# Power MOSFET, N Channel, 100 V, 7.3 A, 0.022 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2803413/)

**URL**: https://novapart.co/products/IRF7495TRPBF/power-mosfet-n-channel-100-v-73-a-0022-ohm-soic
**SKU**: IRF7495TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5120
**Stock**: 10+
**Lead Time**: 35 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:7.3A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.018ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 7.3A |
| Drain Source On State Resistance | 0.022ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2803413/)

## IRF7495PbF HEXFET Power MOSFET 

## **Applications** 

High frequency DC-DC converters Lead-Free 

|**VDSS**|**RDS(on) max**|**ID**|
|---|---|---|
|**100V**|**22m**<br>**@VGS = 10V**|**7.3A**|



## **Benefits** 

Low Gate to Drain Charge to Reduce Switching Losses Fully Characterized Capacitance Including Effective COSS to Simplify Design, (See App. Note AN1001) 

Fully Characterized Avalanche Voltage and Current 

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## **Absolute Maximum Ratings** 

||**Parameter**|**Max.**|**Units**|
|---|---|---|---|
|VDS|Drain-to-Source Voltage<br>~~a~~|100<br>~~a~~|V<br>~~a~~<br>~~a~~|
|VGS<br>~~—_—_———~~|Gate-to-Source Voltage<br>~~a~~<br>~~—_—_———~~|± 20<br>~~a~~<br>~~en~~||
|ID@ TA= 25°C<br>~~—_—_———~~|Continuous Drain Current, VGS@ 10V<br>~~a~~<br>~~—_—_———~~|7.3<br>~~a~~<br>~~en~~|A<br>~~a~~<br>~~a~~|
|ID@ TA= 100°C<br>~~—_—_———~~|Continuous Drain Current, VGS@ 10V<br>~~a~~<br>~~—_—_———~~|4.6<br>~~a~~<br>~~en~~||
|IDM<br>~~—_—_———~~|Pulsed Drain Current<br>~~—_—_———~~|58<br>~~en~~||
|PD@TA= 25°C<br>~~—_—_———~~|Maximum Power Dissipation<br>~~—_—_———~~<br>~~a~~|2.5<br>~~en~~<br>~~a~~|W<br>~~a~~|
||Linear Derating Factor<br>~~a~~<br>~~RG~~|0.02<br>~~a~~<br>~~RG~~<br>~~ee~~|W/°C<br>~~a~~<br>~~RG~~|
|dv/dt|Peak Diode Recovery dv/dt<br>~~RG~~<br>~~ee~~|7.3<br>~~RG~~<br>~~ee~~<br>~~ee~~|V/ns<br>~~RG~~<br>~~ee~~|
|TJ<br>TSTG|Operating Junction and<br>Storage Temperature Range<br>~~ee~~|-55  to + 150<br>~~ee~~<br>~~ee~~|°C<br>~~ee~~|



> Notes ® hrough © are on page 8 www.irf.com 

1 

9/21/04 

## IRF7495PbF 

## **Static @ TJ = 25°C (unless otherwise specified)** 

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||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|V(BR)DSS|es|Drain-to-Source Breakdown Voltage|ee|100|Gs|–––|–––|V|VGS = 0V, ID = 250µA|
|∆V(BR)DSS/∆TJ|Ps|Breakdown Voltage Temp. Coefficient|–––|nn|Gs|0.10|–––|Gd|V/°C|Reference to 25°C, ID = 1mA|
|RDS(on)|es|Static Drain-to-Source On-Resistance|–––|en|Os|18|22|mΩ|VGS = 10V, ID = 4.4A|
|VGS(th)|es|Gate Threshold Voltage|2.0|en|Gs|–––|4.0|V|VDS = VGS, ID = 250µA|
|IDSS|Drain-to-Source Leakage Current|–––|–––|20|µA|VDS = 100V, VGS = 0V|
|ee|–––|||–––|250|VDS = 80V, VGS = 0V, TJ = 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|200|nA|VGS = 20V|
|———|Gate-to-Source Reverse Leakage||TT|–––|–––|-200|VGS = -20V|
|Dynamic @ TJ = 25°C (unless otherwise specified)|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|gfs|es|Forward Transconductance|11|en|Gd|–––|–––|S|VDS = 25V, ID = 4.4A|
|Qg|ee|Total Gate Charge|–––|ee|ee|34|51|ID = 4.4A|
|Qgs|ee|Gate-to-Source Charge|–––|6.3|–––|nC|VDS = 50V|
|Qgd|Gate-to-Drain ("Miller") Charge|–––|11.7|–––|VGS = 10V|
|es|eeee|es|@|
|td(on)|es|Turn-On Delay Time|–––|ee|es|8.7|–––|VDD = 50V|
|tr|ee|Rise Time|–––|ee|ee|13|–––|ID = 4.4A|
|td(off)|ee|Turn-Off Delay Time|–––|10|–––|ns|RG = 6.2Ω|
|tf|Fall Time|–––|36|–––|VGS = 10V|
|ee|ee|ee|@|
|Ciss|ee|Input Capacitance|–––|ee|1530|–––|VGS = 0V|
|Coss|ee|Output Capacitance|–––|ee|250|ee|–––|VDS = 25V|
|Crss|ee|Reverse Transfer Capacitance|–––|ee|110|–––|pF|ƒ = 1.0MHz|
|Coss|ee|Output Capacitance|–––|ee|980|ee|–––|VGS = 0V,  VDS = 1.0V,  ƒ = 1.0MHz|
|Coss|ee|Output Capacitance|–––|160|–––|VGS = 0V,  VDS = 80V,  ƒ = 1.0MHz|
|Coss eff.|Effective Output Capacitance|–––|240|–––|VGS = 0V, VDS = 0V to 80V|
|es|eeee|e|se|©|
|Avalanche Characteristics|
|Parameter|Typ.|Max.|Units|
|EAS|Single Pulse Avalanche Energy|–––|180|mJ|
|ee|Ge|
|IAR|Avalanche Current|–––|4.4|A|
|ee|
|Diode|Characteristics|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|2.3|MOSFET symbol|D|
|(Body Diode)|A|showing  the|
|ISM|Pulsed Source Current|–––|–––|58|integral reverse|G|
|S|
|(Body Diode)|p-n junction diode.|
|VSD|ee|Diode Forward Voltage|–––|en|Gs|–––|Ge|1.3|V|TJ = 25°C, IS = 4.4A, VGS = 0V|
|trr|+++|Reverse Recovery Time|–––|42|–––|ns|TJ = 25°C, IF = 4.4A, VDD = 25V|
|Qrr|Reverse Recovery Charge|–––|73|–––|nC|di/dt = 100A/µs|
|ee|es|Gs|@|
|ton|es|Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)|

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www.irf.com 

2 

## IRF7495PbF 

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100 100<br>SESE VGS P eco EEE IE VGS<br>TOP           15V TOP           15V<br>10V 10V<br>HE) A a 8.0V E e 8.0V<br>MBE 5.0V 1p. el 5.0V<br>BOTTOM 4.5V 4.5V BOTTOM 4.5V<br>Saeco 4.5V oe<br>7 Peni A L<br>TM LM EE A<br>fo pr TT<br>10 L AAT IM LI 10 y / e<br>oo ey Atee<br>V7 | i iii tT TT A<br>Y Tt TT EE F/M |<br>PCI CI CI Co AN A<br>20µs PULSE WIDTH 20µs PULSE WIDTH<br>Tj = 25°C Tj = 150°C<br>1 1<br>0.1 1 10 100 1000 0.1 1 10 100 1000<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

**Fig 2.** Typical Output Characteristics 

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100<br>r r<br>T = 150°C<br>J<br>10<br>ae<br>Ee ey As ee<br>T = 25°C<br>J<br>1 P P<br>— / -+ —<br>V = 50V<br>DS<br>20µs PULSE WIDTH<br>0.1 |ee ee<br>2 3 4 5<br>VGS, Gate-to-Source Voltage (V)<br>)(Α<br>ID, Drain-to-Source Current<br>**----- End of picture text -----**<br>


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2.5<br>ID = 7.3A<br>VGS  a = 10V PTT LL LLL<br>2.0<br>He<br>1.5 Z|<br>P AT<br>1.0 L EELA<br>aL ELLE<br>0.5 “a ELL ET<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>TJ , Junction Temperature (°C)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance vs. Temperature 

www.irf.com 

3 

## IRF7495PbF 

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100000<br>VGS   = 0V,       f = 1 MHZ<br>Ciss   = C gs + Cgd,  C ds SHORTED<br>Crss    = Cgd<br>10000 | | Coss   = Cds + Cgd |<br>ee<br>Pt HH<br>Ciss<br>1000 el l<br>a eee Coss a SRE<br>100 Crss<br>ee eee<br>10<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


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12.0<br>I = 4.4A<br>D<br>10.0 VDS= 80V<br>V = 50V<br>DS 4 /<br>8.0 VDS= 20V Ae,7<br>6.0 VA<br>4.0<br>Lf<br>2.0<br>0.0<br>0 10 20 30 40<br> QG  Total Gate Charge (nC)<br>VGS, Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge vs. Gate-to-Source Voltage 

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100.00 1000<br>OPERATION IN THIS AREA<br>SEE eae eee Sei LIMITED BY R DS(on)<br>10.00 100<br>T = 150°C<br>J<br>Ee ee ey Ae es A ee ee Yr [AT Ss TEN ST<br>ee ee ee ee ee ee ee eee Pt TT STN S T<br>1.00 10<br>e y ae A U S 100µsec Cy<br>TJ = 25°C 1msec<br>0.10 e e ee 1 r H TAT TI<br>TA = 25°C<br>Tj = 150°C<br>10msec<br>VGS = 0V Single Pulse<br>0.01 ee ee 0.1 mMCTUpl<br>0.0 0.2 0.4 0.6 0.8 1.0 0 1 10 100 1000<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

www.irf.com 

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## IRF7495PbF 

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8<br>Rp<br>7<br>6 P IN N vgs D.U.T.<br>5 P NKaN r a ° -<br>N<br>4<br>≤ 1<br>Duty Factor ≤ 0.1 %<br>3<br>\ Tt<br>2 Fig 10a.   Switching Time Test Circuit<br>1 a e V90%DS90%DSDS fi<br>0<br>25 50 75 100 125 150<br> TA , Ambient Temperature (°C)<br>ID,  Drain Current (A)<br>**----- End of picture text -----**<br>


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V90%DS90%DSDS fi<br>10% /\ A<br>VGS |\« le >|TYPr<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 9.** Maximum Drain Current vs. Ambient Temperature 

**Fig 10b.** Switching Time Waveforms 

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100<br>a a a a ee |<br>D = 0.50 tT rm HI<br>10 a 0.20 ee eo | |<br>_ 0.10 c e<br>— 0.05 ek ee | |<br>a mmm ee<br>1 0.02<br>0.01<br>| | fom<br>a a ec | |_|<br>0.1<br>ae e a eeeelll aaz<br>SINGLE PULSE<br>Sn ott are eee 0 | |<br>( THERMAL RESPONSE )<br>0.01 StiTT ay yi PETUICHEEL LLL IT 21. Dutytesorpeek tu- pone Dm ty itzman +t<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJA )<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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## IRF7495PbF 

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25 50<br>II I<br>40<br>20<br>S o V e = 10V n een<br>GS<br>e er a aen E EE<br>30<br>15<br>TA LE LEER<br>20 I = 4.4A<br>D<br>C CE h t e<br>P y LL L<br>10 10<br>0 10 20 30 40 50 60 70 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16<br>ID , Drain Current (A) VGS, Gate -to -Source Voltage  (V)<br>Fig 12.    On-Resistance vs. Drain Current Fig 13.    On-Resistance vs. Gate Voltage<br>QG<br>L<br>DUT VCC QGS QGD 500<br>0 1K ID<br>VG TOP         2.0A<br>400 3.5A<br>Charge<br>BOTTOM 4.4A<br>a ad c o<br>Fig 14a&b.   Basic Gate Charge Test Circuit 300<br>N U<br>and Waveform<br>200 S N EEL<br>15V<br>100<br>V(BR)DSS<br>tp VDS L DRIVER<br>R G D.U.T + 0 | LOSS<br>IAS - [V][DD] A 25 50 75 100 125 150<br>20V<br>I AS A tp 0.01Ω SQ Starting TJ , Junction Temperature (°C)<br>)Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>)Ω<br>RDS (on) , Drain-to-Source On Resistance (m<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 15a&b.** Unclamped Inductive Test circuit and Waveforms 6 

**Fig 15c.** Maximum Avalanche Energy vs. Drain Current 

www.irf.com 

## IRF7495PbF 

## **SO-8 Package Outline** 

Dimensions are shown in millimeters (inches) 

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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>8 7 6 o 5 ee c .0075 .0098 ee 0.19 ee 0.25 ee<br>i 6 [no] - H a D .189 .1968 4.80 5.00<br>E<br>0.25 [.010]  A E .1497 .1574 3.80 4.00<br>1 2 3 4<br>oe ee e .050  BASIC 1.27  BASIC<br>—— ———<br>Too a e1 .025  BASIC ee 0.635  BASIC ee<br>oO ee ee<br>H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X cb e ok ee L .016 .050 0.40 1.27<br>ee<br>a y  0°  8°  0°  8°<br>e1 K x 45°<br>A<br>= FL C re<br>y<br>ma if<br>0.10 [.004]<br>ae 8X b i A1 ves M L 8X L 8X c S<br>[eo] 0.25 [.010]  C FT| A B 7<br>FOOTPRINT<br>NOTES:<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>“load<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>i rT |<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>     A SUBSTRATE.<br>00003<br>3X 1.27 [.050] ee<br>8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## **SO-8 Part Marking** 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

DATE CODE (YWW) 

XXXX INTERNATIONAL F7101 a ~~i~~ e RECTIFIERLOGO THEE 

- P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) 

- Y =  LAST DIGIT OF THE YEAR WW =  WEEK 

- A =  ASSEMBLY SITE CODE 

LOT CODE 

PART NUMBER 

www.irf.com 

7 

## IRF7495PbF 

**SO-8 Tape and Reel** 

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TERMINAL NUMBER 1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) FEED DIRECTION<br>NOTES:<br>**----- End of picture text -----**<br>


1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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g  330.00<br>(12.992)<br>  MAX.<br>Way<br>14.40 ( .566 )<br>12.40 ( .488 )<br>NOTES :<br>**----- End of picture text -----**<br>


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1. CONTROLLING DIMENSION : MILLIMETER.<br>**----- End of picture text -----**<br>


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2. OUTLINE CONFORMS TO EIA-481 & EIA-541.<br>**----- End of picture text -----**<br>


Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 19mH RG = 25Ω, IAS = 4.4A. When mounted on 1 inch square copper board,  t ≤ 10 sec. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. 

Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. 

ISD ≤ 5.8A, di/dt ≤ 250A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 09/04 

www.irf.com 

8 



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- [Supplier page](https://es.farnell.com/infineon/irf7495trpbf/mosfet-n-ch-100v-7-3a-soic-8/dp/2803413)
---

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