# Power MOSFET, N Channel, 75 V, 100 A, 5000 µohm, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:3703601/)

**URL**: https://novapart.co/products/IPP100N08S2L07AKSA1/power-mosfet-n-channel-75-v-100-a-5000-ohm-to-220
**SKU**: IPP100N08S2L07AKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €1.8500
**Stock**: 200+
**Lead Time**: 2 days (indicative)

## Description

Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (27-Jun-2018) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | OptiMOS |
| Qualification | AEC-Q101 |
| Power Dissipation | 300W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220 |
| Drain Source Voltage Vds | 75V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 5000µohm |
| Gate Source Threshold Voltage Max | 1.6V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3703601/)

**IPB100N08S2L-07 IPP100N08S2L-07** 

## **OptiMOS[®] Power-Transistor** 

## **Features** 

- N-channel Logic Level - Enhancement mode • Automotive AEC Q101 qualified • MSL1 up to 260°C peak reflow 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|75|V|
||||
|_R_DS(on),max(SMD version)|6.5|mΩ|
||||
|_I_D|100|A|



- 175°C operating temperature 

- PG-TO263-3-2 PG-TO220-3-1 

- • Green package (lead free) 

- Ultra low Rds(on) 

- 100% Avalanche tested 

|||||
|---|---|---|---|
|**Type**|**Package**|**Ordering Code**|**Marking**|
|||||
|||||
|IPB100N08S2L-07|PG-TO263-3-2|SP0002-19053|PN08L07|
|||||
|||||
|IPP100N08S2L-07|PG-TO220-3-1|SP0002-19052|PN08L07|
|||||



**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Parameter**|**Symbol**|**Conditions**|**Unit**<br>**Value**|**Unit**|
|---|---|---|---|---|
|Continuous drain current1)|_I_D|_T_C=25 °C,_V_GS=10 V|100<br>A<br>98<br>400|A|
|||_T_C=100 °C,<br>_V_GS=10 V2)|||
|Pulsed drain current2)|_I_D,pulse|_T_C=25 °C|||
|Avalanche energy, single pulse2)|_E_AS|_I_D=80A|810<br>mJ|mJ|
|Gate source voltage4)|_V_GS||±20<br>V|V|
|Power dissipation|_P_tot|_T_C=25 °C|300<br>W|W|
|Operating and storage temperature|_T_j,_T_stg||-55 ... +175<br>°C|°C|



Rev. 1.0 

page 1 

2006-03-03 

|||**IPB100N08S2L-07**|**IPB100N08S2L-07**|**IPB100N08S2L-07**|
|---|---|---|---|---|
|||**IPP100N08S2L-07**|||
|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~<br>~~ee ee ee~~|||||
||**Thermal characteristics2)**||||
||Thermal resistance, junction - case|_R_thJC<br>-<br>-<br>0.5||K/W|
||Thermal resistance, junction -<br>ambient, leaded|_R_thJA<br>-<br>-<br>62|||
||SMD version, device on PCB|_R_thJA<br>minimal footprint<br>-<br>-<br>62|||
|||6 cm2cooling area5)<br>-<br>-<br>40|||
||**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified|||
||**Static characteristics**||||
||Drain-source breakdown voltage<br>Gate threshold voltage|_V_(BR)DSS _V_GS=0 V,_I_D= 1 mA<br>75<br>-<br>-<br>_V_GS(th)<br>_V_DS=_V_GS,_I_D=250 µA<br>1.2<br>1.6<br>2.0<br>~~ee~~<br>~~ee eee ee~~<br>~~cE~~||V|
||Zero gate voltage drain current|_I_DSS<br>_V_DS=75 V,_V_GS=0 V,<br>_T_j=25 °C<br>-<br>0.01<br>1<br>_V_DS=75 V,_V_GS=0 V,<br>_T_j=125 °C2)<br>-<br>1<br>100<br>~~PE=rrr~~<br>~~PT~~||µA|
||Gate-source leakage current<br>Drain-source on-state resistance|_I_GSS<br>_V_GS=20 V,_V_DS=0 V<br>-<br>1<br>100<br>_R_DS(on)<br>_V_GS=4.5 V,_I_D=80 A,<br>SMD version<br>-<br>6.5<br>8.7<br>_V_GS=4.5 V,_I_D=80 A,<br>SMD version<br>-<br>6.2<br>8.4<br>~~ee~~<br>~~ee ee ee~~<br>~~P-=rrr~~<br>~~TT~~||nA<br>mΩ|
||Drain-source on-state resistance|R_DS(on)_<br>_V_GS=10 V,_I_D=80 A,<br>-<br>5.0<br>6.8<br>_V_GS=10 V,_I_D=80 A,<br>SMD version<br>-<br>4.7<br>6.5<br>~~ee~~<br>~~ae~~||mΩ|



Rev. 1.0 

page 2 

2006-03-03 

||||||**IPB100N08S2L-07**|**IPB100N08S2L-07**|**IPB100N08S2L-07**|
|---|---|---|---|---|---|---|---|
||||||**IPP100N08S2L-07**|||
|**Parameter**<br>**Dynamic characteristics2)**<br>~~ee~~||**Symbol**|**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|||||
||Input capacitance|_C_iss||-|5400|-|pF|
||Output capacitance|_C_oss|_V_GS=0 V,_V_DS=25 V,<br>_f_=1 MHz|-|1300|-||
||Reverse transfer capacitance|Crss||-|590|-||
||Turn-on delay time|_t_d(on)||-|19|-|ns|
||Rise time|_t_r|_V_DD=40 V,_V_GS=10 V,|-|56|-||
||Turn-off delay time|_t_d(off)|_I_D=100 A,_R_G=1.1Ω|-|85|-||
||Fall time|_t_f||-|22|-||
||**Gate Charge Characteristics2)**|||||||
||Gate to source charge|_Q_gs||-|18|25|nC|
||Gate to drain charge|_Q_gd|_V_DD=60 V,_I_D=100 A,|-|70|124||
||Gate charge total|_Q_g|_V_GS=0 to 10 V|-|182|246||
||Gate plateau voltage|_V_plateau||-|3.5|-|V|
||**Reverse Diode**|||||||
||Diode continous forward current2)|_I_S||-|-|100|A|
||||_T_C=25 °C|||||
||Diode pulse current2)|_I_S,pulse||-|-|400||
||Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=80 A,<br>_T_j=25 °C|-|0.9|1.3|V|
||Reverse recovery time2)|_t_rr|_V_R=40 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|95|120|ns|
||Reverse recovery charge2)|_Q_rr|_V_R=40 V,_I_F=_I_S,<br>d_i_F/d_t_=100 A/µs|-|240|300|nC|



> 1) Current is limited by bondwire; with an _R_ thJC = 0.5K/W the chip is able to carry 138A at 25°C. For detailed information see Application Note ANPS071E at _www.infineon.com/optimos_ 

2) Defined by design. Not subject to production test. 

- 3) See diagram 13 

4) Qualified at -20V and +20V. 

5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

Rev. 1.0 

page 3 

2006-03-03 

**IPB100N08S2L-07 IPP100N08S2L-07** 

## **1 Power dissipation** 

_P_ tot = f( _T_ C); _V_ GS ≥ 4 V 

## **2 Drain current** 

_I_ D = f( _T_ C); _V_ GS ≥ 10 V 

**==> picture [482 x 644] intentionally omitted <==**

**----- Start of picture text -----**<br>
350 120<br>300<br>100<br>250<br>80<br>200<br>60<br>150<br>40<br>100<br>20<br>50<br>0 ALA 0<br>0 50 100 150 200 0 50 100 150 200<br>T  C [°C] T  C [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br>I  D = f( V  DS);  T  C = 25 °C;  D  = 0 Z  thJC = f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>1000 10 [0]<br>1 µs 0.5<br>10 µs<br>100 100 µs 10 [-1]<br>0.1<br>1 ms<br>0.05<br>10 10 [-2]<br>0.01<br>1 ARE 10 [-3] single pulse<br>0.1 1 10 100 10 [-7] 10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0]<br>V  DS [V] t  p [s]<br>Rev. 1.0 page 4 2006-03-03<br> [W]<br> [A]<br>P  tot I  D<br> [A]  [K/W]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


Rev. 1.0 

**IPB100N08S2L-07 IPP100N08S2L-07** 

## **5 Typ. output characteristics** 

_I_ D = f( _V_ DS); _T_ j = 25 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on-state resistance** 

_R_ DS(on) = ( _I_ D); _T_ j = 25 °C parameter: _V_ GS 

**==> picture [463 x 266] intentionally omitted <==**

**----- Start of picture text -----**<br>
300 20<br>10 V<br>18 3.5 V<br>250<br>16 i<br>14 Fi 3 V |a<br>200<br>150 4 V 1210 Y,<br>8 4 V<br>100 4.5 V<br>3.5 V 6<br>4 10 V<br>50<br>3 V 2<br>0 2.5 V 0<br>0 2 4 6 8 10 0 20 40 60 80 100 120<br>V  DS [V] I  D [A]<br>] Ω<br> [A]  [m<br>I  D<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

## **8 Typ. Forward transconductance** 

**==> picture [471 x 308] intentionally omitted <==**

**----- Start of picture text -----**<br>
I  D = f( V  GS);  V  DS = 6V g  fs = f( I  D);  T  j = 25°C<br>parameter:  T  j parameter:  g  fs<br>200180 I 250<br>160140 |[| 200<br>120 150<br>100 |Vi<br>8060 —f7 100 /<br>40 Y| 50<br>175 °C<br>20<br>25 °C<br>-55 °C<br>0 0<br>1 2 3 4 0 50 100 150 200<br>V  GS [V] I  D [A]<br> [A]  [S]<br>I  D g  fs<br>**----- End of picture text -----**<br>


Rev. 1.0 

2006-03-03 

page 5 

**IPB100N08S2L-07 IPP100N08S2L-07** 

## **9 Typ. Drain-source on-state resistance** 

## **10 Typ. gate threshold voltage** 

_R_ DS(ON) = f( _T_ j) 

_V_ GS(th) = f( _T_ j); _V_ GS = _V_ DS 

parameter: _I_ D = 80 A; VGS = 10 V= 80 A; VGS = 10 VGS = 10 V = 10 V 

**==> picture [471 x 632] intentionally omitted <==**

**----- Start of picture text -----**<br>
parameter:  I  D = 80 A; VGS = 10 V= 80 A; VGS = 10 VGS = 10 V = 10 V parameter:  I  D<br>12 2.5<br>10 2<br>1250µA<br>8 1.5<br>250µA<br>6 1<br>4 0.5<br>2 a 0 cs<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T  j [°C] T  j [°C]<br>11 Typ. capacitances 12 Typical forward diode characteristicis<br>C  = f( V  DS);  V  GS = 0 V;  f  = 1 MHz IF = f(VSD)<br>parameter:  T  j<br>10 [4] 10 [3]<br>Ciss<br>—==58 ae<br>10 [2]<br>Coss<br>10 [3]<br>Crss 175 °C 25 °C<br>10 [1]<br>od ew<br>10 [2] 10 [0]<br>0 5 10 15 20 25 30 0 0.2 0.4 0.6 0.8 1 1.2 1.4<br>V  DS [V] V  SD [V]<br>] Ω<br> [m  [V]<br> DS(on)  GS(th)<br>R V<br>  [pF] C  [A] I  F<br>**----- End of picture text -----**<br>


Rev. 1.0 

page 6 

2006-03-03 

**IPB100N08S2L-07 IPP100N08S2L-07** 

## **13 Typical avalanche energy** 

## **14 Typ. gate charge** 

_E_ AS = f( _T_ j) 

_V_ GS = f( _Q_ gate); _I_ D = 100 A pulsed parameter: _V_ DD 

**==> picture [470 x 633] intentionally omitted <==**

**----- Start of picture text -----**<br>
parameter:  I  D=80A parameter:  V  DD<br>900 12<br>800 15V 60V<br>10<br>700<br>600 8<br>500<br>6<br>400<br>\ (<br>300 4<br>200<br>2<br>100<br>0 iAPN 0 ceEE<br>25 75 125 175 0 40 80 120 160 200<br>T  j [°C] Q  gate [nC]<br>15 Typ. drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS) = f( T  j);  I  D = 1 mA<br>86<br>V GS<br>Q g<br>81<br>76<br>71<br>Q  gate<br>Q gs Q gd<br>66<br>-60 -20 20 60 100 140 180<br>T  j [°C]<br> [mJ]  [V]<br> AS  GS<br>E V<br> [V]<br> BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev. 1.0 

2006-03-03 

page 7 

**IPB100N08S2L-07 IPP100N08S2L-07** 

## **Published by Infineon Technologies AG St.-Martin-Straße 53** 

**D-81541 München** 

**© Infineon Technologies AG 2004 All Rights Reserved.** 

## **Attention please!** 

The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. 

Terms of delivery and rights to technical change reserved. 

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies Office (www.infineon.com) 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies Office. 

effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.0 

page 8 

2006-03-03 



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- [Supplier page](https://es.farnell.com/infineon/ipp100n08s2l07aksa1/mosfet-n-ch-75v-100a-to-220/dp/3703601)
---

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