# Power MOSFET, N Channel, 100 V, 30 A, 0.031 ohm, TO-252 (DPAK), Surface Mount

![Product image](https://novapart.co/image/farnell:2432729/)

**URL**: https://novapart.co/products/IPD30N10S3L34ATMA1/power-mosfet-n-channel-100-v-30-a-0031-ohm-to-252
**SKU**: IPD30N10S3L34ATMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5190
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:30A; Drain Source Voltage Vds:100V; On Resistance Rds(on):0.0258oh; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (21-Jan-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 57W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252 (DPAK) |
| Drain Source Voltage Vds | 100V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 30A |
| Drain Source On State Resistance | 0.031ohm |
| Gate Source Threshold Voltage Max | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2432729/)

**IPD30N10S3L-34** 

## **OptiMOS[®] -T Power-Transistor** 

|**Product Summary**|||
|---|---|---|
||||
|_V_DS|100|V|
||||
|_R_DS(on),max|31|mW|
||||
|_I_D|30|A|



## **Features** 

- N-channel - Enhancement mode 

**==> picture [73 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
PG-TO252-3-11<br>**----- End of picture text -----**<br>


- Automotive AEC Q101 qualified 

- MSL1 up to 260°C peak reflow 

- 175°C operating temperature 

- Green product (RoHS compliant) 

- 100% Avalanche tested 

|——_—_}+—|——_—_}+—|——_—_}+—|
|---|---|---|
|**Type**<br>——_—_}+—|**Package**<br>——_—_}+—|**Marking**<br>——_—_}+—|
|——_—_}+—|——_—_}+—|——_—_}+—|
|IPD30N10S3L-34<br>——_—_}+—|PG-TO252-3-11<br>——_—_}+—|3N10L34<br>——_—_}+—|



**Maximum ratings,** at _T_ j=25 °C, unless otherwise specified 

|**Maximum ratings,**at_T_j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|j=25 °C, unless otherwise specified=25 °C, unless otherwise specified|||
|---|---|---|---|---|
|**Parameter**|**Symbol**|**Conditions**|**Unit**<br>**Value**|**Unit**|
|Continuous drain current|_I_D|_T_C=25°C,_V_GS=10V|30<br>A<br>20<br>120|A|
|||_T_C=100°C,_V_GS=10V1)|||
|Pulsed drain current1)|_I_D,pulse|_T_C=25°C|||
|Avalanche energy, single pulse1)|_E_AS|_I_D=15A|138<br>mJ|mJ|
|Avalanche current, single pulse|_I AS_||30<br>A|A|
|Gate source voltage2)|_V_GS||±20<br>V|V|
|Power dissipation|_P_tot|_T_C=25°C|57<br>W|W|
|Operating and storage temperature|_T_j,_T_stg||-55 ... +175<br>°C|°C|
|IEC climatic category; DIN IEC 68-1|||55/175/56||



Rev. 1.1 

page 1 

2011-10-06 

**IPD30N10S3L-34** 

|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Thermal characteristics1)**<br>**Values**<br>~~es~~<br>~~ee ee~~|
|---|
|Thermal resistance, junction - case<br>_R_thJC<br>-<br>-<br>2.6<br>K/W<br>SMD version, device on PCB<br>_R_thJA<br>minimal footprint<br>-<br>-<br>62<br>6 cm2 cooling area3)<br>-<br>-<br>40<br>~~oe~~|
|**Electrical characteristics,**at_T_j=25 °C, unless otherwise specified|



## **Electrical characteristics,** at _T_ j 

|**Static characteristics**|||||||
|---|---|---|---|---|---|---|
|Drain-source breakdown voltage|_V_(BR)DSS|_V_GS=0V,_I_D= 1mA|100|-|-|V|
|Gate threshold voltage|_V_GS(th)|_V_DS=_V_GS,_I_D=29µA|1.2|1.7|2.4||
|Zero gate voltage drain current|_I_DSS|_V_DS=80V,_V_GS=0V,<br>_T_j=25°C|-|0.01|0.1|µA|
|||_V_DS=80V,_V_GS=0V,<br>_T_j=125°C1)|-|1|10||
|Gate-source leakage current|_I_GSS|_V_GS=16V,_V_DS=0V|-|-|100|nA|
|Drain-source on-state resistance|_R_DS(on)|_V_GS=4.5V,_I_D=30A|-|32.2|41.8|mW|
|||_V_GS=10 V,_I_D=30 A|-|25.8|31.0||



Rev. 1.1 

page 2 

2011-10-06 

**IPD30N10S3L-34** 

|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|**Parameter**<br>**Symbol**<br>**Conditions**<br>**Unit**<br>**min.**<br>**typ.**<br>**max.**<br>**Values**<br>~~ee~~|
|---|---|---|---|---|---|---|---|
||**Dynamic characteristics1)**|||||||
||Input capacitance|_C_iss||-|1520|1976|pF|
||Output capacitance|_C_oss|_V_GS=0V,_V_DS=25V,<br>_f_=1MHz|-|380|494||
||Reverse transfer capacitance|Crss||-|45|68||
||Turn-on delay time|_t_d(on)||-|6|-|ns|
||Rise time|_t_r|_V_DD=20V,_V_GS=10V,|-|4|-||
||Turn-off delay time|_t_d(off)|_I_D=30A,_R_G=3.5W|-|18|-||
||Fall time|_t_f||-|3|-||
||**Gate Charge Characteristics1)**|||||||
||Gate to source charge|_Q_gs||-|5|7|nC|
||Gate to drain charge|_Q_gd|_V_DD=80V,_I_D=30A,|-|4|6||
||Gate charge total|_Q_g|_V_GS=0 to 10V|-|24|31||
||Gate plateau voltage|_V_plateau||-|3.7|-|V|
||**Reverse Diode**|||||||
||Diode continous forward current1)|_I_S||-|-|30|A|
||||_T_C=25°C|||||
||Diode pulse current1)|_I_S,pulse||-|-|120||
||Diode forward voltage|_V_SD|_V_GS=0V,_I_F=30A,<br>_T_j=25°C|0.6|1|1.2|V|
||Reverse recovery time1)|_t_rr|_V_R=50V,_I_F=_I_S,<br>d_i_F/d_t_=100A/µs|-|72|-|ns|
||Reverse recovery charge1)|_Q_rr||-|150|-|nC|



1) Defined by design. Not subject to production test. 

2) Qualified with VGS = +20/-5V. 

3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 

Rev. 1.1 

page 3 

2011-10-06 

**IPD30N10S3L-34** 

## **1 Power dissipation** 

## **2 Drain current** 

_P_ tot = f( _T_ C); _V_ GS ≥ 6 V _I_ D = f( _T_ C); _V_ GS ≥ 6 V 

**==> picture [462 x 610] intentionally omitted <==**

**----- Start of picture text -----**<br>
60<br>30<br>50 \<br>40 \<br>20<br>30<br>20<br>10<br>10<br>0 ie\ a 0<br>0 50 100 150 200 0 50 100 150 200<br>T  C [°C] T  C [°C] [°C]<br>3 Safe operating area 4 Max. transient thermal impedance<br> = f( V  DS););  T  C = 25 °C; = 25 °C;  D = 0 Z  thJC = f( t  p)<br>parameter:  t  p parameter:  D  = t  p/ T<br>1000 10 [1]<br>0.5<br>EEEERE<br>10 [0]<br>1 µs<br>100 0.1<br>10 µs<br>0.05<br>10 [-1]<br>100 µs 0.01<br>10 1 ms<br>single pulse<br>10 [-2]<br>1 aN 10 [-3] ie<br>0.1 1 10 100 10 [-6] 10 [-5] 10 [-4] 10 [-3] 10 [-2] 10 [-1] 10 [0]<br>V  DS [V] t  p [s]<br> [W]  [A]<br>P  tot I  D<br> [A]  [K/W]<br>I  D<br> thJC<br>Z<br>**----- End of picture text -----**<br>


**==> picture [223 x 234] intentionally omitted <==**

**----- Start of picture text -----**<br>
30<br>20<br>10<br>0<br>0 50 100 150 200<br>T  C [°C] [°C]<br> [A]<br>I  D<br>**----- End of picture text -----**<br>


## **3 Safe operating area** 

_I_ D = f( _V_ DS);); _T_ C = 25 °C; = 25 °C; _D_ = 0 parameter: _t_ p 

Rev. 1.1 

page 4 

2011-10-06 

**IPD30N10S3L-34** 

## **5 Typ. output characteristics** 

## **6 Typ. drain-source on-state resistance** 

**==> picture [482 x 686] intentionally omitted <==**

**----- Start of picture text -----**<br>
I  D = f( V  DS);  T  j = 25 °C R  DS(on) = f( I  D);  T  j = 25 °C<br>parameter:  V  GS parameter:  V  GS<br>120 80<br>10 V<br>5 V<br>3 V 3.5 V 4 V<br>70<br>80 60<br>4.5 V<br>50<br>4 V<br>40 40<br>4.5 V<br>3.5 V 5 V<br>30<br>10 V<br>3 V<br>0 20<br>0 1 2 3 4 5 6 0 20 40 60<br>V  DS [V] I  D [A]<br>7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance<br>I  D = f( V  GS);  V  DS = 6V R  DS(on) = f( T  j);  I  D = 30 A;  V  GS = 10 V<br>parameter:  T  j<br>60 60<br>25 °C<br>-55 °C 175 °C<br>50<br>40<br>40<br>30<br>20<br>20<br>0 -<br>jie 10<br>1 2 3 4 5<br>-60 -20 20 60 100 140 180<br>V  GS [V] T  j [°C]<br>Rev. 1.1 page 5 2011-10-06<br>]W<br> [A]  [m<br>I  D<br> DS(on)<br>R<br>]<br>W<br>[m<br> [A]<br>I  D<br> DS(on)<br>R<br>**----- End of picture text -----**<br>


Rev. 1.1 

**IPD30N10S3L-34** 

## **9 Typ. gate threshold voltage** 

_V_ GS(th) = f( _T_ j); _V_ GS = _V_ DS 

## **10 Typ. capacitances** 

## _C_ = f( _V_ DS); _V_ GS = 0 V; _f_ = 1 MHz 

**==> picture [472 x 635] intentionally omitted <==**

**----- Start of picture text -----**<br>
parameter:  I  D<br>2.5 10 [4]<br>2<br>150 µA Ciss<br>S<br>10 [3]<br>30 µA<br>1.5 cE<br>Coss<br>1<br>10 [2]<br>0.5<br>Crss<br>0 10 [1]<br>-60 -20 20 60 100 140 180 0 5 10 15 20 25 30<br>T  j [°C] V  DS [V]<br>11 Typical forward diode characteristicis 12 Typ. avalanche characteristics<br>IF = f(VSD) I  A S= f( t  AV)<br>parameter:  T  j parameter: Tj(start)<br>10 [3] 100<br>25 °C<br>100 °C<br>10 [2] 10<br>2 150 °C<br>AR<br>10 [1] 1<br>175 °C 25 °C<br>10 [0] AES 0.1<br>0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.1 1 10 100 1000<br>V  SD [V] t  AV [µs]<br>[pF]<br>C<br> [V]<br> GS(th)<br>V<br> [A]  [A]<br>I  F I  AV<br>**----- End of picture text -----**<br>


Rev. 1.1 

page 6 

2011-10-06 

**IPD30N10S3L-34** 

## **13 Typical avalanche energy** 

_E_ AS = f( _T_ j) 

## **14 Typ. drain-source breakdown voltage** 

_V_ BR(DSS) = f( _T_ j); _I_ D = 1 mA 

parameter: _I_ D 

**==> picture [464 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
300 115<br>7.5 A<br>250<br>110<br>200<br>105<br>150 15 A<br>100<br>100<br>30 A<br>95<br>50<br>0 90 a<br>25 75 125 175 -55 -15 25 65 105 145<br>T  j [°C] T  j [°C]<br>15 Typ. gate charge 16 Gate charge waveforms<br> GS = f( = f( Q  gate););  I  D = 30 A pulsed = 30 A pulsed<br>parameter:  V  DD<br>10<br>V GS<br>9<br>Q g<br>8<br>20 V 80 V<br>7<br>6<br>5<br>V<br>4 gs(th)<br>3<br>2<br>Q g(th) Q sw Q gate<br>1<br>0 Q gs Q gd<br>0 5 10 15 20 25 a<br>Q  gate [nC]<br> [V]<br> [mJ]<br> AS<br>E  BR(DSS)<br>V<br> [V]<br> GS<br>V<br>**----- End of picture text -----**<br>


## **15 Typ. gate charge 16 Gate charge waveforms** 

_V_ GS = f( = f( _Q_ gate);); _I_ D = 30 A pulsed = 30 A pulsed parameter: _V_ DD 

Rev. 1.1 

2011-10-06 

page 7 

**IPD30N10S3L-34** 

## **Published by Infineon Technologies AG 81726 Munich, Germany** 

## **© Infineon Technologies AG 2008 All Rights Reserved.** 

## **Legal Disclaimer** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, 

any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non‑infringement of intellectual property rights of any third party. 

## **Information** 

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( **www.infineon.com** ). 

## **Warnings** 

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. 

Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

Rev. 1.1 

page 8 

2011-10-06 

**IPD30N10S3L-34** 

|Cinfineon||||**IPD30N10S3L-34**|
|---|---|---|---|---|
|Revision History|||||
|**Version**||Date||Changes|
|||||Page 1: VGSchanged from ±16V to|
||1.1||08.04.2008|±20V|
||1.1||08.04.2008|Page 3: Footnote 2)added|



Rev. 1.1 

page 9 

2011-10-06 



## Links

- [View this product on Novapart](https://novapart.co/products/IPD30N10S3L34ATMA1/power-mosfet-n-channel-100-v-30-a-0031-ohm-to-252)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/ipd30n10s3l34atma1/mosfet-n-ch-100v-30a-to-252-3/dp/2432729)
---

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