# Power MOSFET, N Channel, 200 V, 9.3 A, 0.3 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:8648344/)

**URL**: https://novapart.co/products/IRF630NPBF/power-mosfet-n-channel-200-v-93-a-03-ohm-to-220ab
**SKU**: IRF630NPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4160
**Stock**: 1000+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:9.3A; Drain Source Voltage Vds:200V; On Resistance Rds(on):0.3ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power D

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 82W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 200V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 9.3A |
| Drain Source On State Resistance | 0.3ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8648344/)

## PD - 95047A 

Advanced Process Technology Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated Ease of Paralleling Simple Drive Requirements Lead-Free 

## **Description** 

Fifth Generation HEXFET[®] Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low  on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

## IRF630NPbF IRF630NSPbF IRF630NLPbF 

## HEXFET[®] Power MOSFET 

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D<br>VDSS = 200V<br>R  = 0.30 Ω<br>DS(on)<br>G<br>ID = 9.3A<br>S<br>**----- End of picture text -----**<br>


The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts.  The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry. 

The D[2] Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D[2] Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF630NL) is available for lowprofile application. 

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TO-220AB D [2] Pak TO-262<br>IRF630NPbF IRF630NSPbF IRF630NLPbF<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

a **Parameter Max. Units** ~~>~~ ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 9.3 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 6.5 A ~~a~~ IDM Pulsed Drain Current 37 ~~a~~ PD @TC = 25°C ~~a~~ Power Dissipation 82 W ~~a~~ Linear Derating Factor 0.5 W/°C ~~a~~ VGS Gate-to-Source Voltage ±20 V ~~a~~ EAS Single Pulse Avalanche Energy 94 mJ ~~a~~ IAR Avalanche Current ~~©~~ 9.3 A ~~©~~ EAR Repetitive Avalanche Energy 8.2 mJ ~~a~~ dv/dt Peak Diode Recovery dv/dt 8.1 V/ns TJ Operating Junction and -55 to +175 TSTG Storage Temperature Range °C Soldering Temperature, for 10 seconds 300 (1.6mm from case ) ~~a~~ Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m) www.irf.com 1 07/23/10 

## IRF630N/S/LPbF 

## **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

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|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|es|Parameter|Min.|Typ.|Max.|Units|Conditions|
|V(BR)DSS|Drain-to-Source Breakdown Voltage|200|–––|–––|V|VGS = 0V, ID = 250µA|
|ee|e|s|e|e|
|∆|V(BR)DSS/|∆|TJ|ee|Breakdown Voltage Temp. Coefficient|–––|0.26|–––|V/°C|Reference to 25°C, ID = 1mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|–––|0.30|Ω|VGS = 10V, ID = 5.4A|
|I|®|
|VGS(th)|ee|Gate Threshold Voltage|2.0|–––|4.0|V|VDS = VGS, ID = 250µA|
|gfs|Forward Transconductance|4.9|–––|–––|S|VDS = 50V, ID = 5.4A|
|es|es|®|
|IDSS|ee|Drain-to-Source Leakage Current|––––––|a|––––––|25025|µA|VVDSDS = 200V, V = 160V, VGSGS = 0V = 0V, TJ = 150°C|
|Gate-to-Source Forward Leakage|es|–––|ee|–––|100|e|VGS = 20V|
|IGSS|ee|Gate-to-Source Reverse Leakage|–––|es|–––|-100|nA|VGS = -20V|
|Qg|Total Gate Charge|–––|–––|35|ID = 5.4A|
|ee|Qgs|ee|Gate-to-Source Charge|–––|–––|6.5|nC|VDS = 160V|
|Qgd|Gate-to-Drain ("Miller") Charge|–––|–––|17|VGS = 10V|
|a|td(on)|Turn-On Delay Time|–––|7.9|–––|VDD = 100V|®|
|tr|Rise Time|–––|14|–––|ID = 5.4A|
|es|ns|
|td(off)|Turn-Off Delay Time|–––|27|–––|RG = 13|Ω|
|ee|ee|
|tf|Fall Time|–––|15|–––|RD = 18|Ω|
|Ce|LLDS|Internal Drain InductanceInternal Source Inductance|ee|––––––|4.57.5|––––––|nH|Between lead,6mm (0.25in.)from packageand center of die contact|®|G|SD|
|Ciss|Input Capacitance|–––|575|–––|VGS = 0V|
|ff|
|ee|Coss|ee|Output Capacitance|–––|89|–––|VDS = 25V|
|Crss|Reverse Transfer Capacitance|–––|25|–––|pF|ƒ = 1.0MHz|
|es|

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## **Source-Drain Ratings and Characteristics** 

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||||||||
|---|---|---|---|---|---|---|
|Parameter|Min.|Typ.|Max.|Units|Conditions|
|IS|Continuous Source Current|–––|–––|9.3|MOSFET symbol|D|
|ee|(Body Diode)|ee|showing  the|=o|
|ISM|Pulsed Source Current|–––|–––|37|integral reverse|G|
|ee|(Body Diode)|p-n junction diode.|S|
|ee|SSS|i|
|VSD|Diode Forward Voltage|–––|–––|1.3|V|TJ = 25°C, IS = 5.4A, VGS = 0V|
|trr|Reverse Recovery Time|–––|117|176|ns|TJ = 25°C, IF = 5.4A|
|ee|eeee|e|®|
|Qrr|Reverse Recovery Charge|–––|542|813|nC|di/dt = 100A/µs|
|ton|a|Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)|
|Se|Sn|:|

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## **Thermal Resistance** 

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|||||||||
|---|---|---|---|---|---|---|---|
|Parameter|Typ.|Max.|Units|
|a|R|θ|JC|Junction-to-Case|–––|1.83|
|R|θ|CS|aRe|Case-to-Sink, Flat, Greased Surface|0.50|–––|°C/W|
|—|R|θ|JA|Junction-to-Ambient|©|–––|62|
|R|θ|JA|Junction-to-Ambient (PCB  mount)|–––|40|
|es|aOo©|

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www.irf.com 

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IRF630N/S/LPbF 

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 100<br>VGS<br>TOP 15V<br>10V<br>8.0V<br>7.0V Tt Ht<br>6.0V<br>5.5V i ert TI<br> 10 5.0V<br>BOTTOM 4.5V At ee<br>e | t<br> 1 EP” [0] A ael<br>4.5V<br>Zt ttt<br>0.1 741i A ll<br>PAaeEEE EEE<br>0.01 oirrT Ty Tr eri 20µs PULSE WIDTHT  = 25J °C aera<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics<br> 100<br>=== SS<br>aapop fet<br>——— ae<br>°<br> 10 T  = 175  CJ aot<br>we<br>=> Zaeeeeeeee<br>A ee<br>FA T  = 25  CJ ° R<br> 1<br>ee ee ee<br>a<br>V      = 50VDS<br>P a} 20µs PULSE WIDTH<br>0.1 P| ti tt<br>4.0 5.0 6.0 7.0 8.0 9.0 10.0<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   ,  Drain-to-Source Current (A)<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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 100<br>VGS<br>TOP 15V<br>10V<br>8.0V<br>7.0V<br>6.0V<br>5.5V Te<br>5.0V<br>BOTTOM 4.5V LAT<br> 10<br>e eeeee tet<br>poeee oe e2en ree<br>4.5V<br> 1<br>a<br>See i eit eee eeeant<br>7Aee ee ee<br>0.1 RAYA c h 20µs PULSE WIDTHT  = 175J e °C<br>0.1  1  10  100<br>V     , Drain-to-Source Voltage (V)DS<br>D<br>I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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3.5<br>TIITIIIIIII ID = 9.3A<br>rT<br>3.0<br>i tty| pie ey<br>PEE TT Ty Ey [pA]<br>2.5<br>PPPrPryryyyy<br>SSS ee0557 08<br>2.0<br>coca<br>A<br>1.5<br>f7|<br>REEEEDAEEEE<br>1.0 || pee tt tt tt<br>0.5 Pier tt tT tt tt tt<br>0.0 FREFLELtTetfi ER VGS = 10V<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T  , Junction TemperatureJ (  C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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## IRF630N/S/LPbF 

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1200 16<br>VGS   = 0V,     f = 1 MHZ ID = 5.4A<br>m t Ciss  = Cgs + Cgd, Cds  SHORTED Free VDS= 160V ceeenee<br>1000 ca onnnt CCrss  oss    = C = Cgd ds + Cgd 12 Co VVDSDS== 100V 40V NTNt<br>800<br>P EN Ciss THIEooo  ETooo SETTT R TYRAVenu<br>600 8<br>R E | 24<br>PONE Coss tre TI PLT | | AE<br>400<br>P t A FU ET a aeedeeeee<br>4<br>N OUN TE (AFT ||<br>200 Crss<br>F ee Neeeeee eee PARR<br>0 PE INCE Pee LTH 0<br>CHESSER TT = 0 VOC 5 E 10 15 EEE 20 25 30<br>1 10 100 1000<br>Q   , Total Gate Charge (nC)G<br>VDS, Drain-to-Source Voltage (V)<br>Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 100  1000<br>OPERATION IN THIS AREA LIMITED<br>BY R<br>DS(on)<br>pf of of of tT | ar py | | vai all<br> 100<br>oe<br> 10<br>10us<br>T  = 175  CJ °<br>+ + SS A Ft te REP ll<br>eS A  10 sO<br>100us<br>T  = 25  CJ °<br> 1 PT | VT Tf POEEr TH FSA Ht<br>1ms<br>pj===| | tf]  1 Pir| i ASS||<br>a ==  T TCJ = 25  C= 175  C SS ° ° aes 10ms<br>0.1 FSPTY TTL A V      = 0 V GS | 0.1 S  Single Pulse EC oR oh<br>0.2 0.4 0.6 0.8 1.0 1.2  1  10  100  1000<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


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## IRF630N/S/LPbF 

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12<br>12<br>PEEL TEE Ve Vos >7<br>9 _—SERRE REEEE ee o oU MA) DD<br>9 PRNWN EE soy<br>≤ 1<br>PEL PANENI oe ≤ 0.1 %<br>6<br>6<br>PETE TEN EE<br>3 Pet IN. x Fig VDS  10a. Switching Time Test Circuit<br>3<br>90%<br>iti ENN fi<br>0 PTE EL T T TTLTT EE E X \/ ||<br>0 25 50 75 100 125 150 175<br>25 50 T   , Case TemperatureC 75 100 125 °(  C)150° 175 10% /\ |<br>T   , Case TemperatureC (  C) VGS<br>a2 AN<br>td(on) tr td(off) tf<br>Fig 9. Maximum Drain Current Vs. Fig 10b. Switching Time Waveforms<br>Case Temperature<br> 10<br>aa aeeee ee ee ee<br>a a a |<br> 1 R D = 0.50 ametE<br>0.20<br>SEErE<br>0.10 A<br>e 0.05 e tt PDM t<br>0.1 0.020.01 (THERMAL RESPONSE)SINGLE PULSE t1<br>t2<br>ee ee ee ee eee Notes:<br>1. Duty factor D = t   / t1 2<br>C on 2. Peak TJ= P DM x  ZthJC + TC<br>0.01<br>0.00001 0.0001 CO 0.001 C o 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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## IRF630N/S/LPbF 

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15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>20V<br>2 fh tp 0.01 Ω<br>one<br>Fig 12a. Unclamped Inductive Test Circuit<br>— tp V(BR)DSS<br>/ / \<br>IAS<br>Fig 12b. Unclamped Inductive Waveforms<br>QG<br>Bo<br>10V<br>4 ae QGS <— QGD —><br>VG<br>Charge<br>**----- End of picture text -----**<br>


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200<br>ID<br>TOP 2.2A<br>3.8A<br>BOTTOM 5.4A<br>S E<br>150 RNEREE Ee<br>\<br>100 NSS CEE<br>SONGEEERERES<br>I SN <<br>50 PAYNEPot PSSA<br>S<br>0 pt | tS<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJ (  C)°<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50K Ω<br>12V .2 µ F<br>.3 µ F<br>ar a D.U.T. +-VDS<br>VGS<br>3mA<br>NN VV<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


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## IRF630N/S/LPbF 

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**----- Start of picture text -----**<br>
D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>[| I - Current Transformer<br>+<br>- - +<br>00<br>®<br>Re •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>@ Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current i Current di/dt fs<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>Re-Applied<br>Voltage Body Diode  __ Forward Drop ma<br>® Inductor Curent<br>a<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


> For N-Channel HEXFET ® Power MOSFETs 

www.irf.com 

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## IRF630N/S/LPbF 

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**----- Start of picture text -----**<br>
EXAMPLE: THIS IS AN IRF1010<br>LOT CODE 1789 INTERNATIONAL PART NUMBER<br>ASSEMBLED ON WW 19, 2000 RECTIFIER IRF1010<br>IN THE ASSEMBLY LINE "C" LOGO TeaR 019<br>17 89 DATE CODE<br>YEAR 0 =  2000<br>Note: "P" in assembly line position ASSEMBLY<br>indicates "Lead - Free" LOT CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


TO-220AB package is not recommended for Surface Mount Application 

## **Notes:** 

**1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

www.irf.com 

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## IRF630N/S/LPbF 

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**----- Start of picture text -----**<br>
THIS IS AN IRF530S WITHLOT CODE 8024 INTERNATIONAL | PART NUMBER<br>ASSEMBLED ON WW 02, 2000 RECTIFIER F530S<br>IN THE ASSEMBLY LINE "L" LOGO TOR 002.<br>80 24 DATE CODE<br>ASSEMBLY YEAR 0 =  2000<br>assembly"Lead line- Free”position LOT CODE Hiuu 0 L oT WEEK 02LINE L<br>OR<br>PART NUMBER<br>INTERNATIONAL SY<br>RECTIFIER F530S<br>ASSEMBLYLOGO TOR80FUTP0024)24 DATE CODEYEAR 0 =  2000P =  DESIGNATES LEAD - FREEPRODUCT (OPTIONAL)<br>LOT CODE tyi +fOo WEEK 02<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


**Notes: 1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** www.irf.com 

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## IRF630N/S/LPbF 

## TO-262 Package Outline Dimensions are shown in millimeters (inches) 

## TO-262 Part Marking Information 

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EXAMPLE: THIS IS AN IRL3103L<br>LOT CODE 1789 PART NUMBER<br>Note: "P" in assembly lineAS SEMBLED ON WW 19, 1997IN THE ASSEMBLY LINE "C" INTERNATIONALRECTIFIERLOGO TeaR cS 17IRL3103L719C89 DATE CODE<br>position indicates "Lead-Free" ASSEMBLY YEAR 7 =  1997<br>LOT CODE WEEK 19<br>LINE C<br>OR<br>PART NUMBER<br>INTERNATIONAL |<br>RECTIFIER IRL3103L<br>LOGO TRAP1789 719A DATE CODEP =  DESIGNATES LEAD-FREE<br>ASSEMBLY PRODUCT (OPTIONAL)<br>LOT CODE YEAR 7 =  1997<br>WEEK 19<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


## **Notes:** 

**1. For an Automotive Qualified version of this part please seehttp://www.irf.com/product-info/auto/ 2. For the most current drawing please refer to IR website at http://www.irf.com/package/** 

www.irf.com 

10 

## IRF630N/S/LPbF 

## D[2] Pak Tape & Reel Infomation 

Dimensions are shown in millimeters (inches) 

**==> picture [272 x 292] intentionally omitted <==**

**----- Start of picture text -----**<br>
TRR<br>1.60 (.063)<br>1.50 (.059)<br>4.10 (.161)3.90 (.153) 1.60 (.063)1.50 (.059) 0.368 (.0145)<br>i i . ‘ Te 0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 15.42 (.609)15.22 (.601) 24.30 (.957)23.90 (.941)<br>TRL<br>— (GR<br>0000 Alls 1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>ee 16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>FEED DIRECTION<br>13.50 (.532) 27.40 (1.079)<br>, 12.80 (.504) 23.90 (.941) aie<br>4<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>| F<br>30.40 (1.197)<br>NOTES :       MAX.<br>1.   COMFORMS TO EIA-418.2.   CONTROLLING DIMENSION: MILLIMETER. 26.40 (1.039)24.40 (.961) +t 4<br>aa 3.   DIMENSION MEASURED @ HUB.4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 3<br>**----- End of picture text -----**<br>


Notes: ©® Repetitive rating;  pulse width limited by Pulse width ≤ 400µs; duty cycle ≤ 2%. max. junction temperature. This is only applied to TO-220AB package. 2 Starting TJ = 25°C, L = 6.5mH[®] RG = 25 Ω , IAS = 5.4A. 

©® Repetitive rating;  pulse width limited by Pulse width ≤ 400µs; duty cycle ≤ 2%. max. junction temperature. 

© This is applied to D[2] Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. © ISD ≤ 5.4A di/d t ≤ 280A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. 

Data and specifications subject to change without notice. International 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 07/2010 

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11 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

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---

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