# Power MOSFET, N Channel, 100 V, 192 A, 3500 µohm, TO-263AB, Surface Mount

![Product image](https://novapart.co/image/farnell:2725877/)

**URL**: https://novapart.co/products/IRF100S201/power-mosfet-n-channel-100-v-192-a-3500-ohm-to
**SKU**: IRF100S201
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.7700
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:192A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.0035; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 441W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-263AB |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 192A |
| Drain Source On State Resistance | 3500µohm |
| Gate Source Threshold Voltage Max | 4V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725877/)

## International 

## Strong _IR_ FET™ IRF100B201 IRF100S201 

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**----- Start of picture text -----**<br>
Application  HEXFET [® ] Power MOSFET<br>Brushed Motor drive applications<br>BLDC Motor drive applications  D VDSS  100V<br>Battery powered circuits<br>Half-bridge and full-bridge topologies   RDS(on) typ. 3.5m <br>Synchronous rectifier applications  G<br>            max  4.2m <br>Resonant mode power supplies<br>OR-ing and redundant power switches  S ID (Silicon Limited)  192A<br>DC/DC and AC/DC converters  SEE<br>DC/AC Inverters<br>D<br>Benefits  S<br>D  S<br>Improved  Gate, Avalanche and Dynamic dV/dt Ruggedness  G<br>G<br>Fully Characterized Capacitance and Avalanche SOA<br>TO-220AB<br>Enhanced body diode dV/dt and dI/dt Capability    D [2] -Pak<br>IRF100B201<br>Lead-Free, RoHS Compliant, Halogen-Free  IRF100S201<br>G  D  S<br>Gate  Drain  Source<br>ee<br>Standard Pack<br>Base part number  Package Type  Orderable Part Number<br>Form  Quantity<br>IRF100B201  TO-220  Tube  50  IRF100B201<br> IRF100S201  D [2] -Pak   Tape and Reel   800  IRF100S201<br>20 200<br>18 ID = 115AD = 115A= 115A<br>TT mL]<br>160<br>16<br>14 AREFHAEH] ft | od<br>120<br>12 IPE EEE PSS.<br>10<br>SITE EaaaNG<br>TJ = 125°CJ = 125°C= 125°C 80<br>8<br>AKERAEAE<br>6<br>40<br>TJ = 25°CJ = 25°C= 25°C<br>4<br>2 OP CEEEEEE CEEEEEE 0 ptt<br>tT<br>2 4 6 8 10 12 14 16 18 20 25 50 75 100 125 150 175<br> TC , Case Temperature (°C)<br>ID,  Drain Current (A)<br>)<br> <br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


## **Application** 

- Brushed Motor drive applications 

- BLDC Motor drive applications 

- Battery powered circuits 

- Half-bridge and full-bridge topologies 

- Synchronous rectifier applications 

- Resonant mode power supplies 

- OR-ing and redundant power switches 

- DC/DC and AC/DC converters 

- DC/AC Inverters 

## **Benefits** 

- Improved  Gate, Avalanche and Dynamic dV/dt Ruggedness 

- Fully Characterized Capacitance and Avalanche SOA 

- Enhanced body diode dV/dt and dI/dt Capability 

- Lead-Free, RoHS Compliant, Halogen-Free 

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20<br>18 ID = 115AD = 115A= 115A<br>TT<br>16<br>14 AREFHAEH]<br>12 IPE EEE<br>10<br>SITE<br>TJ = 125°CJ = 125°C= 125°C<br>8<br>AKERAEAE<br>6<br>TJ = 25°CJ = 25°C= 25°C<br>4<br>2 OP CEEEEEE CEEEEEE<br>2 4 6 8 10 12 14 16 18 20<br>VGS, Gate -to -Source Voltage  (V)<br>)<br> <br>RDS(on),  Drain-to -Source On Resistance (m<br>**----- End of picture text -----**<br>


**Fig 1.** Typical On– Resistance vs. Gate Voltage 

**Fig 2.** Maximum Drain Current vs. Case Temperature 

1 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback                March  26, 2015 ~~Ie~~ 

IRF100B201/IRF100S201 

## **Absolute Maximum Rating** 

|**Symbol**|**Parameter**|**Max.**|**Units**|
|---|---|---|---|
|ID @TC= 25°C|Continuous Drain Current,VGS @10V|192|A|
|ID @TC= 100°C|Continuous Drain Current,VGS @10V|136||
|IDM|Pulsed Drain Current|690||
|PD @TC= 25°C|Maximum Power Dissipation|441|W|
||Linear DeratingFactor|2.9|W/°C|
|VGS|Gate-to-Source Voltage|± 20|V|
|TJ<br>TSTG|Operating Junction and<br>Storage Temperature Range|-55  to + 175|°C|
||SolderingTemperature,for 10 seconds (1.6mm fromcase)|300||
||MountingTorque, 6-32 or M3 Screw|10 lbf·in(1.1 N·m)||



|**Avalanche Characteristics**||||
|---|---|---|---|
|EAS (Thermally limited)<br>SinglePulseAvalancheEnergy <br>567<br>EAS (Thermally limited)<br>Single Pulse Avalanche Energy<br>1005<br>IAR<br>Avalanche Current<br>See Fig 15, 15, 23a, 23b<br>A<br>EAR<br>Repetitive Avalanche Energy<br>mJ<br>mJ<br>EAS (tested)<br>Single Pulse Avalanche Energy  Tested Value<br>240<br>~~=~~||||
|**Thermal Resistance**||||
|**Symbol**<br>**Parameter**|**Typ.**|**Max.**|**Units**|
|RJC<br>Junction-to-Case|–––|0.34||
|RCS<br>Case-to-Sink,Flat Greased Surface<br>0.50<br>RJA<br>Junction-to-Ambient<br>–––||–––<br>62|°C/W|
|RJA<br>Junction-to-Ambient(PCB Mount) |–––|40||



## **Static @ TJ = 25°C (unless otherwise specified)** 

|**Symbol**|**Parameter**|**Min.**|**Typ. Max.**|**Typ. Max.**|**Units**|**Conditions**|
|---|---|---|---|---|---|---|
|V(BR)DSS|Drain-to-Source Breakdown Voltage|100|–––|–––|V|VGS= 0V,ID= 250µA|
|V(BR)DSS/TJ|JBreakdown Voltage Temp. Coefficient|–––|0.1|–––|V/°C|Reference to 25°C, ID= 5mA|
|RDS(on)|Static Drain-to-Source On-Resistance|–––|3.5|4.2|m|VGS= 10V,ID= 115A|
|VGS(th)|Gate Threshold Voltage|2.0|–––|4.0|V|VDS =VGS, ID =250µA|
|GS(th)<br>IDSS|Drain-to-Source Leakage Current|–––|–––|20|µA|VDS=100V,VGS=0V|
|||–––|–––|250||VDS= 80V,VGS= 0V,TJ=125°C|
|IGSS|Gate-to-Source Forward Leakage|–––|–––|100|nA|VGS= 20V|
||Gate-to-SourceReverseLeakage|–––|–––|-100||VGS= -20V|
|RG|Gate Resistance|–––|2.2|–––|||



## **Notes:** 

>  Repetitive rating; pulse width limited by max. junction temperature. 

-   Limited by TJmax, starting TJ = 25°C, L = 86µH, RG = 50, IAS = 115A, VGS =10V. 

-  ISD  115A, di/dt  1400A/µs, VDD  V(BR)DSS, TJ 175°C. 

-  Pulse width  400µs; duty cycle  2%. 

- Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. 

- Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS. 

- R is measured at TJ approximately 90°C. 

- When mounted on 1 inch square  PCB (FR-4). Please refer to AN-994 for more details: 

   - - 

   - http://www.irf.com/technical info/appnotes/an 994.pdf 

-     Limited by TJmax, starting TJ = 25°C, L = 1.0mH, RG = 50, IAS = 45A, VGS =10V. 

- This value determined from sample failure population, starting TJ =25°C, L= 86µH, RG = 50, IAS =115A, VGS =10V. 

www.irf.com © 2015 International Rectifier 

Submit Datasheet Feedback                March  26, 2015 

2 

~~1é4R~~ 

IRF100B201/IRF100S201 ~~TT~~ 

## **Dynamic  Electrical Characteristics @ TJ = 25°C (unless otherwise specified)** 

|**Dynamic  Electrical Characteristics @ TJ = 25°C (unless otherwise specified)J = 25°C (unless otherwise specified) = 25°C (unless otherwise specified)**||
|---|---|
|**Symbol**<br>**Parameter**<br>**Min.**<br>**Typ. **<br>**Max. Units**<br>**Conditions**<br>gfs<br>Forward Transconductance<br>278<br>–––<br>–––<br>S<br>VDS= 10V,ID= 115A<br>~~a~~<br>~~In~~<br>~~Ts~~<br>~~I OO (OO~~||
|Qg<br>Total Gate Charge<br>–––<br>170<br>255<br>ID= 115A||
|nC<br>Qgs<br>Gate-to-Source Charge<br>–––<br>46<br>–––<br>VDS= 50V<br>Qgd<br>Gate-to-Drain Charge<br>–––<br>45<br>–––<br>VGS= 10V<br>Qsync<br>Total Gate Charge Sync.(Qg–Qgd)<br>–––<br>125<br>–––<br>td(on)<br>Turn-On DelayTime<br>–––<br>17<br>–––<br>ns<br>VDD= 65V<br>tr<br>Rise Time<br>–––<br>97<br>–––<br>ID= 115A<br>td(off)<br>Turn-Off DelayTime<br>–––<br>110<br>–––<br>RG= 2.7<br>~~ee~~<br>~~GO~~<br>~~es~~<br>~~a~~<br>~~eeen~~<br>~~es~~||
|tf<br>Fall Time<br>–––<br>100<br>–––<br>VGS= 10V<br>Ciss<br>Input Capacitance<br>–––<br>9500<br>–––<br>pF<br>VGS= 0V<br>Coss<br>Output Capacitance<br>–––<br>660<br>–––<br>VDS= 50V<br>Crss<br>Reverse Transfer Capacitance<br>–––<br>310<br>–––<br>ƒ= 1.0MHz,  See Fig.TBD<br>Coss eff.(ER)<br>Effective Output Capacitance<br>(Energy Related)<br>–––<br>725<br>–––<br>VGS= 0V, VDS = 0V to 80V<br>Coss eff.(TR)<br>Output Capacitance(Time Related)<br>–––<br>950<br>–––<br>VGS= 0V,VDS = 0V to 80V<br>~~—en ~~i<br>~~—~~<br>~~|rr—i—i—~s~~<br>~~eets~~<br>~~ID I (ers~~||
|**Diode Characteristics**||
|**Symbol**<br>**Parameter **<br>**Min.**<br>**Typ. **<br>**Max.Units**<br>**Conditions**||
|IS<br>Continuous Source Current<br>–––<br>–––<br>192<br>A<br>MOSFET symbol<br>(Body Diode)<br>showing  the<br>ISM<br>Pulsed Source Current<br>–––<br>–––<br>690<br>integral reverse<br>(BodyDiode)<br>p-njunctiondiode.<br>VSD<br>Diode Forward Voltage<br>–––<br>–––<br>1.3<br>V<br>TJ= 25°C,IS= 115A,VGS= 0V<br>trr<br>Reverse Recovery Time<br>–––<br>47<br>–––<br>nsTJ =25°CVDD= 85V<br>–––<br>55<br>–––<br>TJ =125°CIF= 115A,<br>Qrr<br>Reverse Recovery Charge<br>–––<br>90<br>–––<br>nCTJ =25°Cdi/dt = 100A/µs<br>–––<br>123<br>–––<br>TJ =125°C <br>IRRM<br>Reverse Recovery Current<br>–––<br>3.5<br>–––<br>A<br>TJ= 25°C<br>dv/dt<br>Peak Diode Recoverydv/dt<br>–––<br>18<br>–––<br>V/ns TJ= 175°C,IS=115A,VDS= 100V<br>D<br>S<br>G<br>~~ee~~<br>~~a~~<br>~~re rs ts ts~~<br>~~a~~<br>~~rs tI Ss I~~<br>~~ESS~~<br>~~oo|~~<br>~~eees~~<br>~~ts es es~~||
|3<br>www.irf.com  © 2015 International Rectifier <br>Submit Datasheet FeedbackMarch  26, 2015<br>~~Iie~~||



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IRF100B201/IRF100S201<br>TOR<br>1000 1000<br>VGS VGS<br>TOP           15V TOP           15V<br>10V 10V<br>7.0V 7.0V<br>6.0V 6.0V<br>5.5V 5.5V<br>100 5.0V 4.5V 100 5.0V 4.5V<br>BOTTOM 4.0V ii BOTTOM 4.0V<br>4.0V<br>10 10<br>4<br>4.0V<br>60µs PULSE WIDTH  60µs PULSE WIDTHPULSE WIDTH<br>1 Ht Tj = 25°C 1 Tj = 175°C<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1000<br>VGS<br>TOP           15V<br>10V<br>7.0V<br>6.0V<br>5.5V<br>100 5.0V 4.5V<br>BOTTOM 4.0V<br>4.0V<br>10<br> 60µs PULSE WIDTHPULSE WIDTH<br>Tj = 175°C<br>1<br>0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 4.** Typical Output Characteristics 

## **Fig 3.** Typical Output Characteristics 

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1000<br>3.0<br>ID D = 115A<br>VGS = 10V<br>2.5<br>100<br>TAT TJ = 175J = 175= 175 ° C TJ = 25°CJ = 25°C= 25°C = F 2.0<br>10<br>1.5<br>1<br>SLL<br>1.0<br>VDS = 50VDS = 50V= 50V<br>60µs PULSE WIDTH60µs PULSE WIDTH<br>0.1<br>0.5<br>1 Siieae 2 3 4 5 6 7 8 -60<br>VGS, Gate-to-Source Voltage (V)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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3.0<br>ID D = 115A<br>VGS = 10V<br>2.5<br>100<br>TAT TJ = 175J = 175= 175 ° C TJ = 25°CJ = 25°C= 25°C = F 2.0<br>10<br>1.5<br>1<br>SLL POA<br>1.0<br>VDS = 50VDS = 50V= 50V<br>60µs PULSE WIDTH60µs PULSE WIDTH<br>0.1<br>0.5<br>1 Siieae 2 3 4 5 6 7 8 -60 ert -20 20 TL 60 100 140 180<br>VGS, Gate-to-Source Voltage (V) TJ , Junction Temperature (°C)<br>Fig 5.   Typical Transfer Characteristics  Fig 6.   Normalized On-Resistance vs. Temperature<br>100000 14<br>VGS   = 0V,       f = 1 MHZ<br>Ciss    = C gs + Cgd,  C ds SHORTED ID = 115A<br>C rss    = C gd  12 VDS= 80V<br>Coss   = Cds + Cgd 10 V DS = 50V<br>10000 C iss VDS= 20V<br>8<br>C oss 6<br>aii ae?<br>1000<br>Crss 4<br>CIM, raul oF<br>2<br>vt ZEEE<br>100 0<br>0.1 1 10 100 0 40 80 120 160 200 240<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>C, Capacitance (pF)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 6.** Normalized On-Resistance vs. Temperature 

**Fig 7.** Typical Capacitance vs. Drain-to-Source Voltage 

**Fig 8.** Typical Gate Charge vs.Gate-to-Source Voltage 

4 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback                March  26, 2015 ~~©...~~ 

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IRF100B201/IRF100S201<br>YE———— ==—eesi—”<br>1000<br>OPERATION IN THIS AREA<br>1000 LIMITED BY RDS(on)<br>T J  = 175°C 100µsec<br>100<br>1 m sec<br>100<br>TJ = 25 ° C<br>10<br>| ff 10 Gao bee Sue<br>10msec<br>1 1 Tc = 25°C DC<br>Tj = 175°C<br>Single Pulse<br>VGS = 0V<br>0.1 Ap p 0.1 PN.Bl<br>0.0 0.5 1.0 1.5 2.0 0.1 1 10 100<br>VSD, Source-to-Drain Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 9.   Typical Source-Drain Diode Forward Voltage  Fig 10.   Maximum Safe Operating Area<br>130 3.5<br>Id = 5.0mA<br>3.0<br>120<br>2.5<br>LLL<br>2.0<br>110<br>teat 1.5<br>1.0<br>el<br>100<br>0.5<br>90 ELLE 0.0 |<br>-60 -40 -20 0 20 40 60 80 100120140160180 -10 0 10 20 30 40 50 60 70 80 90 100<br>TJ , Temperature ( °C ) VDS, Drain-to-Source Voltage (V)<br>ISD, Reverse Drain Current (A) ID,  Drain-to-Source Current (A)<br>Energy (µJ)<br>V(BR)DSS, Drain-to-Source Breakdown Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 11.** Drain-to-Source Breakdown Voltage 

**Fig 12.** Typical Coss Stored Energy 

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10<br>VGS = 5.0V<br>VGS = 5.5V<br>VGS = 6.0V<br>8 VGS = 7.0V<br>VGS = 8.0V<br>VGS = 10V<br>re<br>6<br>4<br>TTT LLL.<br>2<br>0 40 80 120 160 200<br>ID, Drain Current (A)<br>)<br><br> m<br>RDS(on),  Drain-to -Source On Resistance (<br>**----- End of picture text -----**<br>


**Fig 13.** Typical On– Resistance vs. Drain Current 

5 ~~—~~ 

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IRF100B201/IRF100S201 ~~TT~~ 

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1<br>an D = 0.50 eal TLLo<br>0.1<br>0.20<br>Tr 0.10 aan<br>0.05<br>0.01<br>0.02<br>0.01<br>SS A<br>0.001 007) 20011 MAA |<br>SINGLE PULSE<br>Notes:<br>( THERMAL RESPONSE )<br>1. Duty Factor D = t1/t2<br>2. Peak Tj = P dm x Zthjc + Tc<br>sil Re A<br>0.0001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1 1<br>t1 , Rectangular Pulse Duration (sec)<br>Fig 14.   Maximum Effective Transient Thermal Impedance, Junction-to-Case<br>1000<br>Duty Cycle = Single Pulse Allowed avalanche Current vs avalanche<br>pulsewidth, tav, assuming  Tj = 150°C and<br>TT | Tstart =25°C (Single Pulse)<br>100<br>0.01<br>Stwe<br>0.05<br>10 Birt 0.10 a Sa<br>Allowed avalanche Current vs avalanche pulsewidth, tav, assuming j = 25°C and  iS<br>Tstart = 150°C.<br>sll ll<br>CISTI<br>1<br>1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01<br>tav (sec)<br>Fig 15.  Avalanche Current vs. Pulse Width<br>Avalanche Current (A)<br>Thermal Response ( Z  thJC ) °C/W<br>**----- End of picture text -----**<br>


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600<br>TOP          Single Pulse<br>BOTTOM   1.0% Duty Cycle<br>500<br>ID = 115A<br>WT<br>400<br>300<br>INSTT<br>200<br>NST<br>100<br>PSSA<br>BEREREEANONS<br>0<br>25 50 75 100 125 150 175<br>Starting TJ , Junction Temperature (°C)<br>EAR , Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 at www.irf.com)** 

- 1.Avalanche failures assumption: 

   - Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type. 

2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 

3. Equation below based on circuit and waveforms shown in Figures 23a, 23b. 

4. PD (ave) = Average power dissipation per single avalanche pulse. 

5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 

6. Iav = Allowable avalanche current. 

7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 14, 15). 

   - tav = Average time in avalanche. 

   - D = Duty cycle in avalanche =  tav ·f 

   - ZthJC(D, tav) = Transient thermal resistance, see Figures 14) PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC 

      - Iav = 2T/ [1.3·BV·Zth] 

**Fig 16.** Maximum Avalanche Energy vs. Temperature 

EAS (AR) = PD (ave)·tav 

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~~IGR~~ 

IRF100B201/IRF100S201 ~~(/~~ 

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4.0<br>3.5<br>ES=S 000008<br>3.0<br>PSSST<br>2.5<br>ULASSSSs<br>2.0<br>BEREBES<OS<br>1.5 I D  = 250µA<br>ID = 1.0mA ZAZEBNS<br>ID = 10mA<br>1.0 ID = 1.0A SHEER<br>Cos<br>0.5<br>-75 -50 -25 0 25 50 75 100 125 150 175<br>TJ , Temperature ( °C )<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


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35<br>IF = 77A<br>30 V R  = 85V<br>TTT<br>TJ = 25°C<br>25<br>TJ = 125°C CCL<br>20<br>a>7dn<br>15<br>ert<br>10<br>er<br>5<br>ALP<br>0 PCCP<br>100 200 300 400 500 600 700 800 900 1000<br>diF /dt (A/µs)<br>IRRM (A)<br>**----- End of picture text -----**<br>


**Fig 17.** Threshold Voltage vs. Temperature 

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35<br>IF = 115A<br>30 V R  = 85V<br>TJ = 25°C<br>CEL<br>25<br>TJ = 125°C<br>20 ee:<br>Boca"<br>15<br>Sane? 4nnn<br>10<br>ERZAnEREE<br>5 AE<br>0 PCO<br>100 200 300 400 500 600 700 800 900 1000<br>diF /dt (A/µs)<br>IRRM (A)<br>**----- End of picture text -----**<br>


**Fig 18.** Typical Recovery Current vs. dif/dt 

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1000<br>IF = 77A<br>VR = 85V<br>800<br>TJ = 25°C }<br>T J  = 125°C<br>600<br>| =the<br>BReZ<br>400 BERSeZane<br>TIT TTT<br>200<br>ye<br>PLETE<br>0<br>100 200 300 400 500 600 700 800 900 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br>


**Fig 19.** Typical Recovery Current vs. dif/dt 

**Fig 20.** Typical Stored Charge vs. dif/dt 

**==> picture [217 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>IF = 115A<br>VR = 85V<br>800<br>TJ = 25°C<br>T J  = 125°C<br>600<br>ir<br>400<br>BERESZaan<br>200 Bee aennan<br>AGRRRRRER<br>0<br>100 200 300 400 500 600 700 800 900 1000<br>diF /dt (A/µs)<br>QRR (nC)<br>**----- End of picture text -----**<br>


**Fig 21.** Typical Stored Charge vs. dif/dt 

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**Fig 22.** Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET[® ] Power MOSFETs 

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15V<br>VDS L DRIVER<br>R G D.U.T +<br>- [V][DD]<br>IAS<br>20V<br>Jt tp Y 0.01<br>**----- End of picture text -----**<br>


**==> picture [17 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
IAS<br>**----- End of picture text -----**<br>


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V(BR)DSS<br>tp ><br>**----- End of picture text -----**<br>


**Fig 23a.** Unclamped Inductive Test Circuit 

**Fig 23b.** Unclamped Inductive Waveforms 

**Fig 24a.** Switching Time Test Circuit 

**==> picture [21 x 7] intentionally omitted <==**

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VDD<br>**----- End of picture text -----**<br>


**Fig 24b.** Switching Time Waveforms 

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**----- Start of picture text -----**<br>
Id<br>Vds<br>Vgs<br>Vgs(th) '<br>l epi n e p i g pig<br>Qgs1 Qgs2 Qgd Qgodr<br>**----- End of picture text -----**<br>


**Fig 25a.** Gate Charge Test Circuit 

**Fig 25b.** Gate Charge Waveform 

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## **TO-220AB Package Outline** (Dimensions are shown in millimeters (inches)) 

## **TO-220AB Part Marking Information** 

E X A M P L E : T H IS IS A N IR F 1 0 1 0 L O T  C O D E 1 7 8 9 A S S E M B L E D O N W W 1 9 , 2 0 0 0 IN T H E A S S E M B L Y  L IN E "C " 

N o t e :  "P " in a s s e m b ly  lin e p o s it io n in d ic a t e s  "L e a d -  F r e e " 

**==> picture [252 x 83] intentionally omitted <==**

**----- Start of picture text -----**<br>
P A R T  N U M B E R<br>IN T E R N A T IO N A L<br>R E C T IF IE R<br>L O G O<br>D A T E  C O D E<br>Y E A R  0  =  2 0 0 0<br>A S S E M B L Y<br>W E E K  1 9<br>L O T  C O D E<br>L IN E  C<br>**----- End of picture text -----**<br>


TO-220AB packages are not recommended for Surface Mount Application. 

Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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IRF100B201/IRF100S201 

## **D[2] Pak (TO-263AB) Package Outline** (Dimensions are shown in millimeters (inches)) 

## **D[2] Pak (TO-263AB) Part Marking Information** 

**==> picture [296 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
THIS IS AN IRF530S WITH<br>PART NUMBER<br>LOT CODE 8024 INTERNATIONAL<br>ASSEMBLED ON WW 02, 2000 RECTIFIER F530S<br>IN THE ASSEMBLY LINE "L" LOGO<br>DATE CODE<br>on YEAR 0 =  2000<br>ASSEMBLY UW<br>LOT CODE WEEK 02<br>U UJ<br>LINE L<br>OR<br>PART NUMBER<br>INTERNATIONAL<br>RECTIFIER F530S j e<br>LOGO I@aR ~ DATE CODE<br>P =  DESIGNATES LEAD - FREE<br>PRODUCT (OPTIONAL)<br>ASSEMBLY<br>YEAR 0 =  2000<br>LOT CODE<br>WEEK 02<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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IRF100B201/IRF100S201 ~~nnn~~ 

## **D[2] Pak (TO-263AB) Tape & Reel Information** (Dimensions are shown in millimeters (inches)) 

**==> picture [275 x 295] intentionally omitted <==**

**----- Start of picture text -----**<br>
TRR<br>1.60 (.063)<br>1.50 (.059)<br>1.60 (.063)<br>4.10 (.161)3.90 (.153) 1.50 (.059) 0.368 (.0145)<br>0.342 (.0135)<br>FEED DIRECTION 1.85 (.073) 11.60 (.457)<br>1.65 (.065) 11.40 (.449) 15.42 (.609) 24.30 (.957)<br>15.22 (.601) 23.90 (.941)<br>TRL<br>1.75 (.069)<br>10.90 (.429) 1.25 (.049)<br>10.70 (.421) 4.72 (.136)<br>16.10 (.634) 4.52 (.178)<br>15.90 (.626)<br>FEED DIRECTION<br>13.50 (.532) 27.40 (1.079)<br>12.80 (.504) 23.90 (.941)<br>4<br>330.00 60.00 (2.362)<br>(14.173)       MIN.<br>  MAX.<br>30.40 (1.197)<br>NOTES :       MAX.<br>1.   COMFORMS TO EIA-418. 26.40 (1.039) 4<br>2.   CONTROLLING DIMENSION: MILLIMETER. 24.40 (.961)<br>3.   DIMENSION MEASURED @ HUB.4.   INCLUDES FLANGE DISTORTION @ OUTER EDGE. 3<br>**----- End of picture text -----**<br>


Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 

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## **Qualification Information[† ]** 

|**Qualification Information[† ]**|||
|---|---|---|
|**Qualification Level**|Industrial<br>(per JEDEC JESD47F)††||
|**Moisture Sensitivity Level**|TO-220|N/A|
||D2Pak|MSL1|
|**RoHS Compliant**|Yes||



- Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/ 

**IR WORLD HEADQUARTERS:** 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 

12 www.irf.com ~~=~~ 

~~_~~ 

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## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRF100S201/power-mosfet-n-channel-100-v-192-a-3500-ohm-to)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irf100s201/mosfet-n-ch-100v-192a-to-263ab/dp/2725877)
---

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