# Power MOSFET, N Channel, 30 V, 15 A, 7500 µohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2725907/)

**URL**: https://novapart.co/products/IRF7455TRPBF/power-mosfet-n-channel-30-v-15-a-7500-ohm-soic
**SKU**: IRF7455TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5430
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:15A; Drain Source Voltage Vds:30V; On Resistance Rds(on):0.006ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Power Di

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (08-Jul-2021) |
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 30V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 15A |
| Drain Source On State Resistance | 7500µohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725907/)

PD- 93842B 

## **SMPS MOSFET** 

## IRF7455 

## HEXFET[®] Power MOSFET 

## **Applications** 

High Frequency DC-DC Converters with Synchronous Rectification 

|**VDSS**|**RDS(on) max**|**ID**|
|---|---|---|
|**30V**|**0.0075**Ω|**15A**|



## **Benefits** 

Ultra-Low RDS(on) at 4.5V VGS Low Charge and Low Gate Impedance to Reduce Switching Losses Fully Characterized Avalanche Voltage and Current 

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## **Absolute Maximum Ratings** 

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Symbol Parameter Max. Units<br>| ee|<br>VDS Drain-Source Voltage 30 V<br>VGS                                      Gate-to-Source Voltage                                                              ± 12                                  V<br>Rs<br>Pee ID @ TA = 25°C Continuous Drain Current, VGS @ 10V 15<br>ID @ TA = 70°C Continuous Drain Current, VGS @ 10V 12 A<br>aeee IDM Pulsed Drain Current 120<br>© PD @TA = 25°C Maximum Power Dissipation 2.5 W<br>© PD @TA = 70°C Maximum Power Dissipation 1.6 W<br>                                  Linear Deratin a g Factor                                                                      0.02                              W/°C<br>TJ , TSTG Junction and Storage Temperature Range -55  to + 150 °C<br>Thermal Resistance<br>Parameter Max. Units<br>ee<br>© RθJA Maximum Junction-to-Ambient 50 °C/W<br>**----- End of picture text -----**<br>


## **Typical SMPS Topologies** 

Telecom 48V Input Converters with Logic-Level Driven Synchronous Rectifiers 

Notes hrough are on page 8 www.irf.com 

1 

4/20/00 

## IRF7455 

**Static @ TJ = 25°C (unless otherwise specified)** 

|es<br>a|**Parameter**<br>es<br>a|**Min. **<br>es<br>errs|**Typ. **<br>es<br>res|**Max.**<br>es<br>reed|**Units**<br>es<br>es|**Conditions**<br>es|
|---|---|---|---|---|---|---|
|V(BR)DSS<br>a|Drain-to-Source Breakdown Voltage<br>a<br>~~**|**~~|30<br>errs<br>~~es~~<br>~~**|**~~|–––<br>res<br>|–––<br>reed<br>|V<br>es<br>|VGS= 0V, ID= 250µA|
|∆V(BR)DSS/∆TJ<br>~~es~~|JBreakdown Voltage Temp. Coefficient –––     0.029    –––     V/°C    Reference to 25°C, I<br>~~es~~<br>~~**|**~~|–––     0.029    –––     V/°C    Reference to 25°C, I<br>~~es~~<br>~~es~~<br>~~**|**~~|–––     0.029    –––     V/°C    Reference to 25°C, I<br>~~es~~<br>|–––     0.029    –––     V/°C    Reference to 25°C, I<br>~~es~~<br>|–––     0.029    –––     V/°C    Reference to 25°C, I<br>~~es~~<br>|–––     0.029    –––     V/°C    Reference to 25°C, ID= 1mA<br>~~es~~|
|RDS(on)<br>~~Ce~~|Static Drain-to-Source On-Resistance<br>~~**|**~~<br>~~|~~<br>~~Ce~~|–––<br>~~es~~<br>~~**|**~~|0.00600.0075<br>|0.00600.0075<br>|Ω<br>—}—<br>~~ds~~|VGS= 10V, ID= 15A|
|||–––<br>~~es~~<br>~~**|**~~—}—<br>~~|~~|0.0069 0.009<br>—}—|0.0069 0.009<br>—}—||VGS= 4.5V, ID= 12A<br>~~@~~|
|||–––<br>—}—<br>~~|~~<br>~~rs ds~~|0.010 <br>—}—<br>~~ds~~|0.020<br>—}—<br>~~ds~~||VGS= 2.8V, ID= 3.5A<br>~~@~~|
|VGS(th)<br>~~es~~<br>~~Ce~~|Gate Threshold Voltage<br>~~|~~<br>~~es~~<br>~~Ce~~|0.6<br>~~|~~<br>~~es~~<br>~~rs ds~~|–––<br>~~es~~<br>~~ds~~|2.0<br>~~es~~<br>~~ds~~|V<br>~~es~~<br>~~ds~~|VDS= VGS, ID= 250µA<br>~~@~~<br>~~es~~|
|IDSS<br>~~Ce~~|Drain-to-Source Leakage Current<br>~~Ce~~<br>~~|~~|–––<br>~~rs ds~~<br>~~|~~|–––<br>~~ds~~<br>|20<br>~~ds~~<br>|µA<br>~~ds~~<br>TT|VDS= 24V, VGS= 0V<br>VDS= 24V, VGS= 0V, TJ= 125°C<br>|
|||–––<br>~~rs ds~~<br>~~|~~TT|–––<br>~~ds~~<br>TT|100<br>~~ds~~<br>TT|||
|IGSS<br>~~Ce~~|Gate-to-Source Forward Leakage<br>Gate-to-Source Reverse Leakage<br>~~Ce~~<br>~~|~~|–––<br>–––<br>~~rs ds~~<br>~~|~~|–––<br>–––<br>~~ds~~<br>|200<br>-200<br>~~ds~~<br>|nA<br>~~ds~~<br>|VGS= 12V<br> ~~PO~~|
|||||||VGS= -12V|



**Dynamic @ TJ = 25°C (unless otherwise specified)** 

|**Dynamic @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)**|||
|---|---|---|
|**Parameter**<br>**Min. Typ. Max.**<br>**Units**<br>gfs<br>Forward Transconductance<br>44<br>–––<br>–––<br>S<br>es<br>eee ee ee<br>es|**Conditions**<br>VDS= 10V, ID= 15A||
|Qg<br>Total Gate Charge<br>–––<br>37<br>56<br>Qgs<br>Gate-to-Source Charge<br>–––<br>8.9<br>13<br>nC<br>Qgd<br>Gate-to-Drain("Miller")Charge<br>–––<br>13<br>20<br>td(on)<br>Turn-On Delay Time<br>–––<br>17<br>–––<br>tr<br>Rise Time<br>–––<br>18<br>–––<br>td(off)<br>Turn-Off Delay Time<br>–––<br>51<br>–––<br>tf<br>Fall Time<br>–––<br>44<br>–––<br>Ciss<br>Input Capacitance<br>–––<br>3480<br>–––<br>ns<br>~~ee~~<br>a~~es es~~<br>~~Rs~~<br>~~es~~<br>ee~~ee~~<br>ee<br>~~ee~~|ID= 15A<br>VDS= 24V<br>VGS= 5.0V,<br>VDD= 15V<br>ID= 1.0A<br>RG= 6.0Ω<br>VGS= 4.5V<br>VGS= 0V|= 5.0V,<br>~~®~~<br>~~°~~|
|Coss<br>Output Capacitance<br>–––<br>870<br>–––<br>a~~ee~~|VDS= 25V||
|Crss<br>Reverse Transfer Capacitance<br>–––<br>100<br>–––<br>pF|ƒ = 1.0MHz||



## **Avalanche Characteristics** 

**Parameter Typ. Max. Units** es EAS Single Pulse Avalanche Energy ––– 200 mJ eseG IAR Avalanche Current ––– 15 A Snee EAR nn© Repetitive Avalanche Energy ––– 0.25 mJ 

**Diode Characteristics** 

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 Parameter Min. Typ. Max. Units Conditions<br>IS Continuous Source Current ––– ––– 2.5 MOSFET symbol D<br>(Body Diode) showing  the<br>A<br>ISM Pulsed Source Current ––– ––– 120 integral reverse G<br>fT (Body Diode)  p-n junction diode. S<br>VSD Diode Forward Voltage ––– ––– 1.2 V TJ = 25°C, IS = 2.5A, VGS = 0V<br>| trr Reverse Recovery Time ––– 64 96 ns TJ = 25°C, IF = 2.5A<br>Qrr Reverse RecoveryCharge ––– 99 150 nC di/dt = 100A/µs<br>Se ee ee ee<br>2 www.irf.com<br>**----- End of picture text -----**<br>


IRF7455 

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 1000<br>VGS<br>TOP 10V ot<br>4.5V<br>3.7V |<br>3.5V3.3V 10 a | |<br>3.0V<br>2.7V el ll<br>BOTTOM 2.5V<br>iN<br> S00 MUI<br> 100<br>ee // a<br>rTEe| mat0 ee TTeel<br>ey ///AA1<br>eeV ZG 2.5V all<br>20µs PULSE WIDTH<br>ZAa T  = 25J °C<br> 10<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>Fig 1.   Typical Output Characteristics<br> 1000 ===<br>Eeareeeee ee ee ee ee<br>Py<br>PP ee ee ee ee<br>faleeeeeee<br> 100<br>hz T  = 150  CJ ° eee ee eee eee<br>SE Sere<br>eeSepee eee eee eee<br>T  = 25  CJ °<br>V      = 15VDS<br>Pa 20µs PULSE WIDTH<br> 10<br>2.4 2.6 2.8 3.0 3.2 3.4<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

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 1000<br>VGS<br>TOP 10V et<br>4.5V<br>3.7V tt<br>3.5V3.3V Te<br>3.0V2.7V ee<br>BOTTOM 2.5V<br>|<br>NATION<br> 100<br>-—r- i LSS ee ee ee<br>ER)2 eee ee<br>_ ee eee<br>2.5V<br>eyDYZale anil il<br>20µs PULSE WIDTH<br>Ai Y Us 4 T  = 150 | J el °C<br> 10<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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2.0<br>ID = 15A<br>Pee EEE<br>1.5 PEELEalEE EEL<br>ps<br>1.0 eTETAL<br>0.5 TOLLEA EEL<br>VGS = 10V<br>0.0 ELLE EE L<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRF7455 

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6000 VGS = 0V, f = 1MHz 12 ID = 15A<br>Ciss = Cgs + Cgd , C      SHORTEDds VDS = 24V<br>5000 | CCrssoss == CCgdds + Cgd 10 P|<br>= E E RE<br>4000 TTT PTT 8 ee ee ee<br>Ciss<br>pT P| ft Tt Tr<br>3000 PNETKt EL meET.eill 6 P|mn| |TL]ae<br>2000 a el 4 P| [| Ye | ft<br>Coss<br>PN ee PT YT<br>1000 PT TL Et TT 2 A ee ee eee<br>FOR TEST CIRCUIT<br>0 | e e Crss ll 0 Amfff oo SEE FIGURE       13<br> 1  10  100 0 20 40 60 80<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 1000  1000<br>OPERATION IN THIS AREA LIMITED<br>BY RDS(on)<br>ee TE<br> 100<br>T  = 150  CJ °  100 10us<br>= =—- =S==== pa TTEa Tl<br> 10 PT TAA TT Ty ptf SN OS 100us<br>== ee ° eC |<br>T  = 25  CJ<br>ASE FS  10 | 1ms<br> 1 |ee|/i/| ee| | ee| | | |ee| ePEotees sh eer<br> TA = 25  C° 10ms<br>0.1 ==PyYi tfyee -===—===| TTPp TT V      = 0 V GS  1 CR  T Single PulseJ = 150  C° LUTELh<br>0.2 0.6 1.0 1.4 1.8 2.2 0.1  1  10  100<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


## **Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

www.irf.com 

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## IRF7455 

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RD<br>16 VDS<br>hsNEEZ  EE VGS “[-<br>D.U.T.<br>RG<br>12 PERE EE l +- [V] DD<br> NEL<br>PT [TT] IS ~~ > EE<br>10V<br>PEt eT XJNEL Pulse Width  : ≤ 1 µs<br>8 Duty Factor ≤ 0.1 %<br>N r<br>PEE EIN<br>PEt Fig 10a.   Switching Time Test Circuit<br>4<br>VDS<br>PEELE EL [ELEN] ELING 90%<br>0<br>25 50 75 100 125 150 |<br>T   , Case TemperatureC (  C)° |<br>10%<br>Pi tt} | EE yl VGS AY.\¢ le >|| < e<br>Fig 9.   Maximum Drain Current Vs. td(on) tr td(off) tf<br>Case Temperature<br>Fig 10b.   Switching Time Waveforms<br> 100<br>D = 0.50 ——————————— ee |_| So eee<br> 10 0.20<br>0.10<br>0.05<br>= errr er TT I rr Pet<br>0.02<br> 1 ea ee eeeet| |<br>0.01<br>era a | cane ee erence cr PDM<br>a a ns | | | t 1<br>0.1 A (THERMAL RESPONSE)SINGLE PULSE t2<br>Notes:<br>pos peas op resiap erpSy<br>e eee eee 1. Duty factor D = t   / t1 2<br>0.01 a a ee 2. Peak T J = P DM x  Z thJA + TA<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

www.irf.com 

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## IRF7455 

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**----- Start of picture text -----**<br>
0.008 0.012<br>P te<br>VGS = 4.5V<br>| 0.007 0.010 y P i tdN<br>ID = 15A<br>0.006 0.008<br>V = 10V<br>GS  C OR E E<br>Op SLL<br>PP<br>0.005 0.006 EE<br>0 20 40 60 80 100 120 2.5 3.0 3.5 4.0 4.5<br>ID , Drain Current (A) VGS, Gate -to -Source Voltage  (V)<br>Fig 12.    On-Resistance Vs. Drain Current Fig 13.    On-Resistance Vs. Gate Voltage<br>Current Regulator<br>Same Type as D.U.T.<br>QG<br>12V .2µF 50KΩ VGS<br>.3µF QGS QGD<br>tre D.U.T. +-VDS VG 500 ID<br>VGS TOP 6.7A<br>3mA (a | poo Charge pt 9.5A<br>oe IG ID | 400 COP BOTTOM 15A<br>Current Sampling Resistors Keane<br>ENE<br>Fig 13a&b.   Basic Gate Charge Test Circuitand Waveformand Waveform 300 NEN<br>PNA Et<br>200<br>NONN<br>15V<br>PANNA<br>100<br>V (B R )D S S (B R )D S S<br>tp VD S L DRIVER<br>a ae SNee<br>R G D.U .T + 0<br>IAS - [[VD D]] A 25 50 75 100 125 150<br>20 V °<br> A S /|| \ i e i t t p 0.01 e Ω PP Starting T  , Junction TemperatureJ S85 (  C)<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>)<br>Ω<br>RDS (on) , Drain-to-Source On Resistance (<br>)<br>Ω<br>RDS(on) ,  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


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Fig 13a&b.   Basic Gate Charge Test Circuitand Waveformand Waveform<br>15V<br>V (B R )D S S (B R )D S S<br>tp VD S L DRIVER<br>a<br>R G D.U .T +<br>- [[VD D]]<br>IAS<br>20 V<br>I A S /|| \ i e i t t p 0.01 e Ω<br>**----- End of picture text -----**<br>


**Fig 14a&b.** Unclamped Inductive Test circuit and Waveforms 

6 

**Fig 14c.** Maximum Avalanche Energy Vs. Drain Current 

www.irf.com 

## IRF7455 

## **SO-8 Package Details** 

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      INCH ES        M ILLIM ET ERS<br>D D IM   M IN        M A X       M IN      M AX<br>= - B - 5 as<br>A       .0532     .0688     1.35      1.75<br>| |<br>| -<br>A1     .0040     .0098     0.10      0.25<br>_ 8     7      6     5 a<br>5 E H ee B       .014       .018       0.36      0.46<br>J - A - 1     2      3     4  0.25  (.010)    M    A  M ee C       .0075     .0098     0.19      0.25<br>L e D       .189       .196       4.80      4.98 e e<br>— T_T E       .150       .157       3.81      3.99 ee<br>CHL 6Xe e1 θ K x 45° ft e         .050 BA SIC          1.27 B ASICe1       .025 BA SIC         0.635 B AS IC<br>ao, θ UF _[T<br>H       .2284     .2440      5.80     6.20<br>A<br>K       .011       .019       0.28      0.48<br>= - C - TAA B  8X A1 0.10  (.004) LyThon  L8X 6  C8X J ee Pf L       0.16        .050       0.41     1.27 ee<br>θ          0°          8°           0°         8°<br>0.25  (.010)      M    C  A  S  B  S<br>[fe], OTT OO |__| RECOM MENDED FOOTPRINT<br>NOTES:<br>       1.  DIM ENSIONING AND TOLERANCING PER ANSI Y14.5M-1982. 0.72 (.028 )<br>       2.  CONTROLLING DIM ENSION : INCH. an 8X<br>       3.  DIM ENSIONS ARE SHOW N IN MILLIMETERS (INCHES).<br>       4.  OUTLINE CONFORM S TO JEDEC OUTLINE MS-012AA. oun<br>           DIMENSION DOES NOT INCLUDE M OLD PROTRUSIONS5 6.46 ( .255 ) 1.78 (.070)<br>       8X<br>           MOLD PROTRUSIONS NOT TO EXCEED 0.25 (.006).<br>           DIMENSIONS IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE..6<br>1.27 ( .050 )<br>        3X  |_ [pone,] i<br>**----- End of picture text -----**<br>


## **SO-8 Part Marking** 

www.irf.com 

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## IRF7455 

## **SO-8 Tape and Reel** 

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**----- Start of picture text -----**<br>
TERM INAL NUM BER 1<br>oOO6) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTIO N a<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
N OTES :<br>**----- End of picture text -----**<br>


1.   CO NTRO LLING  DIM E NSIO N : M ILLIM ETER . 

2.   ALL DIM ENS ION S ARE SHO W N IN M ILL IM E TER S(INC HES). 

3.   OU TL IN E CO N FO RM S  TO  EIA-481 & EIA-541. 

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 330.00<br>(12.992)<br>  M AX.<br>VAY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NO TES : 

1. CO NTRO LLING  DIM ENSIO N : M ILLIMETER. 

2. O UTLINE CO NFO RM S TO  EIA-481 & EIA-541. 

## **Notes:** 

Repetitive rating;  pulse width limited by max. junction temperature. 

Starting TJ = 25°C, L = 1.8mH RG = 25Ω, IAS = 15A. 

Pulse width ≤ 300µs; duty cycle ≤ 2%. 

When mounted on 1 inch square copper board,  t<10 sec 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 **IR EUROPEAN REGIONAL CENTER:** 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000 **IR CANADA:** 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 **IR GERMANY:** Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590 **IR ITALY:** Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111 **IR JAPAN:** K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086 **IR SOUTHEAST ASIA:** 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65  (0)838 4630 **IR TAIWAN:** 16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673  Tel: 886-(0)2 2377 9936 Data and specifications subject to change without notice. 4/00 

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