# Power MOSFET, N Channel, 100 V, 100 A, 2600 µohm, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:2443403/)

**URL**: https://novapart.co/products/IPP030N10N3GXKSA1/power-mosfet-n-channel-100-v-a-2600-ohm-to-220
**SKU**: IPP030N10N3GXKSA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €2.0700
**Stock**: 10+
**Lead Time**: 162 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:100A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.0026ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2.7

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 300W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220 |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 100A |
| Drain Source On State Resistance | 2600µohm |
| Gate Source Threshold Voltage Max | 2.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2443403/)

**IPP030N10N3 G IPI030N10N3 G** 

## **OptiMOS™3 Power-Transistor** 

## **Features** 

- N-channel, normal level • Excellent gate charge x _R_ DS(on) product (FOM) 

|**Product Summary**|||
|---|---|---|
|_V_DS|100|V|
|_R_DS(on),max|3|mW|
|_I_D|100|A|



- Very low on-resistance _R_ DS(on) 

- 175 °C operating temperature • Pb-free lead plating; RoHS compliant 

- Qualified according to JEDEC[1)] for target application 

- Ideal for high-frequency switching and synchronous rectification 

|**Type**|IPP030N10N3|G|IPI030N10N3|G|
|---|---|---|---|---|
|||a|||
||,||if||
||.||||
|**Package**<br>**Marking**<br>a|PG-TO220-3<br>030N10N<br>ee||PG-TO262-3<br>030N10N||



**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol **|**Conditions**|**Value**|**Unit**|
|Continuous drain current|_I_D|_T_C=25 °C2)|100|A|
|||_T_C=100 °C|100||
|Pulsed drain current2)|_I_D,pulse|_T_C=25 °C|400||
|Avalanche energy, single pulse|_E_AS|_I_D=100 A,_R_GS=25W|1000|mJ|
|Gate source voltage|_V_GS||±20|V|
|Power dissipation|_P_tot|_T_C=25 °C|300|W|
|Operating and storage temperature|_T_j,_T_stg||-55 ... 175|°C|
|IEC climatic category; DIN IEC 68-1|||55/175/56||



- 1)J-STD20 and JESD22 

- 2) See figure 3 

Rev. 2.1 

page 1 

2011-07-18 

|**IPP030N10N3 G**<br>**IPI030N10N3 G**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~ee~~<br>~~ee~~|**IPP030N10N3 G**<br>**IPI030N10N3 G**<br>**Parameter**<br>**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>Cinfineon~~ee~~<br>~~ee~~|
|---|---|
|**Thermal characteristics**||
|Thermal resistance, junction - case|_R_thJC<br>-<br>-<br>0.5<br>K/W|
|Thermal resistance,|_R_thJA<br>minimal footprint<br>-<br>-<br>62|
|junction - ambient|6 cm2 cooling area3)<br>-<br>-<br>40|



**Electrical characteristics,** at _T_ j=25 °C, unless otherwise specified 

## **Static characteristics** 

|Drain-source breakdown voltage|_V_(BR)DSS <br>~~a ee~~|_V_GS=0 V,_I_D=1 mA<br>~~ee~~|100<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~ee~~<br>~~eee~~|V|
|---|---|---|---|---|---|---|
|Gate threshold voltage|_V_GS(th)<br>~~ee~~|_V_DS=_V_GS,_I_D=275 µA<br>~~ee~~|2<br>~~ee~~<br>~~ee~~|2.7<br>~~ee~~<br>~~ee~~<br>~~eee~~|3.5<br>~~ee~~<br>~~ee~~<br>~~eee~~||
|Zero gate voltage drain current|_I_DSS<br>~~ae~~|_V_DS=100 V,_V_GS=0 V,<br>_T_j=25 °C<br>~~ae~~<br>~~fT~~|-<br>~~ee ~~<br>~~ae~~<br>~~fTty~~|0.1<br> ~~eee~~<br>~~ae~~<br>~~ty~~|1<br>~~eee~~<br>~~ae~~<br>~~ty~~|µA|
|||_V_DS=100 V,_V_GS=0 V,<br>_T_j=125 °C<br>~~ae~~<br>~~fT~~|-<br>~~ae~~<br>~~fTty~~|10<br>~~ae~~<br>~~ty~~|100<br>~~ae~~<br>~~ty~~||
|Gate-source leakage current|_I_GSS<br>~~ee~~|_V_GS=20 V,_V_DS=0 V<br>~~fT~~<br>~~ee~~|-<br>~~fT ty~~<br>~~ee~~|1<br>~~ty~~<br>~~eee~~|100<br>~~ty~~<br>~~eee~~|nA|
|Drain-source on-state resistance|_R_DS(on)<br>~~ee~~|_V_GS=10 V,_I_D=100 A<br>~~ee~~|-<br>~~ee~~|2.6<br>~~eee~~|3<br>~~eee~~|mW|
|||_V_GS=6 V,_I_D=50 A<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|3.1<br>~~eee~~<br>~~eee~~|4.8<br>~~eee~~<br>~~eee~~||
|Gate resistance|_R_G<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ft~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ftft~~|1.9<br> ~~eee~~<br>~~ee~~<br>~~eee~~<br>~~ft~~|-<br>~~eee~~<br>~~ee~~<br>~~eee~~<br>~~ft~~|W|
|Transconductance|_g_fs<br>~~P|~~||_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=100 A<br>~~P|~~<br>~~ft~~|94<br>~~ee ~~<br>~~P|~~<br>~~ftft~~|188<br> ~~eee~~<br>~~P|~~<br>~~ft~~|-<br>~~eee~~<br>~~P|~~<br>~~ft~~|S|



3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

Rev. 2.1 

page 2 

2011-07-18 

**IPP030N10N3 G IPI030N10N3 G** 

|**Parameter**<br>~~ee ~~|**Parameter**<br>~~ee ~~|**Symbol Conditions**<br> ~~ee~~|**Symbol Conditions**<br> ~~ee~~|**min.**|**typ.**<br>**Values**|**max.**|**Unit**|
|---|---|---|---|---|---|---|---|
||**Dynamic characteristics**|||||||
||Input capacitance|_C_iss||-|11100|14800|pF|
||Output capacitance|_C_oss|_V_GS=0 V,_V_DS=50 V,<br>_f_=1 MHz|-|1940|2580||
||Reverse transfer capacitance|_C_rss||-|69|-||
||Turn-on delay time|_t_d(on)||-|34|-|ns|
||Rise time|_t_r|_V_DD=50 V,_V_GS=10 V,|-|58|-||
||Turn-off delay time|_t_d(off)|_I_D=100 A,_R_G=1.6W|-|84|-||
||Fall time|_t_f||-|28|-||
||Gate Charge Characteristics4)|||||||
||Gate to source charge|_Q_gs||-|49|-|nC|
||Gate to drain charge|_Q_gd||-|28|-||
||Switching charge|_Q_sw|_V_DD=50 V,_I_D=100 A,<br>_V_GS=0 to 10 V|-|43|-||
||Gate charge total|_Q_g||-|155|206||
||Gate plateau voltage|_V_plateau||-|4.4|-|V|
||Output charge|_Q_oss|_V_DD=50 V,_V_GS=0 V|-|205|273|nC|
||**Reverse Diode**|||||||
||Diode continous forward current|_I_S||-|-|100|A|
||||_T_C=25 °C|||||
||Diode pulse current|_I_S,pulse||-|-|400||
||Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=100 A,<br>_T_j=25 °C|-|1|1.2|V|
||Reverse recovery time|_t_rr|_V_R=50 V,_I_F=_I S_,|-|86|-|ns|
||Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs|-|232|-|nC|



4) See figure 16 for gate charge parameter definition 

Rev. 2.1 

page 3 

2011-07-18 

**IPP030N10N3 G IPI030N10N3 G** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

## **2 Drain current** 

_I_ D=f( _T_ C); _V_ GS≥10 V 

**==> picture [465 x 611] intentionally omitted <==**

**----- Start of picture text -----**<br>
350 120<br>300<br>100<br>250<br>80<br>200<br>60<br>150<br>40<br>100<br>20<br>50<br>0 0<br>0 50 100 150 200 0 50 100 150 200<br>T C [°C] T C [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br>=f( V  DS););  T  C=25 °C;=25 °C;  D  =0 Z  thJC=f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>10 [3] 10 [0]<br>limited by on-state<br>resistance 1 µs<br>10 µs<br>100 µs<br>10 [2]<br>0.5<br>1 ms<br>10 ms 0.2<br>10 [1] 10 [-1]<br>DC 0.1<br>0.05<br>10 [0]<br>0.02<br>0.01<br>single pulse<br>10 [-1] 10 [-2]<br>10 [-1] 10 [0] 10 [1] 10 [2] 10 [3] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0]<br>V DS [V] t p [s]<br> [W]  [A]<br>P tot I D<br> [A]  [K/W]<br>I D<br>thJC<br>Z<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS);); _T_ C=25 °C;=25 °C; _D_ =0 parameter: _t_ p 

Rev. 2.1 

page 4 

2011-07-18 

**IPP030N10N3 G IPI030N10N3 G** 

## **5 Typ. output characteristics** 

## **6 Typ. drain-source on resistance** 

_I_ D=f(=f( _V_ DS);); _T_ j=25 °C=25 °C 

**==> picture [465 x 652] intentionally omitted <==**

**----- Start of picture text -----**<br>
 D=f(=f( V  DS););  T  j=25 °C=25 °C R  DS(on)=f( I  D);  T  j=25 °C<br>parameter:  V  GS parameter:  V  GS<br>300 6<br>10 V<br>6 V<br>250 5<br>7.5 V 5.5 V 4.5 V<br>5 V<br>200 4<br>5 V<br>6 V<br>150 3<br>7.5 V<br>10 V<br>100 4.5 V 2<br>50 1<br>0 pe 0<br>0 1 2 0 40 80 120 160<br>V DS [V] I D [A]<br>7 Typ. transfer characteristics 8 Typ. forward transconductance<br>=f( V  GS); |); | V  DS|>2||>2| I  D|| R  DS(on)max g  fs=f( I  D);  T  j=25 °C<br>parameter:  T  j<br>300 240<br>250 200<br>200 160<br>150 120<br>100 80<br>25 °C<br>50 40<br>175 °C<br>0 0<br>0 2 4 6 0 40 80 120 160<br>V GS [V] I D [A]<br>]<br>W<br>[m<br> [A]<br>I D<br>DS(on)<br>R<br> [A]  [S]<br>I D g fs<br>**----- End of picture text -----**<br>


parameter: _V_ GS 

## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); |); | _V_ DS|>2||>2| _I_ D|| _R_ DS(on)max parameter: _T_ j 

Rev. 2.1 

2011-07-18 

page 5 

**IPP030N10N3 G IPI030N10N3 G** 

## **9 Drain-source on-state resistance** 

## **10 Typ. gate threshold voltage** 

**==> picture [470 x 652] intentionally omitted <==**

**----- Start of picture text -----**<br>
R  DS(on)=f( T  j);  I  D=100 A;  V  GS=10 V V  GS(th)=f( T  j);  V  GS= V  DS<br>parameter:  I  D<br>7 4<br>6 3.5<br>3<br>5<br>2750 µA<br>2.5<br>4<br>275 µA<br>98 %<br>Z 2 e<br>3 LZ typ ; S S<br>1.5<br>2<br>1<br>1<br>0.5<br>0 ee 0<br>-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180<br>T j [°C] T j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br>C  =f( V  DS);  V  GS=0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [5] 10 [3]<br>Ciss<br>10 [4] 175 °C, 98%<br>25 °C<br>Santali 10 [2]<br>Coss<br>10 [3]<br>175 °C<br>25 °C, 98%<br>10 [1]<br>Crss<br>10 [2]<br>ai<br>Peis<br>10 [1] 10 [0]<br>0 20 40 60 80 0 0.5 1 1.5 2<br>V DS [V] V SD [V]<br>]<br>W<br> [m  [V]<br>DS(on) GS(th)<br>R V<br>C  [pF]  [A] I F<br>**----- End of picture text -----**<br>


Rev. 2.1 

page 6 

2011-07-18 

**IPP030N10N3 G IPI030N10N3 G** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 W 

parameter: _T_ j(start) 

**==> picture [228 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>100<br>25 °C<br>100 °C<br>150 °C<br>10<br>1<br>1 10 100 1000<br>t AV [µs]<br> [A]<br>I AS<br>**----- End of picture text -----**<br>


**15 Drain-source breakdown voltage** 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=100 A pulsed parameter: _V_ DD 

**==> picture [225 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>8<br>80 V<br>50 V<br>6<br>20 V<br>4<br>2<br>0<br>0 40 80 120 160<br>Q gate [nC]<br> [V]<br>GS<br>V<br>**----- End of picture text -----**<br>


**16 Gate charge waveforms** 

_V_ BR(DSS)=f( _T_ j); _I_ D=1 mA 

**==> picture [226 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
110<br>105<br>100<br>95<br>90<br>-60 -20 20 60 100 140 180<br>T j [°C]<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


**==> picture [206 x 226] intentionally omitted <==**

**----- Start of picture text -----**<br>
V GS<br>Q g<br>V<br>gs(th)<br>Q g(th) Q sw Q gate<br>Q gs Q gd<br>**----- End of picture text -----**<br>


Rev. 2.1 

2011-07-18 

page 7 

**IPP030N10N3 G IPI030N10N3 G** 

## **PG-TO220-3: Outline** 

Rev. 2.1 

page 8 

2011-07-18 

**IPP030N10N3 G IPI030N10N3 G** 

## **PG-TO262-3** 

Rev. 2.1 

page 9 

2011-07-18 

**IPP030N10N3 G IPI030N10N3 G** 

**Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 2.1 

page 10 

2011-07-18 



## Links

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- [Supplier page](https://es.farnell.com/infineon/ipp030n10n3gxksa1/mosfet-n-ch-100v-100a-to-220-3/dp/2443403)
---

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