# Power MOSFET, P Channel, 20 V, 6.7 A, 0.04 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2468018RL/)

**URL**: https://novapart.co/products/IRF7404TRPBF/power-mosfet-p-channel-20-v-67-a-004-ohm-soic
**SKU**: IRF7404TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3120
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-6.7A; Drain Source Voltage Vds:-20V; On Resistance Rds(on):0.04ohm; Rds(on) Test Voltage Vgs:-4.5V; Threshold Voltage Vgs:-70

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (23-Jan-2024) |
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 4.5V |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 6.7A |
| Drain Source On State Resistance | 0.04ohm |
| Gate Source Threshold Voltage Max | 700mV |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2468018RL/)

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SO-8<br>**----- End of picture text -----**<br>


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∆ ∆<br>Ω<br>Rpson) Static Drain-to-Source On-Resistance —| =| 0.04 Ves = -4.9¥, Ip = -3.2A @<br>Gate Threshold Voltage _-—||-0.70]—~|0.060—-| ——| Vv | Vos=Vos = Ves,-2.7V,Ip Ip = =-250HA -2.7A @<br>Forward Transconductance | 6.8|-——-|-—| s | Vos = -15V, Ip = -3.2A<br>| Dss Drain-to-S rain-to-source | Leakage Leakage C Curren t _-—|/——| —|—| -1.0|-25 | Hy A VosVos == -16V,6V, VesVos == ov,OV Ty = 125°C<br>loss Gate-to-Source Forward Leakage | -—-| ——| -100] nA Ves = -12V<br>|Q,___|_ Gate-to-Source Reverse Leakage | —-| -—| 100 | Ves = 12V<br>Total Gate Charge _——| —| 50 | | Ip = -3.2A<br>| - Gate- to-Drainto-Source("Miller")Charge Charge | —-| —]|| 5.521 | nC | V pe s = - 4.5V,16V See Fig. 6 and 12 ®<br>sid [RiseTime—SSS~S] Turn-On Delay Time 4 [| Von = tov<br>Turn-Off | ST —] | WBZ Ω<br>Fall Delay Time roof) "| Ro=60 Ω,<br>Time [es [|__| Ro=31_ seeFig. 10.0 D<br>Lp Internal Drain Inductance —);} 25); — .<br>nH | Between lead tip G<br>Ls Internal Source Inductance —, 40 ;— | and center of die contact<br>S<br>**----- End of picture text -----**<br>


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≤ ≤ 

ISD ≤ -3.2A, di/dt ≤ -65A/Us, Vpp ≤ ≤ 

≤ 

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1000<br> TOP         - 7.5V<br>                 - 5.0V<br>                 - 4.0V<br>                 - 3.5V EEEPT<br>                 - 3.0V<br>                 - 2.5V<br>100                  - 2.0V BOTTOM - 1.5V en ee a<br>aSe ee) ee |<br>ey Zone<br>10<br>PEE ges<br>1 |gYA  -1.5V<br>”|eee eee<br>0.1 O74 alll  T   = 25°C Bots J PULSE wo<br>0.01 0.1 1 10 100<br>-V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics<br>100<br>aS po aa T  = 25°CJ ree<br>4,aan , caaeee32a deat<br>T  = 150°CJ<br>a p<br>|AE fe<br>10 IAL |<br>PSSey A<br>|ATAif7t | ft | ft | ft | Pf ft ft<br>[Att tt<br>(Ae  V     = -15VDS<br>11.5 LL 2.0 2.5 3.0 cocruse 3.5 4.0  wore 4.5 5.0A<br>-V     , Gate-to-Source Voltage (V)GS<br>D<br>-I   , Drain-to-Source Current (A)<br>D<br>-I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1000<br> TOP         - 7.5V<br>                 - 5.0V<br>                 - 4.0V<br>                 - 3.5V eeea afi eli| el|<br>                 - 3.0V<br>                 - 2.5V<br>100                  - 2.0V BOTTOM - 1.5V a<br>Eeee.ane ee |<br>Po | ag tt |||<br>10<br>Pg is<br>-1.5V<br>1 || | ld Lot |<br>> feces<br> 20µs PULSE WIDTH<br>0.1 FAy poy ol  T   = 150°CJ  eel<br>0.01 0.1 1 10 100<br>-V     , Drain-to-Source Voltage (V)DS<br>Fig 2. Typical Output Characteristics<br>2.0<br>a ana a<br>1.5 PLETE EEE<br>5<br>CLE Ee<br>1.0 ere aa 00RREn<br>TTpeeane<br>0.5 PEPE EEE<br>CLEP<br>0.0<br>-60 PEEP -40 -20 0 20 40 60 80 100 a 120 140 160<br>T   , Junction Temperature (°C)J<br>D<br>-I   , Drain-to-Source Current (A)<br>(Normalized)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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3000 10<br>V      = 0V,         f = 1MHzGS  I    = -3.2AD<br>C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds  V     = -16V DS<br>C      = Crss         gd<br>C      = C     + Coss        ds         gd 8<br>WN tet te<br>2000 AW s TILL BERR eeeeey ae<br>6<br>PN OL| ss Ut PotTT TIAL<br>4<br>1000 NEN No e eePet EYAL eee<br>ss<br>2<br>aa ee See<br>    SEE FIGURE 12<br>0 re) A 0 Fe bee A<br>1 10 100 0 10 20 30 40 50 60<br>-V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>100 [_ | — | |  100 2 LLL OPERATION IN THIS AREA LIMITED<br>BY R<br>== caseeeeeeace So DS(on)<br>P S T  = 150°C P CEI o T<br>J<br>10<br>|<br>sae|. eA T  = 25°CJ | aaa ii An e<br>coeeeee I PAU Fl<br> 10 1ms<br>1<br>| Af| | | | SSPPE aaa Peediteoeet<br>10ms<br> T TAJ = 25  C= 150  C° °<br>0.1 PeeGn aeA e)  1 L  Single Pulse _I PTIPHTE<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1  1  10  100<br>-V     , Source-to-Drain Voltage (V)SD -V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>-V     , Gate-to-Source Voltage (V)<br>SD I   , Drain Current (A) D-<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


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8.0 VDS RD<br>VGS D.U.T.<br>6.0 Pt RG - A<br>+ VDD<br>4.0 PEPetPN ENE|EE EE Pulse Width -4.5V ≤ 1µs<br>Duty Factor ≤ 0.1%<br>ER EREeNNU :<br>SeaaeeeeNG Fig 10a. Switching Time Test Circuit<br>2.0<br>VDS<br>90%<br>|<br>0.0 PEt i tt ty |<br>25 50 75 100 125 150 |<br>T   , Case TemperatureC (  C)° |<br>10%<br>VGS | |<br>a _<br>Fig 9. Maximum Drain Current Vs. td(on) tr td(off) tf<br>Ambient Temperature<br>Fig 10b. Switching Time Waveforms<br> 100<br>D = 0.50<br>D a Terr il<br>a | ee |<br> 10 0.20<br>0.10<br>SS STeer<br>0.05<br>e S a<br>0.02 ee see ee ee ee PDM<br> 1<br>0.01 t1<br>SINGLE PULSE t2<br>|SeieT at (THERMAL RESPONSE) a1 ee oe Notes:<br>1. Duty factor D = t   / t1 2<br>a 2. Peak T J = P DM x  Z thJA + TA<br>0.1<br>0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>D<br>-I   , Drain Current (A)<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>QG 12V .2µF .3µF<br>> : ; -<br>4 << QGS aan QGD — D.U.T. +VDS<br>VGS<br>VG<br>-3mA tL [<br>IG ID<br>Charge Current Sampling Resistors<br>**----- End of picture text -----**<br>


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D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| I - Current Transformer<br>+<br>- - +<br>(0<br>Kk<br>®<br>Re •   dv/dt controlled by Rg +<br>•   -<br>•   D.U.T. - Device Under Test<br>‘ > Isp controlled by Duty Factor "D"<br>* Reverse Polarity for P-Channel<br>** Use P-Channel Driver for P-Channel Measurements<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. — Period _t<br>VGS=10V<br>{<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current i Current di/dt fs<br>1) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>’<br>Re-Applied<br>Voltage Body Diode  ie Forward Drop<br>® Inductor Curent<br>a<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


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## SO-8  Package Outline 

Dimensions are shown in milimeters (inches) 

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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>8 7 6 5 c .0075 .0098 0.19 0.25<br>jes E 0 6 0.25 [.010] H A -EES=— DE .189.1497 .1968.1574 4.803.80 5.004.00<br>1 2 3 4<br>e .050  BASIC 1.27  BASIC<br>e1 .025  BASIC 0.635  BASIC<br>H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X q e d bk +4 L .016 .050 0.40 1.27<br>ee y  0°  8°  0°  8°<br>e1 K x 45°<br>A<br>C<br>y<br>0.10 [.004]<br>[oyal 8X b A1 e iy ef 8X L n 8X c<br>0.25 [.010]  C A B 7<br>FOOTPRINT<br>NOTES:<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER aApee<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>: F O00g<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>     A SUBSTRATE.<br>3X 1.27 [.050] 8X 1.78 [.070]<br>| [0]<br>**----- End of picture text -----**<br>


## SO-8 Part Marking Information (Lead-Free) 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

XXXX INTERNATIONAL F7101 RECTIFIER LOGO ~~ee~~ 

DATE CODE (YWW) P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) Y =  LAST DIGIT OF THE YEAR WW =  WEEK A =  ASSEMBLY SITE CODE LOT CODE 

PART NUMBER 

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## SO-8 Tape and Reel 

Dimensions are shown in milimeters (inches) 

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TERMINAL NUMBER 1<br>**----- End of picture text -----**<br>


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12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) FEED DIRECTION<br>**----- End of picture text -----**<br>


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NOTES:<br>**----- End of picture text -----**<br>


1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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%  330.00<br>(12.992)<br>  MAX.<br>PY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 09/04 

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- [Supplier page](https://es.farnell.com/infineon/irf7404trpbf/mosfet-p-ch-20v-6-7a-soic-8/dp/2468018RL)
---

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