ω<br>tp<br>V(BR)DSS<br>15V<br>**----- End of picture text -----**<br>


**Fig 18a.** Unclamped Inductive Test Circuit 

**Fig 18b.** Unclamped Inductive Waveforms 

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-<br>+<br>≤ 1<br>≤ 0.1 %<br>**----- End of picture text -----**<br>


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td(on) tr td(off) tf<br>VGS<br>ooo<br>10%<br>*n<br>\/<br>90% X<br>VDS<br>**----- End of picture text -----**<br>


**Fig 19a.** Switching Time Test Circuit 

**Fig 19b.** Switching Time Waveforms 

www.irf.com 

6 

## SO-8 Part Marking Information 

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

www.irf.com 

7 

SO-8 Tape and Reel (Dimensions are shown in milimeters (inches)) 

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**----- Start of picture text -----**<br>
TERMINAL NUMBER 1<br>Oo Oo ©2o © t<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) ee FEED DIRECTION<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
NOTES:<br>**----- End of picture text -----**<br>


1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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**----- Start of picture text -----**<br>
 330.00<br>(12.992)<br>  MAX.<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

## **Qualification Information[†]** 

|**Qualification Information[†]**|||
|---|---|---|
|Qualification level|Consumer††<br>(per JEDEC JESD47F†††guidelines)||
|Moisture Sensitivity Level|SO-8<br>(per JEDEC JESD47F|MSL1<br>(per JEDEC J-STD-020D†††)<br>(per JEDEC JESD47Fguidelines)|
|RoHS Compliant|(per JEDEC J)<br>Yes||



+ Qualification standards can be found at International Rectifier’s web site http://www.irf.com/product-info/reliability ~~t~~ Higher qualification ratings may be available should the user have such requirements. H 

- Higher qualification ratings may be available should the user have such requirements. 

- Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ 

- ~~H~~ Applicable version of JEDEC standard at the time of product release. t 

Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 09/2010 

www.irf.com 

8 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irf9332trpbf/mosfet-p-ch-30v-9-8a-soic-8/dp/2687600)
---

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