# Power MOSFET, N Channel, 100 V, 6.9 A, 0.026 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2803411/)

**URL**: https://novapart.co/products/IRF7473TRPBF/power-mosfet-n-channel-100-v-69-a-0026-ohm-soic
**SKU**: IRF7473TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.5100
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:6.9A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.022ohm; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 6.9A |
| Drain Source On State Resistance | 0.026ohm |
| Gate Source Threshold Voltage Max | 5.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2803411/)

## **Applications** 

Telecom and Data-Com 24 and 48V input DC-DC converters Motor Control . Uninterrutible Power Supply Lead-Free 

## PD- 95559 IRF7473PbF HEXFET Power MOSFET 

**VDSS RDS(on) max ID** -—}—, **[100V] 26m @VGS = 10V 6.9A** 

## **Benefits** 

Ultra Low On-Resistance High Speed Switching : Low Gate Drive Current Due to Improved Gate Charge Characteristic Improved Avalanche Ruggedness and Dynamic dv/dt Fully Characterized Avalanche Voltage and Current 

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## **Typical SMPS Topologies** 

Full and Half Bridge 48V input Circuit Forward 24V input Circuit 

## **Absolute Maximum Ratings** 

**Parameter Max. Units** ~~ee~~ ID @ TA = 25°C ~~es~~ Continuous Drain Current, VGS @ 10V 6.9 ID @ TA = 70°C ~~PO~~ Continuous Drain Current, VGS @ 10V 5.5 A ~~el~~ IDM Pulsed Drain Current 55 PD @TA = 25°C Power Dissipation 2.5 W ~~esnD a~~ Linear Derating Factor 0.02 W/°C VGS Gate-to-Source Voltage ± 20 V ~~i~~ dv/dt Peak Diode Recovery dv/dt ~~ph~~ 5.8 V/ns TJ Operating Junction and -55  to + 150 TSTG Storage Temperature Range °C Soldering Temperature, for 10 seconds 300 (1.6mm from case ) ~~eee~~ **Thermal Resistance Symbol Parameter Typ. Max. Units** RθJL Junction-to-Drain Lead ––– 20 ~~**e**~~ RθJA ~~s~~ Junction-to-Ambient ~~© eee~~ ––– 50 ~~_~~ °C/W Notes ® hrough © are on page 8 www.irf.com 1 

## **Thermal Resistance** 

8/17/04 

## IRF7473PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

|||~~ee~~|||||
|---|---|---|---|---|---|---|
||**Parameter**<br>es|**Min.**<br>es<br>~~ee~~|**Typ. **<br>es|**Max. **<br>es|**Units**<br>es|**Conditions**|
|V(BR)DSS|Drain-to-Source Breakdown Voltage<br>~~es~~<br>~~es~~|100<br>~~ee~~<br>~~es~~|–––<br>~~es~~|–––<br>~~es~~|V<br>~~es~~|VGS= 0V, ID= 250µA<br>~~@~~|
|∆V(BR)DSS/∆TJ|JBreakdown Voltage Temp. Coefficient –––     0.11    –––     V/°C    Reference to 25°C, I<br>~~es~~<br>~~es~~|–––     0.11    –––     V/°C    Reference to 25°C, I|–––     0.11    –––     V/°C    Reference to 25°C, I|–––     0.11    –––     V/°C    Reference to 25°C, I|–––     0.11    –––     V/°C    Reference to 25°C, I|–––     0.11    –––     V/°C    Reference to 25°C, ID= 1mA<br>~~@~~<br>~~@~~|
|RDS(on)|Static Drain-to-Source On-Resistance<br>~~es~~<br>~~es~~|–––|22|26|mΩ|VGS= 10V, ID= 4.1A<br>~~@~~<br>~~@~~|
|VGS(th)|Gate Threshold Voltage<br>~~es~~<br>~~es~~<br>~~ee eee~~|3.5<br>~~es~~<br>~~eee~~|–––<br>~~es~~<br>~~eee~~|5.5<br>~~es~~<br>~~eee~~|V<br>~~es~~<br>~~eee~~|VDS= VGS, ID= 250µA<br>~~@~~|
|IDSS|Drain-to-Source Leakage Current<br>~~ee eee~~<br>~~**|**~~<br>||–––<br>~~eee~~<br>~~**|**~~|–––<br>~~eee~~|1.0<br>~~eee~~|µA<br>~~eee~~<br>|<br>|VDS= 95V, VGS= 0V|
|||–––<br>~~eee~~<br>~~**|**~~<br>||–––<br>~~eee~~<br>|<br>|250<br>~~eee~~<br>|<br>||VDS= 80V, VGS= 0V, TJ= 150°C|
|IGSS|Gate-to-Source Forward Leakage<br>~~ee eee~~<br>~~**|**~~<br>|~~tT~~|–––<br>~~eee~~<br>~~**|**~~<br>|~~tT~~|–––<br>~~eee~~<br>~~tT~~|100<br>~~eee~~<br>~~tT~~|nA<br>~~eee~~<br>~~tT~~|VGS= 20V|
||Gate-to-Source Reverse Leakage<br>|~~tT~~|–––<br>|~~tT~~|–––<br>~~tT~~|-100<br>~~tT~~||VGS= -20V|



||||~~ee~~|~~ee~~|||||||
|---|---|---|---|---|---|---|---|---|---|---|
||**Parameter**<br>ee||**Min.**<br>ee<br>~~ee~~|**Typ. **<br>ee<br>~~ee~~|**Max. **<br>ee||**Units**<br>ee|**Conditions**|||
|gfs|Forward Transconductance<br>~~es~~||10<br>~~ee ~~<br>~~es~~|–––<br> ~~ee~~<br>~~es~~|–––<br>~~es~~||S<br>~~es~~|VDS= 50V, ID= 4.1A|||
|Qg|Total Gate Charge<br>~~a~~||–––<br>~~a~~<br>es|61<br>~~a~~|–––                 I<br>~~a~~||–––                 I<br>nC|–––                 ID= 4.1A<br>VDS= 50V<br>VGS= 10V,|||
|Qgs<br>~~a~~<br>~~Rs~~|Gate-to-Source Charge<br>~~ee~~<br>~~a~~||–––<br>~~ee~~<br>es<br>es|21<br>~~ee~~|–––<br>~~ee~~||||||
|Qgd<br>~~a~~<br>~~Rs~~|Gate-to-Drain("Miller")Charge<br>~~ee~~<br>~~a~~||–––<br>es<br>~~ee~~<br>es|19<br>~~ee~~|–––<br>~~ee~~||||||
|td(on)<br>~~a~~<br>~~Rs~~|Turn-On Delay Time<br>~~a~~||–––<br>es|24|–––||ns|VDD= 50V<br>ID= 4.1A<br>RG= 6.0Ω<br>VGS= 10V<br>~~®~~|||
|tr<br>~~a~~<br>~~Rs~~<br>ee|Rise Time<br>~~a~~<br>~~ee~~||–––<br>es<br>~~ee~~|20<br>~~ee~~|–––<br>~~ee~~||||||
|td(off)<br>~~a~~<br>~~Rs~~<br>ee<br>~~ee~~|Turn-Off Delay Time<br>~~a~~<br>~~ee~~<br>~~ee~~||–––<br>es<br>~~ee~~<br>~~eee~~|29<br>~~ee~~<br>~~eee~~|–––<br>~~ee~~<br>~~eee~~||||||
|tf<br>ee<br>~~ee~~|Fall Time<br>~~ee~~<br>~~ee~~||–––<br>~~ee~~<br>~~eee~~|11<br>~~ee~~<br>~~eee~~|–––<br>~~ee~~<br>~~eee~~||||||
|Ciss<br>~~ee~~<br>~~Ps~~|Input Capacitance<br>~~ee~~<br>~~ee~~||–––<br>~~eee~~<br>~~ee~~|3180<br>~~eee~~<br>~~ee~~|–––<br>~~eee~~<br>~~ee~~||pF|VGS= 0V<br>VDS= 25V<br>ƒ = 1.0MHz<br>~~®~~|||
|Coss<br>~~ee~~<br>~~Ps~~<br>es|Output Capacitance<br>~~ee~~<br>~~ee~~<br>~~ee~~||–––<br>~~eee~~<br>~~ee~~<br>~~ee~~|230<br>~~eee~~<br>~~ee~~<br>~~ee~~|–––<br>~~eee~~<br>~~ee~~<br>~~ee~~||||||
|Crss<br>~~Ps~~<br>es<br>Rs|Reverse Transfer Capacitance<br>~~ee~~<br>~~ee~~||–––<br>~~ee~~<br>~~ee~~|120<br>~~ee~~<br>~~ee~~|–––<br>~~ee~~<br>~~ee~~||||||
|Coss<br>es<br>Rs<br>es|Output Capacitance<br>~~ee~~||–––<br>~~ee~~|830<br>~~ee~~|–––<br>~~ee~~|||VGS= 0V,  VDS= 1.0V,  ƒ = 1.0MHz|||
|Coss<br>Rs<br>es<br>es|Output Capacitance||–––|150|–––|||VGS= 0V,  VDS= 80V,  ƒ = 1.0MHz<br>®|||
|Cosseff.<br>es<br>es|Effective Output Capacitance||–––|230|–––|||VGS= 0V, VDS= 0V to 80V<br>®|||
|**Avalanche Characteristics**<br>es<br>®<br>eser|||||||||||
|es<br>es||**Parameter**<br>er||||**Typ.**<br>er|||**Max.**<br>er|**Units**<br>er|
|EAS<br>es<br>es<br>re||Single Pulse Avalanche Energy<br>er<br>©||||–––<br>er<br>©|||140<br>er<br>©|mJ<br>er<br>©|
|IAR<br>es<br>re||Avalanche Current<br>©||||–––<br>©|||4.1<br>©|A<br>©|



## **Avalanche Characteristics** 

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Parameter Typ. Max. Units<br>es EAS er Single Pulse Avalanche Energy ––– 140 mJ<br>es<br>IAR Avalanche Current ––– 4.1 A<br>re©<br>Diode Characteristics<br> Parameter Min. Typ. Max. Units Conditions<br>IS Continuous Source Current ––– ––– 2.3 MOSFET symbol D<br>ne (Body Diode) ee showing  the<br>ISM Pulsed Source Current ––– ––– 55 integral reverse G<br>Sea (Body Diode) p-n junction diode. (a S<br>VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 4.1A, VGS = 0V<br>Sn trr Reverse Recovery Time ––– 55 ––– ns TJ = 25°C, IF = 4.1A ®<br>Qrr es Reverse RecoveryCharge ––– ee 140 ––– nC di/dt = 100A/µs 5<br>2 www.irf.com<br>**----- End of picture text -----**<br>


**Diode Characteristics** 

## IRF7473PbF 

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1000<br>VGS<br>TOP           15V<br>                  12V<br>100                   10V<br>                  8.0V oe SealHY]<br>                  7.0V                  6.5V arr ene<br>                  6.0V SLi<br>10 BOTTOM   5.5V<br>Eee<br>rt a}<br>1 EE) | ||<br>re EH<br>6.0V<br>4G Se eel<br>0.1 dT<br>20µs PULSE WIDTH<br>Tj = 25°C<br>0.01<br>PL<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics<br> 1000 ==========>==—<br>a<br> 100<br>tt T  = 150  CJ ° | ert<br>=>. ---=-———<br>Yo<br> 10<br>pity ttt<br>=> 2725S ===S====<br>AEE<br> 1<br>fi7A ttt ft ttt<br>SSS<br>T  = 25  CJ °<br>0.1 oPPe,PeeFreee<br>So =<br>V      = 25VDS<br>acsPE RE 20µs PULSE WIDTH<br>0.01<br>5 6 7 8 9 10 11 12<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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 1000<br>VGS<br>TOP 15V<br>12V<br>10V<br>8.0V<br>7.0V<br> 100 BOTTOM 6.5V6.0V5.5V EREeeee|<br>Pt tt<br>EE Zee<br>> i<br> 10<br>> Za<br>5.5V<br> 1 C——ee oB ee )ll<br>20µs PULSE WIDTH<br>eco Po T  = 150J °C<br>0.1<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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2.5<br>ID = 6.9A<br>Po LUELLA<br>PEELE EEE<br>2.0<br>4<br>LEE<br>ELLE<br>1.5<br>|<br>ELLE ee<br>EEL<br>1.0<br>eteer EEE<br>ArT<br>0.5 TTLaa<br>PEELE EEE<br>TEE E f VGS = 10V<br>0.0<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRF7473PbF 

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100000<br>VGS   = 0V,       f = 1 MHZ<br>= = Ciss    = Cgs + Cgd,   Cds    SHORTED<br>Crss    = Cgd<br>10000 — Coss   = Cds + Cgd<br>Ciss<br>= ooo<br>1000 e el<br>Coss<br>Crss<br>|<br>100<br>P | Ee—<br>aa eeee ee ee<br>10 es ee ee ee<br>1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


## **Fig 5.** Typical Capacitance Vs. Drain-to-Source Voltage 

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**----- Start of picture text -----**<br>
 100<br>ee a<br> 10<br>-———_ ——} — ¢  f¢ —  —_  — TF<br>T  = 150  CJ ° —————<br>=<br>T  = 25  CJ °<br> 1 ||==Tei yT tT |<br>SSS<br>0.1 |a| fF ft jf oo V      = 0 V GS |<br>0.0 0.4 0.8 1.2 1.6<br>V     ,Source-to-Drain Voltage (V)SD<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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20<br>ID = 4.1A<br>LT VDS = 80V T<br>16 VDS = 50V<br>Pt | | VDS = 20V ~| |<br>12 Y,<br>Seen enn<br>8<br>ar<br>tty| tt<br>4<br>0 Yi ttt) tot<br>0 20 40 60 80 100<br>Q   , Total Gate Charge (nC)G<br>Fig 6.   Typical Gate Charge Vs.<br>Gate-to-Source Voltage<br>1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>100<br>g D) A<br>EEA A ee SS eel<br>10 B Sc DN) SE<br>te SN<br>eanmeeaiiineaata 100µsec<br>1 1msec een<br>B BC A<br>Tc = 25°C<br>Tj = 150°C 10msec<br>ee Single Pulse Set a:<br>0.1 Ba a: ll<br>0.1 1 10 100 1000<br>VDS  , Drain-toSource Voltage (V)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 8.** Maximum Safe Operating Area 

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## IRF7473PbF 

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8.0<br>ERR Vos Rp .<br>PN Et<br>6.0 PN Ves D.ULT.<br>4.0 PENAPEENEPA Z N\ ns){ 10V : - Vop<br>≤ 1<br>≤ 0.1 %<br>CoeeSIN aseDuty Factor<br>2.0 Fig 10a.   Switching Time Test Circuit<br>VDS<br>90%<br>0.0 \<br>25 50 75 100 125 150<br>T   , Case TemperatureC (  C)°<br>Pit  Ey Ty ony,<br>10%<br>Fig 9.   Ambient TemperatureMaximum Drain Current Vs. VGS /\|\< le >|KSPy\ ><br>td(on) tr td(off) tf<br>Fig 10b.   Switching Time Waveforms<br> 100<br>D = 0.50<br>a eee eee ee<br> 10 0.20<br>0.10<br>SS ee ee nt ee ee eae<br>0.05<br>a ee | = — | | |<br>mTrtt it —<br>0.02<br> 1 e l<br>j 0.01 f ep<br>PDM<br>fae cette ree ceree<br>m c t1<br>SINGLE PULSE<br>0.1 a (THERMAL RESPONSE) e t2<br>Notes:<br>i a | | 1. Duty factor D = t   / t1 2<br>PE 2. Peak T J = P DM x  Z thJA + TA<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

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## IRF7473PbF 

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0.028 e e 0.035 e e<br>0.026 0.030<br>S oe A pe<br>VGS = 10V<br>0.024 a e 0.025 e e Cee<br>ID = 6.9A<br>e T | SN<br>eee<br>0.022 0.020<br>0 20 40 60 6.0 8.0 10.0 12.0 14.0 16.0<br>ID , Drain Current (A) VGS, Gate -to -Source Voltage  (V)<br>Fig 12.    On-Resistance Vs. Drain Current Fig 13.    On-Resistance Vs. Gate Voltage<br>Current Regulator<br>Same Type as D.U.T.<br>QG<br>50KΩ<br>12V .2µF<br>.3µF QGS QGD<br>cre D.U.T. +-VDS VG 400 ID<br>VGS TOP 1.8A<br>3mA Charge 3.3A<br>BOTTOM 4.1A<br>oe CurrentIGSampling ResistorsID | = Pobo a 300 pNpe ppE<br>Fig 14a&b.   Basic Gate Charge Test Circuit<br>and Waveform 200 pNPWENGEP|<br>15V 100<br>SN NO<br>V(BR)DSS<br>tp VDS L DRIVER<br>- PASI<br>R G D.U.T + 0<br>IAS - [V][DD] A 25 50 75 100 125 150<br>°<br>I AS O L] et | tp h, 0.01Ω SSS Starting T  , Junction TemperatureJ (  C)<br>Fig 15c.   Maximum Avalanche Energy<br>Fig 15a&b.   Unclamped Inductive Test circuit<br>Vs. Drain Current<br>and Waveforms<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>) Ω )Ω<br>RDS ( on) , Drain-to-Source On Resistance ( RDS(on),  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


6 

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## IRF7473PbF 

## **SO-8 Package Outline** 

Dimensions are shown in millimeters (inches) 

**==> picture [355 x 335] intentionally omitted <==**

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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>a E 6 8 7 6 q 5 t H i—=a Dc .189.0075 .0098.1968 0.194.80 0.255.00<br>0.25 [.010]  A E .1497 .1574 3.80 4.00<br>1 2 3 4<br>e .050  BASIC 1.27  BASIC<br>e1 .025  BASIC 0.635  BASIC<br>Ta e r o a<br>= a H .2284  a .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>cH a L .016 .050 0.40 1.27<br>a y  0°  8°  0°  8°<br>e1 K x 45°<br>A<br>C<br>y<br>0.10 [.004]<br>an 8X b n A1 iverme X L 8X L 8X c ft<br>SIT 0.25 [.010]  C A B 7<br>FOOTPRINT<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>“toad<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>i rT<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>000g<br>3X 1.27 [.050] a_i<br>8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## NOTES: 

1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 

2.  CONTROLLING DIMENSION: MILLIMETER 

3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 

4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 

- 5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 

- 7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 

## **SO-8 Part Marking** 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

DATE CODE (YWW) 

XXXX INTERNATIONAL F7101 Sc ~~a~~ le RECTIFIERLOGO THEE 

- P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) 

- Y =  LAST DIGIT OF THE YEAR WW =  WEEK A =  ASSEMBLY SITE CODE LOT CODE 

PART NUMBER 

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7 

## IRF7473PbF 

## **SO-8 Tape and Reel** 

Dimensions are shown in millimeters (inches) 

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TERMINAL NUMBER 1<br>o O66) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTION a<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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 330.00<br>(12.992)<br>  MAX.<br>SY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 16mH RG = 25Ω, IAS = 4.1A. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. 

When mounted on 1 inch square copper board Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS ISD ≤ 4.1A, di/dt ≤ 210A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 08/04 

www.irf.com 

8 



## Links

- [View this product on Novapart](https://novapart.co/products/IRF7473TRPBF/power-mosfet-n-channel-100-v-69-a-0026-ohm-soic)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irf7473trpbf/mosfet-n-ch-100v-6-9a-soic-8/dp/2803411)
---

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