# Power MOSFET, N Channel, 12 V, 15 A, 0.006 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2781117/)

**URL**: https://novapart.co/products/IRF7476TRPBF/power-mosfet-n-channel-12-v-15-a-0006-ohm-soic
**SKU**: IRF7476TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1940
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 4.5V |
| On Resistance Rds(On) | 0.006ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 12V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 0.006ohm |
| Gate Source Threshold Voltage Max | 1.9V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2781117/)

## IRF7476PbF 

# HEXFET ® Power MOSFET 

## **Applications** 

High Frequency 3.3V and 5V input Pointof-Load Synchronous Buck Converters for Netcom and Computing Applications. Power Management for Netcom, Computing and Portable Applications. Lead-Free 

## **Benefits** 

Ultra-Low Gate Impedance Very Low RDS(on) Fully Characterized Avalanche Voltage and Current 

a **VDSS RDS(on) max ID** ee **[12V] 8.0** eo **m @VGS = 4.5V** ee **15A** 

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A<br>A<br>S 1 8 D<br>S 2 7 D<br>S 3 6 D<br>G 4 5 D<br>SO-8<br>Top View<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

Po **Symbol Parameter Max. Units** I VDS Drain-Source Voltage 12 V GO VGS                                     Gate-to-Source Voltage ±12                                   V ~~ns~~ ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 15 ID @ TA = 70°C Continuous Drain Current, VGS @ 10V 12 A IDM Pulsed Drain Current 120 ~~ee——————————GO ne~~ PD @TA = 25°C Maximum Power Dissipation 2.5 W ~~Re ©~~ PD @TA = 70°C Maximum Power Dissipation 1.6 W ~~Re ©~~ Linear Deratin ~~I~~ g Factor                                                                     0.02                              W/°C ~~GG~~ TJ , TSTG Junction and Storage Temperature Range -55  to + 150 °C 

**Thermal Resistance** 

**Symbol Parameter Typ. Max. Units** ~~eeen~~ RθJL Junction-to-Drain Lead ––– 20 RθJA Junction-to-Ambient ––– 50 °C/W es ~~S~~ ~~**e** ee n~~ ( ~~ne~~ 

Notes oO) hrough ® are on page 8 www.irf.com 

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## IRF7476PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

|**Parameter**<br>**Min. Typ. Max.**<br>**Units**<br> **Conditions**<br>V(BR)DSS<br>Drain-to-Source Breakdown Voltage<br>12<br>–––<br>–––<br>V<br>VGS= 0V, ID= 250µA<br>∆V(BR)DSS/∆TJBreakdown Voltage Temp. Coefficient –––     0.014    –––   V/°C    Reference to 25°C, ID= 1mA<br>–––<br>6.0<br>8.0<br>VGS= 4.5V, ID= 15A<br>–––<br>12<br>30<br>VGS= 2.8V, ID= 12A<br>VGS(th)<br>Gate Threshold Voltage<br>0.6<br>–––<br>1.9<br>V<br>VDS= VGS, ID= 250µA<br>RDS(on)<br>Static Drain-to-Source On-Resistance<br>mΩ<br>rs<br>ts rsre rs<br>en<br>~~GG~~<br>~~es~~<br>~~es se~~<br>~~Bo~~<br>===<br>~~es~~|
|---|
|–––<br>–––<br>100<br>µA<br>VDS= 9.6V, VGS= 0V<br>–––<br>–––<br>250<br>VDS= 9.6V, VGS= 0V, TJ= 125°C<br>Gate-to-Source Forward Leakage<br>–––<br>–––<br>200<br>VGS= 12V<br>Gate-to-Source Reverse Leakage<br>–––<br>–––<br>-200<br>nA<br>VGS= -12V<br>IGSS<br>IDSS<br>Drain-to-Source Leakage Current<br>~~|~~<br>~~Pf~~<br>~~**|**~~<br>~~a~~<br>~~Ps~~<br>rs Ge|
|**Dynamic @ TJ = 25°C (unless otherwise specified)**|
|**Symbol**<br>**Parameter**<br>**Min.**<br>**Typ. Max. Units**<br> **Conditions**<br>gfs<br>Forward Transconductance<br>31<br>–––<br>–––<br>S<br>VDS= 6.0V, ID= 12A<br>ee<br>ee ee<br>ee<br>es|
|Qg<br>Total Gate Charge<br>–––<br>26      40                ID= 12A<br>Qgs<br>Gate-to-Source Charge<br>–––<br>4.6<br>–––<br>nC<br>VDS= 10V<br>Qgd<br>Gate-to-Drain ("Miller") Charge<br>–––<br>11<br>–––<br>VGS= 4.5V<br>~~ee~~<br>es<br>~~Rs~~|
|Qoss<br>Output Gate Charge<br>–––<br>17<br>–––<br>VGS= 0V, VDS= 5.0V<br>a|
|ns<br>td(on)<br>Turn-On Delay Time<br>–––<br>11<br>–––<br>VDD= 6.0V<br>tr<br>Rise Time<br>–––<br>29<br>–––<br>ID= 12A<br>td(off)<br>Turn-Off Delay Time<br>–––<br>19<br>–––<br>RG= 1.8Ω<br>tf<br>Fall Time<br>–––<br>8.3<br>–––<br>VGS= 4.5V<br>Ciss<br>Input Capacitance<br>–––<br>2550<br>–––<br>VGS= 0V<br>Coss<br>Output Capacitance<br>–––<br>2190<br>–––<br>VDS= 6.0V<br>a<br>aee<br>ee<br>eeee<br>~~ee~~<br>~~a~~<br>es<br>~~a~~|
|Crss<br>Reverse Transfer Capacitance<br>–––<br>450<br>–––<br>pF<br>ƒ = 1.0MHz|



**Dynamic @ TJ = 25°C (unless otherwise specified)** 

## **Avalanche Characteristics** 

|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>EAS<br>Single Pulse Avalanche Energy<br>–––<br>160<br>mJ<br>IAR<br>Avalanche Current<br>–––<br>12<br>A<br>—————————————<br>a|
|---|
|**Diode Characteristics**|
|**Symbol**<br>**Parameter**<br>**Min.**<br>**Typ. Max. Units**<br> **Conditions**<br>IS<br>Continuous Source Current<br>MOSFET symbol<br>(Body Diode)<br>–––<br>–––<br>showing  the<br>ISM<br>Pulsed Source Current<br>integral reverse<br>(Body Diode)<br>–––<br>–––<br>p-n junction diode.<br>S<br>D<br>G<br>2.5<br>120<br>~~ne~~<br>~~ee~~|
|2<br>www.irf.com<br>–––<br>0.87<br>1.2<br>V<br>TJ= 25°C, IS= 12A, VGS= 0V<br>–––<br>0.73<br>–––<br>TJ= 125°C, IS= 12A, VGS= 0V<br>trr<br>Reverse Recovery Time<br>–––<br>55<br>82<br>ns<br>TJ= 25°C, IF= 12A, VR=12V<br>Qrr<br>Reverse Recovery Charge<br>–––<br>59<br>89<br>nC<br>di/dt = 100A/µs<br>trr<br>Reverse Recovery Time<br>–––<br>54<br>81<br>ns<br>TJ= 125°C, IF= 12A, VR=12V<br>Qrr<br>Reverse Recovery Charge<br>–––<br>60<br>90<br>nC<br>di/dt = 100A/µs<br>VSD<br>Diode Forward Voltage<br>~~oo~~<br>| |<br>@<br>-—<br>_<br>RR<br>©)<br>nn<br>es<br>©|



## IRF7476PbF 

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1000<br>PSEC CEE top tov<br>100<br>10 e ae ell a7<br>a ee.<br>1 nS S Ses eS a el<br>0.1 P| T |)TA|<br>E EF<br>P E 1.5V<br>ee. TS<br>0.01 a tl ee 00 e eeell<br>= Sere<br>20µs PULSE WIDTH<br>el Pe to Tj = 25°C CT<br>0.001<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br>1000.00<br>Es es es<br>100.00 e s ee ee<br>p a T s = 150°C es>fes es<br>J<br>10.00 A ys F| | | |<br>T = 25°C<br>1.00 yff f J  |f||__|<br>Se ee eee es eS aes<br>V = 10V<br>0=——ae eee DS  ;—<br>20µs PULSE WIDTH<br>0.10 yf [|_|] fp} ft SY<br>1.5 2.0 2.5 3.0 3.5 4.0<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>)<br>(Α<br>ID, Drain-to-Source Current<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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1000<br>F AH PY,<br>100<br>| a a7V<br>10<br>EO eI<br>ee ONL ee eee ad |eT<br>a<br>1 S S<br>1.5V<br>Se Sat — eeeeeaa<br>a eeeeee ee ee<br>ee<br>0.1 P SS SEES E ray<br>—— a 20µs PULSE WIDTH i<br>Tj = 150°C<br>0.01 FEATeli pameal<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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2.0<br>ID = 15A<br>1.5 PELEPEELEELEEELLLereT | |<br>1.0 ELE LTTeer|<br>LEELA<br>0.5 EEE<br>0.0 FELLER EE V GS = 4.5V<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>Tj, Junction Temperature (°C)<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRF7476PbF 

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100000 6<br>VGS   = 0V,       f = 1 MHZ ID = 12A<br>= — CCiss rss    = C = Cgs gd + Cgd,  Cds SHORTED 5 en P| | | | VVVDSDSDS ===  9.6V 6V 2.4V aanTO<br>— Coss  = Cds + Cgd P| | | NGe<br>10000 oe 4 SeeeERE87748<br>a ee ee ee eee<br>Ciss 3<br>Coss<br>ea eeelll Sannn/,/4nen0<br>1000 2<br>p t ptt [ae]<br>Crss 1<br>Pe e r TTT OLLLLL<br>100 PT EE EE 0 Vititity tye<br>1 10 100 0 5 10 15 20 25 30<br>VDS, Drain-to-Source Voltage (V) Q   , Total Gate Charge (nC)G<br>GS<br>C, Capacitance(pF) V     , Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance Vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge Vs. Gate-to-Source Voltage 

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 1000 1000<br>OPERATION IN THIS AREA<br>a eee eee eee pt LIMITED BY R DS(on) ll<br> 100 100<br>| ee pose T T<br>100µsec<br>ee SSAA<br> 10 A T  = 150      CJ ° 10 1msec Hl<br>S a KA RA<br>10msec<br> 1 T  = 25      CJ ° 1<br>Soe sn eeee nee E A NE<br>Tc = 25°C<br>Tj = 150°C<br>0.1 oe V      = 0 V GS 0.1 Single Pulse CCE oe<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 10 100<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>I     , Reverse Drain Current (A)SD ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


## **Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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## IRF7476PbF 

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15 BNE Vos Be<br>12 PL RA tT Ves<br>SERN Re oa<br>-<br>9<br>pi} ft} IN Yoo<br>ppt PEN AsV ≤ 1<br>≤ 0.1 %<br>6<br>copper<br>Fig 10a.   Switching Time Test Circuit<br>3 Pit tt Ty [TT]<br>VDS<br>Cope 90% —<br>0 pt te tt Tt Y |<br>25 50 75 100 125 150<br>°<br>10%<br>Fig 9.    Maximum Drain Current Vs. VGS —_———\ /\ |<br>Case Temperature td(on) tr td(off) tf<br>Fig 10b.   Switching Time Waveforms<br> 100<br>S D = 0.50 aTT<br> 10 A 0.20 =<br>0.10<br>0.05<br>a eee<br>0.02 P DM<br>e mer<br> 1 0.01 peruicd MIE CT t 1<br>SINGLE PULSE<br>(THERMAL RESPONSE) t 2<br>a cess O ee e s e i c Notes:<br>1. Duty factor D = t   / t1 2<br>a 2. Peak T J = P DM x  Z thJA + T A<br>0.1<br>ee<br>0.0001 0.001 0.01 0.1  1  10  100  1000<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJA<br>(Z          )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 10.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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## IRF7476PbF 

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7.5 15.00<br>AT<br>13.00<br>+ --+ e e<br>7.3<br>S e) e e<br>11.00<br>VGS = 4.5V<br>er e ee<br>7.0<br>r T an 9.00 r yt<br>6.8 a fy n ID = 15A e<br>7.00<br>|[A 4 ee<br>P S) Se o<br>6.5 Ff tf | tf 5.00 P EEoe<br>0 20 40 60 80 100 120 2.0 4.0 6.0 8.0 10.0<br>ID , Drain Current (A) VGS, Gate -to -Source Voltage  (V)<br>)<br>Ω<br>RDS (on) , Drain-to-Source On Resistance (m<br>)<br>Ω<br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance Vs. Drain Current 

**Fig 13.** On-Resistance Vs. Gate Voltage 

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Current Regulator<br>Same Type as D.U.T.<br>QG<br>50KΩ<br>12V .2µF<br>.3µF QGS QGD<br>D.U.T. +-VDS VG 400 I D<br>VGS TOP 5.4A<br>3mA Charge 9.6A<br>OES IG ID | K p BOTTOM 12A<br>Current mofo Sampling Resistors : 300 NE<br>P NP<br>Fig 13a&b.   Basic Gate Charge Test Circuit<br>and Waveform<br>200<br>GRNEESEEEE<br>\URNEEEEEe<br>15V<br>100<br>BNNGNEEEEE<br>V(BR)DSS<br>tp VDS L DRIVER<br>_ SRN<br>R G IASD.U.T +- [V][DD] A 0 25 50 75 100 125 150<br>20V<br>I AS /\ : tp 0.01Ω Po Starting Tj, Junction Temperature (°C) S S AL<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 14a&b.** Unclamped Inductive Test circuit and Waveforms 

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**Fig 14c.** Maximum Avalanche Energy Vs. Drain Current 

www.irf.com 

## IRF7476PbF 

## SO-8  Package Outline 

Dimensions are shown in milimeters (inches) 

## SO-8 Part Marking Information 

www.irf.com 

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## IRF7476PbF 

## **SO-8 Tape and Reel** 

Dimensions are shown in millimeters (inches) 

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TERMINAL NUMBER 1<br>ood 0) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTION a<br>**----- End of picture text -----**<br>


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NOTES:<br>**----- End of picture text -----**<br>


1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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 330.00<br>(12.992)<br>  MAX.<br>PY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

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1. CONTROLLING DIMENSION : MILLIMETER.<br>**----- End of picture text -----**<br>


2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 2.3mH RG = 25Ω, IAS = 12A. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. When mounted on 1 inch square copper board. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 04/2006 

www.irf.com 

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- [Supplier page](https://es.farnell.com/en-ES/infineon/irf7476trpbf/mosfet-n-ch-12v-15a-soic/dp/2781117)
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