# Power MOSFET, SMPS, N Channel, 200 V, 2.5 A, 0.17 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2803409/)

**URL**: https://novapart.co/products/IRF7450TRPBF/power-mosfet-smps-n-channel-200-v-25-a-017-ohm
**SKU**: IRF7450TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5990
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.17ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 200V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 2.5A |
| Drain Source On State Resistance | 0.17ohm |
| Gate Source Threshold Voltage Max | 5.5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2803409/)

## PD- 95306 IRF7450PbF **SMPS MOSFET** 

## **Applications** 

High frequency DC-DC converters Lead-Free 

HEXFET Power MOSFET **VDSS RDS(on) max ID 200V 0.17 @VGS = 10V 2.5A** ————— 

## **Benefits** 

Low Gate to Drain Charge to Reduce Switching Losses Fully Characterized Capacitance Including Effective COSS to Simplify Design (See App. Note AN1001) 

> ° Fully Characterized Avalanche Voltage and Current 

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## **Absolute Maximum Ratings** 

|~~Se~~|**Parameter**<br>~~PO~~|**Max.**<br>~~PO~~|**Units**|
|---|---|---|---|
|ID@ TA= 25°C<br>~~Se~~<br>~~re~~|Continuous Drain Current, VGS@ 10V<br>~~PO~~<br>~~re~~|2.5<br>~~PO~~<br>~~re~~|A<br>~~re~~|
|ID@ TA= 70°C<br>~~Se ~~<br>~~re~~|Continuous Drain Current, VGS@ 10V<br> ~~PO~~<br>~~PO~~<br>~~re~~|2.0<br>~~PO~~<br>~~PO~~<br>~~re~~||
|IDM<br>~~re~~|Pulsed Drain Current<br>~~re~~|20<br>~~re~~||
|PD@TA= 25°C<br>~~2~~|Power Dissipation<br>~~2~~|2.5|W|
||Linear DeratingFactor|0.02|W/°C|
|VGS<br>~~a~~|Gate-to-Source Voltage<br>~~a~~|± 30|V|
|dv/dt<br>~~a~~<br>~~pp~~|Peak Diode Recoverydv/dt<br>~~a~~<br>~~pp~~|11|V/ns|
|TJ<br>TSTG<br>~~pp~~|Operating Junction and<br>Storage Temperature Range<br>~~pp~~|-55  to + 150|°C|
|~~pp~~|Soldering Temperature, for 10 seconds<br>~~pp~~|300 (1.6mm from case )||



## **Thermal Resistance** 

|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RθJL<br>Junction-to-Drain Lead<br>–––<br>20<br>RθJA<br>Junction-to-Ambient<br>–––<br>50<br>°C/W<br>eG<br>~~—ee~~<br>~~ee~~ eee Ae|
|---|
|Notes<br>hrough<br>are on page 8<br>®O<br>©|
|www.irf.com<br>1|



10/12/04 

## IRF7450PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

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|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|es|Parameter|Min.|ee|ee|Typ.|Max.|Units|Conditions|
|V(BR)DSS|es|Drain-to-Source Breakdown Voltage|200|–––|–––|V|VGS = 0V, ID = 250µA|
|∆V(BR)DSS/∆TJ   Breakdown Voltage Temp. Coefficient|–––     0.26    –––     V/°C    Reference to 25°C, ID = 1mA|
|es|@|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|–––|0.17|Ω|VGS = 10V, ID = 1.5A|
|es|@|
|VGS(th)|ee|Gate Threshold Voltage|3.0|–––|5.5|V|VDS = VGS, ID = 250µA|
|IIDSSGSS|ee|Gate-to-Source Forward LeakageGate-to-Source Reverse LeakageDrain-to-Source Leakage Current|eee|||TT|tT|––––––––––––|––––––––––––|-10010025025|nAµA|VVVVDSDSGSGS = 200V, V = 160V, V = 30V = -30V|GSGS = 0V = 0V, TJ = 125°C|

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**Dynamic @ TJ = 25°C (unless otherwise specified)** 

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|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|ee|Parameter|ee|Min.|Typ.|Max.|Units|Conditions|
|gfs|ee|Forward Transconductance|2.6|es|–––|–––|S|VDS = 50V, ID = 1.5A|
|Qg|a|Total Gate Charge|–––|26|39                 ID = 1.5A|
|Qgs|ee|Gate-to-Source Charge|es|–––|6.0|9.0|nC|VDS = 160V|
|Qgd|ee|Gate-to-Drain ("Miller") Charge|–––|12|18|VGS = 10V,|
|td(on)|Turn-On Delay Time|–––|10|–––|VDD = 100V|
|es|tr|a|Rise Time|es|–––|3.0|–––|ns|ID = 1.5A|
|td(off)|Turn-Off Delay Time|–––|17|–––|RG = 6.0Ω|
|ee|ee|
|tf|Fall Time|–––|18|–––|VGS = 10V|
|Ciss|Input Capacitance|–––|940|–––|VGS = 0V|
|oe|Coss|Output Capacitance|–––|160|–––|VDS = 25V|°|
|Psa|
|Crss|Reverse Transfer Capacitance|–––|33|–––|pF|ƒ = 1.0MHz|
|es|ee|
|Coss|Output Capacitance|–––|1100|–––|VGS = 0V,  VDS = 1.0V,  ƒ = 1.0MHz|
|Rs|
|Coss|Output Capacitance|–––|66|–––|VGS = 0V,  VDS = 160V,  ƒ = 1.0MHz|
|Rs|
|Coss eff.|Effective Output Capacitance|–––|25|–––|VGS = 0V, VDS = 0V to 160V|®|

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## **Avalanche Characteristics** 

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||||||||||
|---|---|---|---|---|---|---|---|---|
|Parameter|Typ.|Max.|Units|
|ee|
|EAS|Single Pulse Avalanche Energy|–––|230|mJ|
|es|
|Of|IAR|Avalanche Current|–––|2.5|A|
|Diode Characteristics|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|2.3|MOSFET symbol|D|
|>|(Body Diode)|showing  the|
|ISM|Pulsed Source Current|–––|–––|20|integral reverse|G|
|(Body Diode)|p-n junction diode.|S|
|VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ = 25°C, IS = 1.5A, VGS = 0V|
|ee|trr|Reverse Recovery Time|–––|97|146|ns|TJ = 25°C, IF = 1.5A|°|
|Qrr|Reverse RecoveryCharge|–––|350|525|nC|di/dt = 100A/µs|
|ee|es|@|
|2|www.irf.com|

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**Diode Characteristics** 

## IRF7450PbF 

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100<br>VGS<br>TOP          15V<br>                  12V                  10V                  10V a a a |<br>                   8.0V<br>"ae i<br>10                  7.0V<br>                   6.0V<br>                   5.5V<br>BOTTOM  5.0V m o<br>1<br>P A ar<br>0.1<br>5.0V<br>RD 20µs PULSE WIDTH l<br>Pai Tj = 25°C Pil<br>0.01<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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100 100<br>VGS VGS<br>TOP          15V TOP          15V<br>                  12V                  10V                  10V a a a |                   12V                  10V 0 a<br>                   8.0V "ae i                    8.0V<br>10                  7.0V                    7.0V<br>                   6.0V                    6.0V<br>                   5.5V 10                  5.5V<br>BOTTOM  5.0V m o BOTTOM  5.0V — 4s see<br>1<br>P A ar ‘i CL<br>5.0V<br>1<br>0.1<br>5.0V<br>RD 20µs PULSE WIDTH l 20µs PULSE WIDTH<br>Pai Tj = 25°C Pil AL Tj = 150°C mal<br>0.01 0.1<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br> 100 2.5<br>ID = 2.5A<br>S555 SSeS eeee POUPVU nL GERU0ERUER00N<br>REEEEER T  = 150  CJ ° RRR EE 2.0 SERAOSEROOGHROGEREOT<br> 10 Po p) Deer FEASERUGEROEREDZANNEAS<br>1.5<br>===S252===== a<br>D AE T  = 25  CJ ° ere<br>1.0<br> 1<br>eA} yd reece EECCA<br>0.5<br>PASSER :<br>V      = 50VDS<br>0.1 CE RES 20µs PULSE WIDTH 0.0 crBAKA SAAEAO AREA AAAAAE c VGS = 10V<br>5.0 5.5 6.0 6.5 7.0 7.5 8.0 -60 -40 -20 0 20 40 60 80 100 120 140 160<br>V     , Gate-to-Source Voltage (V)GS T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>D<br>I   ,  Drain-to-Source Current (A)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRF7450PbF 

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10000<br>VGS   = 0V,       f = 1 MHZ 20<br>Ciss    = Cgs + Cgd,   Cds    SHORTED ID = 1.5A<br>C   = C<br>rss   gd  VDS = 160V<br>mail Coss   = Cds + Cgd 16 a VDS = 100V rt<br>Ciss VDS = 40V<br>1000<br>e Coss e TT rl_<br>12<br>Crss<br>PP NINE ETI UTI ane Ane<br>100 8<br>a el pi | | YA |<br>4<br>EHH SHA ft fe pe<br>10<br>1 PEATE 10 CTI 100 Fr 1000 0 An<br>0 10 20 30 40<br>VDS, Drain-to-Source Voltage (V) Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100 100<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)<br>| | | | | | [| [| Tt | | a a en e l<br> 10 SEEEEEESZe 10 W720 i<br>° A |<br>T  = 150  CJ<br>100µsec<br>pFfr || [|| ||-AYt| AY |[| [[ |[| | eeeee e ee:<br>1msec<br> 1 ii T  = 25  CJ ° 1 ee See el<br>| | I ES |<br>TA = 25°C<br>| | [7/| [| ff [| [| f[ [ | TJ = 150°C e e 10msec<br>V      = 0 V GS Single Pulse<br>0.1 on s 0.1 Scie<br>0.2 0.4 0.6 0.8 1.0 1.2 1 10 100 1000<br>V     ,Source-to-Drain Voltage (V)SD<br>VDS  , Drain-toSource Voltage (V)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I     , Reverse Drain Current (A)SD ID,  Drain-to-Source Current (A)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


## **Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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## IRF7450PbF 

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2.5 SCT TTT an,<br>2.0 PUNT 7<br>PNET 2. DUT<br>-<br>PTT PN<br>1.5 TTI + tov<br>≤ 1<br>1.0 PTETTINTNT pacman ≤ 0.1 % :<br>Fig 10a.   Switching Time Test Circuit<br>PTE<br>0.5<br>VDS<br>PTT ry 90% —<br>0.0<br>25 50 75 100 125 150<br>T   , Case TemperatureC (  C)°<br>PTE : \/<br>10%<br>/\ [_\]<br>VGS \<br>Fig 9.   Maximum Drain Current Vs. i! im<br>Ambient Temperature td(on) tr td(off) tf<br>Fig 10b.   Switching Time Waveforms<br> 100<br>m D = 0.50 A |e<a<br> 10 0.20<br>0.10<br>0.05<br>ace ee eT Oe —— 0<br> 1 0.02<br>0.01<br>| | PDM t1<br>0.1 SINGLE PULSE t2<br>(THERMAL RESPONSE)<br>Notes:<br>Se ee eeeee 1. Duty factor D = t   / t1 2<br>a e e 2. Peak TJ = P DM x  Z thJA + TA<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

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## IRF7450PbF 

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0.18 0.35 i:<br>0.30<br>0.16<br>0.25<br>VGS = 10V<br>pie:<br>0.20<br>0.14 ID = 1.5A<br>FE a:<br>0.15<br>0.12 ace| 0.10 [r] co [T] ;an —|<br>0 4 8 12 16 20 24 6 8 10 12 14 16<br>ID , Drain Current (A) VGS, Gate -to -Source Voltage  (V)<br>)<br>Ω<br>RDS(on),  Drain-to -Source On Resistance (<br>)<br> Ω<br>RDS ( on) , Drain-to-Source On Resistance (<br>**----- End of picture text -----**<br>


**Fig 12.** On-Resistance Vs. Drain Current 

**Fig 13.** On-Resistance Vs. Gate Voltage 

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Current Regulator<br>Same Type as D.U.T.<br>QG<br>12V | .2µF 50KΩ<br>.3µF QGS ; QGD<br>D.U.T. +-VDS VG 600 : ID<br>VGS TOP 1.1A<br>3mA Charge 500 1.6A<br>BOTTOM 2.5A<br>IG ID<br>Current Sampling Resistors<br>es<br>400<br>‘<br>Fig 14a&b.   Basic Gate Charge Test Circuit<br>SEE<br>and Waveform 300<br>REE<br>See<br>200<br>15V SS=<br>SRE<br>V(BR)DSS 100 as<br>tp VDS L DRIVER SNee<br>SS<br>SSee:EESEESo=<br>R G D.U.T + 0<br>: IAS - [V][DD] A 25 50 75 100 125 ° 150<br>I AS _ | ~ 20V I tp 0.01 | Ω Starting T  , Junction TemperatureJ (  C)<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 15a&b.** Unclamped Inductive Test circuit and Waveforms 

6 

**Fig 15c.** Maximum Avalanche Energy Vs. Drain Current 

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## IRF7450PbF 

## SO-8  Package Outline 

Dimensions are shown in milimeters (inches) 

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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>a b .013 .020 0.33 0.51<br>8 7 a 6 5 EE c .0075 .0098 0.19 0.25<br>6 H D .189 .1968 4.80 5.00<br>E 0.25 [.010]  A E .1497 .1574 3.80 4.00<br>1 2 3 4 es e .050  BASIC 1.27  BASIC<br>>> e1 .025  BASIC 0.635  BASIC<br>a +--+ es H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>L .016 .050 0.40 1.27<br>Oo} b += y  0°  8°  _-+  0°  8° 44<br>- e1 A K x 45°<br>C z<br>y<br>0.10 [.004]<br>Tanerai 8X b A1 e if 8X L ee 8X c<br>0.25 [.010]  C A B 0 7<br>FOOTPRINT<br>NOTES:<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER WwW<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>:      MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. (000<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>s)      MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. Li dd<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>     A SUBSTRATE.<br>: LAN<br>3X 1.27 [.050] aa 8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## SO-8 Part Marking Information (Lead-Free) 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

**==> picture [145 x 37] intentionally omitted <==**

**----- Start of picture text -----**<br>
XXXX<br>INTERNATIONAL O F7101<br>RECTIFIER<br>LOGO<br>**----- End of picture text -----**<br>


DATE CODE (YWW) P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) Y =  LAST DIGIT OF THE YEAR WW =  WEEK 

A =  ASSEMBLY SITE CODE LOT CODE 

PART NUMBER 

www.irf.com 

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## IRF7450PbF 

## SO-8 Tape and Reel 

Dimensions are shown in milimeters (inches) 

**==> picture [174 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
TERMINAL NUMBER 1<br>oO66) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTION a<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

**==> picture [154 x 69] intentionally omitted <==**

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 330.00<br>(12.992)<br>  MAX.<br>SY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 73mH RG = 25Ω, IAS = 2.5A. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. 

When mounted on 1 inch square copper board 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 10/04 

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- [Supplier page](https://es.farnell.com/en-ES/infineon/irf7450trpbf/mosfet-n-ch-200v-2-5a-soic-8/dp/2803409)
---

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