# Power MOSFET, N Channel, 30 V, 14 A, 8000 µohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2781116/)

**URL**: https://novapart.co/products/IRF7458TRPBF/power-mosfet-n-channel-30-v-14-a-8000-ohm-soic
**SKU**: IRF7458TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5570
**Stock**: 10+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:14A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.0063ohm; Rds(on) Test Voltage Vgs:16V; Threshold Voltage Vgs:4V; Power D

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 16V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 14A |
| Drain Source On State Resistance | 8000µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2781116/)

## **SMPS MOSFET** 

## IRF7458PbF 

## **Applications** 

High Frequency Isolated DC-DC Converters with Synchronous Rectification for Telecom and Industrial Use 

## HEXFET ® Power MOSFET 

|**VDSS**|**RDS(on) max**|**ID**|
|---|---|---|
|**30V**|**8.0m**Ω|**14A**|



High Frequency Buck  Converters for Computer Processor Power Lead-Free 

## **Benefits** 

Ultra-Low Gate Impedance Very Low RDS(on) Fully Characterized Avalanche Voltage and Current 

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A<br>A<br>S 1 8 D<br>S 2 7 D<br>S 3 6 D<br>G 4 5 D<br>SO-8<br>Top View<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|**Symbol**<br>**Parameter**<br>**Max.**<br>**Units**<br>VDS<br>Drain-Source Voltage<br>30<br>V<br>VGSGate-to-Source Voltage<br>± 30                                   V<br>ID@ TA= 25°C<br>Continuous Drain Current, VGS@ 10V<br>14<br>ID@ TA= 70°C<br>Continuous Drain Current, VGS@ 10V<br>11<br>A<br>IDM<br>Pulsed Drain Current<br>110<br>PD@TA= 25°C<br>Maximum Power Dissipation<br>2.5<br>W<br>PD@TA= 70°C<br>Maximum Power Dissipation<br>1.6<br>W<br>a<br>nn tt<br>eo<br>~~esee~~<br>~~a~~<br>~~—~~<br>~~ee~~<br>~~aoo pT~~<br>~~a~~|
|---|
|Linear DeratingFactor                                                                     0.02                              mW/°C<br>TJ, TSTG<br>Junction and Storage Temperature Range<br>-55  to + 150<br>°C<br>~~df~~<br>~~es~~|
|**Thermal Resistance**|
|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RθJL<br>Junction-to-Drain Lead<br>–––<br>20<br>RθJA<br>Junction-to-Ambient<br>–––<br>50<br>°C/W<br>~~es~~<br>~~I~~<br>~~So~~<br>~~a~~|



Notes 0) hrough ® are on page 8 

www.irf.com 

1 

## IRF7458PbF 

## **Static @ TJ = 25°C (unless otherwise specified)** 

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||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
|rs|Parameter|Min.|ss|Typ.|Max.|s  (|Units|Conditions|
|V(BR)DSS|rs|Drain-to-Source Breakdown Voltage|30|–––|–––|V|VGS = 0V, ID = 250µA|
|∆V(BR)DSS/∆TJ|PDPorr——ee—(—i—‘“‘<~i|Breakdown Voltage Temp. Coefficient|–––     0.029    –––     V/°C    Reference to 25°C, I|Gs|ee|ts|D = 1mA|
|–––|6.3|8.0|VGS = 16V, ID = 14A|
|RDS(on)|SS|Static Drain-to-Source On-Resistance|rf|–––|[||7.0|||9.0|mΩ|VGS = 10V, ID = 11A|
|VGS(th)|ns|Gate Threshold Voltage|ers|2.0|–––|ss|4.0|V|VDS = VGS, ID = 250µA|
|IDSS|ee|Drain-to-Source Leakage Current|||fT|––––––|––––––|10020|µA|VVDSDS = 24V, V = 24V, VGSGS = 0V = 0V, TJ = 125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|200|nA|VGS = 24V|
|es|Gate-to-Source Reverse Leakage|||–––|ee|fT|–––|-200|Po|VGS = -24V|
|Dynamic @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)|
|Symbol|es|Parameter|es|Min.|Typ.|Max.|Units|Conditions|
|gfs|es|Forward Transconductance|26|–––|–––|S|VDS = 15V, ID = 11A|
|Qg|a|Total Gate Charge|es|–––|(|39      59                ID = 11A|
|Qgs|es|Gate-to-Source Charge|–––|11|17|nC|VDS = 15V|
|Qgd|Gate-to-Drain ("Miller") Charge|–––|8.7|13|VGS = 10V|
|es|Qoss|es|Output Gate Charge|–––|29|44|VGS = 0V, V|©)|DS = 16V|
|es|td(on)|es|Turn-On Delay Time|–––|10|–––|VDD = 15V|
|tr|Rise Time|–––|4.6|–––|ID = 11A|
|eees|ns|
|ee|td(off)|Turn-Off Delay Time|–––|22|–––|RG = 1.8Ω|
|tf|Fall Time|–––|5.0|–––|VGS = 10V|
|es|Ciss|ss|Input Capacitance|–––|2410|–––|VGS = 0V|
|es|Coss|Output Capacitance|–––|1100|–––|VDS = 15V|
|Crss|Reverse Transfer Capacitance|–––|110|–––|pF|ƒ = 1.0MHz|

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**Dynamic @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)** 

## **Avalanche Characteristics** 

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|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|Symbol|Parameter|Typ.|Max.|Units|
|es|
|Po|EAS|Single Pulse Avalanche Energy|eee|–––|280|mJ|
|IAR|Avalanche Current|–––|11|A|
|Diode Characteristics|
|Symbol|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|2.3|MOSFET symbol|D|
|en|(Body Diode)|eee|showing  the|
|ISM|Pulsed Source Current|–––|–––|110|integral reverse|G|
|(Body Diode)|p-n junction diode.|S|
|p44|*|Ge|
|VSD|Diode Forward Voltage|–––|0.82|1.3|V|TJ = 25°C, IS = 11A, VGS = 0V|
|EEE|–––|0.68|–––|TJ = 125°C, IS = 11A, VGS = 0V|:|
|trr|Reverse Recovery Time|–––|51|77|ns|TJ = 25°C, IF = 11A, VR= 20V|
|—|Qrr|—|Reverse Recovery Charge|TE|–––|87|130|nC|di/dt = 100A/µs|
|ne|trr|Reverse Recovery Time|–––|52|78|ns|TJ = 125°C, IF = 11A, VR=20V|
|Qrr|Reverse Recovery Charge|–––|93|140|nC|di/dt = 100A/µs|
|2|www.irf.com|

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## **Diode Characteristics** 

www.irf.com 

IRF7458PbF 

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 1000<br>VGS<br>TOP 16V<br>12V<br>10V<br>8.0V<br>6.0V5.5V ee |<br>5.0V<br>BOTTOM 4.5V<br> 100 ree |<br>ee 66 nn ET<br>t-—| ear Ht<br>er<br>fr}<br>4.5V<br> 10<br>20µs PULSE WIDTH<br>TBe MI T  = 25J °C<br> 1<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>Fig 1.   Typical Output Characteristics<br> 1000 a—————<br>eea eeee ee<br>a ee<br> 100 Pt |<br>T  = 150  CJ °<br>= SS<br>SL—|7tore<br>T  = 25  CJ °<br>V      = 15VDS<br>a | | 20µs PULSE WIDTH a[ |<br> 10<br>4.5 5.0 5.5 6.0<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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 1000<br>VGS<br>TOP 16V<br>12V<br>10V<br>8.0V<br>6.0V5.5V a el<br>5.0V<br>BOTTOM 4.5V<br> 100 ree Pn |<br>See PY, 0 ceTT<br>e e<br>age<br>a 4.5V<br> 10<br>20µs PULSE WIDTH<br>T  = 150J °C<br> 1 TEL HM<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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2.0<br>ID = 14A<br>Pee EEE ELT<br>1.5 LEAL EEELL<br>ELLE De<br>PETELTT |<br>1.0 LTTEEE<br>PEELE LE<br>0.5<br>EEE E ET VGS = 10V<br>0.0<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

www.irf.com 

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## IRF7458PbF 

**==> picture [437 x 472] intentionally omitted <==**

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100000 VGS   = 0V,       f = 1 MHZ 20 ID = 11A<br>==: CCrss  iss    = C  = Cgd gs + Cgd,   Cds    SHORTED 16 He e VVDSDS == 24V 15V K H<br>PH C  = C + C PE tT ty Na<br>10000 oss   ds  gd<br>Ciss 12<br>pe ty A<br>1000 Coss<br>ee Ee<br>8<br>Crss<br>100<br>4<br>FFE EH BZ<br>10 fe ATP tree<br>0<br>1 10 100 0 10 20 30 40 50 60<br>VDS, Drain-to-Source Voltage (V) Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 1000  1000<br>OPERATION IN THIS AREA LIMITED<br>BY R<br>DS(on)<br> 100 ee ee A<br> 100 10us<br>SSS SS eS padabtlddbenlt stents Il<br>T  = 150  CJ °<br> 10 AA CE Seti eee meeaatt 100us<br>== AAS = = = == po il<br>T  = 25  CJ °  10 1ms<br>a= LT<br> 1<br> TA = 25  C° 10ms<br>in a ee ee  TJ = 150  C° 1<br>0.1 SA P V      = 0 V GS  1 LH  Single Pulse St<br>0.2 0.6 1.0 1.4 1.8 2.2 0.1  1  10  100<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

www.irf.com 

4 

**Fig 6.** On-Resistance Vs. Drain Current 

## IRF7458PbF 

**==> picture [431 x 473] intentionally omitted <==**

**----- Start of picture text -----**<br>
1612 PEta~ SER [ELE] [EL] Ves Vos butRp |<br>-<br>PT] AXLE LL ns<br>LAKE<br>8 PEE hs IN EL )} 10V ° Vop<br>≤ 1<br>Duty Factor ≤ 0.1 %<br>Coo} “rs<br>q -<br>4 Fig 10a.   Switching Time Test Circuit<br>VDS<br>90%<br>0 \<br>25 50 75 100 125 150<br>T   , Case TemperatureC (  C)°<br>PEELE TE L  E E A ony,<br>10% /\ X<br>VGS f\« le >|\/pl< ><br>td(on) tr td(off) tf<br>Fig 10b.   Switching Time Waveforms<br> 100<br>D = 0.50<br>m mr tH<br> 10 0.20<br>0.10<br>Sareillor suman Smee ss ied ERENCES ee, ee een ees<br>0.05<br>r r te<br>0.02<br> 1<br>a mae -<br>SS 0.01 SS<br>a PDM<br>P P PPP TER EER J t1<br>0.1 n (THERMAL RESPONSE)SINGLE PULSE L t2<br>Notes:<br>ee ni 1. Duty factor D = t   / t1 2<br>a ee 2. Peak T J = P DM x  Z thJA + TA<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 10.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

www.irf.com 

5 

## IRF7458PbF 

**==> picture [433 x 205] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.020 0.016<br>0.014<br>0.016 T TT TF] [ OL<br>0.012<br>0.012 P VGS = 6.0V o A<br>0.010 ID = 14A<br>V = 10V<br>GS<br>t eeet<br>0.008<br>| 0.008 A<br>o V = 16V e} LIN<br>GS<br>0.004 ee ee 0.006 S e<br>0 20 40 60 80 100 120 4 6 8 10 12 14 16<br>ID , Drain Current (A) VGS, Gate -to -Source Voltage  (V)<br>)<br>Ω<br>RDS (on) , Drain-to-Source On Resistance (<br>)<br>Ω<br>RDS(on),  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance Vs. Drain Current 

**Fig 13.** On-Resistance Vs. Gate Voltage 

**==> picture [437 x 240] intentionally omitted <==**

**----- Start of picture text -----**<br>
Current Regulator<br>Same Type as D.U.T.<br>QG<br>50KΩ<br>12V .2µF<br>.3µF QGS QGD<br>D.U.T. +-VDS VG 800 ID<br>VGS TOP 5.0A<br>3mA Charge 9.0A<br>BOTTOM 11A<br>of CurrentIGSampling Resistors | ID P 600 Npp eepp<br>Fig 13a&b.   Basic Gate Charge Test Circuit<br>and Waveform 400 PNKSNEtt<br>15V 200 SAONU<br>V(BR)DSS<br>tp VDS L DRIVER<br>_ SWNT<br>R G D.U.T + 0<br>IAS - [V][DD] A 25 50 75 100 125 150<br>20V °<br>I AS | 4 tp 0.01Ω PT Starting T  , Junction TemperatureJ ASS (  C)<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 14a&b.** Unclamped Inductive Test circuit and Waveforms 

6 

**Fig 14c.** Maximum Avalanche Energy Vs. Drain Current 

www.irf.com 

## IRF7458PbF 

## **SO-8 Package Outline** 

Dimensions are shown in millimeters (inches) 

**==> picture [351 x 232] intentionally omitted <==**

**----- Start of picture text -----**<br>
INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>ana s rT| b  Re| .013 | .020 ft 0.33 0.51<br>i E 6 8 7 6 5 H ee —aa Dc .189.0075 .1968.0098 ee ee 4.800.19 ee ee eee 5.000.25 ee<br>0.25 [.010]  A E .1497 .1574 3.80 4.00<br>1 2 3 4<br>e .050  BASIC 1.27  BASIC<br>I a<br>e 1 .025  BASIC 0.635  BASIC<br>H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>L .016 .050 0.40 1.27<br>c+ L ot ————aa ee ee ee<br>a y  0°  8°  0°  8°<br>e1 K x 45°<br>A<br>FL] C aa<br>y<br>JkTANS 8X b A1 : 0.10 [.004]  _A af 8X L Th 8X c 7<br>0.25 [.010]  C A B 7<br>le. @lTT1<br>FOOTPRINT<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>**----- End of picture text -----**<br>


## NOTES: 

1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 

2.  CONTROLLING DIMENSION: MILLIMETER 

3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 

4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 

- 5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 

- 7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 

**==> picture [154 x 60] intentionally omitted <==**

**----- Start of picture text -----**<br>
6.46 [.255] an<br>00004<br>3X 1.27 [.050] —-y bk<br>8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## **SO-8 Part Marking** 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

DATE CODE (YWW) 

**==> picture [178 x 58] intentionally omitted <==**

**----- Start of picture text -----**<br>
XXXX<br>INTERNATIONAL F7101<br>e e<br>RECTIFIERLOGO THHE<br>**----- End of picture text -----**<br>


- P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) 

- Y =  LAST DIGIT OF THE YEAR 

WW =  WEEK 

- A =  ASSEMBLY SITE CODE 

LOT CODE 

PART NUMBER 

www.irf.com 

7 

## IRF7458PbF 

## **SO-8 Tape and Reel** 

Dimensions are shown in millimeters (inches) 

**==> picture [174 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
TERMINAL NUMBER 1<br>oOO 0) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )7.9 ( .312 ) | FEED DIRECTION |<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

**==> picture [154 x 69] intentionally omitted <==**

**----- Start of picture text -----**<br>
 330.00<br>(12.992)<br>  MAX.<br>VY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 4.6mH RG = 25Ω, IAS = 11A. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. 

When mounted on 1 inch square copper board,  t<10 sec 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 08/04 

www.irf.com 

8 



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- [Supplier page](https://es.farnell.com/infineon/irf7458trpbf/mosfet-n-ch-30v-14a-soic/dp/2781116)
---

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