# Dual MOSFET, N Channel, 40 V, 35 A, 0.0051 ohm, PQFN, Surface Mount

![Product image](https://novapart.co/image/farnell:3282273/)

**URL**: https://novapart.co/products/IRF40H233XTMA1/dual-mosfet-n-channel-40-v-35-a-00051-ohm-pqfn
**SKU**: IRF40H233XTMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.4500
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 8Pins |
| Channel Type | N Channel |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | N Channel |
| Power Dissipation Pd | 50W |
| Rds(On) Test Voltage | 10V |
| On Resistance Rds(On) | 0.0051ohm |
| Transistor Case Style | PQFN |
| Drain Source Voltage Vds | 40V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 35A |
| Power Dissipation N Channel | 50W |
| Power Dissipation P Channel | 50W |
| Gate Source Threshold Voltage Max | 3V |
| Drain Source Voltage Vds N Channel | 40V |
| Drain Source Voltage Vds P Channel | 40V |
| Continuous Drain Current Id N Channel | 35A |
| Continuous Drain Current Id P Channel | 35A |
| Drain Source On State Resistance N Channel | 0.0051ohm |
| Drain Source On State Resistance P Channel | 0.0051ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3282273/)

**IRF40H233** 

## **MOSFET** 

## **Benefits** 

||**Parameter**|**Value**|**Value**|**Value**|||**Unit**|||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||
||_V_DS|40|||||V|||||
||_R_DS(on),typ|5.1|||||mΩ|||||
||_R_DS(on),max|6.2|||||mΩ|||||
|_I_<br>_I_<br>~~jovsiconume~~<br>~~[owocaseumey ~~||63<br>A<br>35<br>A<br>~~||~~<br> ~~|~~<br>~~|~~||||||||||
||IRF40H233<br>~~Type/OrderingCode ~~||**Package**<br>PQFN 5x6 Dual<br> ~~|~~|||PQFN 5x6 Dual<br>~~|~~||**Marking**<br>H233||-<br>~~Related Links~~||



Final Data Sheet 

1 

**IR�MOSFET�-�StrongIRFETª IRF40H233** 

**==> picture [120 x 53] intentionally omitted <==**

## **Table�of�Contents** 

Description   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Outlines  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision History  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimer   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 

Final Data Sheet 

2 

Rev.�2.1,��2018-07-16 

**IR�MOSFET�-�StrongIRFETª IRF40H233** 

**==> picture [120 x 53] intentionally omitted <==**

**1�����Maximum�ratings** at� _TC_ =25�°C,�unless�otherwise�specified 

## **Table�2�����Maximum�ratings** 

|**Table2Maximumratings**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Continuous drain current|_I_D|-<br>-<br>-|-<br>-<br>-|35<br>63<br>32|A|_V_GS=10V,_T_C=25°C<br>_V_GS=10V,_T_C=25°C(siliconlimited)<br>_V_GS=10V,_T_C=100°C1)|
|Pulsed drain current1)|_ID,pulse_|-|-|140|A|_T_C=25°C|
|Avalanche energy, single pulse2)|_E_AS|-|-|71|mJ|_I_D=35A,_R_GS=50Ω|
|Gate source voltage|_V_GS|-20|-|20|V|-|
|Power dissipation|_P_tot|-|-|50|W|_T_C=25°C|
|Operating and storage temperature|_T_j,_T_stg|-55|-|175|°C|IEC climatic category; DIN IEC 68-1:<br>55/175/56|



## **2�����Thermal�characteristics** 

## **Table�3�����Thermal�characteristics** 

|**Parameter**|**Symbol**||**Values**|**Values**|**Unit**|**Note/TestCondition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Thermal resistance, junction - case,<br>bottom3)|_R_thJC|-|-|3|°C/W|-|
|Thermal resistance, junction - case,<br>top|_R_thJC|-|-|45|°C/W|-|
|Device on PCB,<br>6 cm² cooling area1)|_R_thJA|-|-|40|°C/W|-|
|Device on PCB,<br>RTHJA(<10s)|_R_thJA|-|-|25|°C/W|-|



> 1) See Diagram 3 for more detailed information 

> 2) See Diagram 13 for more detailed information 3) RthJC is measured at TJ approximately 90°C. 

Final Data Sheet 

3 

Rev.�2.1,��2018-07-16 

**IR�MOSFET�-�StrongIRFETª IRF40H233** 

**==> picture [120 x 53] intentionally omitted <==**

## **3�����Electrical�characteristics** 

at� _T_ j=25�°C,�unless�otherwise�specified 

## **Table�4�����Static�characteristics** 

|**Parameter**|**Symbol**||**Values**|**Values**|**Unit**|**Note/TestCondition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Drain-source breakdown voltage|_V_(BR)DSS|40|-|-|V|_V_GS=0V,_I_D=250µA|
|Breakdown voltage temperature<br>coefficient|d_V_(BR)DSS/d_T_j|-|41|-|mV/°C|_I_D=1mA,referencedto25°C|
|Gate threshold voltage|_V_GS(th)|2.2|3.0|3.9|V|_V_DS=_V_GS,_I_D=50µA|
|Zero gate voltage drain current|_I_DSS|-<br>-|-<br>-|1<br>150|µA|_V_DS=40V,_V_GS=0V,_T_j=25°C<br>_V_DS=40V,_V_GS=0V,_T_j=125°C|
|Gate-source leakage current|_I_GSS|-|-|100|nA|_V_GS=20V,_V_DS=0V|
|Drain-source on-state resistance|_R_DS(on)|-|5.10|6.20|mΩ|_V_GS=10V,_I_D=35A|
|Gate resistance1)|_R_G|-|1.8|-|Ω|-|
|Transconductance|_g_fs|-|60|-|S||_V_DS|≥2|_I_D|_R_DS(on)max,_I_D=35A|



## **Table�5�����Dynamic�characteristics** 

|**Parameter**|**Symbol**||**Values**|**Values**|**Unit**|**Note/TestCondition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Input capacitance1)|_C_iss|-|2200|-|pF|_V_GS=0V,_V_DS=20V,_f_=1MHz|
|Output capacitance1)|_C_oss|-|380|-|pF|_V_GS=0V,_V_DS=20V,_f_=1MHz|
|Reverse transfer capacitance1)|Crss|-|260|-|pF|_V_GS=0V,_V_DS=20V,_f_=1MHz|
|Turn-on delay time|_t_d(on)|-|11|-|ns|_V_DD=26V,_V_GS=10V,_I_D=35A,<br>_R_G,ext=2.7Ω|
|Rise time|_t_r|-|67|-|ns|_V_DD=26V,_V_GS=10V,_I_D=35A,<br>_R_G,ext=2.7Ω|
|Turn-off delay time|_t_d(off)|-|25|-|ns|_V_DD=26V,_V_GS=10V,_I_D=35A,<br>_R_G,ext=2.7Ω|
|Fall time|_t_f|-|30|-|ns|_V_DD=26V,_V_GS=10V,_I_D=35A,<br>_R_G,ext=2.7Ω|



## **Table�6�����Gate�charge�characteristics[2)]** 

|**Table6Gatechargecharacte**|**ristics2)**||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Gate to source charge|_Q_gs|-|12|-|nC|_V_DD=20V,_I_D=35A,_V_GS=0to10V|
|Gate charge at threshold|_Q_g(th)|-|6.6|-|nC|_V_DD=20V,_I_D=35A,_V_GS=0to10V|
|Gate to drain charge1)|_Q_gd|-|16|-|nC|_V_DD=20V,_I_D=35A,_V_GS=0to10V|
|Switchingcharge|_Q_sw|-|21|-|nC|_V_DD=20V,_I_D=35A,_V_GS=0to10V|
|Gate charge total1)|_Q_g|-|45|57|nC|_V_DD=20V,_I_D=35A,_V_GS=0to10V|
|Gate plateau voltage|_V_plateau|-|5.2|-|V|_V_DD=20V,_I_D=35A,_V_GS=0to10V|
|Gate charge total, sync. FET|_Q_g(sync)|-|29|-|nC|_V_DS=0.1V,_V_GS=0to10V|
|Output charge2)|_Q_oss|-|13|-|nC|_V_DD=20V,_V_GS=0V|



> 1) Defined by design. Not subject to production test. 

> 2) See ″ Gate charge waveforms ″ for parameter definition Final Data Sheet 

Rev.�2.1,��2018-07-16 

4 

**IR�MOSFET�-�StrongIRFETª IRF40H233** 

**==> picture [120 x 53] intentionally omitted <==**

## **Table�7�����Reverse�diode** 

|**Table7Reversediode**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**||**Values**||**Unit**|**Note/TestCondition**|
|||**Min.**|**Typ.**|**Max.**|||
|Diode continuous forward current1)|_I_S|-|-|35|A|_T_C=25°C|
|Diode pulse current|_I_S,pulse|-|-|140|A|_T_C=25°C|
|Diode forward voltage|_V_SD|-|-|1.3|V|_V_GS=0V,_I_F=35A,_T_j=25°C|
|Reverse recoverytime2)|_t_rr|-|22|-|ns|_V_R=34V,_I_F=35A,d_i_F/d_t_=100A/µs|
|Reverse recoverycharge2)|_Q_rr|-|16|-|nC|_V_R=34V,_I_F=35A,d_i_F/d_t_=100A/µs|



> 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

2) Defined by design. Not subject to production test. 

Final Data Sheet 

Rev.�2.1,��2018-07-16 

5 

IR MOSFET - StrongIRFET™ 

**IRF40H233** 

**==> picture [539 x 284] intentionally omitted <==**

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10 [3] 10 [2]<br>single pulse<br>0.01<br>0.02<br>0.05<br>10 [2] S e aailill i 0.1 CCE<br>oe 100 µs ae 10 µs 10 [1] : 0.20.5 EEE He<br>10 [1]<br>1 ms<br>2 NAU Lh N N AL = 10 [0] rA T ae TTT<br>i TI Lil<br>ES aEe<br>10 ms<br>10 [0] ee Oe ll eee meets nee att aoe sah ae aa<br>DC<br>ee eee UTM IIEATL<br>10 [-1]<br>10 [-1]<br>=== aN Ae<br>ee ee et tinCMC<br>a a ee ee ee<br>10 [-2] A 10 [-2] LUVIN LETRAEERIELIM<br>10 [-1] 10 [0] 10 [1] 10 [2] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0]<br>V DS [V] t p [s]<br>I D=f( V DS T C D t p Z thJC=f( t p D = t p/ T<br>I D thJC<br>Z<br>**----- End of picture text -----**<br>


Final Data Sheet 

6 

**IRF40H233** 

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Final Data Sheet 

7 

IR MOSFET - StrongIRFET™ 

**IRF40H233** 

**==> picture [528 x 282] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.4 TT  TTP? 4.0 TTT TTT<br>3.5<br>2.0 GRRE EEE<br>PPP PT [TTT)]<br>Pt 3.0 SSS<br>> 1.6  ttt ee et ly TNS 500 µA<br>ye | ti tt tt] A 2.5 fp OND<br>2 EEE TT] | et NN<br>> — EEPrPrriyx<br>1.2 2.0<br>Bf NN<br>pot |tr +_+_ 1} 1 AEN<br>1.5<br>50 µA<br>0.8<br>fF ii re<br>J 1.0 |<br>0.4 Te TT PP Td a<br>0.5<br>PEt} ee<br>0.0 ET Tt yt 0.0<br>-75 -25 25 75 125 175 -75 -25 25 75 125 175<br>T j [°C] T j [°C]<br>R DS(on)=f( T j I D V GS V GS(th=f( T j V GS= V DS I D<br>GS(th)<br>V<br>R<br>**----- End of picture text -----**<br>


**==> picture [527 x 283] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [4] 10 [3]<br>Se ——— —————————<br>25 °C<br>175 °C<br>SSEESSSSSSSSSEES |<br>FSS EEE a<br>CEE FEE | L E<br>10 [2]<br>Ciss<br>KEEFE EEE e e<br>EES<br>NUL) es es ee 2<br>10 [3] 10 [1]<br>BM ef Sf<br>ARNE EEE EE 4 ———————<br>SSERSSSEESEE<br>Coss<br>COBSECECRSEEEEEEE PAE—<br>10 [0]<br>CCBAC EPRREEE T T ET | atLT<br>|<br>Crss ee aS FS Oe|<br>Po<br>10 [2] 10 [-1]<br>0 5 10 15 20 25 30 35 40 0.0 0.4 0.8 1.2 1.6<br>V DS V SD<br>[Vv] [Vv]<br>C =f( V DS V GS f I F=f( V SD T j<br>C I F<br>**----- End of picture text -----**<br>


Final Data Sheet 

8 

**IRF40H233** 

**==> picture [526 x 283] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [2] 14<br>8 V<br>20 V<br>32 V<br>12<br>A<br>os CTS oe TESTO 25 °C lllll 10 T E L te | AK/ a7,<br>10 [1] CUI USCUINONU | EEE S61<br>a 8 / a<br>= Pt TTT ANTI 100 °C co Bf<br><x S| S.<br>6<br>150 °C<br>oh pe ee PON Eg e n eee<br>10 [0] AIIM UIE | Eu NNT pr<br>Poaaeee 4 rif) | | | tt i ytd<br>|<br>2<br>rn PY] | | | ft iytd<br>UTI C onAV rnUE CeTAM ATIZEEE<br>10 [-1] 0<br>10 [-1] 10 [0] 10 [1] 10 [2] 10 [3] 0 10 20 30 40 50 60<br>t AV [us] Q gate [nC]<br>I AS=f( t AV R GS Ω T j,start V GS=f( Q gate I D T j V DD<br>I AV V GS<br>**----- End of picture text -----**<br>


## **Diagram Gate charge waveforms** 

**==> picture [259 x 282] intentionally omitted <==**

**----- Start of picture text -----**<br>
50<br>48<br>Coe<br>Z|<br>46<br>PTT [TTT] Ty<br>ralett<br>L [So]<br>ERR<br>44<br>Bp Zee<br>42<br>ap4nR00EER<br>fo<br>40<br>-75 PET -25 ETE 25 75 EET 125 175<br>T j<br>V BR(DSS)=f( T j I D<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Final Data Sheet 

9 

**IRF40H233** 

Final Data Sheet 

10 

**IR�MOSFET�-�StrongIRFETª IRF40H233** 

**==> picture [120 x 53] intentionally omitted <==**

## **REEL DIMENSIONS** 

**==> picture [79 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
TAPE DIMENSIONS<br>**----- End of picture text -----**<br>


**==> picture [134 x 134] intentionally omitted <==**

DESCRIPTION Dimension design to accommodate the component width Dimension design to accommodate the component lenght Dimension design to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers 

## **QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE** 

Note:  All dimension are nominal 

|Type<br>Package|Diameter<br>Reel<br>(Inch)|QTY|Width<br>Reel<br>W1<br>(mm)|(mm)<br>Ao|(mm)<br>Bo|(mm)<br>Ko|(mm)<br>P1|(mm)<br>W|Quadrant<br>Pin 1|
|---|---|---|---|---|---|---|---|---|---|
|5 X 6 PQF|N<br>13|4000|12.4|6.300|5.300|1.20|8.00|12|Q1|



**Figure�2�����Outline�Tape�(PQFN�5x6�Dual),�dimensions�in�mm/inches** 

Final Data Sheet 

11 

Rev.�2.1,��2018-07-16 

**IRF40H233** 

## IRF40H233 

## Previous Revision 

|Revision|Date|Subjects (major changes since last revision)|
|---|---|---|
|1.0|2018-07-05|Release of preliminary version|
|2.0|2018-07-12|Release of final version|
|2.1|2018-07-16|Update Potential Application|



## **Trademarks** 

## **erratum@infineon.com** 

## **Information** 

**www.infineon.com** ). 

## **Warnings** 

Final Data Sheet 

12 



## Links

- [View this product on Novapart](https://novapart.co/products/IRF40H233XTMA1/dual-mosfet-n-channel-40-v-35-a-00051-ohm-pqfn)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/infineon/irf40h233xtma1/mosfet-dual-n-ch-40v-35a-pqfn/dp/3282273)
---

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