# Power MOSFET, P Channel, 30 V, 3.6 A, 0.09 ohm, µSOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2803414/)

**URL**: https://novapart.co/products/IRF7606TRPBF/power-mosfet-p-channel-30-v-36-a-009-ohm-soic
**SKU**: IRF7606TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3770
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-3.6A; Drain Source Voltage Vds:-30V; On Resistance Rds(on):0.075ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-1

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 1.8W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | µSOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 3.6A |
| Drain Source On State Resistance | 0.09ohm |
| Gate Source Threshold Voltage Max | 1V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2803414/)

Generation V Technology Ultra Low On-Resistance P-Channel MOSFET Very Small SOIC Package Low Profile (<1.1mm) Available in Tape & Reel Fast Switching Lead-Free **Description** 

**==> picture [204 x 94] intentionally omitted <==**

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A<br>S 1 8 D<br>S 2 7 D VDSS = -30V<br>S 3 6 D<br>G 4 5 D R  = 0.09Ω<br>DS(on)<br>Top View<br>**----- End of picture text -----**<br>


Fifth  Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low  on-resistance per silicon area.  This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline.  This makes the Micro8 an ideal device for applications where printed circuit board space is at a premium.  The low profile (<1.1mm) of the Micro8 will allow it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards. 

**==> picture [30 x 8] intentionally omitted <==**

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Micro8<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|a|**Parameter**<br>|**Max.**<br>|**Units**<br>|
|---|---|---|---|
|VDS<br>~~Qn~~|Drain-Source Voltage<br>~~Qn~~|-30<br>~~Qn~~|V<br>~~Qn~~|
|ID@ TA= 25°C<br><br>~~oo~~|Continuous Drain Current, VGS@ -10V<br><br>~~oo~~|-3.6<br>_<br>~~oo~~|A<br>_<br>~~a~~|
|ID@ TA= 70°C<br><br>~~oo~~|Continuous Drain Current, VGS@ -10V<br><br>~~oo~~|-2.9<br>_<br>~~oo~~||
|IDM<br><br>~~oo~~<br>~~a~~|Pulsed Drain Current<br><br>~~oo~~<br>~~a~~|-29<br>_<br>~~oo~~<br>~~a~~||
|PD@TA= 25°C<br>~~a~~|Maximum Power Dissipation<br>~~a~~|1.8<br>~~a~~|W<br>~~a~~|
|PD@TA= 70°C<br>~~a~~|Maximum Power Dissipation<br>~~a~~|1.1<br>~~a~~|W<br>~~a~~|
|Linear Deratin<br>~~a~~|Linear DeratingFactor                                                                       14                                 mW/°C<br>~~a~~|Factor                                                                       14                                 mW/°C<br>~~a~~|Factor                                                                       14                                 mW/°C<br>~~a~~|
|VGS<br>~~a~~|GSGate-to-Source Voltage<br>± 20                                    V<br>~~a~~|± 20                                    V<br>~~a~~|± 20                                    V<br>~~a~~|
|VGSM<br>~~a~~|GSMGate-to-Source Voltage Single Pulse tp<10µS                                      30                                    V<br>~~a~~|S                                      30                                    V<br>~~a~~|S                                      30                                    V<br>~~a~~|
|dv/dt<br>~~a~~<br>~~RR~~|Peak Diode Recoverydv/dt<br>~~a~~<br>~~RR~~|-5.0<br>~~a~~|V/ns<br>~~a~~|
|TJ, TSTG<br>~~a~~<br>~~RR~~<br>~~se~~|Junction and Storage Temperature Range<br>~~a~~<br>~~RR~~<br>~~se~~|-55  to + 150<br>~~a~~<br>~~se~~|°C<br>~~a~~<br>~~se~~|
|Soldering Temperature, for 10 seconds                                 240 (1.6mm from case)<br>~~RR~~<br>~~se~~|Soldering Temperature, for 10 seconds                                 240 (1.6mm from case)<br>~~RR~~<br>~~se~~|Soldering Temperature, for 10 seconds                                 240 (1.6mm from case)<br>~~se~~||



All Micro8 Data Sheets reflect improved Thermal Resistance, Power and Current -Handling Ratings- effective only for product marked with Date Code 505 or later . 

www.irf.com 

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## **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

|~~es~~|**Parameter**<br>~~Gd~~|**Min. **<br>~~Gd~~|**Typ. **<br>~~Gd~~|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS<br>~~es~~<br>~~ee~~|Drain-to-Source Breakdown Voltage<br>~~Gd~~<br>~~ee~~|-30<br>~~Gd~~<br>~~ee~~|–––<br>~~Gd~~<br>~~ee~~|–––<br>~~ee~~|V<br>~~ee~~|VGS= 0V, ID= 250µA<br>~~ee~~|
|∆V(BR)DSS/∆TJ <br>~~ee~~|Breakdown Voltage Temp. Coefficient<br>~~ee~~|––– -0.024<br>~~ee~~<br>|<br>**|**|-0.024 <br>~~ee~~|–––<br>~~ee~~|V/°C<br>~~ee~~|Reference to 25°C, ID= -1mA<br>~~ee~~|
|RDS(on)<br>~~ee~~|Static Drain-to-Source On-Resistance|––– <br>|<br>**|**<br>~~[—0.130]~~|0.075 <br>~~0.130]~~|0.09<br>~~0.130]~~|Ω|VGS= - 10V, ID= -2.4A|
||||<br>**|**<br>~~[—0.130]~~|~~0.130]~~|0.15<br>~~0.130]~~||VGS= -4.5V, ID= -1.2A|
|VGS(th)<br>~~ee~~|Gate Threshold Voltage|-1.0<br>~~[—0.130]~~|–––<br>~~0.130]~~|–––<br>~~0.130]~~|V|VDS= VGS, ID= -250µA|
|gfs<br>~~ee~~<br>~~ts~~|Forward Transconductance<br>~~LeakageCurrent~~|2.3<br>~~[— 0.130]~~<br>~~>~~|–––<br>~~0.130]~~<br>~~>~~|–––<br>~~0.130]~~<br>~~>~~|S<br>~~[t—“CSCsdCY~~<br>~~A~~|VDS= -10V, ID= -1.2A<br>~~[t—“CSCsdCY~~|
|~~ts~~|Drain-to-Source~~LeakageCurrent~~|–––<br>~~>~~<br>ee|–––<br>~~>~~<br>ee|-1.0<br>~~>~~<br>~~|~~<br>ee|~~[t—“CSCsdCY~~<br>~~|~~<br>~~A~~<br>ee|VDS= -24V, VGS= 0V<br>~~[t—“CSCsdCY~~|
|||–––<br>~~>~~<br>ee|–––<br>~~>~~<br>ee|-25<br>~~>~~<br>~~|~~<br>ee||VDS= -24V, VGS= 0V, TJ= 125°C<br>~~[t—“CSCsdCY~~|
|~~ts~~<br>a <br>~~Se~~|Gate-to-Source Forward Leakage<br> ~~Leakage Current~~<br>~~ee~~<br>~~oT~~|–––<br>~~ee~~<br>~~oT~~|–––<br>~~ee~~<br>~~oT~~|-100<br>|~~A~~<br>~~Po~~<br>~~“T~~|VGS= -20V<br>~~Po~~<br>~~“T~~|
||Gate-to-Source Reverse Leakage<br>~~ee~~<br> ~~oT~~|–––<br>~~ee~~<br>~~oT~~|–––<br>~~ee~~<br>~~oT~~|100<br>||VGS= 20V<br>~~Po~~<br>~~“T~~|
|Qg<br> <br>~~Se~~<br>es|Total Gate Charge<br> ~~oT~~|–––<br>~~oT~~|20<br>~~oT~~|30<br>|nC<br> ~~“T~~|ID= -2.4A<br>VDS= -24V<br>VGS= -10V, See Fig. 9<br>~~“T~~<br>~~@~~|
|Qgs<br> <br>~~Se~~<br>es<br>~~ee~~|Gate-to-Source Charge<br> ~~oT~~|–––<br>~~oT~~|2.1<br>~~oT~~|3.1<br>|||
|Qgd<br> <br>~~Se~~<br>es<br>~~ee~~<br>~~ee~~|Gate-to-Drain("Miller")Charge<br> ~~oT~~|–––<br>~~oT~~|7.6<br>~~oT ~~|11<br>|||
|td(on)<br>~~ee~~<br>~~ee~~<br>es|Turn-On Delay Time|–––|13|–––||VDD= -10V<br>ID= -2.4A<br>RG= 6.0Ω<br>RD= 4.0Ω<br>~~@~~<br>~~@~~|
|tr<br>~~ee~~<br>es<br>ee|Rise Time|–––|20|–––|||
|td(off)<br>es<br>ee<br>~~es~~|Turn-Off Delay Time|–––|43|–––|||
|tf<br>ee<br>~~es~~<br>~~ee~~|Fall Time|–––|39|–––|||
|Ciss<br>~~es~~<br>~~ee~~<br>ee|Input Capacitance|–––|520|–––|pF|VGS= 0V<br>VDS= -25V<br>ƒ = 1.0MHz, See Fig. 8<br>~~@~~|
|Coss<br>~~ee~~<br>ee<br>es|Output Capacitance|–––|300|–––|||
|Crss<br>ee<br>es|Reverse Transfer Capacitance|–––|140|–––|||



## **Source-Drain Ratings and Characteristics** 

|~~es~~|**Parameter**<br>~~OG~~|**Min. **<br>~~OG~~|**Typ. **<br>~~OG~~|**Max. **<br>~~OG~~|**Units**<br>~~OG~~|**Conditions**<br>~~OG~~|
|---|---|---|---|---|---|---|
|IS<br>~~es~~<br>~~a ee~~<br>~~ee~~|Continuous Source Current<br>(Body Diode)<br>~~OG~~<br>~~ee~~<br>~~ee~~|~~OG~~<br>~~ee~~<br>~~ee~~|~~OG~~<br>~~ee~~<br>~~ee~~|~~OG~~<br>~~ee~~<br>~~ee~~|~~OG~~<br>~~ee~~<br>~~ee~~|MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunction diode.<br>S<br>D<br>G<br>~~OG~~|
|ISM<br>~~ee~~|Pulsed Source Current<br>(BodyDiode)<br>~~ee~~|~~ee~~|~~ee~~|-29<br>~~ee~~|||
|VSD<br>~~ee~~<br>~~DO~~<br>~~a~~|Diode Forward Voltage<br>~~ee~~<br>~~DO~~|–––<br>~~ee~~<br>~~DO~~|–––<br>~~ee~~<br>~~DO~~|-1.2<br>~~ee~~<br>~~DO~~|V<br>~~ee~~<br>~~DO~~|TJ= 25°C, IS= -2.4A, VGS= 0V<br>~~DO~~<br>ee|
|trr<br>~~es~~<br>~~a~~|Reverse Recovery Time<br>~~es~~|–––<br>~~es~~|43<br>~~es~~|64<br>~~es~~|ns<br>~~es~~|TJ= 25°C, IF= -2.4A<br>di/dt = -100A/µs<br>~~es~~<br>ee<br>®|
|Qrr<br>~~es~~<br>~~a~~|Reverse Recovery Charge<br>~~es~~|–––<br>~~es~~|50<br>~~es~~|76<br>~~es~~|nC<br>~~es~~||



## **Notes:** 

> Repetitive rating;  pulse width limited by ©) Pulse width ≤ 300µs; duty cycle ≤ 2%. max. junction temperature. ( See fig. 10 ) 

ISD ≤ -2.4A, di/dt ≤ -130A/µs, VDD ≤ V(BR)DSS, @ Surface mounted on  FR-4 board, t ≤ TJ ≤ 150°C 10sec. 

www.irf.com 

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**==> picture [205 x 477] intentionally omitted <==**

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100<br>VG@SI— 4<br> TOP         - 15V<br>                 - 10V<br>                 - 7.0V<br>                 - 5.5V eer<br>                 - 4.5V                 - 4.0V ee ee<br>                 - 3.5V BOTTOM - 3.0V ae7 ee elae<br>10 fri Gans<br>S$ SD OT<br>wy /7/i,6-di enn<br>KLE or<br>VY gra anni<br> -3.0V  T   = 25°CJ<br>1<br>0.1 1 10<br>-V     , Drain-to-Source Voltage (V)DS<br>Fig 1.   Typical Output Characteristics<br>100 === eS Se<br>eee eee ee<br>ee ee ee<br>pf<br>T  = 25°CJ<br>10 ot ftaT T  = 150°CJ ep<br>| |<br>a,aof+deneeeuen4aee eee<br>YA +4  V     = -10VDS -F<br>1 CL |_| cos eurse won<br>3.0 3.5 4.0 4.5 5.0 5.5 6.0<br>-V     , Gate-to-Source Voltage (V)GS<br>D<br>-I   , Drain-to-Source Current (A)<br>D<br>-I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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100<br>VG@SI— 4<br> TOP         - 15V<br>                 - 10V<br>                 - 7.0V<br>                 - 5.5V eer<br>                 - 4.5V                 - 4.0V ee eeee<br>                 - 3.5V BOTTOM - 3.0V eneaeeel<br>10 fFME.<br>OS Jn<br>ee 1/7,anne<br>|<br> -3.0V<br>JU"h| f<br> T   = 150°CJ<br>1<br>0.1 1 10<br>-V     , Drain-to-Source Voltage (V)DS<br>Fig 2.   Typical Output Characteristics<br>100 ==5=5===—=_—<br>ee<br>en<br>10 | | dL dLeT<br>T  = 150°CJ<br>| = a | eee<br>A T  = 25°CJ<br>1 f r)<br>—A_f_|4||<br>Se SSSe<br>0.1 5aeseeeeeeer<br>0.4 0.6 0.8 1.0 1.2 1.4 1.6<br>-V     , Source-to-Drain Voltage (V)SD<br>D<br>-I   , Drain-to-Source Current (A)<br>SD<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 4.** Typical Source-Drain Diode Forward Voltage 

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**==> picture [432 x 210] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0<br>T T «. “Mo<br>1.5 PEEEEELEELELe QD&oO<br>1.0 NARA sth (e)§ PPT |<br>E nn D> <a 0000 00 0 J<br>0.5 PELL oer e=} fpEee<br>OU NSUU REGUEEE)OREO OU OR EY le@ TT i|inft<br>0.0 PEPPERPE = -10V A o2 00: Eb best<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 0) 2 4 6 8 10<br>T   , Junction Temperature (°C)J<br> ( Ω )<br>(Normalized)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 5.** Normalized On-Resistance Vs. Temperature 

**Fig 6.** Typical On-Resistance Vs. Drain Current 

**==> picture [9 x 30] intentionally omitted <==**

**----- Start of picture text -----**<br>
ee<br> ( Ω )<br>**----- End of picture text -----**<br>


**Fig 7.** Typical On-Resistance Vs. Gate Voltage 

www.irf.com 

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**==> picture [435 x 473] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 20<br>V      = 0V,         f = 1MHzGS  I    = -2.7AD<br>C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds<br>C      = Crss         gd<br>800 aNNe C      = C     + Coss        ds         gd 16 PoppoEE  V      = -15VDS<br>| NNO P| | Py<br>s<br>600 PT Ne 12 pt OY | |<br>ss<br>400 ea n il, 8 Pt Lye |<br>NSE Sl pS tT tT yw<br>ss<br>200 ee SSR 4 PEt LAA<br>a ell PF | wt | |<br>0 a iell| A 0 71} y_ | | | roar     SEE FIGURE 9<br>1 10 100 0 5 10 15 20 25 30<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 8.   Typical Capacitance Vs. Fig 9.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>D = 0.50<br>Aa 0.20 i | tt<br> 10 o eII<br>0.10<br>0.05<br>eee eens Si eeel<br>P 0.02 Leset PDM<br> 1 0.01<br>T T t1<br>= TCT TTT<br>t2<br>SINGLE PULSE Notes:<br>(THERMAL RESPONSE) 1. Duty factor D = t   / t1 2<br>af 2. Peak T J = P DM x  Z thJA + TA<br>0.1 mull THAN ELT<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>-V     , Gate-to-Source Voltage (V)<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 10.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

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## Micro8 Package Outline 

Dimensions are shown in milimeters (inches) 

**==> picture [301 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
LEAD ASSIGNMENTS       INCHES        MILLIMETERS<br>D DIM   MIN       MAX       MIN      MAX<br>- B - 3 D  D  D  D D1 D1 D2 D2 A       .036       .044        0.91      1.11<br>A1     .004       .008        0.10      0.20<br>[= 8   7   6   5 8   7   6   5 PET B       .010       .014        0.25      0.36<br>3 E 8   7   6   5 H SINGLE DUAL C       .005       .007        0.13      0.18D       .116       .120        2.95      3.05<br>- A - 0.25  (.010)       M     A    M 1   2   3   4 1   2   3   4 e        .0256 BASIC        0.65 BASIC<br>1   2   3   4 e1      .0128 BASIC        0.33 BASIC<br>S  S  S  G S1 G1 S2 G2 E       .116       .120         2.95      3.05<br>H       .188       .198        4.78       5.03<br>e L        .016      .026         0.41       0.66<br>att 6X —— θ          0°          6°           0°           6°<br>e 1<br>θ RECOMMENDED FOOTPRINT<br>A  1.04   0.38<br>- C - Hoytei 0.10  (.004) | ( .041 )   8X ( .015 )  [8X]<br>B     8X A 1 L C<br>ee eee ee 8X 8X i ea<br>0.08  (.003)         M    C   A  S    B   S   3.20   4.24   5.28<br>( .126 ) ( .167 ) ( .208 )<br>       1  DIMENSIONING AND TOLERANCING PER ANSI Y14.5M-1982.<br>       2  CONTROLLING DIMENSION : INCH.    0.65<br>       3  DIMENSIONS DO NOT INCLUDE MOLD FLASH. ( .0256 ) [6X]<br>**----- End of picture text -----**<br>


NOTES: 

- 1  DIMENSIONING AND TOLERANCING PER ANSI Y14.5M-1982. 

- 2  CONTROLLING DIMENSION : INCH. 

- 3  DIMENSIONS DO NOT INCLUDE MOLD FLASH. 

## Micro8 Part Marking Information 

EXAMPLE: THIS IS AN IRF7501 

LOT CODE (XX) PART NUMBER 

DATE CODE (YW) - See table below Y =  YEAR W =  WEEK P =  DESIGNATES LEAD - FREE PRODUCT (OPTIONAL) 

WW =  (1-26) IF PRECEDED BY LAST DIGIT OF CALENDAR YEAR 

|||WORK|WORK|||
|---|---|---|---|---|---|
|YEAR|Y|WEEK||W||
|2003<br>2002<br>2001<br>2004|3<br>2<br>1<br>4|03<br>02<br>01<br>04||C<br>B<br>A<br>D||
|2005|5|||||
|2006|6|||||
|2007|7|||||
|2008|8|||||
|2009<br>2010|9<br>0|26<br>24<br>25||Z<br>X<br>Y||



WW =  (27-52) IF PRECEDED BY A LETTER 

|||WORK|WORK|||
|---|---|---|---|---|---|
|YEAR|Y|WEEK||W||
|2001|A|27||A||
|2002|B|28||B||
|2003|C|29||C||
|2004|D|30||D||
|2005|E|||||
|2006|F|||||
|2007|G|||||
|2008|H|||||
|2009|J|||||
|2010|K|50||X||
|||51||Y||
|||52||Z||



www.irf.com 

6 

## Micro8 Tape & Reel Information 

Dimensions are shown in millimeters (inches) 

**==> picture [210 x 339] intentionally omitted <==**

**----- Start of picture text -----**<br>
TERMINAL NUMBER 1<br>Oo Oo Oo ©<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 ) Lo FEED DIRECTION<br>7.9 ( .312 )<br> 330.00<br>(12.992)<br>  MAX.<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES: 

1.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

2.   CONTROLLING DIMENSION : MILLIMETER. 

NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 05/04 

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7 



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- [Supplier page](https://es.farnell.com/infineon/irf7606trpbf/mosfet-p-ch-30v-3-6a-usoic-8/dp/2803414)
---

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