# Power MOSFET, N Channel, 100 V, 13 A, 0.078 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2480837/)

**URL**: https://novapart.co/products/IPD78CN10NGATMA1/power-mosfet-n-channel-100-v-13-a-0078-ohm-to-252
**SKU**: IPD78CN10NGATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.2770
**Stock**: 1000+
**Lead Time**: 64 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:13A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.059ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Po

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 31W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 13A |
| Drain Source On State Resistance | 0.078ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2480837/)

## **IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **OptiMOS[™] 2 Power-Transistor** 

## **Features** 

• N-channel, normal level 

- Excellent gate charge x _R_ DS(on) product (FOM) 

|**Product Summary**|||
|---|---|---|
|||V|
|_V_DS|100||
|||mW|
|_R_DS(on),max (TO252)|78||
|||A|
|_I_D|13||



- Very low on-resistance _R_ DS(on) 

- 175 °C operating temperature 

- Pb-free lead plating; RoHS compliant • Qualified according to JEDEC[1)] for target application 

- Ideal for high-frequency switching and synchronous rectification 

- Halogen-free according to IEC61249-2-21 

||||IPI80CN10N G||
|---|---|---|---|---|
|**Type**|IPB79CN10N G|IPD78CN10N G||IPP80CN10N G|
|ee|eeoe<br>3|oe<br>3||7|
|ee|||||
|ee|ee oe|oe|PG-TO262-3||
|**Package**|PG-TO263-3|PG-TO252-3||PG-TO220-3|
||||80CN10N||
|**Marking**|79CN10N|78CN10N||80CN10N|



**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Parameter**|**Symbol **|**Conditions**|**Unit**<br>**Value**|**Unit**|
|---|---|---|---|---|
|Continuous drain current|_I_D|_T_C=25 °C|13<br>A<br>9<br>52|A|
|||_T_C=100 °C|||
|Pulsed drain current2)|_I_D,pulse|_T_C=25 °C|||
|Avalanche energy, single pulse|_E_AS|_I_D=13 A,_R_GS=25W|17<br>mJ|mJ|
|Gate source voltage3)|_V_GS||±20<br>V|V|
|Power dissipation|_P_tot|_T_C=25 °C|31<br>W|W|
|Operating and storage temperature|_T_j,_T_stg||-55 ... 175<br>°C|°C|
|IEC climatic category; DIN IEC 68-1|||55/175/56||



- 1)J-STD20 and JESD22 

- 2) see figure 3 

3) Tjmax=150°C and duty cycle D=0.01 for Vgs<-5V 

Rev. 1.091 

page 1 

2013-07-25 

**IPB79CN10N G  IPD78CN10N G** 

**IPI80CN10N G  IPP80CN10N G** 

|~~Cinfineon~~|**IPB79CN10N G  IPD78CN10N G**<br>**IPI80CN10N G  IPP80CN10N G**<br>|**IPB79CN10N G  IPD78CN10N G**<br>**IPI80CN10N G  IPP80CN10N G**<br>|
|---|---|---|
|**Parameter**<br>**Thermal characteristics**<br>~~ee~~|**Symbol Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~<br>~~ee el~~||
|Thermal resistance, junction - case|_R_thJC<br>-<br>-<br>4.9|K/W|
|Thermal resistance, junction -|_R_thJA<br>minimal footprint<br>-<br>-<br>62||
|ambient (TO220, TO262, TO263)|6 cm2 cooling area4)<br>-<br>-<br>40||
|Thermal resistance, junction -|minimal footprint<br>-<br>-<br>75||
|ambient (TO252, TO251)|6 cm2 cooling area4)<br>-<br>-<br>50||
|**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|=25 °C, unless otherwise specified||
|**Static characteristics**|||
|Drain-source breakdown voltage<br>Gate threshold voltage<br>Zero gate voltage drain current<br>Gate-source leakage current<br>Drain-source on-state resistance|_V_(BR)DSS _V_GS=0 V,_I_D=1 mA<br>100<br>-<br>-<br>_V_GS(th)<br>_V_DS=_V_GS,_I_D=12 µA<br>2<br>3<br>4<br>_I_DSS<br>_V_DS=80 V,_V_GS=0 V,<br>_T_j=25 °C<br>-<br>0.1<br>1<br>_V_DS=80 V,_V_GS=0 V,<br>_T_j=125 °C<br>-<br>10<br>100<br>_I_GSS<br>_V_GS=20 V,_V_DS=0 V<br>-<br>1<br>100<br>_R_DS(on)<br>_V_GS=10 V,_I_D=13 A,<br>(TO252)<br>-<br>59<br>78<br>~~ee~~<br>~~ee ee~~<br>~~ee~~<br>~~ee ee ee~~<br>~~are~~<br>~~tT~~<br>~~ee~~<br>~~ee ee ee~~<br>~~ft~~|V<br>µA<br>nA<br>mW|
||_V_GS=10 V,_I_D=13 A,<br>(TO251)<br>-<br>59<br>78<br>~~tT~~||
||_V_GS=10 V,_I_D=13 A,<br>(TO263)<br>-<br>61<br>79<br>~~tT~~||
|Gate resistance<br>Transconductance|_V_GS=10 V,_I_D=13 A,<br>(TO220, TO262)<br>-<br>61<br>80<br>_R_G<br>-<br>0.8<br>-<br>_g_fs<br>|_V_DS|>2|_I_D|_R_DS(on)max,<br>_I_D=13 A<br>7<br>13<br>-<br>~~tT~~<br>~~ee~~<br>~~eeee~~<br>~~PttT~~|W<br>S|



4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

Rev. 1.091 

page 2 

2013-07-25 

**IPB79CN10N G  IPD78CN10N G** 

**IPI80CN10N G  IPP80CN10N G** 

|**Parameter**<br>~~ee~~|**Symbol **<br>~~ee~~|**Conditions**<br>~~ee~~|**min.**<br>~~ee~~|**typ.**<br>**Values**<br>~~ee~~|**max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|~~ee~~|
|**Dynamic characteristics**|||||||
|Input capacitance|_C_iss||-|538|716|pF|
|Output capacitance|_C_oss|_V_GS=0 V,_V_DS=50 V,<br>_f_=1 MHz|-|76|101||
|Reverse transfer capacitance|_C_rss||-|8|12||
|Turn-on delay time|_t_d(on)||-|9|13|ns|
|Rise time|_t_r|_V_DD=50 V,_V_GS=10 V,|-|4|6||
|Turn-off delay time|_t_d(off)|_I_D=13 A,_R_G,ext=2.4W|-|13|18||
|Fall time|_t_f||-|3|4||
|Gate Charge Characteristics5)|||||||
|Gate to source charge|_Q_gs||-|3|4|nC|
|Gate to drain charge|_Q_gd||-|2|3||
|Switching charge|_Q_sw|_V_DD=50 V,_I_D=13 A,<br>_V_GS=0 to 10 V|-|3|5||
|Gate charge total|_Q_g||-|8|11||
|Gate plateau voltage|_V_plateau||-|5.7|-|V|
|Output charge|_Q_oss|_V_DD=50 V,_V_GS=0 V|-|8|10|nC|
|**Reverse Diode**|||||||
|Diode continous forward current|_I_S||-|-|13|A|
|||_T_C=25 °C|||||
|Diode pulse current|_I_S,pulse||-|-|52||
|Diode forward voltage|_V_SD|_V_GS=0 V,_I_F=13 A,<br>_T_j=25 °C|-|1|1.2|V|
|Reverse recovery time|_t_rr|_V_R=50 V,_I_F=_I_S,|-|67|-|ns|
|Reverse recovery charge|_Q_rr|d_i_F/d_t_=100 A/µs|-|114|-|nC|



5) See figure 16 for gate charge parameter definition 

Rev. 1.091 

page 3 

2013-07-25 

**IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **1 Power dissipation** 

_P_ tot=f( _T_ C) 

## **2 Drain current** 

_I_ D=f( _T_ C); _V_ GS≥10 V 

**==> picture [467 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
40  15<br>30<br>10<br>20<br>5<br>10<br>0  0<br>0  50  100  150  200  0  50  100  150  200<br>T C [°C]  T C [°C]<br> [W]<br> [A]<br>P tot I D<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D=f( _V_ DS); _T_ C=25 °C; _D_ =0 parameter: _t_ p 

## **4 Max. transient thermal impedance** 

_Z_ thJC=f( _t_ p) 

parameter: _D_ = _t_ p/ _T_ 

**==> picture [228 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [2 ]<br>1 µs<br>10 µs<br>100 µs<br>10 [1 ]<br>1 ms<br>10 [0 ] 10 ms<br>DC<br>10 [-1 ]<br>10 [-1 ] 10 [0 ] 10 [1 ] 10 [2 ] 10 [3 ]<br>V DS [V]<br> [A]<br>I D<br>**----- End of picture text -----**<br>


**==> picture [76 x 238] intentionally omitted <==**

**----- Start of picture text -----**<br>
10<br>0.5<br>0.2<br>1<br>0.1<br>0.05<br>0.02<br>0.01<br>single pulse<br>0.1<br>[K/W]<br>thJC<br>Z<br>**----- End of picture text -----**<br>


_**t**_ **p [s]** 

Rev. 1.091 

page 4 

2013-07-25 

**IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **5 Typ. output characteristics** 

_I_ D=f( _V_ DS); _T_ j=25 °C 

parameter: _V_ GS 

## **6 Typ. drain-source on resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=25 °C parameter: _V_ GS 

**==> picture [466 x 266] intentionally omitted <==**

**----- Start of picture text -----**<br>
60  200<br>180<br>160<br>10 V<br>140<br>40  8 V  5 V  5.5 V  6 V  6.5 V  7 V<br>120<br>7 V<br>100<br>80  8 V<br>6.5 V<br>20  10 V<br>60<br>6 V<br>40<br>5.5 V<br>20<br>5 V<br>4.5 V<br>0  0<br>0  1  2  3  4  5  0  10  20  30  40<br>V DS [V]  I D [A]<br>]<br>W<br> [A]   [m<br>I D<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


## **7 Typ. transfer characteristics** 

_I_ D=f( _V_ GS); | _V_ DS|>2| _I_ D| _R_ DS(on)max parameter: _T_ j 

## **8 Typ. forward transconductance** 

_g_ fs=f( _I_ D); _T_ j=25 °C 

**==> picture [466 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
30  20<br>25<br>15<br>20<br>15  10<br>10  175 °C<br>5<br>25 °C<br>5<br>0  0<br>0  2  4  6  8  0  10  20  30<br>V GS [V]  I D [A]<br> [A]   [S]<br>I D g fs<br>**----- End of picture text -----**<br>


Rev. 1.091 

2013-07-25 

page 5 

**==> picture [477 x 751] intentionally omitted <==**

**----- Start of picture text -----**<br>
IPB79CN10N G  IPD78CN10N G<br>IPI80CN10N G  IPP80CN10N G<br>Cinfin eon<br>9 Drain-source on-state resistance 10 Typ. gate threshold voltage<br>R  DS(on)=f( T  j);  I  D=13 A;  V  GS=10 V V  GS(th)=f( T  j);  V  GS= V  DS<br>parameter:  I  D<br>180  4<br>160<br>3.5<br>140<br>120 µA<br>3<br>120<br>12 µA<br>2.5<br>100  98 %<br>2<br>80<br>typ<br>1.5<br>60<br>1<br>40<br>20  0.5<br>0  a 0<br>-60  -20  20  60  100  140  180  -60  -20  20  60  100  140  180<br>T j [°C]  T j [°C]<br>11 Typ. capacitances 12 Forward characteristics of reverse diode<br>C  =f( V  DS);  V  GS=0 V;  f  =1 MHz I  F=f( V  SD)<br>parameter:  T  j<br>10 [3 ] 100<br>Ciss<br>a a Zs<br>175 °C  25 °C  175 °C, 98%<br>Coss<br>10 [2 ] 10<br>25 °C, 98%<br>Crss<br>10 [1 ] 1<br>10 [0 ] eS e C 0.1  i/<br>0  20  40  60  80  0  0.5  1  1.5  2<br>V DS [V]  V SD [V]<br>Rev. 1.091 page 6 2013-07-25<br>]<br>W<br>[m  [V]<br>DS(on) GS(th)<br>R V<br> [pF]   [A]<br>C I F<br>**----- End of picture text -----**<br>


Rev. 1.091 

2013-07-25 

## **IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **13 Avalanche characteristics** 

_I_ AS=f( _t_ AV); _R_ GS=25 W parameter: _T_ j(start) 

## **14 Typ. gate charge** 

_V_ GS=f( _Q_ gate); _I_ D=13 A pulsed parameter: _V_ DD 

**==> picture [483 x 642] intentionally omitted <==**

**----- Start of picture text -----**<br>
100  12<br>50 V<br>10<br>20 V  80 V<br>8<br>10  6<br>25 °C  4<br>100 °C<br>150 °C  2<br>1  0<br>1  10  100  1000  0  2  4  6  8  10<br>t AV [µs]  Q gate [nC]<br>15 Drain-source breakdown voltage 16 Gate charge waveforms<br>V  BR(DSS)=f( T  j);  I  D=1 mA<br>115<br>V  GS<br>Q g<br>110<br>105<br>100  V  gs(th)<br>95<br>Q  g(th) Q  sw Q gate<br>90  Q  gs Q  gd<br>-60  y -20  20  60  100  aa 140  180<br>T j [°C]<br>Rev. 1.091 2013-07-25<br> [A]   [V]<br>I AS V GS<br> [V]<br>BR(DSS)<br>V<br>**----- End of picture text -----**<br>


Rev. 1.091 

page 7 

**IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **PG-TO220-3: Outline** 

Rev. 1.091 

page 8 

2013-07-25 

## **IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **PG-TO-263 (D²-Pak)** 

Rev. 1.091 

page 9 

2013-07-25 

**IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **PG-TO262-3-1 (I²PAK)** 

Rev. 1.091 

page 10 

2013-07-25 

## **IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

## **PG-TO252-3: Outline** 

Rev. 1.091 

page 11 

2013-07-25 

**IPB79CN10N G  IPD78CN10N G IPI80CN10N G  IPP80CN10N G** 

**Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office 

(www.infineon.com). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. 

Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.091 

page 12 

2013-07-25 



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- [Supplier page](https://es.farnell.com/infineon/ipd78cn10ngatma1/mosfet-n-ch-100v-13a-to-252-3/dp/2480837)
---

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