# Power MOSFET, N Channel, 150 V, 37 A, 0.042 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:8648093/)

**URL**: https://novapart.co/products/IRF3415PBF/power-mosfet-n-channel-150-v-37-a-0042-ohm-to
**SKU**: IRF3415PBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.9050
**Stock**: 1000+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:37A; Drain Source Voltage Vds:150V; On Resistance Rds(on):0.042ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:4V; Power D

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 150W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 150V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 37A |
| Drain Source On State Resistance | 0.042ohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8648093/)

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D<br>Voss = 150V<br>R = 0.042 Ω<br>G DS(on) :<br>Ip = 43A<br>S<br>TO-220AB<br>**----- End of picture text -----**<br>


|θ<br>θ<br>Po<br>Ric|θ<br>θ<br>Po<br>Ric|
|---|---|
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∆ ∆<br>Veross Ty | Breakdown Voltage Temp. Coefficient | ——- | 0.17 | -—— | V/°C | Reference to 25°C, Ip = 1mA<br>Rpsion) Static Drain-to-Source On-Resistance | —— | ——- |0.042] Ω | Vas = 10V, Ip = 22A<br>Dis Vesith) GateForwardThresholdTransconductanceVoltage || 2.019 |—-||—-|——[40 | S$V || Vos=Vos =50V,  Vos, Ip Ip  = = 250NA22A<br>Iess Drain-to-Source; Leakage Current | —- |—| A VpsDS = 150V,_*GSVes = OV<br>9 | — [|250 | | Vos = 120V, Vos = OV, Ty = 150°C<br>less Gate-to-Source Forward Leakage | —- | —| 100 | nA Vas = 20V<br>Qyg Gate-to-Source Reverse Leakage | —- | — | -100 | Vos = -20V<br>|Qgs__—| Qua TotalGate-to-Source Gate-to-Drain Gate Charge ("Miller") Charge Charge | | —- —-—- | | -—| —-—-|| 200 9817 | | | nc | V Ip ep = s = 22A = 1 0V,20V See Fig. 6 and 13 ©<br>ta(on) Turn-On Delay Time | -—— | 12 | -— | Vpp = 75V<br>Ω<br>ty Turn-Off Delay Fall Time  Time | [7 —— | 69 [=] | — | ™| re=28 Rp =3.3_ Ω,  See Fig. 10 ©<br>Lp Internal Drain Inductance 45 Beteween leadea , D<br>nH 6mm (0.25in.) G<br>Ls Internal Source Inductance 7.5 from package .<br>and center of die contact S<br>**----- End of picture text -----**<br>


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43 MOSFET symbol D<br>A showing the<br>150 integral reverse G<br>p-n junction diode. S<br>—|—-|13] V_ | Ts= 25°C, Is = 22A, Ves = OV @<br>——| 260] 390 | ns | Ty= 25°C, Ir = 22A<br>——| 2.2 uC | di/dt = 100A/us ©<br>ISD ≤ 22A, di/dt ≤ 820A/Us, Vop ≤ Veerppss:<br>≤<br>**----- End of picture text -----**<br>


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≤   ≤<br>**----- End of picture text -----**<br>


Ω 

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**----- Start of picture text -----**<br>
 1000  1000<br>VGS VGS<br>TOP 15V TOP 15V<br>10V 10V<br>8.0V7.0V a ee ee ee 8.0V7.0V ee<br>6.0V es 6.0V ee ee<br>5.5V 5.5V<br>a e e el ee<br>BOTTOM 4.5V BOTTOM 4.5V<br> 100 mee” |IAe [4.] CT [ee.] —_ See |  100 Lj eee” TST = ee ee eee<br>Re eee ee a” Zell<br>DD ZeeAA EEE eeeeee eel eyEeanes“Leeeeele<br>4.5V<br>4.5V<br>a — >” Antti ll<br>20us PULSE WIDTH 20us PULSE WIDTH<br>T  = 25J oC T  = 175J oC<br> 10  10<br> 1  10  100  1  10  100<br>V     , Drain-to-Source Voltage (V)DS V     , Drain-to-Source Voltage (V)DS<br>Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics<br> 1000 3.0<br>ID = 37A<br>po=————— Po EE<br>a 2.5 P O<br>PET Wg<br>PLT Try ry rer 2.0 P U<br>T  = 25  CJ °<br> 100 PTPt  pt | |teeeeE ET ETee T  = 175  CJ  T ° ETL 1.5 PEPEVaPPP Eeee<br>——— | PE A<br>ee 2. eee | — A<br>yA et 1.0 PU et<br>TATEZ eetLA<br>Yi ll ttle 0.5 eee<br>V      = 50VDS<br> 10 A c 20µs PULSE WIDTH t 0.0 P E eE VGS = 10V<br>4 5 6 7 8 9 10 -60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>V     , Gate-to-Source Voltage (V)GS T  , Junction Temperature (  C)J o<br>D D<br>I   ,  Drain-to-Source Current (A) I   ,  Drain-to-Source Current (A)<br>(Normalized)<br>D<br>I   ,  Drain-to-Source Current (A)<br>DS(on)<br>R            , Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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6000 20<br>VGS = 0V, f = 1MHz ID = 22A<br>Ciss = Cgs + Cgd , C      SHORTEDds VDS = 120V<br>5000 HH CCrssoss == CCgdds + Cgd 16 aa VVDSDS == 75V 30V of<br>1 Pe =e<br>4000<br>PSC Fai a<br>12<br>Ciss<br>Na el Y<br>3000 N RR _—) 6 8 EE AEj<br>2000 | NS Coss 1 1 ><br>re Crss 4 —<br>1000<br>FOR TEST CIRCUIT<br>0 ee | 0 Aepy pei SEE FIGURE        h 13 |<br> 1  10  100 0 40 80 120 160 200<br>V     , Drain-to-Source Voltage (V)DS Q   , Total Gate Charge (nC)G<br>Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br> 1000  1000<br>OPERATION IN THIS AREA LIMITED<br>BY RDS(on)<br>pe 7<br> 100<br> 100 10us<br>e T  = 175  CJ o T eres att tte | |<br> 10 100us<br>S S T  = 25  CJ o =  10 ot e 1ms<br>A r ’<br> 1 Pp 7 ify | | | Geer Aeee S eeeeeial<br>SS feaiene  TC = 25  Co || mamma e)|RIAA 10ms<br> TJ = 175  Co<br>0.1 =VAne eea V      = 0 V GS ie  1 fa  Single Pulse Lieee l bated<br>0.2 0.6 1.0 1.4 1.8  1  10  100  1000<br>V     ,Source-to-Drain Voltage (V)SD V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A) D<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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50<br>PLETE ET ves Rp |<br>40<br>eet Et _“’ pur.<br>-<br>PLANE EEE ;<br>30<br>PUPPET ov<br>SRE rise ih ≤ 1<br>≤ 0.1 %<br>20<br>SEREEEEESGEe —— ;<br>yf NG Fig 10a. Switching Time Test Circuit<br>10 VDS<br>90%<br>ttt ttt tt TyN }<br>0 SERRE |<br>25 50T   , Case TemperatureC 75 100 125 (  C)° 150 175 ||<br>10%<br>VGS | |<br>or ™<br>Fig 9. Maximum Drain Current Vs. td(on) tr td(off) tf<br>I   , Drain Current (A)D<br>**----- End of picture text -----**<br>


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 1 ee<br>nr<br>S D = 0.50 r<br>er es ete<br>ees el<br>0.20<br>e e een enalill<br>0.1 a 0.10 ee|g<br>PDM<br>0.05<br>t1<br>siiaaee? 0.02 SINGLE PULSE aeons et t2<br>i 0.01 S e er (THERMAL RESPONSE) Notes:<br>1. Duty factor D = t   / t1 2<br>at i 2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1  1<br>A RAN<br>t  , Rectangular Pulse Duration (sec)1<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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15V<br>VDS L DRIVER<br>R G D.U.T +<br>- [V][DD]<br>IAS<br>TL<br>poe 20V<br>Fig tp 0.01Ω<br>12a. Unclamped Inductive Test Circuit<br>V(BR)DSS<br>~— tp —><br>/<br>\<br>IAS<br>**----- End of picture text -----**<br>


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QG<br>B e<br>ry + QGS aan QGD Ss<br>VG<br>Charge<br>**----- End of picture text -----**<br>


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1400<br>Wares ID<br>TOP 9.0A<br>1200 AN 16A<br>P\ ft ft [ty] BOTTOM 22A<br>1000 Nee<br>PK TE Pt yt<br>800 PIN<br>NE Et<br>600 PNPRNREee<br>UN | |<br>NONE NESE<br>400 PINSa> AG ft<br>200 NSN EEE<br>pot | UN EN<br>eee ~\Neee<br>PS<br>0<br>25 50 75 100 125 150 175<br>Starting T  , Junction Temperature ( C)J o<br>AS<br>E     , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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ee SameCurrentTypeRegulatoras D.U.T.<br>50KΩ<br>12V .2µF<br>| J .3µF<br>a a D.U.T. +-VDS<br>VGS<br>3mA Tl IG [rN ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


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D.U.T + Circuit Layout Considerations<br>-_    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>(0<br>Re •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>**----- End of picture text -----**<br>


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Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ii Current di/dt /<br>@ D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  I Forward Drop<br>® Inductor Curent es ae<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


Dimensions are shown in millimeters (inches) 

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10.54 (.415) 3.78 (.149) - B -<br>2.87 (.113) 10.29 (.405) 3.54 (.139) 4.69 (.185)<br>2.62 (.103) - A - 4.20 (.165) 1.32 (.052)<br>| g 1.22 (.048)<br>6.47 (.255)<br>4 6.10 (.240)<br>maey OC =<br>15.24 (.600)<br>14.84 (.584)<br>LEAD ASSIGNMENTS<br>1.15 (.045)     MIN HEXFETLEAD ASSIGNMENTS       1 - GATE  IGBTs, CoPACK<br>1     2    3 1- GATE       2 - DRAIN 1- GATE<br>2- DRAIN       3 - SOURCE 2- COLLECTOR<br>| dar= 3- SOURCE4- DRAIN       4 - DRAIN 3- EMITTER4- COLLECTOR<br>14.09 (.555)<br>13.47 (.530) 4.06 (.160)<br>3.55 (.140)<br>3X [0.93 (.037)] 0.69 (.027) 3X [0.55 (.022)] 0.46 (.018)<br>3X AP [1.40 (.055)] 1.15 (.045) 0.36  (.014)        M    B   A   M = 2.92 (.115)<br>2.64 (.104)<br>___} 2.54 (.100) || T<br>2X<br>NOTES:<br>     1  DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.             3  OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB.<br>**----- End of picture text -----**<br>


- 2  CONTROLLING DIMENSION : INCH                                                       4  HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS. 

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E XAMPLE: T HIS  IS  AN IR F1010<br>LOT  CODE  1789<br>AS S EMBLED ON WW 19, 1997 INT ER NAT IONAL PART  NUMBER<br>IN T HE AS S EMBLY LINE "C" RECT IFIER<br>LOGO<br>Note: position indicates "Lead-Free"  "P" in assembly line DAT E CODE<br>YEAR  7 =  1997<br>AS S EMBLY<br>LOT  CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. International 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 01/04 

Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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