# Power MOSFET, N Channel, 650 V, 10.6 A, 0.34 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2480835RL/)

**URL**: https://novapart.co/products/IPD65R380C6ATMA1/power-mosfet-n-channel-650-v-106-a-034-ohm-to-252
**SKU**: IPD65R380C6ATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.3920
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Channel Type | N Channel |
| Power Dissipation | 83W |
| Drain Source On State Resistance | 0.34ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2480835RL/)

## MOSFET 

Metal Oxide Semiconductor Field Effect Transistor 

## CoolMOS C6 

650V CoolMOS™ C6 Power Transistor IPx65R380C6 

## Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 Final 

Industrial & Multimarket 

## **650V CoolMOS™ C6 Power Transistor** 

## **IPD65R380C6, IPI65R380C6 IPB65R380C6, IPP65R380C6 IPA65R380C6** 

## **1 Description** 

CoolMOS™ is a revolutionary technology for high voltage power MOSFETs, designed according to the superjunction (SJ) principle and pioneered by Infineon Technologies. CoolMOS™ C6 series combines the experience of the leading SJ MOSFET supplier with high class innovation. The resulting devices provide all benefits of a fast switching SJ MOSFET while not sacrificing ease of use. Extremely low switching and conduction losses make switching applications even more efficient, more compact, lighter, and cooler. 

## **Features** 

- Extremely low losses due to very low FOM Rdson*Qg and Eoss 

- Very high commutation ruggedness 

- Easy to use/drive 

- Qualified for industrial grade applications according to JEDEC[1)] 

- Pb-free plating, , available in Halogen free mold compound[2)] 

## **Applications** 

**==> picture [85 x 87] intentionally omitted <==**

**----- Start of picture text -----**<br>
drain<br>pin 2<br>gate<br>pin 1<br>source<br>pin 3<br>**----- End of picture text -----**<br>


PFC stages, hard switching PWM stages and resonant switching PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV, Lighting, Server, Telecom, UPS and Solar. 

_Please note: For MOSFET paralleling the use of ferrite beads on the gate or separate totem poles is generally recommended._ 

**Table 1 Key Performance Parameters** 

|**Parameter**|**Value**|**Unit**|
|---|---|---|
|_V_DS@_T_j,max|700|V|
|_R_DS(on),max|0.38||
|_Q_g,typ|39|nC|
|_I_D,pulse|29|A|
|_E_oss@ 400V|2.8|µJ|
|Body diode d_i_/d_t_|500|A/µs|



|**Type / Ordering Code**|**Package**|**Marking**|**Related Links**<br> IFX CoolMOS Webpage<br> IFX Design tools|
|---|---|---|---|
|IPD65R380C6|PG-TO252|65C6380||
|IPI65R380C6|PG-TO262|||
|IPB65R380C6|PG-TO263|||
|IPP65R380C6|PG-TO220|||
|IPA65R380C6|PG-TO220 FullPAK|||



- 1) J-STD20 and JESD22 

- 2)2) For PG-TO252: non-Halogen free (OPN: IPD65R380C6BT); Halogen free (OPN: IPD65R380C6AT)no PG-To252 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

2 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

## **Table of Contents** 

## **Table of Contents** 

|**1**|**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2|
|---|---|
||**Table of Contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3|
|**2**|**Maximum ratings**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  4|
|**3**|**Thermal characteristics**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  5|
|**4**|**Electrical characteristics**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6|
|**5**|**Electrical characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8|
|**6**|**Test circuits**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  13|
|**7**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  14|
|**8**|**Revision History**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19|



Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

3 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

**Maximum ratings** 

## **2 Maximum ratings** 

at _T_ j = 25 °C, unless otherwise specified. 

## **Table 2 Maximum ratings** 

|**Table 2**<br>**Maximum ratings**|||||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Values**|||**Unit**|**Note / Test Condition**|
|||**Min.**|**Typ.**|**Max.**|||
|Continuous drain current1)|_I_D|-|-|10.6|A|_T_C= 25 °C|
|||||6.7||_T_C= 100°C|
|Pulsed drain current2)|_I_D,pulse|-|-|29|A|_T_C=25 °C|
|Avalanche energy, single pulse|_E_AS|-|-|215|mJ|_I_D=1.8 A,_V_DD=50 V<br>(see table 21)|
|Avalanche energy, repetitive|_E_AR|-|-|0.32||_I_D=1.8 A,_V_DD=50 V|
|Avalanche current, repetitive|_I_AR|-|-|1.8|A||
|MOSFET dv/dt ruggedness|dv/dt|-|-|50|V/ns|_V_DS=0...480 V|
|Gate source voltage|_V_GS|-20|-|20|V|static|
|||-30||30||AC (f>1 Hz)|
|Power dissipation for<br>TO-220, TO-252, TO-262, TO-263|_P_tot|-|-|83|W|_T_C=25 °C|
|Power dissipation for<br>TO-220 FullPAK|_P_tot|-|-|31|W|_T_C=25 °C|
|Operating and storage temperature|_T_j,_T_stg|-55|-|150|°C||
|Mounting torque<br>TO-220||-|-|60|Ncm|M3 and M3.5 screws|
|Mounting torque<br>TO-220 FullPAK||||50||M2.5 screws|
|Continuous diode forward current|_I_S|-|-|9.2|A|_T_C=25 °C|
|Diode pulse current2)|_I_S,pulse|-|-|29|A|_T_C=25 °C|
|Reverse diode dv/dt3)|dv/dt|-|-|15|V/ns|_V_DS=0...400 V,_I_SD_I_D,<br>_T_j=25 °C|
|Maximum diode commutation<br>speed3)|dif/dt|||500|A/µs||



1) Limited by _T_ j,max. Maximum duty cycle D=0.75 

2) Pulse width _t_ p limited by _T_ j,max 

- 3) Identical low side and high side switch with identical _R_ G 

Final Data Sheet 

Rev. 2.1, 2011-02-17Rev. 2.2, 2013-07-31 

4 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

## **Thermal characteristics** 

## **3 Thermal characteristics** 

## **Table 3 Thermal characteristics TO-220 & TO-262** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note /**<br>**Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Thermal resistance, junction - case|_R_thJC|-|-|1.5|°C/W||
|Thermal resistance, junction -<br>ambient|_R_thJA|-|-|62||leaded|
|Soldering temperature,<br>wavesoldering only allowed at<br>leads|_T_sold|-|-|260|°C|1.6 mm (0.063 in.)<br>from case for 10 s|



## **Table 4 Thermal characteristics TO-220FullPAK** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note /**<br>**Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Thermal resistance, junction - case|_R_thJC|-|-|4.0|°C/W||
|Thermal resistance, junction -<br>ambient|_R_thJA|-|-|80||leaded|
|Soldering temperature,<br>wavesoldering only allowed at<br>leads|_T_sold|-|-|260|°C|1.6 mm (0.063 in.)<br>from case for 10 s|



## **Table 5 Thermal characteristics TO-263 & TO-252** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note /**<br>**Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Thermal resistance, junction - case|_R_thJC|-|-|1.5|°C/W||
|Thermal resistance, junction -<br>ambient|_R_thJA|-|-|62||SMD version, device<br>on PCB, minimal<br>footprint|
||||35|||SMD version, device<br>on PCB, 6cm2cooling<br>area1)|
|Soldering temperature,<br>wave- & reflowsoldering allowed|_T_sold|-|-|260|°C|reflow MSL1|



1) Device on 40mm*40mm*1.5 epoxy PCB FR4 with 6cm[2] (one layer, 70µm thick) copper area for drain connection. PCB is vertical without air stream cooling. 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

5 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

**Electrical characteristics** 

## **4 Electrical characteristics** 

Electrical characteristics, at _T_ j=25 °C, unless otherwise specified 

## **Table 6 Static characteristics** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note / Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Drain-source breakdown voltage|_V_(BR)DSS|650|-|-|V|_V_GS=0 V,_I_D=1.0 mA|
|Gate threshold voltage|_V_GS(th)|2.5|3|3.5||_V_DS=_V_GS,_I_D=0.32 mA|
|Zero gate voltage drain current|_I_DSS|-|-|1|µA|_V_DS=600 V,_V_GS=0 V,<br>_T_j=25 °C|
|||-|10|-||_V_DS=600 V,_V_GS=0 V,<br>_T_j=150 °C|
|Gate-source leakage current|_I_GSS|-|-|100|nA|_V_GS=20 V,_V_DS=0 V|
|Drain-source on-state resistance|_R_DS(on)|-|0.34|0.38||_V_GS=10 V,_I_D=3.2 A,<br>_T_j=25 °C|
|||-|0.89|-||_V_GS=10 V, _I_D=3.2 A,<br>_T_j=150 °C|
|Gate resistance|_R_G|-|17|-||_f_=1 MHz, open drain|



## **Table 7 Dynamic characteristics** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note /**<br>**Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Input capacitance|_C_iss|-|710|-|pF|_V_GS=0 V, _V_DS=100 V,<br>_f_=1 MHz|
|Output capacitance|_C_oss|-|41|-|||
|Effective output capacitance,<br>energy related1)|_C_o(er)|-|32|-||_V_GS=0 V,<br>_V_DS=0...480 V|
|Effective output capacitance, time<br>related2)|_C_o(tr)|-|140|-||_I_D=constant,_V_GS=0 V<br>_V_DS=0...480V|
|Turn-on delay time|_t_d(on)|-|12|-|ns|_V_DD=400 V,<br>_V_GS=13 V,_I_D=4.9A,<br>_R_G= 3.4<br>(see table 20)|
|Rise time|_t_r|-|12|-|||
|Turn-off delay time|_t_d(off)|-|110|-|||
|Fall time|_t_f|-|11|-|||



1) _C_ o(er) is a fixed capacitance that gives the same stored energy as _C_ oss while VDS is rising from 0 to 80% V(BR)DSS 

2) _C_ o(tr) is a fixed capacitance that gives the same charging time as _C_ oss while VDS is rising from 0 to 80% V(BR)DSS 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

6 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

## **Electrical characteristics** 

## **Table 8 Gate charge characteristics** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note /**<br>**Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|IGate to source charge|_Q_gs|-|4|-|nC|_V_DD=480 V,_I_D=4.9 A,<br>_V_GS=0 to 10 V|
|Gate to drain charge|_Q_gd|-|20|-|||
|Gate charge total|_Q_g|-|39|-|||
|Gate plateau voltage|_V_plateau|-|5.5|-|V||



## **Table 9 Reverse diode characteristics** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note /**<br>**Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Diode forward voltage|_V_SD|-|0.9|-|V|_V_GS=0 V,_I_F=4.9A,<br>_T_j=25 °C|
|Reverse recovery time|_t_rr|-|280|-|ns|_V_R=400 V,_I_F=4.9 A,<br>d_i_F/d_t_=100 A/µs<br>(see table 22)|
|Reverse recovery charge|_Q_rr|-|2.8|-|µC||
|Peak reverse recovery current|_I_rrm|-|17|-|A||



Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

7 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**5** 

## **Electrical characteristics diagrams** 

## **Electrical characteristics diagrams** 

## **Table 10** 

## **Power dissipation Non FullPAK** 

_P_ tot = f( _T_ C) 

**Power dissipation FullPAK** 

_P_ tot = f( _T_ C) 

## **Table 11** 

## **Max. transient thermal impedance Non FullPAK** 

## **Max. transient thermal impedance FullPAK** 

_Z_ (thJC)=f(tp); parameter: D=tp/T 

_Z_ (thJC)=f(tp); parameter: D=tp/T 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

8 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**Electrical characteristics diagrams** 

## **Table 12** 

> **Safe operating area** _**T**_ **C=25 °C Non FullPAK** 

**Safe operating area** _**T**_ **C=25 °C FullPAK** 

_I_ D=f(VDS); _T_ C=25 °C; _V_ GS > 7V; D=0; parameter _t_ p _I_ D=f(VDS); _T_ C=25 °C; _V_ GS > 7V; D=0; parameter _t_ p 

**Table 13** 

> **Safe operating area** _**T**_ **C=80 °C Non FullPAK** 

**Safe operating area** _**T**_ **C=80 °C FullPAK** 

_I_ D=f(VDS); _T_ C=80 °C; _V_ GS > 7V; D=0; parameter _t_ p 

_I_ D=f(VDS); _T_ C=80 °C; _V_ GS > 7V; D=0; parameter _t_ p 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

9 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**Electrical characteristics diagrams** 

**Table 14** 

> **Typ. output characteristics** _**T**_ **C=25 °C** 

_I_ D=f( _V_ DS); _T_ j=25 °C; parameter: _V_ GS 

**==> picture [175 x 12] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typ. output characteristics T j=125 °C<br>**----- End of picture text -----**<br>


_I_ D=f( _V_ DS); _T_ j=125 °C; parameter: _V_ GS 

## **Table 15** 

## **Typ. drain-source on-state resistance** 

_R_ DS(on)=f( _I_ D); _T_ j=125 °C; parameter: _V_ GS 

## **Drain-source on-state resistance** 

_R_ **DS(on)** =f( _T_ **j** ); _I_ **D** =4.9 A; _V_ **GS** =10 V 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

10 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

## **Electrical characteristics diagrams** 

## **Table 16** 

**Typ. transfer characteristics** 

_I_ D=f( _V_ GS); _V_ DS=20V 

## **Typ. gate charge** 

**==> picture [131 x 12] intentionally omitted <==**

**----- Start of picture text -----**<br>
V GS=f( Q gate),  I D=4.9 A pulsed<br>**----- End of picture text -----**<br>


## **Table 17** 

**==> picture [405 x 286] intentionally omitted <==**

**----- Start of picture text -----**<br>
Avalanche energy Drain-source breakdown voltage<br>250 ; 760<br>740<br>200 720 |<br>700<br>=&wo 450 i =ag 680 /y,<br>wity z 660<br>100 | n > WA<br>640 f |<br>50 620<br>- \<br>o | i 600580<br>20 60 100 140 180 -60 -20 20 60<br>T, [°c] T [°C]<br> E AS =f( T j );  I D =1.8 A;  V DD =50 V  V BR(DSS)=f( T j);  I D=1.0 mA<br>**----- End of picture text -----**<br>


Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

11 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**Electrical characteristics diagrams** 

**Table 18** 

**Typ. capacitances** 

## **Typ.** _**C**_ **oss stored energy** 

C=f( _V_ DS); _V_ GS=0 V; _f_ =1 MHz _E_ **OSS** =f( _V_ DS) 

**Table 19** 

## **Forward characteristics of reverse diode** 

_I_ F=f( _V_ SD); parameter: _T_ j 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

12 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

## **Test circuits** 

## **6 Test circuits** 

**Table 20 Switching times test circuit and waveform for inductive load Switching times test circuit for inductive load Switching time waveform** 

**==> picture [357 x 136] intentionally omitted <==**

**----- Start of picture text -----**<br>
V DS<br>90%<br>V DS<br>V GS<br>10%<br>V GS<br>t d(on) t r t d(off) t f<br>t on t off<br>**----- End of picture text -----**<br>


**Table 21 Unclamped inductive load test circuit and waveform** 

**Unclamped inductive load test circuit** 

**==> picture [57 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
I D V DS<br>**----- End of picture text -----**<br>


**Unclamped inductive waveform** 

**==> picture [230 x 97] intentionally omitted <==**

**----- Start of picture text -----**<br>
V (BR)DS<br>V D<br>V DS V DS<br>I D<br>**----- End of picture text -----**<br>


**Table 22 Test circuit and waveform for diode characteristics** 

**==> picture [498 x 181] intentionally omitted <==**

**----- Start of picture text -----**<br>
 Test circuit for diode characteristics  Diode recovery waveform<br>I D i<br>v d i F /d t<br>R G1 [t] Q rrrr== t S Q +S t +F  Q F<br>V DS Ι F t S t rr t F<br>R G2 ΙRRM Q S Q F d i rr /d10% t Ι V RRMRRM t<br>90% Ι RRM<br>R G1 =  R G2 v<br>SIL00088<br>**----- End of picture text -----**<br>


Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

13 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**7** 

## **Package outlines** 

## **Package outlines** 

**Figure 1 Outlines TO-252, dimensions in mm/inches** 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

14 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

## **Package outlines** 

**Figure 2 Outlines TO-220, dimensions in mm/inches** 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

15 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

## **Package outlines** 

**Figure 3 Outlines TO-220 FullPAK, dimensions in mm/inches** 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

16 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

## **Package outlines** 

**Figure 4 Outlines TO-262, dimensions in mm/inches** 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

17 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

**==> picture [131 x 63] intentionally omitted <==**

**Package outlines** 

**==> picture [396 x 584] intentionally omitted <==**

**Figure 5 Outlines TO-263, dimensions in mm/inches** 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

18 

**650V CoolMOS™ C6 Power Transistor IPx65R380C6** 

## **Revision History** 

## **8 Revision History** 

## **Revision History: 2011-02-17, Rev. 2.1Revision History: 2013-07-31, Rev. 2.2** 

|**Previous Revision:**<br>**2.1**|
|---|
|**Revision**<br>**Subjects (major changes since last revision)**|
|2.0<br>Release of final data sheet|
|2.1<br>Update test condition of reverse diode dv/dt|
|2.2<br>Update halogen free mold compound status of PG-TO252 package|



## **We Listen to Your Comments** 

Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: **erratum@infineon.com** 

Edition 2011-02-17 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( **www.infineon.com** ). 

## **Warnings** 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. 

The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered 

Final Data Sheet 

Rev. 2.2, 2013-07-31Rev. 2.1, 2011-02-17 

19 



## Links

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