# Power MOSFET, P Channel, 100 V, 40 A, 0.06 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:1704021/)

**URL**: https://novapart.co/products/IRF5210PBF/power-mosfet-p-channel-100-v-40-a-006-ohm-to-220ab
**SKU**: IRF5210PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.9400
**Stock**: 1000+
**Lead Time**: 85 days (indicative)

## Description

Transistor Polarity:P Channel; Continuous Drain Current Id:-40A; Drain Source Voltage Vds:-100V; On Resistance Rds(on):0.06ohm; Rds(on) Test Voltage Vgs:-10V; Threshold Voltage Vgs:-4V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | P Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 200W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 40A |
| Drain Source On State Resistance | 0.06ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1704021/)

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D Voss = -100V<br>R -0.06 Ω<br>DS(on) ~ ©:<br>G<br>Ip =-40A<br>S<br>all<br>TO-220AB<br>**----- End of picture text -----**<br>


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Viaross | Drain-to-Souree Breakdown Voltage | [-100[——|—-] | V_| Ves= OV, Ip = -250uA<br>∆ ∆<br>Ω<br>Rosin___| Static Drain-to-Source On-Resistance | —— |—— [0.06 |__| Ves = -10V, Ip = -244 ©<br>Vesti) [Gate Threshold Vottage | -2.0 | —|-40 | V_| Vs = Vos, fp = -250HA<br>Transconductance<br>Gs | Forward | 10 [—-[——| S| Vps=-50V, Ip =-21A<br>[Gate-to-Source<br>@; Reverse Leakage | —— |——|-100| "" | Vos = -20V<br>[TotalGate Charge | == || 180] ‘(| >= 2A<br>ftan) ||Ee [Tumn-OnDelayTime———SS«|] Gate t o-SourceeemtoeCharge ——*«| —-Eis"| | 28 | ne | V oe s = ~10V,-80V See Fig. 6 and 13 ©<br>fe —— | 17 |] _| Voo = -0V<br>Ω<br>«[RiseTime SS SS*d 8B] | to = 210<br>tr | Tum-Off Delay Time «| —— | 79 | —— | | Ro=25 Ω,<br>raitme | | 81 | |__| Ro #24 See Fig. 100 D<br>from package G<br>ay | mm (0.25in.) &<br>S<br>**----- End of picture text -----**<br>


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D<br>G<br>(st S<br>**----- End of picture text -----**<br>


ISD ≤ ≤ ≤ Ty ≤ 175°C ≤ ≤ 

Ω 

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1000 1000<br>                   VGS                    VGS<br> TOP          - 15V  TOP          - 15V<br>                  - 10V                   - 10V<br>                  - 8.0V                   - 8.0V<br>                  - 7.0V                   - 7.0V<br>                  - 6.0V                   - 6.0V<br>                  - 5.5V                   - 5.5V<br>                  - 5.0V                   - 5.0V<br> BOTTOM  - 4.5V ef |  BOTTOM  - 4.5V A |<br>100 eee | || 100 et|<br>|Vor| | ||Vor| | ||| | || | || || een Seee<br>10 Of | 10 UY|<br>-4.5V<br> -4.5V<br> 40µs PULSE WIDTH  40µs PULSE WIDTH<br>1 YaCAACAA  T   = 25°Ccc A 1 7ig [Ai] iA-_ee  T   = 175°CC<br>0.1 1 10 100 0.1 1 10 100<br>-V     , Drain-to-Source Voltage (V)DSDS -V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br>1000 3.0<br>Paee ee ee ee eee ee 2.5 E I    = -35AD ERE<br>pop PE<br>100 2.0<br>T  = 25°CJ<br>P—— e See ter|<br>aeenA45Sae eee T  = 175°CJ ee 1.5 PLEPPP Pueet<br>10 PAT | 1.0 PL eet eer ey<br>—ASS eTLe<br>0.5<br>2 ot<br> V     = -50VDS<br>1 fPp| | yo  40µs PULSE WIDTH | A 0.0 P PE  V      = -10VGS<br>4 5 6 7 8 9 10 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>-V     , Gate-to-Source Voltage (V)GS T   , Junction Temperature (°C)J<br>D D<br>-I   , Drain-to-Source Current (A) -I   , Drain-to-Source Current (A)<br>(Normalized)<br>D<br>-I   , Drain-to-Source Current (A)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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1000<br>                   VGS<br> TOP          - 15V<br>                  - 10V<br>                  - 8.0V<br>                  - 7.0V<br>                  - 6.0V<br>                  - 5.5V<br>                  - 5.0V<br> BOTTOM  - 4.5V ef |<br>100 eee | ||<br>|Vor| | ||Vor| | ||| | || | || ||<br>10 Of |<br> -4.5V<br> 40µs PULSE WIDTH<br> T   = 25°Ccc<br>1 YaCAACAA<br>0.1 1 10 100<br>-V     , Drain-to-Source Voltage (V)DSDS<br>D<br>-I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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6000<br>V      = 0V,         f = 1MHzGS<br>C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds<br>5000 Ciss C      = CC      = C     + Crss         gdoss        ds         gd<br>Pe<br>4000 NN oo<br>C oss<br>PBNE EHH<br>3000<br>NNT Sl<br>Crss<br>2000 PS NSE STth<br>SSN<br>1000<br>ee ll<br>ETee eel<br>0<br>1 10 100<br>-V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


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20<br> I    = -21AD<br>V      = -80VDS<br> V      = -50VDS<br>16  V      = -20VDS<br>pt Nae<br>aa ry | |<br>12<br>SaaaeeyLYVian<br>fF | | By]<br>8<br>1PF oTYA If<br>4 paoh<br>T<br> FOR TEST CIRCUIT<br>| AeATTTT     SEE FIGURE 13<br>0<br>0 40 80 120 160 200<br>Q   , Total Gate Charge (nC)G<br>GS<br>-V     , Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


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1000 1000<br> OPERATION IN THIS AREA LIMITED<br>a ee ee _                        BY R ” DS(on) aul<br>ee ee ee ee ee el a<br>10µs<br>100 100<br>T  = 175°CJ<br>ne a eee eee eee ZR AB) 100µs LT TTT]<br>T  = 25°CJ<br>10 AP 72 0 10 YDSA PE 1ms cs<br>2 ee ee ee eeeeeeee 0 ee 10ms el<br>T     = 25°CC<br>T     = 175°CJ<br>1 oe120 |ee ee V      = 0VGS A 1 pp  Single Pulse 1 secs<br>0.4 0.8 1.2 1.6 2.0 2.4 1 10 100 1000<br>-V     , Source-to-Drain Voltage (V)SD -V     , Drain-to-Source Voltage (V)DS<br>D<br>-I   , Drain Current (A)<br>SD<br>-I     , Reverse Drain Current (A)<br>**----- End of picture text -----**<br>


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50<br>EERE Ves out<br>40 PEPEPALE re) +- .<br>30 ≤ 1<br>PEP EE EEE ≤ 0.1 %<br>Pit PNTE PN EEE ET o u Faee :<br>20 Pitt; EE LIN | Fig 10a. Switching Time Test Circuit<br>CCPCEA NEE ;<br>td(on) tr td(off) tf<br>10 Pitt TT TT TIN VGS an _<br>10%<br>pi titty ty TIN ane<br>0<br>25 50 75 100 125 150 175<br>SERRE T   , Case TemperatureC (  C)° 90% Vf}<br>VDS a,<br>Fig 9. Maximum Drain Current Vs. Fig 10b. Switching Time Waveforms<br>Case Temperature<br> 1 ye<br>a O_O<br>PEE D = 0.50 HE te<br>P O ome OC<br>0 0.20<br>rr<br>0.1 a 0.10 OF PDM<br>0.05<br>alee t1<br>0.02 SINGLE PULSE t2<br>See 0.01 (THERMAL RESPONSE) ee eit<br>sand OO Notes:<br>1. Duty factor D = t   / t1 2<br>TU 2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>| |<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>D<br>-I   , Drain Current (A)<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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VDS L<br>RG D.U.T |. VDD<br>-20V t IAS DRIVER<br>Pott tp 0.01Ω :<br>15V<br>Fig 12a. Unclamped Inductive Test Circuit<br>IAS<br>Sf]<br>‘||<br>le tp \<br>V(BR)DSS<br>**----- End of picture text -----**<br>


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QG<br>A0V o o ,<br>f o<br>QGS QGD<br>VG<br>| ><br>Charge<br>**----- End of picture text -----**<br>


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2000<br>                    ID<br>TOP            -8.6A<br>Was                    -15A<br>1600 BOTTOM    -21A<br>NaeBNEEEE<br>Po<br>1200 NEKU GEER EE<br>800 PXE Nftt<br>SUNGPRKKU REEIfEE<br>400 BEER | ‘ SSNNGE \  EE<br>0<br>25 50 75 100 125 150 175<br>| | UP SS<br>Starting T  , Junction Temperature (°C)J<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>12V .2µF<br>.3µF<br>ree<br>7 D.U.T. +-VDS<br>VGS<br>-3mA<br>& |<br>Oe.<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


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‘* + Circuit Layout Considerations<br>D.U.T    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| | - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Re •   dv/dt controlled by Rg +<br>•   Isp controlled by Duty Factor "D" -<br>•   D.U.T. - Device Under Test<br>* Reverse Polarity of D.U.T for P-Channel<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>[<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ii Current di/dt /<br>©) D.U.T. VDS Waveform Diode Recoverydv/dt \ F<br>L,<br>Re-Applied<br>Voltage Body Diode  Forward Drop<br>® Inductor Curent<br>a<br>Ripple  ≤ 5% ]<br>**----- End of picture text -----**<br>


Dimensions are shown in millimeters (inches) 

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10.54 (.415) 3.78 (.149) - B -<br>2.87 (.113) 10.29 (.405) 3.54 (.139) 4.69 (.185)<br>2.62 (.103) - A - 4.20 (.165) 1.32 (.052)<br>1.22 (.048)<br>6.47 (.255)<br>4 6.10 (.240)<br>15.24 (.600) = aoa na<br>14.84 (.584) LEAD ASSIGNMENTS<br>1.15 (.045)     MIN HEXFETLEAD ASSIGNMENTS       1 - GATE  IGBTs, CoPACK<br>1     2    3 1- GATE       2 - DRAIN 1- GATE<br>2- DRAIN       3 - SOURCE 2- COLLECTOR<br>3- SOURCE       4 - DRAIN 3- EMITTER<br>| ba— 4- DRAIN 4- COLLECTOR<br>14.09 (.555)<br>13.47 (.530) 4.06 (.160)<br>3.55 (.140)<br>3X [0.93 (.037)] 0.69 (.027) 3X [0.55 (.022)] 0.46 (.018)<br>3X Te [1.40 (.055)] 1.15 (.045) 0.36  (.014)        M    B   A   M | 2.92 (.115)<br>2.64 (.104)<br>2.54 (.100) || T<br>2X<br>NOTES:<br>     1  DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.             3  OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.<br>**----- End of picture text -----**<br>


- 2  CONTROLLING DIMENSION : INCH                                                       4  HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS. 

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EXAMPLE : T HIS  IS  AN IR F1010<br>L OT  CODE  1789<br>AS S E MB LE D ON WW 19, 1997 INT E RNAT IONAL PART  NU MB ER<br>IN T HE  AS S E MBLY LINE  "C" RE CT IFIER<br>LOGO<br>Note:   "P" in assembly line<br>position indicates "Lead-Free" DAT E  CODE<br>YEAR  7 =  1997<br>AS S E MBL Y<br>LOT  CODE WE E K 19<br>LINE  C<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 06/04 

Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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