# Dual MOSFET, Complementary N and P Channel, 55 V, 55 V, 4.7 A, 4.7 A, 0.043 ohm

![Product image](https://novapart.co/image/farnell:2097999/)

**URL**: https://novapart.co/products/IRF7343TRPBF/dual-mosfet-complementary-n-and-p-channel-55-v-47
**SKU**: IRF7343TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.2980
**Stock**: 1000+
**Lead Time**: 92 days (indicative)

## Description

Transistor Polarity:N and P Channel; Continuous Drain Current Id:4.7A; Drain Source Voltage Vds:55V; On Resistance Rds(on):0.043ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1V

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | Complementary N and P Channel |
| Product Range | - |
| Qualification | - |
| Transistor Case Style | SOIC |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 2W |
| Power Dissipation P Channel | 2W |
| Drain Source Voltage Vds N Channel | 55V |
| Drain Source Voltage Vds P Channel | 55V |
| Continuous Drain Current Id N Channel | 4.7A |
| Continuous Drain Current Id P Channel | 4.7A |
| Drain Source On State Resistance N Channel | 0.043ohm |
| Drain Source On State Resistance P Channel | 0.043ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2097999/)

PD - 92547 

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N-CHANNEL MOSFET<br>S1 1 8 D1<br>G1 2 7 D1<br>S2 3 6 D2 Voss} 55V_ | -55V<br>G2 4 5 D2<br>P-CHANNEL MOSFET Rosjon)| 0-050 Ω | 0.105 Ω<br>Top View<br>x PU ><br>val °<br>.<br>SO-8<br>**----- End of picture text -----**<br>


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∆ ∆<br>Verypss_ Ty |Breakdown Voltage Temp. Coefficient Noh = goed VC | Reference c ane 7 = ima<br>R DS(ON) Staticatic: Drain-to-SDrain-to-Source. On-R'On-Resistance: t Nechesoch *| —— [0.056/0.065|[0.0950.105bes Ω Ves Vas = =  -10V.Ip=-3.4A 10V,4.5V, IpIp = = 4.7A3.8A ® ® @<br>| — |0.150|0.170 Ves = -4.5V, Ip = -2.7A ®<br>(N-Ch/<br>Mesa 7.0 — | — |) | Vos=Ves, Ip = 250uA<br>Ofs _[Sate Threshold vowsae |.N-Ch]“P-ch/-1.0)7.9 | —— || —— || V_[Vos=Ves.loVps = 10V, Ip =  -24. 5 0uAA ®<br>Forward Transconductance iP-chi331— 1 — | Ss Vos = -10V. [p= -3.1A<br>|.N-ch| — | — | 20 | Vos = 55V, Vas = OV<br>lpss into. | P-Ch| — | — | -2.00 | Vos = -55V, Ves = OV<br>Drain-to-Source Leakage Current iN-chi —| — | 5 uA Vos = 55V. Veg = OV. T) = 55°C<br>|P-Ch|— | — | -25 Vos = -55V, Ves = OV, Ty = 55°C<br>oe To alGa t e-to-Source Gate Charge Forward Leakage |Hecht N-P | —= |  —Bh[+100] nA38  | Vog=+20VN-Channel<br>Gate-to-Drain ("Miller") Charge Sep 70/10,FO | P-Channe!Ip = -3.1A, Vpg = -44V, Veg = -10V<br>Ω,<br>|N-Ch| — | 3.2 | 4.8 | Von = 28V, Ω  I= 1.08, Re = 6.0<br>ta(ott) |N-Ch] — | 32 | 48 |<br>Turn-Offretin Delay Time ‘P-chCN-Ch)—— [13| 43 || 20)64 | $007P-Channel -28V. Ω  n= -1.0A, Ro = 6.0 Ω<br>**----- End of picture text -----**<br>


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≤   ≤<br>max. junction temperature. ( See fig. 22 )<br>N-Channel ISD ≤ 4.7A, di/dt ≤ 220A/us, Vop ≤ Vierypss: Ty ≤ 150°C ® Surface mounted on FR-4 board, t ≤<br>P-Channel ISD ≤ -3.4A, di/dt ≤ -1 SOA/US, Vop ≤ Ver)Dss: Ty ≤ 150°C<br>N-Channel Starting Ty = 25°C, L=6.5mMH Rg=25_ Ω , Ing=4.7A.<br>P-Channel Starting Ty = 25°C, L= 20mMH Rg = 25, Ω Ing=-3.4A.<br>**----- End of picture text -----**<br>


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 100  100<br>VGS VGS<br>TOP 15V ch TOP 15V otee<br>12V 12V<br>10V HE Et 10V HE EH EH<br>8.0V 1 | 8.0V 10<br>4.0V 4.0V<br>3.5V 3.5V<br>BOTTOM 3.0V eel BOTTOM 3.0V A ey 72<br>), gaan Wo<br> 10 BE) y  10 UY aailil<br>a e/aZornes ee ee Bl) y, YT Wa All<br>3.0V<br>3.0V<br> //4740 ee ee | | YTTT<br>Uy 7 | YYGAN | TAM FT<br> 1 y4a t 20µs PULSE WIDTHT  = 25J °C  1 yMjai l 20µs PULSE WIDTHT  = 150J li °C<br>0.1  1  10  100 0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br> 100 rr  100 ——<br>[- | | }—_J a<br>T  = 25  CJ °<br>Ppmn Seer- T  = 150  CJ °  10 Sna T  = 150  CJ  nn ° ee445<br>Oa —— _—<br> 10 7 |  Se T  = 25  CJ °<br>——————— ey Ay A<br>Sr ee ee ee ee eee<br> 1<br>a ee ee -——— — f — FY<br>V      = 25VDS<br>20µs PULSE WIDTH V      = 0 V GS<br> 1 0.1<br>3 4 5 6 0.2 0.5 0.8 1.1 1.4<br>V     , Gate-to-Source Voltage (V)GS V     ,Source-to-Drain Voltage (V)SD<br>I   ,  Drain-to-Source Current (A)D I   ,  Drain-to-Source Current (A)D<br>I   ,  Drain-to-Source Current (A)D I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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2.5 0.120<br>ID = 4.7A<br>P G<br>0 8 ee<br>2.0<br>PEEP PP<br>0.100<br>HU EU ER GRRRREREDEREREDS<br>1.5 TTPEELE EETA 0.080 PiPt fttL| TEtt delLy<br>1.0 Pee B an VGS = 4.5V n<br>Pe 4<br>0.060<br>0.5 EEE T {i [1] P<br>VGS = 10V<br>eee f ee<br>VGS = 10V<br>0.0 CE E 0.040 |} {| | |} |<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 0 10 20 30 40<br>T  , Junction TemperatureJ (  C)° I    , Drain Current (A)D<br>Fig 5. Normalized On-Resistance Fig 6. Typical On-Resistance Vs. Drain<br>Vs. Temperature Current<br>0.12 200<br>ID<br>Pf pp pf TOP 2.1A<br>3.8A<br>160 BOTTOM 4.7A<br>e 0.10 | | [| | | | |_|<br>eer ON<br>: | 120 P N<br>e 0.08 ft ttt<br>s ty ft 80 TNC<br>a 1 | VE yf SENSES<br>0.06 ee NAL Nf<br>40<br>PN ET ] EPS<br>§ | P|SSN><br>e 0.04 | | | mek A 0 PL SSS<br>0 2 4 6 8 10 25 50 75 100 125 150<br>V       , Gate-to-Source Voltage (V)GS  Starting T  , Junction TemperatureJ (  C)°<br> ( Ω )<br>Ω<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance DS (on)<br>R            , Drain-to-Source On Resistance<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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1200 VGS = 0V, f = 1MHz 20 ID = 4.5A<br>1000 —Nt CCCissrssoss === CCCgsgdds + C+ Cgd ,gd C      SHORTEDds 16 |tr| VVVDSDSDS === 48V 30V 12V ||ST|<br>800 Ciss<br>S r ot 12 a fi<br>CO), SS P| tT | | ge<br>600<br>S c t EEA<br>IN 8 ,<br>400<br>P| NAT TT TA TTT<br>Coss<br>ee e e 4 TT GAT TTT<br>200 P SALT TTT all Wa<br>Crss<br>a e l | | tt<br>0 PT TT 4 LI 0 AEE<br> 1  10  100 0 10 20 30 40<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 9. Typical Capacitance Vs. Fig 10. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>P D = 0.50 rto——err ol<br>0.20<br> 10<br>0.10<br>= ee<br>0.05<br>ncn en So - —co<br>p 0.02 e dy FTA FY PDM<br> 1 0.01<br>oo etree TANI t1<br>SINGLE PULSE<br>(THERMAL RESPONSE) t2<br>e eee ee 1. Duty factor D =Notes: t   / t1 2<br>e e 2. Peak T J= P DM x  Z thJA + TA<br>0.1<br>0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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 100<br>VGS<br>TOP -15V<br>-12V<br>-10V<br>-8.0V TTT]<br>-4.0V<br>-3.5V 17720<br>BOTTOM -3.0V<br> 10<br>byeYt jy | a n in<br>-3.0V<br> 1<br>20µs PULSE WIDTH<br>T  = 25J °C<br>0.1 n i<br>0.1  1  10  100<br>-V     , Drain-to-Source Voltage (V)DS<br>D<br>-I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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 100 ———<br>a<br>ee<br>PE T  = 25  CJ Ty ° pepe<br>T  = 150  CJ °<br>| SSF<br> 10<br>SS ee<br>na<br>| wl ee| | eeeif; { | |<br>yA<br>V      = -25VDS<br>P |) 20µs PULSE WIDTH<br> 1<br>3 4 5 6 7<br>-V     , Gate-to-Source Voltage (V)GS<br>D<br>-I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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 100<br>VGS<br>TOP -15V<br>-12V<br>-10V<br>-8.0V a a |<br>-4.0V<br>BOTTOM -3.5V-3.0V i a 7<br> 10<br>0:<br>> ee ee -3.0V  ee |<br> 1<br>20µs PULSE WIDTH<br>T  = 150J °C<br>0.1 Ati TE |<br>0.1  1  10  100<br>-V     , Drain-to-Source Voltage (V)DS<br>Fig 13. Typical Output Characteristics<br> 100<br>Saas aaaaaaa=<br>PT ee I<br>—4-+<br> 10 SEREEED2Caen++ aH<br>SSS T  = 150  CJ ° ae<br>BET SAREE T  = 25  CJ  SES °<br> 1 Saar araneean<br>PTSSS TIAL= 2 AISS SS aa<br>BEE RA S RRS EESE<br>0.1 |FLU| [| f f[Tet i E V      = 0 V GS<br>0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>-V     ,Source-to-Drain Voltage (V)SD<br>D<br>-I   ,  Drain-to-Source Current (A)<br>SD<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


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2.0 0.240<br>ID = -3.4 A 7 PEELE EEL<br>1.5 0.200<br>e e PTTL TT Ee<br>PLA i VGS = -4.5V VA<br>He aa anni<br>1.0 0.160<br>0.5 0.120<br>arene = PERE<br>VGS = -10V<br>Ep p VGS = -10V PSECro]  eee[ |[Pp<br>0.0 0.080<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 0 2 4 6 8 10 12<br>T  , Junction TemperatureJ (  C)° -I    , Drain Current (A)D<br>Fig 16. Normalized On-Resistance Fig 17. Typical On-Resistance Vs. Drain<br>Vs. Temperature Current<br>0.45 300<br>ID<br>TTT . ) TOP -1.5A<br>250 -2.7A<br>BOTTOM -3.4A<br>PP 0.35 Re<br>: A<br>200<br>PIV] B Ae<br>eV 2 0.25 | 150 EPi KET TT e tT<br>3 NENG<br>WY N<br>100<br>¢ nei ONIN<br>se 0.15 | N |<br>7 | 50 BAND<br>$ EEE]— RSSpt |SAN<br>Pe 0.05 LE || 0 nd<br>2 5 8 11 14 [A] 25 50 75 100 125 150<br>Starting T  , Junction TemperatureJ (  C)°<br>-V        , Gate-to-Source Voltage (V)GS<br> ( Ω )<br>Ω<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance DS (on)<br>R            , Drain-to-Source On Resistanc<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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1200 20<br>VGS = 0V, f = 1MHz ID = -3.1A<br>|| CCissrss == CCgsgd + Cgd , C      SHORTEDds P| VVDSDS ==-48V-30V mm<br>960 NU Coss = Cds + Cgd 16 pt VDS =-12V im<br>SS pt tT ye<br>Ciss<br>720 12<br>SNC H SSs = FSC|<br>480 8<br>SCS 4)<br>IN ral WA<br>iN Coss = EAA<br>240 4<br>Si Crss pe<br>l Al lme AEE[1<br>0 0<br> 1  10  100 0 10 20 30 40<br>-V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 20. Typical Capacitance Vs. Fig 21. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100<br>P D = 0.50 C<br>0.20<br> 10 = e = aer——<br>0.10<br>0.05<br>Sea act mente =s casei eee ea<br>S 0.02 t TH PDM<br> 1 0.01<br>t1<br>= cee<br>SINGLE PULSE<br>(THERMAL RESPONSE) t2<br>aeT ty [E] ee ee [E] eeL R Notes:<br>1. Duty factor D = t   / t1 2<br>a a 2. Peak T J = P DM x  Z thJA + TA<br>0.1<br>0.0001 0.001 0.01 0.1  1  10  100<br>t  , Rectangular Pulse Duration (sec)1<br>C, Capacitance (pF)<br>GS<br>-V     , Gate-to-Source Voltage (V)<br>thJA<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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## SO-8  Package Outline 

Dimensions are shown in milimeters (inches) 

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INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>8 7 6 5 c .0075 .0098 0.19 0.25<br>} 6 eal — H === D .189 .1968 4.80 5.00<br>E 0.25 [.010]  A E .1497 .1574 3.80 4.00<br>1 2 3 4<br>e .050  BASIC 1.27  BASIC<br>e1 .025  BASIC 0.635  BASIC<br>Tr e =— H .2284 .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>cH ee L .016 .050 0.40 1.27<br>y  0°  8°  0°  8°<br>e1 K x 45°<br>A<br>_=o C y a<br>0.10 [.004]<br>coo 8X b A1 l [ - ify 8X L 8X c<br>0.25 [.010]  C A B 0 7<br>FOOTPRINT<br>NOTES:<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER aApee<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>:      MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. F aed<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>O      MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. oan<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>     A SUBSTRATE.<br>3X 1.27 [.050] L una 8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## SO-8 Part Marking Information (Lead-Free) 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

DATE CODE (YWW) 

P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) Y =  LAST DIGIT OF THE YEAR XXXX WW =  WEEK INTERNATIONAL F7101 A =  ASSEMBLY SITE CODE RECTIFIER LOT CODE LOGO ~~ee~~ 

PART NUMBER 

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## SO-8 Tape and Reel 

Dimensions are shown in milimeters (inches) 

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TERMINAL NUMBER 1<br>eoss) |<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) FEED DIRECTION ss<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

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 330.00<br>(12.992)<br>  MAX.<br>VAY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 10/04 

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- [Supplier page](https://es.farnell.com/infineon/irf7343trpbf/mosfet-np-ch-55v-3-4a-8soic/dp/2097999)
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