# Power MOSFET, N Channel, 80 V, 10 A, 0.0134 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2725918/)

**URL**: https://novapart.co/products/IRF7854TRPBF/power-mosfet-n-channel-80-v-10-a-00134-ohm-soic
**SKU**: IRF7854TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5170
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:10A; Drain Source Voltage Vds:80V; On Resistance Rds(on):0.011ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4.9V; Power

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 80V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 10A |
| Drain Source On State Resistance | 0.0134ohm |
| Gate Source Threshold Voltage Max | 4.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725918/)

## **Applications** 

PD-97172 IRF7854PbF HEXFET Power MOSFET 

> Primary Side Switch in Bridge or two- **VDSS RDS(on) max ID** 

> switch forward topologies using 48V ~~igee~~ **80V** ~~ee~~ **13.4m** ~~ee~~ **@VGS = 10V 10A** (±10%) or 36V to 60V ETSI range inputs. Secondary Side Synchronous 

Rectification Switch for 12Vout 

Suitable for 48V Non-Isolated 

Synchronous Buck DC-DC Applications 

## **Benefits** 

° Low Gate to Drain Charge to Reduce Switching Losses Fully Characterized Capacitance Including Effective COSS to Simplify Design, (See App. Note AN1001) 

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Fully Characterized Avalanche Voltage and Current 

|**Absolute Maximum Ratings**<br>**Parameter**<br>**Units**<br>VDS<br>Drain-to-Source Voltage<br>V<br>VGS<br>Gate-to-Source Voltage<br>ID@ TA= 25°C<br>Continuous Drain Current, VGS@ 10V<br>A<br>ID@ TA= 70°C<br>Continuous Drain Current, VGS@ 10V<br>IDM<br>Pulsed Drain Current<br>PD@TA= 25°C<br>Maximum Power Dissipation<br>W<br>Linear Derating Factor<br>W/°C<br>2.5<br>**Max.**<br>10<br>7.9<br>79<br>80<br>± 20<br>0.02<br>~~asses~~<br>~~OTT~~<br>~~—ee~~<br>~~——~~<br>~~a~~<br>~~——On~~<br>~~i~~<br>~~a CO~~|
|---|
|dv/dt<br>Peak Diode Recovery dv/dt<br>V/ns<br>TJ<br>Operating Junction and<br>°C<br>TSTG<br>Storage Temperature Range<br>11<br>-55  to + 150<br>~~>~~|
|**Thermal Resistance**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RθJL<br>Junction-to-Drain Lead<br>–––<br>20<br>°C/W<br>RθJA<br>Junction-to-Ambient (PCB Mount)<br>–––<br>50<br>~~Too~~<br>~~EL~~<br>~~os~~<br>~~_~~<br>~~TEE~~|
|Notes<br>hrough  are on page 8<br>0)<br>®|
|www.irf.com<br>1|



1 01/05/06 

## IRF7854PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

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|||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|GO|Parameter|Min.|GO|Typ.|GR|Max.|GO|Units|Conditions|
|GD|V(BR)DSS|Drain-to-Source Breakdown Voltage|80|–––|–––|V|VGS = 0V, ID = 250µA|
|∆V(BR)DSS/∆TJ|Breakdown Voltage Temp. Coefficient|–––|0.095|–––|V/°C|Reference to 25°C, ID = 1mA|
|Rs|GO|GO|GO|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|11|13.4|mΩ|VGS = 10V, ID = 10A|
|es|DeGOGD|QOGO(GOGO|
|GO|VGS(th)|Gate Threshold Voltage|3.0|GO|–––|(GO|4.9|V|VDS = VGS, ID = 100µA|
|IDSS|Drain-to-Source Leakage Current|–––|–––|20|µA|VDS = 80V, VGS = 0V|
|ee|IGSS|Gate-to-Source Forward Leakage|––––––|ee|––––––|ee|100250|nA|VVDSGS|eee|= 80V, V = 20V|GS = 0V, TJ = 125°C|
|OE|Gate-to-Source Reverse Leakage|–––|–––|-100|po|VGS = -20V|
|EEa|ee|||
|Dynamic @ TJ = 25°C (unless otherwise specified)|
|GO|Parameter|Min.|Typ.|Max.|Units|Conditions|
|gfs|Forward Transconductance|12|–––|–––|S|VDS = 25V, ID = 6.0A|
|es|GO|(GO|
|Qg|Total Gate Charge|–––|27|41|ID = 6.0A|
|es|GOD|I|GO|GO|
|Qgs|Gate-to-Source Charge|–––|7.7|–––|nC|VDS = 40V|
|ee|Qgd|Gate-to-Drain ("Miller") Charge|–––|8.7|–––|VGS = 10V|@|
|td(on)|Turn-On Delay Time|–––|9.4|–––|VDD = 40V|
|ee|
|tr|Rise Time|–––|8.5|–––|ID = 6.0A|
|td(off)|Turn-Off Delay Time|–––|15|–––|ns|RG = 6.2Ω|
|ee|tf|Fall Time|–––|8.6|–––|VGS = 10V|@|
|Ciss|Input Capacitance|–––|1620|–––|VGS = 0V|
|ee|
|Coss|Output Capacitance|–––|350|–––|VDS = 25V|
|Crss|Reverse Transfer Capacitance|–––|86|–––|pF|ƒ = 1.0MHz|
|ee|Coss|Output Capacitance|–––|1730|–––|pO|VGS = 0V,  VDS = 1.0V,  ƒ = 1.0MHz|
|Coss|Output Capacitance|–––|230|–––|VGS = 0V,  VDS = 64V,  ƒ = 1.0MHz|
|es|Po|
|Coss eff.|Effective Output Capacitance|–––|410|–––|VGS = 0V, VDS = 0V to 64V|
|a|
|Avalanche Characteristics|
|QO|Parameter|Typ.|Max.|Units|
|EAS|Single Pulse Avalanche Energy|–––|110|mJ|
|po|IAR|Avalanche Current|–––|6.0|A|
|Qe|
|Diode Characteristics|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|2.3|MOSFET symbol|D|
|(Body Diode)|A|showing  the|
|ISM|Pulsed Source Current|–––|–––|79|integral reverse|G|
|(Body Diode)|p-n junction diode.|S|
|VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ = 25°C, IS = 6.0A, VGS = 0V|
|es|i:|
|trr|Reverse Recovery Time|–––|43|65|ns|TJ = 25°C, IF = 6.0A, VDD = 25V|
|e|Qrr|e|ee|Reverse Recover|s|y Charge|GD|–––|GO|76|GO|110|GO|nC|(EO|di/dt = 100A/µs|@|
|Ge|ton|Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)|

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## IRF7854PbF 

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100 100<br>VGS VGS<br>SS TOP           15V S aaS TOP           15V<br>| fo 10V ail) Ales 10V<br>10 8.0V 8.0V<br>Z une 7.0V fem 7.0V<br>6.5V 6.5V<br>2 SS 6.0V Y le 6.0V<br>Zeiten 5.5V 10 | fe 5.5V<br>1 BOTTOM 5.0V BOTTOM 5.0V<br>7<br>S p eerBE TI Uy/ et| |<br>0.1<br>nP ape EUIcenit 1 a 1 5.0V ul{<br>ee 5.0V TH<br>0.01<br>a m a Sa<br>≤60µs PULSE WIDTH ≤60µs PULSE WIDTH<br>S HE AA Sei mari<br>Tj = 25°C Tj = 150°C<br>TE ll<br>0.001 ii EEE 0.1 CCU<br>0.1 1 10 100 1000 0.1 1 10 100 1000<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

**Fig 2.** Typical Output Characteristics 

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100 a eeeeae<br>eeeeaae<br>ee A)r<br>TJ = 150°C<br>10 0 A<br>e e ne Ae oe<br>F f<br>es eeA |es<br>TJ = 25°C<br>1<br>|e yAfi| |<br>ey Aeae ee e ee e esee<br>VDS = 25V<br>≤60µs PULSE WIDTH<br>J ib<br>0.1<br>4 5 6 7 8<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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2.0<br>ID = 10A<br>VGS = 10V<br>1.5<br>1.0<br>0.5<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>TJ , Junction Temperature (°C)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance vs. Temperature 

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## IRF7854PbF 

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100000<br>VGS   = 0V,       f = 1 MHZGS   = 0V,       f = 1 MHZ = 0V,       f = 1 MHZ<br>Ciss iss    = C gs + Cgd,  C+ Cgd,  Cgd,  C,  C ds SHORTEDSHORTED<br>Crss  rss    = Cgd gd<br>10000 Coss  oss   = Cds + Cgdds + Cgd+ Cgdgd<br>e e ee ee ee nL<br>Cississ<br>1000 a<br>Cossoss<br>SP R<br>100 Crssrss<br>Se e<br>e e eee<br>10 ee ee ee<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


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100000 12.0<br>VGS   = 0V,       f = 1 MHZGS   = 0V,       f = 1 MHZ = 0V,       f = 1 MHZ<br>Ciss iss    = C gs + Cgd,  C+ Cgd,  Cgd,  C,  C ds SHORTEDSHORTED ID= 6.0A<br>Crss  rss    = Cgd gd  10.0 VDS= 64V<br>10000 Coss  oss   = Cds + Cgdds + Cgd+ Cgdgd VDS= 40V<br>e e ee ee ee nL 8.0 a VDS= 16V LL<br>Cississ<br>1000 a = 6.0 |<br>Cossoss<br>SP R 4.0 L e<br>100 Crssrss<br>Se e 2.0<br>e e eee<br>10 ee ee ee 0.0 J} | | ft f-<br>1 10 100 0 5 10 15 20 25 30<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>Fig 5.   Typical Capacitance vs. Fig 6.   Typical Gate Charge vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>100 1000<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br>T OF) Co<br>TJ = 150°C 100<br>10 P | A K] ==<br>10 100µsec<br>a a P anin i at all<br>TJ = 25°C<br>| | fl ae<br>1 10msec<br>T AA<br>1 p f | OLR<br>Sere [c] [es] [s]<br>0.1 T A = 25°C i gen il<br>a lae ea<br>Tj = 150°C 1msec<br>VGS = 0V Single Pulse<br>0.1 | 0.01 vit3a |<br>0.2 0.4 0.6 0.8 1.0 1.2 0 1 10 100 1000<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>VGS, Gate-to-Source Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>C, Capacitance (pF)<br>ISD, Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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## IRF7854PbF 

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10 Nn Rp<br>8 N Re Vvie D.U.T.<br>a f ° - Vop<br>6<br>) 10V<br>Pulse Width ≤ 1  ys<br>4 . Duty Factor ≤ 0.1 %<br>Fig 10a.   Switching Time Test Circuit<br>2<br>VDS<br>90%<br>0<br>25 50 75 100 125 150<br> TA , Ambient Temperature (°C)<br>10%<br>/\ \<br>Fig 9.   Maximum Drain Current vs. VGS |\< le >|KS«ee ><br>Ambient Temperature td(on) tr td(off) tf<br>Fig 10b.   Switching Time Waveforms<br>100<br>—= D = 0.50 a a a | cc||<br>10 0.20<br>0.10<br>o t S EL eee ——e—aol<br>———- 0.05 il<br>1 a 0.02 =ee;ieZal aul e|<br>0.01<br>0.1 P A eeadE eeTTfa| OATH|| EH oe | τJ r τJτ1 τ1 R1 R1 τ2τR22 R2 Rτ33Rτ33 τAτ eea 4.32930.099Ri (°C/W) 1.12490.003565τι  ee (sec | ) illil<br>0.01 ee Ci= Ci= τi/τRii/Ri 15.590 34.5<br>SINGLE PULSE<br>0.001 A Sa GRASET ( THERMAL RESPONSE ) eee|eeee ieee eeeeeALETTARee| eeeEEAIIE eenfgg PE Notes:1. Duty Factor D = t1/t2 E ra TTT||i<br>ee | | | | 2. Peak Tj = P dm x Zthja + Tc |<br>a en ee ell |<br>0.0001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1 , Rectangular Pulse Duration (sec)<br>ID,  Drain Current (A)<br>Thermal Response ( Z  thJA )<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

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## IRF7854PbF 

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25 40<br>ID = 6.0A<br>TJ = 125°C 35 tT]<br>20<br>30 et<br>| yt<br>15 25 PN]<br>| yf<br>TJ = 25°C TJ = 125°C<br>20<br>CINSEE<br>10<br>15<br>Vgs = 10V  ATVSRES TJ = 25°C<br>5 10<br>P| [REY]<br>0 10 20 30 40 50 60 70 80 90 4 6 8 10 12 14 16<br>ID, Drain Current (A)<br>VGS, Gate -to -Source Voltage  (V)<br>Fig 12.    On-Resistance vs. Drain Current Fig 13.    On-Resistance vs. Gate Voltage<br>QG<br>L<br>DUT VCC QGS QGD<br>0 450<br>1K<br>VG ID<br>400<br>TOP         0.61A<br>.4 h lal T IE<br>Charge 0.75A<br>350<br>BOTTOM 6.0A<br>; Eo EEe<br>Fig 14a&b.   Basic Gate Charge Test Circuit 300<br>and Waveform P ALETTE<br>250 Ty<br>G N<br>200<br>15V 150 A A<br>V(BR)DSS 100 L E) SQEE EE E<br>tp VDS L DRIVER<br>50<br>| R G m D.U.T + S SS<br>IAS - [V][DD] A 0<br>20V<br>IAS tp 0.01Ω 25 50 75 100 125 150<br>Starting TJ , Junction Temperature (°C)<br>) Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>)Ω<br>RDS(on),  Drain-to -Source On Resistance ( m<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 15a&b.** Unclamped Inductive Test circuit and Waveforms 

6 

**Fig 15c.** Maximum Avalanche Energy vs. Drain Current 

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## IRF7854PbF 

## SO-8  Package Outline 

Dimensions are shown in milimeters (inches) 

## SO-8 Part Marking Information 

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7 

## IRF7854PbF 

## **SO-8 Tape and Reel** 

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TERMINAL NUMBER 1<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) : FEED DIRECTION<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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 330.00<br>(12.992)<br>  MAX.<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Notes: o® Repetitive rating;  pulse width limited by Pulse width ≤ 400µs; duty cycle ≤ 2%. max. junction temperature. © Coss eff. is a fixed capacitance that gives the same charging time @ Starting TJ = 25°C, L = 6.0mH, as Coss while VDS is rising from 0 to 80% VDSS. RG = 25Ω, IAS = 6.0A. © ISD ≤ 6.0A, di/dt ≤ 350A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C. 5 When mounted on 1 inch square copper @ Rθ is measured at Ty of approximately 90°C. board,  t ≤ 10 sec. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 01/06 

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