# Power MOSFET, P Channel, 150 V, 700 mA, 2.4 ohm, SOIC, Surface Mount

![Product image](https://novapart.co/image/farnell:2577176/)

**URL**: https://novapart.co/products/IRF6217TRPBF/power-mosfet-p-channel-150-v-700-ma-24-ohm-soic
**SKU**: IRF6217TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3770
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | P Channel |
| Product Range | HEXFET |
| Power Dissipation | 2.5W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | P Channel |
| Power Dissipation Pd | 2.5W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 2.4ohm |
| Transistor Case Style | SOIC |
| Drain Source Voltage Vds | 150V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 700mA |
| Drain Source On State Resistance | 2.4ohm |
| Gate Source Threshold Voltage Max | 5V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2577176/)

## PD - 95252 IRF6217PbF 

## **SMPS MOSFET** 

## HEXFET Power MOSFET 

## **Applications** 

Reset Switch for Active Clamp Reset DC to DC converters Lead-Free 

|**VDSS**<br>ee|**RDS(on) max**<br>ee<br>ee|**ID**<br>ee|
|---|---|---|
|**-150V**<br>ee|**2.4**<br>**@VGS =-10V**<br>ee<br>ee|**-0.7A**<br>ee|



## **Benefits** 

Low Gate to Drain Charge to Reduce Switching Losses Fully Characterized Capacitance Including Effective COSS to Simplify Design (See App. Note AN1001) 

Fully Characterized Avalanche Voltage and Current 

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A<br>S 1 8 D<br>S 2 7 D<br>S 3 6 D<br>G 4 5 D<br>SO-8<br>Top View<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

|a<br>~~TIT~~|**Parameter**<br>~~TIT~~|**Max.**<br>~~TIT~~|**Units**<br>~~ae~~|
|---|---|---|---|
|ID@ TA= 25°C<br>~~TIT~~|Continuous Drain Current, VGS@ 10V<br>~~TIT~~|-0.7<br>~~————~~<br>~~TIT~~|A<br>~~————~~<br>~~ae~~|
|ID@ TA= 70°C<br>~~TIT~~|Continuous Drain Current, VGS@ 10V<br>~~TIT~~|-0.5<br>~~————~~<br>~~TIT~~||
|IDM<br>~~TIT~~<br>~~or~~|Pulsed Drain Current<br>~~TIT~~<br>~~or~~|-5.0<br>~~————~~<br>~~TIT~~<br>~~or~~||
|PD@TA= 25°C<br>~~TIT~~<br>~~OTT~~|Power Dissipation<br>~~TIT~~<br>~~OTT~~|2.5<br>~~TIT~~<br>~~OTT~~|W<br>~~ae~~<br>~~OTT~~|
|~~a~~|Linear DeratingFactor<br>~~a~~|0.02<br>|W/°C<br>|
|VGS<br>~~ee~~|Gate-to-Source Voltage<br>~~ee~~|± 20<br>~~ee~~|V<br>~~ee~~|
|dv/dt<br>~~ee~~<br>~~pf~~|Peak Diode Recoverydv/dt<br>~~ee~~<br>~~pf~~|4.5<br>~~ee~~|V/ns<br>~~ee~~|
|TJ<br>TSTG<br>~~ee~~<br>~~pf~~|Operating Junction and<br>Storage Temperature Range<br>~~ee~~<br>~~pf~~|-55  to + 150<br>~~ee~~|°C|
|~~pf~~|Soldering Temperature, for 10 seconds<br>~~pf~~|300 (1.6mm from case )||



|**Thermal Resistance**||||
|---|---|---|---|
|**Symbol**<br>**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>RθJL<br>Junction-to-Drain Lead<br>–––<br>20<br>RθJA<br>Junction-to-Ambient<br>–––<br>50<br>°C/W<br>~~es~~<br>~~I (~~<br>~~ee~~<br>~~ee ee~~ ee||||
|Notes<br>hrough<br>are on page 8<br>0)<br>)||||
|www.irf.com|||1|



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## IRF6217PbF 

**Static @ TJ = 25°C (unless otherwise specified)** 

|||~~ee~~|~~ee~~||||
|---|---|---|---|---|---|---|
||**Parameter**<br>es|**Min.**<br>es<br>~~ee~~|**Typ. **<br>es<br>~~ee~~|**Max. **<br>es|**Units**<br>es|**Conditions**|
|V(BR)DSS|Drain-to-Source Breakdown Voltage<br>~~es~~<br>~~es~~|-150<br>~~ee ~~<br>~~es~~|–––<br> ~~ee~~<br>~~es~~|–––<br>~~es~~|V<br>~~es~~|VGS= 0V, ID= -250µA<br>~~@~~|
|∆V(BR)DSS/∆TJ|JBreakdown Voltage Temp. Coefficient –––     -0.17   –––   V/°C    Reference to 25°C, I<br>~~es~~<br>~~es~~|–––     -0.17   –––   V/°C    Reference to 25°C, I|–––     -0.17   –––   V/°C    Reference to 25°C, I|–––     -0.17   –––   V/°C    Reference to 25°C, I|–––     -0.17   –––   V/°C    Reference to 25°C, I|–––     -0.17   –––   V/°C    Reference to 25°C, ID= -1mA<br>~~@~~<br>~~@~~|
|RDS(on)|Static Drain-to-Source On-Resistance<br>~~es~~<br>~~es~~|–––|–––|2.4|Ω|VGS= -10V, ID= -0.42A<br>~~@~~<br>~~@~~|
|VGS(th)|Gate Threshold Voltage<br>~~es~~<br>~~ee~~<br>~~ee eee~~|-3.0<br>~~ee~~<br>~~eee~~|–––<br>~~ee~~<br>~~eee~~|-5.0<br>~~ee~~<br>~~eee~~|V<br>~~ee~~<br>~~eee~~|VDS= VGS, ID= -250µA<br>~~@~~|
|IDSS|Drain-to-Source Leakage Current<br>~~ee eee~~<br>~~|~~TT<br>||–––<br>~~eee~~<br>~~|~~|–––<br>~~eee~~<br>|-25<br>~~eee~~<br>|µA<br>~~eee~~<br>TT<br>|VDS= -150V, VGS= 0V, TJ= 25°C|
|||–––<br>~~eee~~<br>~~|~~TT<br>||–––<br>~~eee~~<br>TT<br>|-250<br>~~eee~~<br>TT<br>||VDS= -120V, VGS= 0V, TJ= 125°C|
|IGSS|Gate-to-Source Forward Leakage<br>~~ee eee~~<br>~~|~~<br>|~~tT~~|–––<br>~~eee~~<br>~~|~~<br>|~~tT~~|–––<br>~~eee~~<br><br>~~tT~~|-100<br>~~eee~~<br><br>~~tT~~|nA<br>~~eee~~<br><br>~~tT~~|VGS= -20V|
||Gate-to-Source Reverse Leakage<br>|~~tT~~|–––<br>|~~tT~~|–––<br>~~tT~~|100<br>~~tT~~||VGS= 20V|



**Dynamic @ TJ = 25°C (unless otherwise specified)** 

|**Dynamic @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)**||
|---|---|
|**Parameter**<br>**Min.**<br>**Typ. Max. Units**<br>gfs<br>Forward Transconductance<br>0.55<br>–––<br>–––<br>S<br>Qg<br>Total Gate Charge<br>–––     6.0     9.0                I<br>Qgs<br>Gate-to-Source Charge<br>–––<br>1.6<br>2.4<br>nC<br>Qgd<br>Gate-to-Drain("Miller")Charge<br>–––<br>2.8<br>4.2<br>td(on)<br>Turn-On Delay Time<br>–––<br>12<br>–––<br>tr<br>Rise Time<br>–––<br>7.2<br>–––<br>td(off)<br>Turn-Off Delay Time<br>–––<br>14<br>–––<br>tf<br>Fall Time<br>–––<br>16<br>–––<br>Ciss<br>Input Capacitance<br>–––<br>150<br>–––<br>Coss<br>Output Capacitance<br>–––<br>30<br>–––<br>Crss<br>Reverse Transfer Capacitance<br>–––<br>10<br>–––<br>pF<br>Coss<br>Output Capacitance<br>–––<br>150<br>–––<br>Coss<br>Output Capacitance<br>–––<br>15<br>–––<br>ns<br>ee<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~a~~<br>~~ee~~<br>es<br>~~ee~~<br>es<br>~~a~~<br>~~es~~<br>ee~~ee~~<br>~~oe~~<br>~~a~~<br>~~Ps~~<br>es~~ee~~<br>Rs<br>Rs|**Conditions**<br>VDS= -50V, ID= -0.42A<br>–––     6.0     9.0                ID= -0.42A<br>VDS= -120V<br>VGS= -10V,<br>VDD= -75V<br>ID= -0.42A<br>RG= 6.2Ω<br>VGS= -10V<br>VGS= 0V<br>VDS= -25V<br>ƒ = 1.0KHz<br>VGS= 0V,  VDS= -1.0V,  ƒ = 1.0KHz<br>VGS= 0V,  VDS= -120V,  ƒ = 1.0KHz|
|Cosseff.<br>Effective Output Capacitance<br>–––<br>45<br>–––|VGS= 0V, VDS= 0V to -120V|



## **Avalanche Characteristics** 

|**Parameter**<br>**Typ.**<br>**Max.**<br>**Units**<br>EAS<br>Single Pulse Avalanche Energy<br>–––<br>15<br>mJ<br>IAR<br>Avalanche Current<br>–––<br>-1.4<br>A<br>ee<br>es<br>Of|
|---|



## **Diode Characteristics** 

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 Parameter Min. Typ. Max. Units Conditions<br>IS Continuous Source Current ––– ––– -1.8 MOSFET symbol D<br>> (Body Diode) showing  the<br>ISM Pulsed Source Current ––– ––– -5.0 integral reverse G<br>Sea (Body Diode) p-n junction diode. Gs S<br>VSD Diode Forward Voltage ––– ––– -1.6 V TJ = 25°C, IS = -0.42A, VGS = 0V<br>ee trr Reverse Recovery Time ––– 51 77 ns TJ = 25°C, IF = -0.42A ®<br>Qrr Reverse RecoveryCharge ––– 86 130 nC di/dt = -100A/µs<br>ee es @<br>2 www.irf.com<br>**----- End of picture text -----**<br>


## IRF6217PbF 

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 10<br>VGS<br>TOP -15V<br>-12V<br>-10V<br>-8.0V<br>-7.0V<br>-6.0V<br>-5.5V<br>BOTTOM -5.0V Hae<br> 1 ll Ao |||<br>fy<br>0.1 |P| IN -5.0V |<br>Ye/  | Wt<br>20µs PULSE WIDTH<br>P ai T  = 25J ° C<br>0.01<br>0.1  1  10  100<br>-V     , Drain-to-Source Voltage (V)DS<br>D<br>-I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

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 10<br>ee a<br>P| | ft | Pree<br>a T  = 25      CJ ° ‘ T  = 150      CJ °<br> 1<br>S==s52=======<br>an aie<br>0.1 ;)4nGeGneeee[|<br>===<br>=== == ===<br>pop<br>V      = -50VDS<br>PEEL 20µs PULSE WIDTH<br>0.01<br>4 5 7 8 9 11 12<br>-V     , Gate-to-Source Voltage (V)GS<br>D<br>-I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**==> picture [200 x 195] intentionally omitted <==**

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 10<br>VGS<br>TOP -15V<br>-12V<br>-10V<br>-8.0V<br>-7.0V<br>-6.0V<br>-5.5V<br> 1 BOTTOM -5.0V |NtArcalA l|<br>emeestiioct eee<br>0.1 ey ” -5.0V )|<br>CACZz tt 20µs PULSE WIDTH<br>T  = 150J ° C<br>0.01 aii<br>0.1  1  10  100<br>-V     , Drain-to-Source Voltage (V)DS<br>D<br>-I   ,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 2.** Typical Output Characteristics 

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2.5<br>ID = -0.70A<br>|<br>2.0 TL ETA|<br>1.5<br>een<br>PETE<br>1.0<br>Hepa<br>TET<br>0.5<br>ATT EE ELE<br>PELE<br>PELE EEEE E V GS = -10V<br>0.0<br>-60 -40 -20 0 20 40 60 80 100 120 140 160<br>T  , Junction TemperatureJ (    C)°<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


**Fig 4.** Normalized On-Resistance Vs. Temperature 

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## IRF6217PbF 

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**----- Start of picture text -----**<br>
10000<br>VGS   = 0V,       f = 1 MHZ<br>Ciss    = Cgs + Cgd,   Cds    SHORTED<br>PH Crss    = Cgd<br>C  = C + C<br>1000 n ail oss   ds  gd<br>ee || ||<br>Ciss<br>100 SS E<br>ae<br>PRES Coss THEE<br>10 Crss<br>S SE eC)<br>a ee eee ll<br>1 a ee ell<br>1 10 100 1000<br>-VDS, Drain-to-Source Voltage (V)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


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12<br>ID = -0.42A VDS = -120V<br>VDS = -75V<br>10 | | VDS = -30V Se<br>a 77<br>8<br>A<br>6<br>4<br>2<br>0 V | | | tT | tT<br>0 2 4 6 8<br>Q   , Total Gate Charge (nC)G<br>GS<br>-V     , Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 5.** Typical Capacitance Vs. Drain-to-Source Voltage 

**Fig 6.** Typical Gate Charge Vs. Gate-to-Source Voltage 

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**----- Start of picture text -----**<br>
 10<br>a ao<br>T  = 150      CJ °<br> 1<br>ao fVil |<br>a ase<br>T  = 25      CJ °<br>pea V      = 0 V GS<br>0.1<br>0.2 0.6 0.9 1.3 1.6<br>-V     ,Source-to-Drain Voltage (V)SD<br>SD<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

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**----- Start of picture text -----**<br>
100<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br>10 Se ot<br>1<br>100µsec<br>V7a  | TTA SD e<br>0.1 a eel 10msec1msec THT<br>Tc = 25°C<br>Tj = 150°C<br>Single Pulse aEHHa<br>0.01<br>tte<br>1 10 100 1000<br>-VDS  , Drain-toSource Voltage (V)<br>-ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 8.** Maximum Safe Operating Area 

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## IRF6217PbF 

**==> picture [434 x 472] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0 P| ft | ft | ty tt Vos Ro<br>0.8 P| tt tt tt Ves<br>Pi} tt tt tt Re DUT. -<br>+<br>0.6<br>SSP) ot vs<br>P| PF eR Ves<br>≤ 1<br>≤ 0.1 %<br>0.4<br>Sees<br>Fig 10a.   Switching Time Test Circuit<br>0.2 P| tt ttt ININ I =<br>VDS<br>CECE 90% —S<br>0.0 P| tt tt tt tt \<br>25 50 75 100 125 150<br>T   , Case TemperatureC (    C)°<br>10% /\ \<br>Fig 9.   Maximum Drain Current Vs.<br>Ambient Temperature VGS \<br>td(on) tr td(off) tf<br>Fig 10b.   Switching Time Waveforms<br> 100<br>a eee<br>D = 0.50<br> 10 ea 0.20 ee eerrlltoi ttt<br>0.10<br>0.05<br>BSI 0.020.01 — ae (THERMAL RESPONSE)SINGLE PULSE teseett P DM<br> 1 S e L h<br>t 1<br>PEE t 2<br>rf LE ETT ETE TT 1. Duty factor D =Notes: t   / t1 2<br>ll 2. Peak T J = P DM x  Z thJA + T A<br>0.1<br>0.0001 0.001 0.01 0.1  1  10<br>t  , Rectangular Pulse Duration (sec)1<br>D<br>-I   , Drain Current (A)<br>thJA<br>(Z          )<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

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## IRF6217PbF 

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**----- Start of picture text -----**<br>
1.94 9.00<br>1.92 e e 8.00 e e<br>7.00<br>1.90<br>P | E EE<br>6.00<br>1.88<br>N VGS = -10V S 5.00 e ee<br>1.86<br>R A 4.00<br>1.84 ID = -0.7A<br>M EAL 3.00 AR S<br>1.82<br>2.00<br>P Y) ER E<br>1.80 1.00<br>e e ee<br>0.00 0.25 0.50 0.75 1.00 1.25 1.50 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>-ID , Drain Current (A) -VGS, Gate -to -Source Voltage  (V)<br>Fig 12.    On-Resistance Vs. Drain Current Fig 13.    On-Resistance Vs. Gate Voltage<br>Current Regulator<br>Same Type as D.U.T.<br>QG<br>50KΩ<br>12V .2µF .3µF D.U.T. +-VDS VG QGS QGD 35 I D<br>TOP -0.6A<br>VGS rue 4 30 ne a -1.1A<br>-3mA Charge BOTTOM -1.4A<br>o Current pa IGSampling ResistorsID o 25 NneNESE E<br>NS<br>Fig 14a&b.   Basic Gate Charge Test Circuit 20<br>and Waveform CONTE<br>KE<br>15 RNNEE<br>VDS L 10 PEXSK ERE<br>HARNESSES<br>AS<br>RG D.U.T VDD 5<br>IAS A<br>-20V DRIVER<br>tp 0.01Ω SS<br>S|, @ [ly] 0<br>25 50 75 100 125 150<br>Starting Tj, Junction Temperature (   C)°<br>+— tp<br>Y V(BR)DSS  ev. 15V FSS<br>Fig 15c.   Maximum Avalanche Energy<br>Fig 15a&b.   Unclamped Inductive Test circuit<br>Vs. Drain Current<br>and Waveforms<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>)<br>Ω<br>RDS (on) , Drain-to-Source On Resistance (<br>)<br>Ω<br>RDS(on),  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
I AS<br>**----- End of picture text -----**<br>


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## IRF6217PbF 

## **SO-8 Package Outline** 

Dimensions are shown in millimeters (inches) 

**==> picture [356 x 336] intentionally omitted <==**

**----- Start of picture text -----**<br>
INCHES MILLIMETERS<br>DIM<br>D B MIN MAX MIN MAX<br>A 5 A .0532 .0688 1.35 1.75<br>A1 .0040 .0098 0.10 0.25<br>b .013 .020 0.33 0.51<br>‘a 6 Ho 8 7 AE 6 q 5 t H eeee——= Dc .189.0075 eeee .0098.1968 0.194.80 0.255.00<br>E<br>0.25 [.010]  A E .1497 .1574 3.80 4.00<br>a 1 2 3 4 a e .050  BASIC 1.27  BASIC<br>— e1 .025  BASIC 0.635  BASIC<br>Lo es H .2284 a .2440 5.80 6.20<br>K .0099 .0196 0.25 0.50<br>6X e<br>cH =———— L .016 .050 0.40 1.27<br>a y  0°  8°  0°  8°<br>e1 K x 45°<br>A<br>C<br>y<br>0.10 [.004]<br>an 8X b v A1 o X O 8X L 8X c of<br>0.25 [.010]  C A B 7<br>fe. ott<br>FOOTPRINT<br>1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 8X 0.72 [.028]<br>2.  CONTROLLING DIMENSION: MILLIMETER<br>3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].<br>4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.<br>5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>rT<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. | Tove [|]<br>6.46 [.255]<br>6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.<br>     MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].<br>7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO<br>| UUUu<br>3X 1.27 [.050] ake<br>8X 1.78 [.070]<br>**----- End of picture text -----**<br>


## NOTES: 

1.  DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 

2.  CONTROLLING DIMENSION: MILLIMETER 

3.  DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 

4.  OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 

- 5   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6   DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 

- 7   DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 

## **SO-8 Part Marking** 

EXAMPLE: THIS IS AN IRF7101 (MOSFET) 

## DATE CODE (YWW) 

**==> picture [174 x 58] intentionally omitted <==**

**----- Start of picture text -----**<br>
XXXX<br>INTERNATIONAL F7101<br>ac a ik<br>RECTIFIERLOGO TEEe<br>**----- End of picture text -----**<br>


- P =  DESIGNATES LEAD-FREE PRODUCT (OPTIONAL) 

- Y =  LAST DIGIT OF THE YEAR WW =  WEEK A =  ASSEMBLY SITE CODE LOT CODE 

PART NUMBER 

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7 

## IRF6217PbF 

## **SO-8 Tape and Reel** 

Dimensions are shown in millimeters (inches) 

**==> picture [174 x 112] intentionally omitted <==**

**----- Start of picture text -----**<br>
TERMINAL NUMBER 1<br>&O66) fF<br>12.3 ( .484 )<br>11.7 ( .461 )<br>8.1 ( .318 )<br>7.9 ( .312 ) | FEED DIRECTION a<br>**----- End of picture text -----**<br>


NOTES: 

1.   CONTROLLING DIMENSION : MILLIMETER. 

2.   ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 

3.   OUTLINE CONFORMS TO EIA-481 & EIA-541. 

**==> picture [154 x 68] intentionally omitted <==**

**----- Start of picture text -----**<br>
 330.00<br>(12.992)<br>  MAX.<br>SY<br>14.40 ( .566 )<br>12.40 ( .488 )<br>**----- End of picture text -----**<br>


NOTES : 

1. CONTROLLING DIMENSION : MILLIMETER. 

2. OUTLINE CONFORMS TO EIA-481 & EIA-541. 

Repetitive rating;  pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 15mH RG = 25Ω, IAS = -1.4A. 

Pulse width ≤ 400µs; duty cycle ≤ 2%. 

When mounted on 1 inch square copper board. 

Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualifications Standards can be found on IR’s Web site. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 10/04 

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- [View this product on Novapart](https://novapart.co/products/IRF6217TRPBF/power-mosfet-p-channel-150-v-700-ma-24-ohm-soic)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/infineon/irf6217trpbf/mosfet-p-ch-150v-0-7a-soic-8/dp/2577176)
---

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