# Power MOSFET, N Channel, 100 V, 57 A, 0.023 ohm, TO-263 (D2PAK), Surface Mount

![Product image](https://novapart.co/image/farnell:1463261/)

**URL**: https://novapart.co/products/IRF3710STRLPBF/power-mosfet-n-channel-100-v-57-a-0023-ohm-to-263
**SKU**: IRF3710STRLPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.1700
**Stock**: 500+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:57A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.023ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power Dissipation

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 200W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263 (D2PAK) |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 57A |
| Drain Source On State Resistance | 0.023ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1463261/)

Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated Lead-Free 

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HEXFET [®]  Power MOSFET<br>D<br>VDSS = 100V<br>R  = 23mΩ<br>DS(on)<br>G<br>ID = 57A<br>S<br>**----- End of picture text -----**<br>


## **Description** 

Advanced HEXFET[®] Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.  This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. 

The D[2] Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D[2] Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF3710L) is available for low-profile applications. 

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D [2] Pak TO-262<br>IRF3710SPbF IRF3710LPbF<br>**----- End of picture text -----**<br>


## **Absolute Maximum Ratings** 

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||||||
|---|---|---|---|---|
|Parameter|Max.|Units|
|ee|
|ee|ID @ TC = 25°C|Continuous Drain Current, VGS @ 10V|57|
|es|ID @ TC = 100°C|Continuous Drain Current, VGS @ 10V|40|A|
|IDM|Pulsed Drain Current|180|
|PD @TC = 25°C|Power Dissipation|200|W|
|es|
|Linear Derating Factor|1.3|W/°C|
|es|
|VGS|Gate-to-Source Voltage|± 20|V|
|es|
|IAR|Avalanche Current|28|A|
|es|ON|
|©|EAR|Repetitive Avalanche Energy|20|mJ|
|dv/dt|Peak Diode Recovery dv/dt|5.8|V/ns|
|es|©2G|
|TJ|Operating Junction and|-55  to + 175|
|TSTG|Storage Temperature Range|°C|
|Soldering Temperature, for 10 seconds|300 (1.6mm from case )|

**----- End of picture text -----**<br>


## **Thermal Resistance** 

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||||||
|---|---|---|---|---|
|Parameter|Typ.|Max.|Units|
|RθJC|Junction-to-Case|–––|0.75|°C/W|
|RθJA|Junction-to-Ambient (PCB Mounted,steady-state)**|–––|40|

**----- End of picture text -----**<br>


## IRF3710S/LPbF 

## **Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**|**Typ. **|**Max. **|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage|100|–––|–––|V|VGS= 0V, ID= 250µA|
|∆V(BR)DSS/∆TJ|Breakdown Voltage Temp. Coefficient|–––|0.13|–––|V/°C|Reference to 25°C, ID= 1mA�|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|–––|23|mΩ|VGS= 10V, ID=28A�|
|VGS(th)|Gate Threshold Voltage|2.0|–––|4.0|V|VDS= VGS, ID= 250µA|
|gfs|Forward Transconductance|32|–––|–––|S|VDS= 25V, ID= 28A��|
|IDSS|Drain-to-Source Leakage Current|–––|–––|25|µA|VDS= 100V, VGS= 0V|
|||–––|–––|250||VDS= 80V, VGS= 0V, TJ= 150°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V|
||Gate-to-Source Reverse Leakage|–––|–––|-100||VGS= -20V|
|Qg|Total Gate Charge|–––|–––|130|nC|ID= 28A<br>VDS= 80V<br>VGS= 10V, See Fig. 6 and 13�|
|Qgs|Gate-to-Source Charge|–––|–––|26|||
|Qgd|Gate-to-Drain("Miller")Charge|–––|–––|43|||
|td(on)|Turn-On Delay Time|–––|12|–––|ns|VDD= 50V<br>ID= 28A<br>RG= 2.5Ω<br>VGS= 10V, See Fig. 10��|
|tr|Rise Time|–––|58|–––|||
|td(off)|Turn-Off Delay Time|–––|45|–––|||
|tf|Fall Time|–––|47|–––|||
|LD|Internal Drain Inductance|–––|4.5|–––||Between lead,<br>6mm (0.25in.)<br>from package<br>and center of die contact<br>S<br>D<br>G|
|LS|Internal Source Inductance|–––|7.5|–––|nH||
|Ciss|Input Capacitance|–––|3130|–––|pF|VGS= 0V<br>VDS= 25V<br>ƒ= 1.0MHz, See Fig. 5�|
|Coss|Output Capacitance|–––|410|–––|||
|Crss|Reverse Transfer Capacitance|–––|72|–––|||
|EAS|Single Pulse Avalanche Energy��|–––|1060�|280�|mJ|IAS= 28A, L = 0.70mH|



## **Source-Drain Ratings and Characteristics** 

||**Parameter**|**Min. **|**Typ. **|**Max.**|**Units**|**Conditions**|**Conditions**|
|---|---|---|---|---|---|---|---|
|IS|Continuous Source Current<br>(Body Diode)|–––|–––|57|�|G<br>MOSFET symbol<br>showing  the<br>integral reverse<br>p-njunction diode.|S<br>D|
|ISM|Pulsed Source Current<br>(BodyDiode)�|–––|–––|230||||
|VSD|Diode Forward Voltage|–––|–––|1.2|V|TJ= 25°C, IS= 28A, VGS= 0V�||
|trr|Reverse Recovery Time|–––|140|220|ns|TJ= 25°C, IF= 28A<br>di/dt = 100A/µs �||
|Qrr|Reverse RecoveryCharge|–––|670|1010|nC|||
|ton|Forward Turn-On Time|Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)||||||



## **������** 

- Repetitive rating;  pulse width limited by 

max. junction temperature. (See fig. 11). 

- Starting TJ = 25°C, L = 0.70mH, RG = 25Ω, IAS = 28A, VGS=10V. (See Figure 12). 

- [≤][28A][��][di/d][��][≤][380A/µs, V] DD[≤][V] (BR)DSS[,] 

- TJ ≤ 175°C. 

- Pulse width ≤ 400µs; duty cycle ≤ 2%. 

- This is a typical value at device destruction and represents 

- operation outside rated limits. 

- This is a calculated value limited to TJ = 175°C . 

- Uses IRF3710 data and test conditions. 

- **When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. 

� �������������������������������������������������������������������� ������������������� 

## IRF3710S/LPbF ~~a~~ 

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1000 1000<br>VGS VGS<br>TOP           16V TOP           16V<br>                   10V                    10V<br>                   7.0V a                    7.0V HH}<br>                   6.0V                    6.0V<br>100                5.0V 100                5.0V<br>                   4.5V Ue att alll                    4.5V ee  aenlll|<br>                   4.0V                    4.0V<br>BOTTOM   3.5V BOTTOM   3.5V<br>10 P y w AS eeeeell 10 R LotSeerDeel<br>3.5V<br>3.5V<br>Salil annie P| tt} ll<br>1 rt 1<br>eT A e e<br>20µs PULSE WIDTH 20µs PULSE WIDTH<br>0.1 Qaee Tj = 25°C eel ll 0.1 tTSe Tj = 175°C ee l l<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 1.** Typical Output Characteristics 

**Fig 2.** Typical Output Characteristics 

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1000.00 3.0<br>ID = 57A<br>Ee es es es es<br>Ee es ee ee es ee 2.5<br>100.00 e e ee ee ee ee PT TTT ELL TL [LIAL]<br>TJ = 175°C 2.0<br>A T SA<br>a 0 2 ee ee ee eee<br>10.00 | #7 | | | | | 1.5 PT tT te t_ tT ee<br>F /7/if/ | FOTO PTT EE Le LLL<br>1.00 | TJ = 25°C ee ee 1.0 Pt]TeeET<br>= —— 0.5 aT | | tT TT | Tt<br>VDS =<br>0.10 a Pf] ft 20µs PULSE WIDTH 0.0 FFEEEFE t_ EL ELTECL L V E GS = 10V<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>3.0 4.0 5.0 6.0 7.0 8.0 9.0 T  , Junction TemperatureJ (  C)°<br>VGS, Gate-to-Source Voltage (V)<br>(Normalized)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>)<br>(Α<br>ID, Drain-to-Source Current<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance Vs. Temperature 

## IRF3710S/LPbF ~~|~~ 

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**----- Start of picture text -----**<br>
100000 VGS   = 0V,       f = 1 MHZ 12 ID = 28A VDS =  80V<br>= = Ciss    = Cgs + Cgd,   Cds    SHORTED P o | VDS =  50V {|<br>Crss    = Cgd  10 VDS =  20V<br>C  = C + C<br>10000 oss   ds  gd<br>Se ee e e [ee][e] [e][ea] [e] ce<br>Ciss<br>a 7 pt YA<br>PEK Pi tt | | fAl<br>1000<br>p e Pi TL tL ifAl ti<br>Coss Yo<br>100 FFE Crss FH 5 Pi¢ery| | tt<br>ee | eee 2 Ff |tt|<br>10 0 Vi} ifi t t<br>1 10 100 0 20 40 60 80 100<br>VDS, Drain-to-Source Voltage (V) Q   , Total Gate Charge (nC)G<br>Fig 5.   Typical Capacitance Vs. Fig 6.   Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>1000.00 1000<br>OPERATION IN THIS AREA<br>LIMITED BY RDS(on)<br>100<br>100.00<br>E e ENP | 100µsec<br>T = 175°C<br>J  10<br>| KK I T e g PL<br>10.00 e e A A | EEBll|<br>1 1msec<br>1.00 TJ = 25°C<br>0.1 Tc = 25°C 10msec<br>VGS = 0V Tj = 175°CSingle Pulse DC<br>0.10 ee ee ee 0.01 (Cee<br>0.0 0.5 1.0 1.5 2.0 0.01 0.1 1 10 100 1000<br>VSD, Source-toDrain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>C, Capacitance(pF)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

## IRF3710S/LPbF ~~sd~~ 

**==> picture [434 x 478] intentionally omitted <==**

**----- Start of picture text -----**<br>
60 Ri tT tT yey Ey Vos Wea<br>50 PSP 7<br>PT NEE EL ET ; D.UT.<br>40 PERSE 5 - ve<br>Pit | PT IN ET<br>30 SERENE )+ Ves ≤ 1<br>≤ 0.1 %<br>BREN Puce OS<br>20<br>SEER EEESEaNe :<br>HEE Fig 10a. Switching Time Test Circuit<br>10 VDS<br>90%<br>0 PittPE tt tT Tt | [\<br>25 50 75 100 125 150 175<br>T   , Case TemperatureC (  C)°<br>TET ETT Yt t t 10% / \ OY\<br>Fig 9.   Maximum Drain Current Vs. VGS l ne<br>Case Temperature td(on) tr td(off) tf<br>Fig 10b. Switching Time Waveforms<br> 1 TTT,<br>a cesCL<br>a<br>D = 0.50<br>B R<br>a |<br>0.20<br>e A TTI<br>0.1 0.10 alll a | a | A<br>en SATE TIL IE<br>ee ak ae ed  ee<br>0.05 P DM<br>SE<br>7 74 SINGLE PULSE a t 1<br>eat 0.02 (THERMAL RESPONSE)<br>O 0.01 I el t 2<br>Notes:<br>1. Duty factor D = t   / t1 2<br>CLUTII 2. Peak T J = P DM x  Z thJC + T C<br>0.01 FEA |<br>0.00001 0.0001 0.001 0.01 0.1  1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>(Z        )thJC<br>Thermal Response<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

## IRF3710S/LPbF ~~Pd~~ 

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**----- Start of picture text -----**<br>
550<br>I D<br>NESEEEE<br>TOP 11A<br>20A<br>RUneeee<br>440 PN BOTTOM 28A<br>330<br>SENSE<br>ONENEE EEE EEE<br>220<br>SCEasas N \<br>110<br>PUP ARSACEE<br>SREERER NNER<br>0 Pot | | USS<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJJ (  C)°°<br>Fig 12c. MaximumVs. 12c. MaximumVs. MaximumVs.Vs. Drain AvalaCurre AvalaCurreCurre n tche Energyche Energy<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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15V D<br>TOP 11A<br>20A<br>RUneeee<br>VDS L DRIVER 440 BOTTOM 28A<br>PN<br>RG D.U.T + 330<br>- [V][DD]<br>IAS A<br>ai 20VVGS t SENSE<br>tp A 0.01Ω ONENEE EEE EEE<br>220<br>Fig 12a. Unclamped Inductive Test Circuit SCEasas N \<br>110<br>PUP ARSACEE<br>V(BR)DSS<br>— tp SREERER NNER<br>0 Pot | | USS<br>25 50 75 100 125 150 175<br>Starting T  , Junction TemperatureJJ (  C)°°<br>//al\ Fig 12c. MaximumVs. 12c. MaximumVs. MaximumVs.Vs. Drain AvalaCurre AvalaCurreCurre n tche Energyche Energy<br>IAS<br>Fig 42b, Unclamped Inductive Waveforms<br>Current Regulator<br>Oo Same Type as D.U.T. 7<br>50KΩ<br>12V .2µF<br>QG .3µF<br>CT res<br>+<br>Ves BO : D.U.T. -VDS<br>QGS QGD<br>VGS<br>VG 3mA<br>Ort.<br>IG ID<br>Charge Current Sampling Resistors<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


## IRF3710S/LPbF 

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**----- Start of picture text -----**<br>
D.U.T* + Circuit Layout Considerations<br>   •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| | - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Re •   dv/dt controlled by Rg +<br>•   Isp controlled by Duty Factor "D" -<br>(1) •   D.U.T. - Device Under Test<br>* Reverse Polarity of D.U.T for P-Channel<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. Period<br>——| 7<br>t<br>[<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current i Current di/dt a<br>©) D.U.T. VDS Waveform<br>Diode Recoverydv/dt \<br>/[,<br>Re-Applied<br>Voltage Body Diode  Forward Drop<br>® Inductor Curent UW<br>Ripple  ≤ 5% [ ]<br>**----- End of picture text -----**<br>


For N-channel HEXFET[®] power MOSFETs 

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**----- Start of picture text -----**<br>
IRF3710S/LPbF<br>**----- End of picture text -----**<br>


## IRF3710S/LPbF 

## TO-262 Package Outline 

Dimensions are shown in millimeters (inches) 

## TO-262 Part Marking Information 

## IRF3710S/LPbF 

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**----- Start of picture text -----**<br>
TRR<br>OoO0°°0<br>1.60 (.063)<br>1.50 (.059)<br>4.10 (.161)3.90 (.153) ‘ 1.60 (.063)1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION oS 1.85 (.073) oo ea¢eq—l 11.60 (.457) in|<br>1.65 (.065) 11.40 (.449) 15.42 (.609) 24.30 (.957)<br>15.22 (.601) 23.90 (.941)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>00°00 ee 16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
FEED DIRECTION<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
13.50 (.532) 27.40 (1.079)<br>‘ 12.80 (.504) 23.90 (.941) TT<br>4<br>330.00 60.00 (2.362)<br>(14.173) ‘al g       MIN.<br>  MAX.<br>g ‘<br>30.40 (1.197)<br>NOTES :       MAX.<br>1.   COMFORMS TO EIA-418.2.   CONTROLLING DIMENSION: MILLIMETER. 26.40 (1.039)24.40 (.961) It 4<br>3.   DIMENSION MEASURED @ HUB.<br>3<br>**----- End of picture text -----**<br>


4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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- [Supplier page](https://es.farnell.com/infineon/irf3710strlpbf/mosfet-n-d2-pak/dp/1463261)
---

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